CN101323724B - Heat resisting ink composition, preparation and use thereof - Google Patents
Heat resisting ink composition, preparation and use thereof Download PDFInfo
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- CN101323724B CN101323724B CN 200710041915 CN200710041915A CN101323724B CN 101323724 B CN101323724 B CN 101323724B CN 200710041915 CN200710041915 CN 200710041915 CN 200710041915 A CN200710041915 A CN 200710041915A CN 101323724 B CN101323724 B CN 101323724B
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Abstract
The invention mainly provides a heat-resisting printing ink composition used by a water polytetrafluoroethylene inadhesive paint, and a preparation method thereof. The heat-resisting printing ink composition of the invention comprises: (1) nano-organic-inorganic sol-gel resin with the weight percent of 30 to 70, (2) tetrafluoroethylene/hexafluoropropylene copolymer powder or the mixture of the tetrafluoroethylene/hexafluoropropylene copolymer powder and other fluorine polymer powder with the weight percent of 20 to 50, (3) toner for coloring with the weight percent of 3 to 25, and (4) an addition agent with the weight percent of 0.5 to 6. The heat-resisting printing ink composition of the invention has excellent adherence to the base and surface paints of the water polytetrafluoroethylene paint, thus being capable of being used as the printing ink of the water polytetrafluoroethylene paint.
Description
Technical field
The present invention relates to a kind of heat resisting ink composition, more specifically relate to a kind of heat resisting ink composition that is used for water-based tetrafluoroethylene non-viscous paint.The invention still further relates to the preparation method and the purposes of said composition.
Background technology
Tetrafluoroethylene has many good characteristics, reach not viscosity as thermotolerance, chemically-resistant character, so ptfe emulsion often is used as, and water-based two is coated with or the basic material of overbrushing tetrafluoroethylene non-viscous paint, be used for non-sticking cooking utensils or electrical apparatus product, as pan, frying pan, baking tray, beefsteak dish and iron plate etc.Though the tetrafluoroethylene non-viscous paint on market more than the row year, along with people to the improving constantly of quality of life requirement, except cannot not requiring stickingly, also more and more higher for the requirement of cooker to the requirement of its outward appearance.Usually can be on non-viscous paint the printing ink of silk screen printing shades of colour or pattern, attractive in appearance to increase.Though many printing ink are in the streets being arranged, but because tetrafluoroethylene has good not viscosity, and its storing temperature will reach more than 380 ℃, so general printing ink, as by vinylformic acid, polymeric amide, polyester, Resins, epoxy, organosilicon modified polyester printing ink as main resin, except thermotolerance is not enough, also bad with the consistency of tetrafluoroethylene, can cause the adherence between priming paint and printing ink or finish paint and the printing ink poor.
The heat-resistant inks that is used at present water-based tetrafluoroethylene non-viscous paint on market mostly is polyethersulfone with fluorocarbon polymer is formed, but polyethersulfone need dissolve with high polar solvent such as N,N-DIMETHYLACETAMIDE (DMAC), N-Methyl pyrrolidone (NMP) Come.As the primary solvent of printing ink, N,N-DIMETHYLACETAMIDE (DMAC), N-Methyl pyrrolidone (NMP) aqueous vapor in can suck is when the high humidity of air, printing ink leaving standstill in the process after silk screen printing, its surface will produce water droplet, causes the outward appearance of printing ink bad, the epithelium cracking.In addition, because used solvent is more intense, also easily the silk screen dissolving is destroyed silk screen.Therefore, the affected by environment and silk screen of operability is destroyed is two big shortcomings of the printing ink formed of polyethersulfone and fluorocarbon polymer.
Therefore, press for a kind of thermotolerance printing ink good, that all have good adherence with sticking priming paint of water-based tetrafluoroethylene and finish paint in this area, this printing ink can also overcome the above-mentioned shortcoming of the printing ink that polyethersulfone and fluorocarbon polymer form.
Summary of the invention
A main purpose of the present invention provides a kind of heat resisting ink composition, and sticking priming paint of this ink composite and water-based tetrafluoroethylene and finish paint all have good adherence, and is simultaneously affected by environment little and can not damage silk screen.
Another object of the present invention provides a kind of preparation method of heat resisting ink composition.
A further object of the invention provides a kind of purposes of heat resisting ink composition.
In a first aspect of the present invention, a kind of heat resisting ink composition is provided, said composition comprises following component: (1) nanometer organic and inorganic sol-gel resin, the weight percent that accounts for heat resisting ink composition is 30-70%; (2) mixture of tetrafluoroethylene/hexafluoropropylene copolymer powder or tetrafluoroethylene/hexafluoropropylene copolymer powder and other fluoropolymer powders, the weight percent that accounts for heat resisting ink composition is 20-50%; (3) the painted toner of using, the weight percent that accounts for heat resisting ink composition is 3-25%; (4) additive, the weight percent that accounts for heat resisting ink composition is 0.5-6%.
Preferably, to account for the weight percent of heat resisting ink composition be 40-65% to described component (1); The weight percent that described component (2) accounts for heat resisting ink composition is 25-40%; The weight percent that described component (3) accounts for heat resisting ink composition is 5-20%; The weight percent that described component (4) accounts for heat resisting ink composition is 1-4%.
Preferably, described nanometer organic and inorganic sol-gel resin comprises following organic moiety and inorganic part:
Organic moiety is the hydrolyzate formation by silane shown at least a formula (1):
R
1 nSi(OR
2)
4-n (1)
In the formula, R
1Be C
1-6Alkyl, phenyl or γ-Racemic glycidol oxygen propyl group, R
2Be C
1-4Alkyl, n=1 or 2;
Inorganic part provides by being selected from tetraalkyl silicic acid shown in aqueous silicon dioxide colloidal sol, the following formula (2) or a kind of material in its oligopolymer or two or more mixture;
In the formula, R
3Be C
1-4Alkyl, the integer of m=0-10.
Preferably, in the described aqueous silicon dioxide colloidal sol, the weight content scope of silicon-dioxide is 10-60wt%; Be more preferably, the weight content scope of silicon-dioxide is 20-50wt%.
Preferably, in the described nanometer organic and inorganic sol-gel resin, inorganic silicon dioxide accounts for 5-70 weight %, is benchmark with the solid resin, and organosilane partly accounts for 30-95 weight %; Be more preferably, in the described nanometer organic and inorganic sol-gel resin, inorganic silicon dioxide accounts for 30-50 weight %, is benchmark with the solid resin, and organosilane partly accounts for 50-70 weight %.
Preferably, described other fluoropolymer is to be selected from one or more of tetrafluoroethylene and tetrafluoroethylene/perfluoro alkyl vinyl ether co-polymer; Be more preferably, the tetrafluoroethylene/perfluoro alkyl vinyl ether co-polymer is a tetrafluoroethylene/perfluoro methyl vinyl ether co-polymer.
Preferably, the mixture of described tetrafluoroethylene/hexafluoropropylene copolymer powder and other fluoropolymer powders is to be selected from the mixture of tetrafluoroethylene/hexafluoropropylene copolymer powder and polytetrafluorethylepowder powder or the mixture of tetrafluoroethylene/hexafluoropropylene copolymer powder and tetrafluoroethylene/perfluoro alkyl vinyl ether co-polymer.Be more preferably, in the mixture of tetrafluoroethylene/hexafluoropropylene copolymer powder and polytetrafluorethylepowder powder, polytetrafluorethylepowder powder accounts for the weight percent of mixture in the scope of 1-33 weight %, and tetrafluoroethylene/hexafluoropropylene copolymer accounts for the weight percent of mixture in the scope of 67-99 weight %.Be more preferably, in the mixture of tetrafluoroethylene/hexafluoropropylene copolymer powder and tetrafluoroethylene/perfluoro alkyl vinyl ether co-polymer, tetrafluoroethylene/perfluoro alkyl vinyl ether co-polymer powder accounts for the weight percent of mixture in the scope of 1-67 weight %, and described tetrafluoroethylene/hexafluoropropylene copolymer powder accounts for the weight percent of mixture in the scope of 33-99 weight %.
Preferably, described additive is selected from one or more in rheological agent or the anti-agent of blooming.
In a second aspect of the present invention, a kind of method for preparing above-mentioned heat resisting ink composition is provided, this method comprises also grinds described component (1) to (4) by described consumption uniform mixing, obtains required heat resisting ink composition.
In a third aspect of the present invention, provide a kind of above-mentioned heat resisting ink composition to be used for the purposes of water-based tetrafluoroethylene non-sticking cooking utensils or electrical equipment base plate.
Description of drawings
Fig. 1 is the operating process skeleton diagram of heat-resistant inks silk screen printing.
Embodiment
Heat resisting ink composition of the present invention comprises following component: (1) 30-70 weight % nanometer organic and inorganic sol-gel resin; (2) mixture of 20-50 weight % tetrafluoroethylene/hexafluoropropylene copolymer powder or tetrafluoroethylene/hexafluoropropylene copolymer powder and other fluoropolymer powders; (3) painted toner and (4) the 0.5-6 weight % additive used of 3-25 weight %, the weight percent number average is in the gross weight of heat resisting ink composition.
Below each component of heat resisting ink composition of the present invention is elaborated.
Organic and inorganic sol-gel resin
The component of heat resisting ink composition of the present invention (1) is a nanometer organic and inorganic sol-gel resin, and it comprises inorganic part as described below and organic moiety.
Inorganic part mainly refers to silicon-dioxide, and the source of silicon-dioxide can be aqueous silicon dioxide gel, or tetraalkyl silicic acid or its oligopolymer, and the source can be adopted wherein a kind of, also can be any two or more mixture.The particle size range of aqueous silicon dioxide colloidal sol is 5nm (nanometer)-70nm (nanometer), and preferred particle size range is 10-50nm (nanometer).The solid content of aqueous silicon dioxide colloidal sol is in the scope of 10-50% (w/w), and solid content is more preferably in the scope of 20-50% (w/w).Aqueous silicon dioxide colloidal sol can be alkalescence, also can be acidity.The structural formula of tetraalkyl silicic acid or its low-grade polymer is as follows:
R wherein
3Be C
1-4Alkyl, the integer of m=0-10.
Organic moiety is the hydrolyzate formation by silane shown at least a formula (1):
R
1 nSi(OR
2)
4-n (1)
In the formula, R
1Be C
1-6Alkyl, phenyl or γ-Racemic glycidol oxygen propyl group, R
2Be C
1-4Alkyl, n=1 or 2.
In nanometer organic and inorganic sol-gel resin, the shared ratio of described inorganic silicon dioxide part is 5-70wt% (is benchmark with solid part), is more preferably 30-50wt%; The shared ratio of organosilane part is 30-95wt%, is more preferably 50-70wt%.
Nanometer organic and inorganic sol-gel resin and synthetic method thereof all have description at many publications and patent documentation, Chinese patent publication number CN 1637045A for example, U.S. Pat 6187426B1, US 5013788, US5674625 etc., these bibliographic references are in conjunction with in the present invention.
Nanometer organic and inorganic sol-gel resin for example can come to synthesize by the following method: at first, aqueous silicon dioxide gel is adjusted to PH=2-4 with organic acid or mineral acid, and then adds silane, be hydrolyzed.If the aqueous silicon dioxide colloidal sol that uses is tart, can directly add silane, heated and stirred hydrolysis so; If the aqueous silicon dioxide colloidal sol that uses is alkaline, can alkaline silicon dioxide gel be transferred to acidity with organic acid or mineral acid so, used organic acid is such as but not limited to formic acid, acetate, propionic acid, maleic anhydride, citric acid etc., and used mineral acid is such as but not limited to hydrochloric acid, sulfuric acid, phosphoric acid, nitric acid etc.Hydrolysis temperature is 60-80 ℃, and hydrolysis time is 6-10 hour.Treat that hydrolysis finishes, add appropriate solvent again, such as but not limited to boiling points such as ethylene glycol monobutyl ether, diacetone alcohols in alcohols more than 150 ℃ or ether alcohol class, in the mode of vacuum concentration moisture content remaining in the reactant and the intact alcohols that is produced of silane hydrolyzate are removed again, add other low boiling point solvent at last, for example ethanol, isopropylcarbinol, Virahol etc. are adjusted solid part.
The mixture of tetrafluoroethylene/hexafluoropropylene copolymer or itself and other fluoropolymer
The component of heat resisting ink composition of the present invention (2) is tetrafluoroethylene/hexafluoropropylene copolymer (FEP) micro mist, the perhaps mixture of tetrafluoroethylene/hexafluoropropylene copolymer (FEP) micro mist and other fluoropolymer micro mist.Described other fluoropolymer micro mist can for example be tetrafluoroethylene, tetrafluoroethylene/perfluoro alkyl vinyl ether co-polymer (PFA), and tetrafluoroethylene/perfluoro alkyl vinyl ether co-polymer (PFA) is tetrafluoroethylene/perfluoro C preferably
1-6Alkyl vinyl ether co-polymer, especially preferably tetrafluoroethylene/perfluoro methyl ethylene ether copolymer (MFA).
Preferably, the particle diameter of tetrafluoroethylene/hexafluoropropylene copolymer (FEP) micro mist and other fluoropolymer micro mist is more preferably in the scope of 1-30 μ m in the scope of 0.1-35 μ m.
Described component (2) is 20-50 weight % at the shared part by weight of printing ink, is more preferably at 25-40 weight %.If fluoropolymer not fully in heat resisting ink composition, perhaps the content of fluoropolymer is lower than 20 weight %, has so that the adherence condition of poor takes place between tetrafluoroethylene non-viscous paint lacquer and the printing ink.Therefore, the fluoropolymer of adding appropriate amount is necessary in heat resisting ink composition.
Under the situation of the mixture of tetrafluoroethylene/hexafluoropropylene copolymer powder and polytetrafluorethylepowder powder, preferably, polytetrafluorethylepowder powder accounts for the weight percent of mixture in the scope of 1-33 weight %, and tetrafluoroethylene/hexafluoropropylene copolymer accounts for the weight percent of mixture in the scope of 67-99 weight %.
Under the situation of the mixture of tetrafluoroethylene/hexafluoropropylene copolymer powder and tetrafluoroethylene/perfluoro alkyl vinyl ether co-polymer (PFA), preferably, the weight percent that tetrafluoroethylene/perfluoro alkyl vinyl ether co-polymer (PFA) powder accounts for mixture is in the scope of 1-67 weight %, and described tetrafluoroethylene/hexafluoropropylene copolymer powder accounts for the weight percent of mixture in the scope of 33-99 weight %.
The painted toner of using
The component of heat resisting ink composition of the present invention (3) is the painted toner of using.Can be used for of the present invention painted be nontoxic and heat-resisting high toner with toner, it can be inorganic toner, also can be organic toner, such as but not limited to: titanium dioxide, the cobalt copper-manganese is black, the chromium copper-manganese is black, manganese black, carbon black, titan yellow, cobalt blue, cobalt green, phthalocyanine green, organic red etc.Paintedly can use separately, also can two or more mixing use with toner.Can select the toner that is fit to according to requirement of client.
Additive
The component of heat resisting ink composition of the present invention (4) is an additive, and additive comprises rheological agent, the anti-agent etc. of blooming.The present invention can also comprise some other additive, the Disperbyk-190 that is produced such as but not limited to: dispersion agent, as German Bi Ke (BYK), Disperbyk, the Ailquest A-1230 that unusual Toshiba produced etc.Rheological agent includes but not limited to the aerosil R972 that produced as German Sa (Degussa), the BYK-410 that German Bi Ke (BYK) is produced, the organobentonite Bentone27 that U.S. Elementis Specialties is produced etc.; The anti-agent of blooming includes but not limited to the DCQ2-5211 that produced as Dow corning (Dow Corning), the CoatOSi 1211 that unusual Toshiba produced, the Germany watt gram ADDID-110 that (Wacker) produced etc.
These additives account for the weight percent of heat resisting ink composition in the scope of 0.5-6 weight %, are more preferably in the scope of 1-4 weight %.
Be used for edible occasions such as cooker at heat resisting ink composition of the present invention, should notice that selected additive should be nontoxic, meet united States food and drug administration (FDA) can with the standard of Food Contact.
Heat resisting ink composition of the present invention can prepare by the following method: suitable dispersion agent, rheological agent, the anti-agent of blooming are stirred with nanometer organic and inorganic sol-gel resin earlier, add painted again with toner and fluoropolymer (component (2)), after stirring, grind with three rollers again, preferably 3-5 time, make heat resisting ink composition.As required, can add appropriate solvent to adjust viscosity.
Heat resisting ink composition of the present invention can be coated with or two printing-inks that are coated with above tetrafluoroethylene non-viscous paint as water-based two.Be used for two be coated with or two be coated with above tetrafluoroethylene non-viscous paint heat resisting ink composition silk screen printing operating process as shown in Figure 1.
The excellent heat resistance of heat resisting ink composition of the present invention all has good adherence with the priming paint and the finish paint of water-based tetrafluoroethylene non-viscous paint, and is affected by environment little and can not damage silk screen.Heat resisting ink composition of the present invention for example can be used as the printing ink of water-based teflon coating, when being applied in the ink printing of non-sticking cooking utensils, can increase the outward appearance and the texture of non-sticking cooking utensils.
Below in conjunction with specific embodiment, further set forth the present invention.Should be understood that these embodiment only to be used to the present invention is described and be not used in and limit the scope of the invention.The experimental technique of unreceipted actual conditions in the following example usually according to normal condition, or carries out according to the condition that manufacturer advises.Unless otherwise indicated, otherwise all umbers are weight part, and all per-cents are weight percentage.
Composite formula in following examples, except comparative example, other all within the scope of the present invention.
Employed water-based two coating tetrafluoroethylene coating are coating products of Intelligence Technology (China) Co., Ltd. among the embodiment, and the trade mark of used priming paint is W4089-10022, and the trade mark of finish paint is W4069-25011.
The test mode of adherence is to adopt stroke lattice adherence testing method of GB/T9286-1998, and employed test tape is that the model of 3M is 898 sealing tape.
Synthesizing of embodiment 1 nanometer organic and inorganic sol-gel resin (SG-1)
At one mechanical stirrer is housed, temperature regulator, in 1 liter of reactor of well heater and prolong, (silica weight content is 34% to the aqueous silicon dioxide colloidal sol of adding 200g earlier, the pH value is 3.0, median size is 20nm), the methyltrimethoxy silane that adds 207.2g again, in stirring at room after 8 hours, temperature being raised to 60 ℃ continues to stir 2 hours again, make methyltrimethoxy silane finish hydrolysis, the ethylene glycol monobutyl ether stir about that adds 72.8g again is after 30 minutes, again reactant is moved on to vacuum concentrator, under 60-70 ℃, unreacted methyltrimethoxy silane and residual water and methyl alcohol are removed, the measure theory solid content, after reaching theoretical solid content (about 2-3 hour), add the Virahol of 324g again, solid content is adjusted at 30wt%.
Synthesizing of embodiment 2 nanometer organic and inorganic sol-gel resins (SG-2)
At one mechanical stirrer is housed, temperature regulator, in 1 liter of reactor of well heater and prolong, (silica weight content is 20% to the aqueous silicon dioxide colloidal sol of adding 340g earlier, the pH value is 3.0, median size: 10nm), adding the methyltrimethoxy silane of 200g and the tetraethoxy estersil of 80g again adds, in stirring at room after 8 hours, temperature being raised to 60 ℃ continues to stir 2 hours again, make methyltrimethoxy silane and tetraethoxy estersil complete hydrolysis, the ethylene glycol monobutyl ether that adds 100g again, behind the stir about 30 minutes, again reactant is moved on to vacuum concentrator,, remove methyl alcohol and ethanol that residual water and silane hydrolyzate produce at 60-70 ℃ of vacuum concentration, concentrate after for some time, the sampling and measuring solid content is waited to reach (about 2-3 hour) after the theoretical solid content, stops to concentrate, add the Virahol of 340g, solid content is transferred to 30wt%.
Embodiment 3
SG-1 with 60 weight parts, the tetrafluoroethylene/hexafluoropropylene copolymer of 27 weight parts (FEP) micro mist (the Ultraflon FP-10 that U.S. Laurel Products LLC is produced, median size is 4.1 μ m), the Paliogen red K3911HD that BASF produced of 10 weight parts is as red toner, 2.5 the aerosil R972 that the German Sa (Degussa) of weight part is produced is as rheological agent, be the anti-agent of blooming with the Germany watt gram ADDID-110 that (Wacker) produced of 0.5 weight part, earlier these components were stirred 30 minutes fast, after it is uniformly dispersed, after utilizing three rollers to grind 3-5 time again, can obtain the heat resisting ink composition that water-based tetrafluoroethylene non-viscous paint of the present invention is used.
Embodiment 4-8
Prepare heat resisting ink composition according to embodiment 3 identical methods, each component and content in the composition are as shown in table 1.
Embodiment 4 and 5 mainly is the composition that changes fluoropolymer, and the polytetrafluoroethylene (PTFE) micro mist that embodiment 4 uses is the Ultraflon MP-7T that is produced available from U.S. Laurel Products LLC, and median size is 4.0 μ m; The tetrafluoroethylene/perfluoro methyl vinyl ether co-polymer (MFA) that embodiment 5 uses is the MFA P6010 available from Belgian Su Wei company (Solvay Solexis), and median size is 29 μ m.
Embodiment 6 replaces red toner with the Ti-Pure R-960 of Du Pont (Du Pont) as titanium dioxide.
Embodiment 7 and 8 replaces SG-1 with SG-2.
Comparative example 1-4
Adopt method similar to Example 3 to prepare heat resisting ink composition, different is that comparative example 1 does not contain any fluoropolymer; Comparative example 2 replaces tetrafluoroethylene/hexafluoropropylene copolymer (FEP) with tetrafluoroethylene; Comparative example 3 replaces tetrafluoroethylene/hexafluoropropylene copolymer (FEP) with tetrafluoroethylene/perfluoro methyl ethylene ether copolymer (MFA); Comparative example 4 replaces SG-1 with polyethersulfone.
Table 1
All quote in this application as a reference at all documents that the present invention mentions, just quoted as a reference separately as each piece document.Should be understood that in addition those skilled in the art can make various changes or modifications the present invention after having read above-mentioned teachings of the present invention, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
Claims (14)
1. heat resisting ink composition, said composition comprises following component:
(1) nanometer organic and inorganic sol-gel resin, the weight percent that accounts for heat resisting ink composition is 30-70%, described nanometer organic and inorganic sol-gel resin comprises following organic moiety and inorganic part:
Organic moiety is the hydrolyzate formation by silane shown at least a formula (1):
R
1 nSi(OR
2)
4-n (1)
In the formula, R
1Be C
1-6Alkyl, phenyl or γ-Racemic glycidol oxygen propyl group, R
2Be C
1-4Alkyl, n=1 or 2;
Inorganic part provides by being selected from tetraalkyl silicic acid shown in aqueous silicon dioxide colloidal sol, the following formula (2) or a kind of material in its oligopolymer or two or more mixture;
In the formula, R
3Be C
1-4Alkyl, the integer of m=0-10;
(2) mixture of tetrafluoroethylene/hexafluoropropylene copolymer powder or tetrafluoroethylene/hexafluoropropylene copolymer powder and other fluoropolymer powders, the weight percent that accounts for heat resisting ink composition is 20-50%,
(3) the painted toner of using, the weight percent that accounts for heat resisting ink composition is 3-25%,
(4) additive, the weight percent that accounts for heat resisting ink composition is 0.5-6%.
2. composition as claimed in claim 1 is characterized in that,
The weight percent that described component (1) accounts for heat resisting ink composition is 40-65%,
The weight percent that described component (2) accounts for heat resisting ink composition is 25-40%,
The weight percent that described component (3) accounts for heat resisting ink composition is 5-20%,
The weight percent that described component (4) accounts for heat resisting ink composition is 1-4%.
3. composition as claimed in claim 1 is characterized in that, in the described aqueous silicon dioxide colloidal sol, the weight content scope of silicon-dioxide is 10-60wt%.
4. composition as claimed in claim 1 is characterized in that, in the aqueous silicon dioxide colloidal sol, the weight content scope of silicon-dioxide is 20-50wt%.
5. composition as claimed in claim 1 is characterized in that, in the described nanometer organic and inorganic sol-gel resin, inorganic silicon dioxide accounts for 5-70 weight %, is benchmark with the solid resin, and organosilane partly accounts for 30-95 weight %.
6. composition as claimed in claim 1 is characterized in that, in the described nanometer organic and inorganic sol-gel resin, inorganic silicon dioxide accounts for 30-50 weight %, is benchmark with the solid resin, and organosilane partly accounts for 50-70 weight %.
7. composition as claimed in claim 1 or 2 is characterized in that, described other fluoropolymer is to be selected from one or more of tetrafluoroethylene and tetrafluoroethylene/perfluoro alkyl vinyl ether co-polymer.
8. composition as claimed in claim 7 is characterized in that, the tetrafluoroethylene/perfluoro alkyl vinyl ether co-polymer is a tetrafluoroethylene/perfluoro methyl ethylene ether copolymer.
9. composition as claimed in claim 1 or 2, it is characterized in that the mixture of described tetrafluoroethylene/hexafluoropropylene copolymer powder and other fluoropolymer powders is to be selected from the mixture of tetrafluoroethylene/hexafluoropropylene copolymer powder and polytetrafluorethylepowder powder or the mixture of tetrafluoroethylene/hexafluoropropylene copolymer powder and tetrafluoroethylene/perfluoro alkyl vinyl ether co-polymer.
10. composition as claimed in claim 9, it is characterized in that, in the mixture of tetrafluoroethylene/hexafluoropropylene copolymer powder and polytetrafluorethylepowder powder, polytetrafluorethylepowder powder accounts for the weight percent of mixture in the scope of 1-33 weight %, and tetrafluoroethylene/hexafluoropropylene copolymer accounts for the weight percent of mixture in the scope of 67-99 weight %.
11. composition as claimed in claim 9, it is characterized in that, in the mixture of tetrafluoroethylene/hexafluoropropylene copolymer powder and tetrafluoroethylene/perfluoro alkyl vinyl ether co-polymer, tetrafluoroethylene/perfluoro alkyl vinyl ether co-polymer powder accounts for the weight percent of mixture in the scope of 1-67 weight %, and described tetrafluoroethylene/hexafluoropropylene copolymer powder accounts for the weight percent of mixture in the scope of 33-99 weight %.
12. composition as claimed in claim 1 or 2 is characterized in that, described additive is selected from one or more in rheological agent or the anti-agent of blooming.
13. a method for preparing each described heat resisting ink composition among the claim 1-12, this method comprise described component (1) to (4) is also ground by described consumption uniform mixing, obtain required heat resisting ink composition.
14. each described heat resisting ink composition is used for the purposes of water-based tetrafluoroethylene non-sticking cooking utensils or electrical equipment base plate among the claim 1-12.
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| CN102585605B (en) * | 2012-03-01 | 2016-09-14 | 慧智科技（中国）有限公司 | Water color ink for cook utensil non-sticking lining |
| CN104999601A (en) * | 2015-06-17 | 2015-10-28 | 东莞市佳丹润滑油有限公司 | Mould release agent special for PCB and preparing method thereof |
| CN105167613B (en) * | 2015-10-23 | 2017-08-04 | 张李积 | A kind of tea cooking machine of Pu'er tea |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5013788A (en) * | 1988-12-28 | 1991-05-07 | Central Glass Company, Limited | Liquid coating composition and coating method for forming hard-coat film on plastics |
| US5674625A (en) * | 1993-11-10 | 1997-10-07 | Central Glass Company, Limited | Multilayered water-repellent film and method of forming same on glass substrate |
| CN1237187A (en) * | 1996-11-15 | 1999-12-01 | 新材料公共服务公司研究所 | Composite material |
| JP3087537B2 (en) * | 1993-10-07 | 2000-09-11 | 松下電器産業株式会社 | Pat transfer printing ink and heated container with the ink |
| CN1637045A (en) * | 2004-12-09 | 2005-07-13 | 同济大学 | Prepn of single-component high-hardness silicone glass resin |
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2007
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5013788A (en) * | 1988-12-28 | 1991-05-07 | Central Glass Company, Limited | Liquid coating composition and coating method for forming hard-coat film on plastics |
| JP3087537B2 (en) * | 1993-10-07 | 2000-09-11 | 松下電器産業株式会社 | Pat transfer printing ink and heated container with the ink |
| US5674625A (en) * | 1993-11-10 | 1997-10-07 | Central Glass Company, Limited | Multilayered water-repellent film and method of forming same on glass substrate |
| CN1237187A (en) * | 1996-11-15 | 1999-12-01 | 新材料公共服务公司研究所 | Composite material |
| CN1637045A (en) * | 2004-12-09 | 2005-07-13 | 同济大学 | Prepn of single-component high-hardness silicone glass resin |
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