CN100399152C - Repairing method for transparent conducting layer and structure thereof - Google Patents
Repairing method for transparent conducting layer and structure thereof Download PDFInfo
- Publication number
- CN100399152C CN100399152C CNB200610054964XA CN200610054964A CN100399152C CN 100399152 C CN100399152 C CN 100399152C CN B200610054964X A CNB200610054964X A CN B200610054964XA CN 200610054964 A CN200610054964 A CN 200610054964A CN 100399152 C CN100399152 C CN 100399152C
- Authority
- CN
- China
- Prior art keywords
- layer
- repairing
- mending
- oxide
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 39
- 230000007547 defect Effects 0.000 claims abstract description 32
- 238000011049 filling Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000005229 chemical vapour deposition Methods 0.000 claims abstract description 7
- 238000005240 physical vapour deposition Methods 0.000 claims abstract description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 28
- 239000002245 particle Substances 0.000 claims description 19
- 239000011787 zinc oxide Substances 0.000 claims description 19
- 229960001296 zinc oxide Drugs 0.000 claims description 11
- RNWHGQJWIACOKP-UHFFFAOYSA-N zinc;oxygen(2-) Chemical compound [O-2].[Zn+2] RNWHGQJWIACOKP-UHFFFAOYSA-N 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910003437 indium oxide Inorganic materials 0.000 claims description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052720 vanadium Inorganic materials 0.000 claims description 2
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 239000012780 transparent material Substances 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 10
- 239000004973 liquid crystal related substance Substances 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000001338 self-assembly Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Abstract
The present invention discloses a patching method for a transparent conducting layer, which comprises: a baseplate is supplied and is provided with a transparent conducting layer on the surface of the baseplate, wherein the transparent conducting layer is provided with a concave defect part; subsequently, a filling step is executed, namely, conducting patching materials are filled in the concave defect part to form a conducting patching layer; the filling step comprises ink jet, chemical vapor deposition or physical vapor deposition.
Description
Technical field
The invention relates to a kind of method for repairing and mending of transparency conducting layer, and particularly about a kind of transparency conducting layer method for repairing and mending and structure thereof that can Efficient software patching depression defect point.
Background technology
In order to cooperate modern life pattern, it is thin light that the volume of video or device for image day by day is tending towards.Therefore, the display of panel type has been developed to become common display product at present, for example LCD, plasma display and electroluminescence (electroluminance) display etc.LCD has conventional cathode ray tube (cathode ray tube is called for short CRT) displays such as low-power consumption, radiationless line, in light weight and volume the be little advantage that is beyond one's reach.Therefore, LCD is applied in the electronic products such as hand-held computer, mobile phone widely.
Liquid crystal indicator is made up of colored filter substrate with electrode and array base palte usually.Usually be formed with the thin film transistor (TFT) that is used for being used as switch module on the array base palte, this thin film transistor (TFT) has the gate electrode that is connected in sweep trace (scan line), the source electrode that is connected in signal line (data line) and the drain electrode that is connected in the transparent pixels electrode.The colored filter substrate surface then is provided with the colored light filter membrane layer of light shield layer, color such as red in order to show, blue, green and is covered in light shield layer and the transparent common electrode layer of color filter film laminar surface.In order to keep the fixing distance between two substrates, some can be set usually be commonly called as particle into sept (spacer) between two substrates.The set-up mode of sept (spacer) can have certain size particles with distribution and produce these septs (spacer) between two substrates or in the mode of gold-tinted technology.Sept also makes the liquid crystal of being inserted can be contained in the liquid crystal indicator panel.Export setting voltage respectively by drive IC again and control the rotation of liquid crystal, and then demonstrate the picture of expection to pixel electrode and common electrode layer.
Yet, in the process of preparation colored filter substrate,, will make the transparent common electrode layer be covered in foreign matter surface and foreign matter attachment region substrate surface in addition if there is foreign matter before plating transparent common electrode layer step, to be attached on the colored filter substrate.Because the tack of foreign matter and substrate is poor, foreign matter is removed easily and causes the transparent common electrode layer to peel off the formation depression defect when the cleaning of back.When setting voltage was imported pixel electrode and common electrode layer respectively, near the liquid crystal that is positioned at the common electrode layer depression defect zone can't regular event, made bright spot (or dim spot) defective to occur in the display frame.Similarly situation also may appear on the transparent pixels electrode of array base palte, makes that the liquid crystal that is positioned at transparent pixels electrode depression defect zone can't regular event, causes to occur bright spot (or dim spot) defective in the display frame.
In existing pixel repairing technique, be to utilize laser means that transparent pixels electrode and thin film transistor (TFT) is electrically isolated, make it present black or grey.Yet known transparent pixels repairing technique all can't allow original pixel present the color of originally wanting, so reduce display quality.If have the pixel electrode quantity of depression defect when too much, may directly scrap and do not repair.Thus, not only having a strong impact on yield also raises the cost greatly.
Summary of the invention
In view of this, the purpose of this invention is to provide a kind of method for repairing and mending and structure thereof of transparency conducting layer, can when transparency conducting layer has depression defect, avoid forming bright spot (or dim spot) at panel.
Another object of the present invention provides a kind of method for repairing and mending and structure thereof of transparency conducting layer, to improve bright spot (or dim spot) repair rate.
According to above-mentioned and other purpose, the present invention proposes a kind of method for repairing and mending of transparency conducting layer, and comprising provides substrate, and its substrate is provided with transparency conducting layer in its surface, and wherein transparency conducting layer has depression defect.Then, carry out filling steps, fill up the conduction patching material in this depression defect portion in order to form one the conduction repair layer.The above-mentioned filling mode comprises ink-jet (Ink-Jet), chemical vapor deposition (CVD) or physical vapor deposition (PVD).Method for repairing and mending of the present invention more can carry out planarisation step after fill process.
The present invention proposes a kind of structure of transparency conducting layer, comprises substrate, and its substrate is provided with transparency conducting layer in its surface, and wherein transparency conducting layer has depression defect.The conduction repair layer is filled up in this depression defect portion.
Utilize method for repairing and mending of the present invention, directly fill up the conduction repair layer, it is connected with transparency conducting layer, so significantly improve the bright spot repair rate, and still can normally show original picture in repairing rear panel in notch defective area.In addition, depression defect area size or shape there is no any limitation, all can use repairing method of the present invention to repair, and then improve yield greatly and reduce cost.
Description of drawings
The 1st figure is the sectional view of colored filter substrate of the present invention.
The 2nd figure is an ink-jet technology method for repairing and mending of the present invention.
The 3rd figure is a sectional structure chart of repairing the colored filter substrate after finishing.
The 4th figure is the method for repairing and mending of the small-sized coating apparatus of use of the present invention.
The 5th figure is the method for repairing and mending that local deposits is carried out in use shielding of the present invention.
The 6th figure is the method for repairing and mending that comprehensively deposits of the present invention.
The 7th figure is a sectional structure chart of repairing the array base palte viewing area after finishing.
[primary clustering symbol description]
100,200,300,400,500,600 colored filter substrates
102,702 transparency carriers, 104 light shield layers
106 color filter films, 108 common electrode layer
110 depression defects, 210 conduction patching materials
212,612,712 conduction repair layer
414 small-sized coating apparatus 514 shieldings
700 array base paltes, 704 gate electrodes
706 gate insulators, 708 semiconductor layers
710 drain/source electrodes, 714 source/drain electrodes
716 protective seams, 718 pixel electrodes
Embodiment
The 1st figure is the sectional view of colored filter substrate of the present invention.Colored filter substrate 100 comprises transparency carrier 102, the transparent common electrode layer 108 that it is provided with light shield layer 104, color filter film 106 and is covered in light shield layer 104 and color filter film 106 surfaces.When common electrode layer 108 is peeled off generation depression defect 110, can utilize method for repairing and mending of the present invention to repair, make display can normally show original picture.The form of depression defect 110 is not limited to peel off form fully shown in the 1st figure.Such as cause scratch because of artificial, machine or other factors, form depression defect 110, can utilize method for repairing and mending of the present invention to repair and the partial structure of common electrode layer 108 is come off.Below will cooperate the 2nd figure to the 6 figure to describe method for repairing and mending of the present invention in detail.
＜the first embodiment 〉
First embodiment of method for repairing and mending of the present invention is that locality forms the conduction repair layer in depression defect portion.Shown in the 2nd figure, utilize the technology of ink-jet (Ink-jet), the patching material 210 that will conduct electricity is filled up in depression defect 110.Colored filter substrate 300 cross-section structures after repairing shown in the 3rd figure is finished make conduction repair layer 212 produce with common electrode layer 108 and electrically connect.
Because the material of common electrode layer 108 is tin indium oxide (ITO), indium zinc oxide (IZO) or other transparent conductive material, so the composition of conduction patching material 210 can for example be formed by plural electrically conducting transparent particle and solvent etc.Utilize the technology of ink-jet will conduct electricity patching material and impose on depression defect 110.Then, can make plural electrically conducting transparent particle constitute conduction repair layer 212 by technologies such as bakings with removal of solvents.According to the difference of baking process, conduction repair layer 212 can be constituted by compact arranged form between the electrically conducting transparent particle, also can be constituted by the form that has the mutual fusion area of part between conducting particles at least, or is made of jointly above-mentioned two kinds of forms.The material of transparency conducting layer 212 can for example be tin indium oxide (ITO), indium oxide (In
2O
3), titania (TiO
2), zinc paste (ZnO), zinc paste (ZnO:Sn), vanadium doping zinc-oxide (ZnO:V), cobalt doping zinc-oxide (ZnO:Co), aluminium-doped zinc oxide (ZnO:Al), Ga-doped zinc oxide (ZnO:Ga), titanium doped zinc paste (ZnO:Ti), indium doping zinc-oxide (ZnO:In) or its combination.Conduction repair layer 212 also can be made of by metal below the nano-scale or nonmetal conducting particles a plurality of particle size.These conducting particles structures can be hollow or solid, and its shape can be column, dish shape, fibrous (fiber) or spherical.
In order to allow the conduction repair layer 212 that constitutes by conducting particles can have more flat surfaces, make the liquid crystal molecule of filling afterwards that preferred arrangement be arranged, can select these conducting particles surface coated one deck interfacial agents, the coating situation can be that each conducting particles surface all has one deck interfacial agent or by a plurality of conducting particless, for example be 10 conducting particless, assemble the conducting particles group surface that forms and have one deck interfacial agent.By this, in the time of filling steps, conducting particles will auto arrangement reaches the effect of self assembly (self-assembly).In order to make electrical performance better, after filling steps, can carry out tempering (annealing) step again and make conduction repair layer 212 more fine and close in order to remove interfacial agent.
Except the ink-jet technology shown in the 2nd figure, please refer to the 4th figure, also can use small-sized coating apparatus 414 will conduct electricity repair layer 212 and be formed at 110 ones of depression defects.Or, please refer to the 5th figure, prior to placing shielding 514 on the colored filter substrate 500, make substrate 500 only expose depression defect 110 places.Then, when using chemical vapour deposition technique or physical vaporous deposition, conduction repair layer 212 only is formed on 110 ones of depression defects, and wherein physical vaporous deposition can for example be a sputter.
For subsequent technique is considered, can further carry out planarisation step, for example be to make flatness layer or, make the depression defect zone have smooth surface with grinding technics with gold-tinted technology.
＜the second embodiment 〉
Second embodiment of method for repairing and mending of the present invention is that comprehensive formation conduction repair layer is on substrate.Shown in the 6th figure, by chemical vapour deposition technique or physical vaporous deposition, the repair layer 612 of will conducting electricity is formed at colored optical filtering substrates 600 surfaces.
Similarly, for the penetrability that increases display or consider the subsequent technique factor, can further carry out planarisation step, for example make flatness layer or grinding technics, make the depression defect zone have identical level height with peripheral public electrode layer region with gold-tinted technology.
Method for repairing and mending of the present invention also can be used to repair the pixel electrode of viewing area on the array base palte.The 7th figure is a sectional structure chart of repairing array base palte 700 viewing areas after finishing.Shown in the 7th figure; array base palte 700 viewing areas comprise transparency carrier 702, and it is provided with gate electrode 704, gate insulator 706, semiconductor layer 708, the drain/source electrode 710 that is connected in the signal line (not shown), source/drain electrodes 714, protective seam 716, the transparent pixels electrode 718 that is connected in the sweep trace (not shown) and fills up conduction repair layer 712 in defect area.Pixel electrode 718 is connected with conduction repair layer 712.Array base palte 700 can be the infrabasal plate of stable twisted nematic LCD (TN-LCD), vertical alignment type liquid crystal display device (VA-LCD), coplane switching type liquid crystal display (IPS-LCD) or other kenel display.
Compared to known technology, the present invention can utilize chemical vapor deposition, physical vapour deposition (PVD) or the ink-jetting style depression defect zone on substrate to fill up the conduction repair layer, the conduction repair layer is connected with transparency conducting layer, so significantly improve bright spot (or dim spot) repair rate, and still can normally show original picture in repairing rear panel.In addition, depression defect area size or shape there is no any limitation, all can use repairing method of the present invention to repair, and then improve yield greatly and reduce cost.
The above only is preferred embodiment of the present invention, and all equivalent variations and modifications of being done according to claim scope of the present invention all should belong to covering scope of the present invention.
Claims (13)
1. the method for repairing and mending of a transparency conducting layer comprises the following steps:
Substrate is provided, and this substrate has transparency conducting layer, and wherein this transparency conducting layer has depression defect portion; And
Carry out filling steps, fill up the conductive material that is used to repair in this depression defect portion in order to constitute the conduction repair layer.
2. method for repairing and mending as claimed in claim 1 after this filling steps, more comprises and carries out planarisation step.
3. method for repairing and mending as claimed in claim 1, wherein this filling steps comprises ink-jet, chemical vapor deposition or physical vapour deposition (PVD).
4. method for repairing and mending as claimed in claim 1, wherein the material of this conduction repair layer is the electrically conducting transparent material.
5. method for repairing and mending as claimed in claim 4, wherein this conduction repair layer is selected from group that tin indium oxide, indium oxide, titania, zinc paste, tin mixed with zinc oxide, vanadium doping zinc-oxide, cobalt doping zinc-oxide, aluminium-doped zinc oxide, Ga-doped zinc oxide, titanium doped zinc paste, indium doping zinc-oxide constitute one of them or its combination.
6. method for repairing and mending as claimed in claim 1, wherein this conduction repair layer is made of a plurality of conducting particles.
7. method for repairing and mending as claimed in claim 6, wherein those conducting particless are made of a plurality of metallicss of particle size by nano-scale.
8. method for repairing and mending as claimed in claim 6, wherein those conducting particles surfaces have one deck interfacial activity layer.
9. the structure of a transparency conducting layer comprises:
Substrate;
Transparency conducting layer is arranged on this substrate, and this transparency conducting layer has depression defect portion; And
The conduction repair layer is filled up in this depression defect portion.
10. structure as claimed in claim 9, wherein this conduction repair layer comprises transparent conductive material.
11. structure as claimed in claim 9, wherein this conduction repair layer comprises a plurality of conducting particless.
12. as the structure of claim 11, wherein those conducting particless comprise that particle size is a plurality of metallicss of nano-scale.
13. as the structure of claim 11, wherein those conducting particles surfaces have one deck interfacial activity layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200610054964XA CN100399152C (en) | 2006-02-27 | 2006-02-27 | Repairing method for transparent conducting layer and structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200610054964XA CN100399152C (en) | 2006-02-27 | 2006-02-27 | Repairing method for transparent conducting layer and structure thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1811557A CN1811557A (en) | 2006-08-02 |
| CN100399152C true CN100399152C (en) | 2008-07-02 |
Family
ID=36844562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200610054964XA Expired - Fee Related CN100399152C (en) | 2006-02-27 | 2006-02-27 | Repairing method for transparent conducting layer and structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100399152C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI427387B (en) * | 2011-04-22 | 2014-02-21 | Au Optronics Corp | Repairing method for conductive line and repairing method for display panel |
| CN103439839B (en) * | 2013-08-06 | 2015-12-02 | 京东方科技集团股份有限公司 | A kind of method and substrate forming rete |
| KR101549672B1 (en) * | 2014-08-26 | 2015-09-03 | 주식회사 코윈디에스티 | Display reparing device and method using conductive ink |
| CN106409152B (en) * | 2016-09-26 | 2019-03-08 | 昆山工研院新型平板显示技术中心有限公司 | A kind of metal wire, metal wire selfreparing method and flexible display screen |
| CN112631003B (en) * | 2020-12-30 | 2022-11-29 | 成都中电熊猫显示科技有限公司 | Array substrate and broken line repairing method of array substrate |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5714195A (en) * | 1994-03-31 | 1998-02-03 | Canon Kabushiki Kaisha | Color filter repair method and apparatus, color filter, liquid crystal display device, and apparatus having liquid crystal display device |
| US5847720A (en) * | 1994-02-04 | 1998-12-08 | Toxot Science & Applications | Apparatuses and processes for the production and repair of color filters |
| US6239856B1 (en) * | 1998-04-28 | 2001-05-29 | Matsushita Electric Industrial Co., Ltd. | Liquid crystal panel and its manufacturing method |
| US20040246433A1 (en) * | 2003-06-03 | 2004-12-09 | Hsin-Hung Chen | Method and repairing defects in a liquid crystal display |
| CN1635405A (en) * | 2003-12-29 | 2005-07-06 | 财团法人工业技术研究院 | Method for mending element by ink-jet print |
| JP2006030283A (en) * | 2004-07-12 | 2006-02-02 | Sharp Corp | Method of correcting color filter and device thereof |
-
2006
- 2006-02-27 CN CNB200610054964XA patent/CN100399152C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5847720A (en) * | 1994-02-04 | 1998-12-08 | Toxot Science & Applications | Apparatuses and processes for the production and repair of color filters |
| US5714195A (en) * | 1994-03-31 | 1998-02-03 | Canon Kabushiki Kaisha | Color filter repair method and apparatus, color filter, liquid crystal display device, and apparatus having liquid crystal display device |
| US6239856B1 (en) * | 1998-04-28 | 2001-05-29 | Matsushita Electric Industrial Co., Ltd. | Liquid crystal panel and its manufacturing method |
| US20040246433A1 (en) * | 2003-06-03 | 2004-12-09 | Hsin-Hung Chen | Method and repairing defects in a liquid crystal display |
| CN1635405A (en) * | 2003-12-29 | 2005-07-06 | 财团法人工业技术研究院 | Method for mending element by ink-jet print |
| JP2006030283A (en) * | 2004-07-12 | 2006-02-02 | Sharp Corp | Method of correcting color filter and device thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1811557A (en) | 2006-08-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100421016C (en) | In-plane switching mode LCD and manufacturing method thereof | |
| Mara | Liquid crystal flat panel displays: manufacturing science & technology | |
| CN100573292C (en) | Display panels and the method for making its subtend substrate | |
| CN101995700B (en) | Liquid crystal panel and manufacturing method thereof | |
| CN101295090B (en) | LCD device | |
| CN1190686C (en) | Liquid crystal device, color-filtering substrate, and method for mfg. liquid crystal device, method for mfg. color-filtering substrate | |
| CN101025522B (en) | Liquid crystal device and electronic apparatus | |
| CN107329296A (en) | Liquid crystal panel dim spot method for repairing and mending and array base-plate structure | |
| CN100399152C (en) | Repairing method for transparent conducting layer and structure thereof | |
| US7452567B2 (en) | Method for fabricating color filter of liquid crystal display device | |
| CN101424839A (en) | LCD device | |
| CN102508376A (en) | Liquid crystal display panel and manufacturing method thereof | |
| US7331286B2 (en) | Method for fabricating color filter of liquid crystal display device | |
| CN101114073A (en) | Liquid crystal display board | |
| US20080266474A1 (en) | Liquid crystal panel and liquid crystal display using the same | |
| KR101298610B1 (en) | Liquide crystal display device and method for fabricating the same | |
| US20120133869A1 (en) | Liquid crystal display | |
| CN101071218B (en) | Liquid crystal display device | |
| CN100510891C (en) | Color filter substrate for liquid crystal display, and manufacturing method thereof | |
| USRE45727E1 (en) | Method and apparatus for manufacturing liquid crystal display device using serial production processes | |
| KR101037087B1 (en) | A substrate product apparatus for mmg | |
| CN108227283A (en) | The production method and colored filter substrate of colored filter substrate | |
| JP2003295144A (en) | Processing line for liquid crystal display device and method of manufacturing liquid crystal display device using the same | |
| TWI388530B (en) | Method of repairing a transparent conductive film | |
| US11958275B2 (en) | Display apparatus and method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080702 |