CN101420823B - Optical module mounting construction - Google Patents
Optical module mounting construction Download PDFInfo
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- CN101420823B CN101420823B CN2007101241556A CN200710124155A CN101420823B CN 101420823 B CN101420823 B CN 101420823B CN 2007101241556 A CN2007101241556 A CN 2007101241556A CN 200710124155 A CN200710124155 A CN 200710124155A CN 101420823 B CN101420823 B CN 101420823B
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- optical module
- pcb board
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Abstract
The invention relates to an optical module installing structure comprising a PCB board and an optical module which is arranged on the PCB board, the PCB board comprises ground on which the optical module is arranged, a outer metallic shell of the optical module is electrically connected with the ground which the optical module is arranged, and the minimum distance from the outer metallic shell of the optical module to a CPU chip, a CPLD chip, a SDRAM chip and a crystal oscillator chip on the PCB board is greater than or equal to 3cm. The optical module installing structure solves the static electricity protection problem of installing the optical module on a PCB plastic panel and ensures an optical interface to pass the EMS static electricity test; meanwhile, for a certain circuit board which has great intensity and can not guide and connect the ground of the optical module onto a protective ground GNDP of a system, the outer metallic shell of the optical module is connected with the working ground of the PCB board, thereby breaking the conventional design, overcoming the technical prejudice and meeting the requirements for static electricity protection of the optical interface.
Description
Technical field
The present invention relates to a kind of pcb board structure, more particularly, relate to a kind of mounting structure of optical module on pcb board that is installed on the plastic front board.
Background technology
By electromagnetic compatibility EMC standard, be the essential condition that communication product enters the international market, and the static vulnerability to jamming is one of requirement of EMC standard.
The light mouth is the common interfaces of communication product, and the optical module shell is a metal shell, and electrostatic test will will be carried out to the light mouth according to standard-required if be touched in the position of installing in system.If the design of light mouth electrostatic defending is bad, can not only will influence the communication performance of light mouth and the performance and the life-span of communication product by standard testing, also will have influence on the profit of the market access, the market share and the enterprise of communication product.
In order to guarantee that the light mouth obtains reliable electrostatic protection; in traditional design; normally optical module is installed on the metal decking of system; in this structure; optical module closely contacts with metal decking; the whole metal architecture of metal decking homologous ray links into an integrated entity; so just provide big metal flat for optical module; big ground capacity; and provide the low-impedance electrostatic induced current channel of releasing for light mouth static; the static of light mouth and the electrostatic induced current when the light mouth carried out electrostatic test can flow to the earth by the metal architecture of metal decking and whole system, thereby for the light mouth provides good electrostatic defending, guarantee that the light mouth is by the EMC electrostatic test.
In order to reduce the communication product cost, improve the competitiveness of product in market, need to consider optical module is installed on the plastic front board.Yet, because this structural design can not provide big metal flat for optical module, the low-impedance electrostatic induced current channel of releasing can not be provided, brought thorny light mouth electrostatic defending problem, therefore, do not occur as yet so far optical module is installed in this structure on the PCB plastic front board.
Summary of the invention
The technical problem to be solved in the present invention is, a kind of optical module mounting construction is provided, and the solution optical module is installed in the light mouth electrostatic defending problem on the plastic front board.
The technical solution adopted for the present invention to solve the technical problems is: construct a kind of optical module mounting construction, it is characterized in that: comprise pcb board and the optical module that is installed on this pcb board, described pcb board comprises the ground that this optical module is installed;
The ground of described installation optical module is the place of working of described pcb board, and the ground of perhaps described installation optical module is and the optical module access area separately, place of working of described pcb board that contact pin is drawn in described optical module access area with receiving the circuit board systems protection;
The metal shell of this optical module apart from the minimum range of the cpu chip on this pcb board, CPLD chip, SDRAM chip and crystal oscillator chip more than or equal to 3 centimetres.
In optical module mounting construction of the present invention, the minimum separation distances in described optical module access area and described pcb board place of working is more than or equal to 1 millimeter; Described optical module access area is by being arranged on this pcb board side edge and drawing contact pin with described pcb board place of working PCB track separately with receiving the circuit board systems protection, the minimum separation distances in this PCB track and this pcb board place of working is more than or equal to 1 millimeter, and this PCB track minimum widith is more than or equal to 1 millimeter; Clock signal on the described pcb board, sensitive signal and Sensitive Apparatus apart from the minimum range of this PCB track more than or equal to 2 centimetres.
In optical module mounting construction of the present invention, described optical module access area and described pcb board place of working minimum separation distances are 1 millimeter to 3 millimeters, the minimum separation distances in described PCB track and described pcb board place of working is 1 millimeter to 3 millimeters, 1 millimeter to 2 millimeters of described PCB track minimum widith, the clock signal on the described pcb board, sensitive signal and Sensitive Apparatus are 2 centimetres to 4 centimetres apart from the minimum range of this PCB track.
In optical module mounting construction of the present invention, described pcb board comprises two-layer at least aspect, except that signals layer, all the other each aspects all are provided with the optical module access area corresponding to described optical module installation site, optical module metal shell pin is set in described optical module access area via hole is installed, described via hole along edge, described optical module ground area and the centre position be provided with,, the optical module access area of described all the other each aspects is electrically connected with this optical module metal shell pin; Described all the other each aspects be arranged on its this layer edge connect its this layer optical module access area and circuit board systems protection ground contact pin and with its this layer circuit board place of working PCB track separately, PCB track of described each layer and the circuit board place of working of other layers do not overlap.
In optical module mounting construction of the present invention, the minimum range of cpu chip, CPLD chip, SDRAM chip and crystal oscillator chip on the described pcb board of described optical module metal shell distance is 3 centimetres to 5 centimetres.
In optical module mounting construction of the present invention, described optical module quantity is one, two or polylith.
In optical module mounting construction of the present invention, when the ground of described installation optical module was the place of working of described pcb board, described pcb board comprised two-layer at least aspect, except that signals layer, comprised a complete plane, place of working in the aspect of described pcb board at least; Except that signals layer, all the other each layers are provided with optical module metal shell pin via hole are installed, described via hole along edge, described optical module ground area and the centre position be provided with, this optical module metal shell pin is connected with each ground level on the described pcb board.
Implement optical module mounting construction of the present invention, compared with the prior art, its beneficial effect is:
1. by appropriate design and checking repeatedly, solved the electrostatic defending problem that optical module is installed on the plastic front board of PCB, guaranteed that the light mouth is by the EMC electrostatic test;
2. the ground of optical module can't be drawn in, the design big for some density the system of receiving protection the circuit board on the GNDP, the metal shell of optical module is connect the pcb board place of working, broken conventional design, overcome technology prejudice, satisfy the requirement of light mouth electrostatic defending.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the embodiment one of optical module mounting construction of the present invention.
Fig. 2 is the embodiment two of optical module mounting construction of the present invention.
Embodiment
Embodiment one
As shown in Figure 1, optical module mounting construction of the present invention comprises pcb board 10 and the optical module 8 that is installed on the pcb board 10, the aspect of pcb board can be bilayer or multilayer, (except the signals layer) all is designed to optical module access area 7 on each PCB aspect of (comprising board edge) in optical module 8 regions, in the access area 7 along edge, optical module access area and the centre position via hole (not shown) of some is set, the pin positions of the position of via hole and spacing and optical module metal shell adapts, common via hole spacing in twos is about 2cm, and optical module 8 is electrically connected by the ground of pin each layer with these of its metal shell.Each aspect upper side edge edge on optical module 7 place pcb boards 10, all lay PCB track 2 (can lay at the bilateral edge also and can lay) at one-sided edge, the width D of PCB track is not less than 1 millimeter, test shows, D gets 1 millimeter～2 millimeters, and optical module static can be obtained good releasing effect.Logical PCB track 2 draws the access area 7 of optical module design on the protection ground GNDP contact pin 9 of receiving circuit board systems, like this, for the electrostatic induced current of optical module 8 provides the low-impedance channel of releasing, has reduced electrostatic interference amplitude and energy.
Simultaneously, for fear of overlap capacitance electrostatic interference being guided to the place of working influences the circuit operate as normal, and PCB track 2 can not overlap with the place of working (GND) 1 of circuit board inside.PCB track 2 and place of working 1 spacing distance A be 1 millimeter or more than, test shows, A get 1 millimeter～3 millimeters more reasonable.
The spacing distance C in optical module access area 7 and circuit board place of working 1 get 1.0 millimeters or more than, test shows, C get 1～3 millimeter more reasonable.It is fixed, wide more good more that the width E of optical module access area 7 comes according to the device density on the pcb board, gets 1 centimetre～3 centimetres generally speaking.
For reducing of the influence of electrostatic interference signal to chip, Primary Component on the pcb board 10 such as cpu chip 5, CPLD chip 6, SDRAM chip 4, crystal oscillator 3 etc. are 3 centimetres with the minimum range (B1, B2, B3, B4) of optical module metal shell, test shows, this minimum range get 3 centimetres～5 centimetres more reasonable.
Have influence on the operate as normal of clock signal, sensitive signal and Sensitive Apparatus for the antenna effect that prevents PCB track 2, clock signal on the pcb board, sensitive signal and Sensitive Apparatus should be away from PCB tracks 2, get more than 2 centimetres with the minimum range of optical module metal shell, test shows, get 2 centimetres～4 centimetres more reasonable.
Embodiment two
As shown in Figure 2, present embodiment with the place of working 1 of pcb board 10 directly as the ground of the outer cover metal pin of optical module 8, Primary Component on the pcb board 10 such as cpu chip 5, CPLD chip 6, SDRAM chip 4, crystal oscillator 3 etc. are 3 centimetres with the minimum range (B1, B2, B3, B4) of optical module metal shell, make the static on the optical module 8 cause that the fluctuation in place of working is not enough to influence the operate as normal of said chip.Test shows, this minimum range get 3 centimetres～5 centimetres more reasonable.
It is unreasonable also unallowed that present embodiment is considered on traditional design.But for the light mouth, not having the lightning Protection problem, also do not have the EFT interference problem, is feasible with the place of working on the circuit board as optical module electrostatic leakage ground therefore.By the design and the verification experimental verification of present embodiment, optical module 8 electrostatic defending requirements, and do not influence other performances.Present embodiment has solved the protection ground GNDP that draws the system of receiving in the ground that is difficult on the big density board structure of circuit optical module 8 went up thereby be difficult to install optical module 8 on the plastic front board of PCB a difficult problem.
In the present embodiment, one or above ground level directly join on optical module 8 and the pcb board, and optical module 81 connection has very low impedance to the place of working, for static provides the channel of well releasing.When pcb board had one and an above ground level, the place of working 1 of pcb board can provide big ground capacity for optical module 8.
Claims (9)
1. optical module mounting construction is characterized in that: comprise pcb board and be installed in optical module on this pcb board, described pcb board comprises the ground that this optical module is installed, and the metal shell of this optical module is electrically connected with the ground of this installation optical module;
The ground of described installation optical module is the place of working of described pcb board, and the ground of perhaps described installation optical module is and the optical module access area separately, place of working of described pcb board that contact pin is drawn in described optical module access area with receiving the circuit board systems protection;
The metal shell of this optical module apart from the minimum range of the cpu chip on this pcb board, CPLD chip, SDRAM chip and crystal oscillator chip more than or equal to 3 centimetres.
2. optical module mounting construction as claimed in claim 1 is characterized in that: the minimum separation distances in described optical module access area and described pcb board place of working is more than or equal to 1 millimeter; Described optical module access area is by being arranged on this pcb board side edge and drawing contact pin with described pcb board place of working PCB track separately with receiving the circuit board systems protection, the minimum separation distances in this PCB track and this pcb board place of working is more than or equal to 1 millimeter, and this PCB track minimum widith is more than or equal to 1 millimeter; Clock signal on the described pcb board, sensitive signal and Sensitive Apparatus apart from the minimum range of this PCB track more than or equal to 2 centimetres.
3. optical module mounting construction as claimed in claim 2, it is characterized in that: described optical module access area and described pcb board place of working minimum separation distances are 1 millimeter to 3 millimeters, the minimum separation distances in described PCB track and described pcb board place of working is 1 millimeter to 3 millimeters, 1 millimeter to 2 millimeters of described PCB track minimum widith, the clock signal on the described pcb board, sensitive signal and Sensitive Apparatus are 2 centimetres to 4 centimetres apart from the minimum range of this PCB track.
4. optical module mounting construction as claimed in claim 3, it is characterized in that: described pcb board comprises two-layer at least aspect, except that signals layer, all the other each aspects all are provided with the optical module access area corresponding to described optical module installation site, optical module metal shell pin is set in described optical module access area via hole is installed, described via hole along edge, described optical module ground area and the centre position be provided with, the optical module access area of described all the other each aspects is electrically connected with this optical module metal shell pin; Described all the other each aspects be arranged on its this layer edge connect its this layer optical module access area and circuit board systems protection ground contact pin and with its this layer circuit board place of working PCB track separately, PCB track of described each layer and the circuit board place of working of other layers do not overlap.
5. as the described optical module mounting construction of one of claim 1 to 4, it is characterized in that: the minimum range of cpu chip, CPLD chip, SDRAM chip and crystal oscillator chip on the described pcb board of described optical module metal shell distance is 3 centimetres to 5 centimetres.
6. as the described optical module mounting construction of one of claim 1 to 4, it is characterized in that: described optical module quantity is one, two or polylith.
7. optical module mounting construction as claimed in claim 1, it is characterized in that: when the ground of described installation optical module is the place of working of described pcb board, described pcb board comprises two-layer at least aspect, except that signals layer, comprises a complete plane, place of working in the aspect of described pcb board at least; Except that signals layer, all the other each layers are provided with optical module metal shell pin via hole are installed, described via hole along edge, described optical module ground area and the centre position be provided with, this optical module metal shell pin is connected with each ground level on the described pcb board.
8. optical module mounting construction as claimed in claim 7 is characterized in that: the minimum range of cpu chip, CPLD chip, SDRAM chip and crystal oscillator chip on the described pcb board of described optical module metal shell distance is 3 centimetres to 5 centimetres.
9. optical module mounting construction as claimed in claim 7 is characterized in that: described optical module quantity is one, two or polylith.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101241556A CN101420823B (en) | 2007-10-26 | 2007-10-26 | Optical module mounting construction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101241556A CN101420823B (en) | 2007-10-26 | 2007-10-26 | Optical module mounting construction |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101420823A CN101420823A (en) | 2009-04-29 |
| CN101420823B true CN101420823B (en) | 2011-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101241556A Active CN101420823B (en) | 2007-10-26 | 2007-10-26 | Optical module mounting construction |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595772B (en) * | 2012-01-19 | 2014-07-02 | 福建星网视易信息系统有限公司 | Method for preventing interface burning-out of equipment with external equipment interface |
| CN104320905A (en) * | 2014-08-25 | 2015-01-28 | 深圳市共进电子股份有限公司 | Printed circuit board, PCBA (Printed Circuit Board Assembly) and electronic equipment |
| CN107529022B (en) * | 2016-06-21 | 2021-12-07 | 中兴通讯股份有限公司 | AV interface circuit and method for manufacturing the same |
| CN109819584B (en) * | 2019-03-07 | 2021-08-10 | 武汉光迅科技股份有限公司 | Multilayer FPC |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4169281A (en) * | 1978-06-26 | 1979-09-25 | Gte Sylvania Incorporated | Multilamp photoflash unit with electrostatic protection |
| US6091605A (en) * | 1996-04-26 | 2000-07-18 | Ramey; Samuel C. | Memory card connector and cover apparatus and method |
| KR20030076470A (en) * | 2003-06-19 | 2003-09-26 | 예원플라즈마 주식회사 | An apparutus and method for EMI and ESD shielding using plastic can in borad of electronic equipment |
| CN1620226A (en) * | 2003-11-21 | 2005-05-25 | 大德电子株式会社 | Method of manufacturing capacitor-embedded printed circuit board (PCD) |
-
2007
- 2007-10-26 CN CN2007101241556A patent/CN101420823B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4169281A (en) * | 1978-06-26 | 1979-09-25 | Gte Sylvania Incorporated | Multilamp photoflash unit with electrostatic protection |
| US6091605A (en) * | 1996-04-26 | 2000-07-18 | Ramey; Samuel C. | Memory card connector and cover apparatus and method |
| KR20030076470A (en) * | 2003-06-19 | 2003-09-26 | 예원플라즈마 주식회사 | An apparutus and method for EMI and ESD shielding using plastic can in borad of electronic equipment |
| CN1620226A (en) * | 2003-11-21 | 2005-05-25 | 大德电子株式会社 | Method of manufacturing capacitor-embedded printed circuit board (PCD) |
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| Publication number | Publication date |
|---|---|
| CN101420823A (en) | 2009-04-29 |
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