CN101660739B - Lamp - Google Patents

Lamp Download PDF

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Publication number
CN101660739B
CN101660739B CN200910176109XA CN200910176109A CN101660739B CN 101660739 B CN101660739 B CN 101660739B CN 200910176109X A CN200910176109X A CN 200910176109XA CN 200910176109 A CN200910176109 A CN 200910176109A CN 101660739 B CN101660739 B CN 101660739B
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CN
China
Prior art keywords
light source
lamp
mentioned
component
source support
Prior art date
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Active
Application number
CN200910176109XA
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Chinese (zh)
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CN101660739A (en
Inventor
大泽滋
森川和人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
Toshiba Lighting and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005221571A external-priority patent/JP4482706B2/en
Priority claimed from JP2005221688A external-priority patent/JP4725231B2/en
Priority claimed from JP2005371406A external-priority patent/JP4569465B2/en
Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Publication of CN101660739A publication Critical patent/CN101660739A/en
Application granted granted Critical
Publication of CN101660739B publication Critical patent/CN101660739B/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F21V23/009—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing the casing being inside the housing of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

The invention provides a lamp which includes: an outer shell having heat conductivity, wherein the outer shell includes a light source support, a heat radiating surface exposed to the outside of the outer shell and integrated with the heat radiating surface, and a storage portion provided at the inner side of the heat radiating surface and having an opening end at the opposite side of the light source support; a lighting circuit, including a circuit board assembling the circuit components, wherein the circuit board lights up the light source contained in the storage portion; a resinous connecting element, wherein a latching protuberance is formed on the peripheral surface of the front end portion of the connecting element, when the front end portion is embedded to the opening end of the outer shell, the connecting element and the outer shell are latched by the latching protuberance; a light source supported on the light source support, wherein the light source is heated during lighting, and thermally connected to the light source support; and a transparent cover provided on the light source support in mode of covering the outer shell.

Description

Lamp
The application's case is that denomination of invention is " lamp ", and application number is dividing an application of 200610066778.8 patent application case.
Female case of the application's case is based on previous Japanese patent application case 2005-112339 (in application on April 8th, 2005), Japanese patent application case 2005-221571 (in application on July 29th, 2005), Japanese patent application case 2005-221688 (in application on July 29th, 2005); And Japanese patent application case 2005-371406 (in application on November 26th, 2005); And require priority wherein, its full content is disclosed in this with reference example.
The application of this division also requires above-mentioned priority.
Technical field
The invention relates to will be for example semiconductor element as the light emitting diode (light-emitting diode) as the lamp of light source, particularly relevant for when lamp is lit a lamp, can the heat that light source sends being dispersed into expeditiously the outside lamp of lamp.
Background technology
Lamp as alternative incandescent lamp is used light source, and known have a light emitting diode.When light emitting diode followed its temperature to rise, its light output will descend and the life-span also will shorten.So, must be able to suppress the temperature rising of light emitting diode as the lamp of light source with light emitting diode.
For example, opening in the 2001-243809 communique to disclose in Japanese Patent Laid has the LED electric light, and this LED electric light prevents that through the thermal diffusivity that improves light emitting diode light emitting diode is overheated.Previous LED electric light comprises lamp body, metal substrate and a plurality of light emitting diode.Lamp body is made up of following: at one end have lamp socket (base) and have the metal system radiating part of opening in other end setting, and be provided with translucent cover at the metal system radiating part other end.Metal system radiating part is the shape that is horn-like expansion from an end towards the other end.
Metal substrate is through having the high heat conduction component of electrical insulating property, and the opening of the metal system of being fixed on radiating part.Light emitting diode is supported by metal substrate and is covered by translucent cover.
When the LED electric light threw light on, the heat that light emitting diode sent was delivered to metal system radiating part from metal substrate through high heat conduction component.The heat of the metal system of being delivered to radiating part can be distributed to the atmosphere from the outer peripheral face of metal system radiating part.Thus, it is overheated to suppress light emitting diode, and can improve the luminous efficiency (luminous efficacy) of LED electric light.
According to the LED electric light that Japanese publication communique is disclosed, the metal system radiating part that distributes the heat that light emitting diode sends is different inscapes with the metal substrate that light emitting diode is installed.So in the structure, metal substrate and metal system radiating part combine through high heat conduction component, but can't avoid producing thermal resistance (thermalresistance) at the bound fraction of metal substrate and metal system radiating part.Therefore, can influence the heat conduction of between metal substrate and metal system radiating part, carrying out, and can't the heat of light emitting diode be delivered to metal system radiating part from metal substrate expeditiously.Therefore, waiting further improvement aspect the temperature rising that suppresses light emitting diode.
And then the lamp circuit that makes light-emitting diode lighting in the above-mentioned LED electric light is necessary inscape.When lamp circuit being packed into the LED electric light, must accomplish can not cause the LED electric light to become big because having lamp circuit.Well-known simultaneously, if temperature is too high at ordinary times for lamp circuit, then the reliability of circuit operation will descend, and the life-span will suffer damage.So when lamp circuit being packed into the LED electric light, indispensable is that the inhibition point circuit for lamp is overheated.Yet, in the publication communique of above-mentioned Japan, do not have announcement about lamp circuit.Thus, in the LED electric light that in above-mentioned publication communique, discloses, can't satisfy and suppress maximization of LED electric light and the overheated requirement of lamp circuit.
Summary of the invention
The object of the invention is to provide a kind of lamp; This lamp comprises: the outer component with thermal conductivity; Above-mentioned outer component comprises light source support, expose at the outside radiating surface of above-mentioned outer component and to be arranged on above-mentioned radiating surface inboard and be provided with the resettlement section of openend at the opposition side of above-mentioned light source support, and above-mentioned light source support and above-mentioned radiating surface are integrally formed; Lamp circuit comprises the circuit substrate of assembling circuit part; Resinous connecting elements, the outer peripheral face of its leading section is formed with the fastening projection, when this leading section is embedded into openend inboard of above-mentioned outer component, utilizes this to fasten projection and is fastened; Be connected to the lamp socket of above-mentioned outer component through above-mentioned connecting elements; The light source that on above-mentioned light source support, is supported, foregoing circuit substrate are lit a lamp above-mentioned light source, above-mentioned light source when lighting a lamp, generate heat and thermally coupled in above-mentioned light source support; And be arranged on the translucent cover on the above-mentioned light source support with the mode that covers above-mentioned light source.
The practical implementation form according to the present invention, as outer component for example can use than iron, ferroalloy (alloy iron), with iron as the metal of principal component have the copper of better thermal conductivity, with the copper alloy of copper as principal component.And then also can use as than being the lighter light metal of the metal of principal component (Light metal), light-alloy (light alloy) like aluminium with iron.
In the practical implementation form of the present invention, can implement annular knurl (knurling) to the radiating surface of outer component.Thus, can make radiating surface tumbling (stain finish) and can increase the area of radiating surface.Simultaneously, in the practical implementation form of the present invention, also can prevent that the diaphragm that gets rusty is coated in the radiating surface of outer component with being used to.Particularly can expeditiously heat be dispersed into the atmosphere from radiating surface during for black when diaphragm.
In the practical implementation form of the present invention, as the heating light source, comparatively ideal being to use like the semiconductor element that electric energy (electrical energy) is converted into light as the light emitting diode.And then, also can use electroluminescent cell to replace light emitting diode.Light source is at least one, but quantity of light source is not limited.Light source also can be directly installed on light source support to be easy to transfer heat to light source support.Perhaps also can light source be installed on the distributing board, and make this distributing board and light source support thermally coupled.
In the practical implementation form of the present invention, translucent cover is protected light source in a covered manner, and it also can be for example spherical (globe) or umbrella (shade) shape, also can be flat.When translucent cover when being spherical, can optical reflection film be arranged on the part of this spherical inner face.Simultaneously, translucent cover can be and uses so that the light diffusion that light source sent or the arbitrary shape of optically focused.And then, as translucent cover the light optically focused that light source sends or the lens of diffusion of making also capable of using.
According to practical implementation form of the present invention, the heat that can when lighting a lamp, light source be sent is delivered to radiating surface from light source support, and is dispersed into the outside of lamp through this radiating surface.Because light source support and radiating surface become one, so between radiating surface and light source support, do not have the heat conducting bonding part of overslaugh.Thus, heat can be transmitted to radiating surface from light source support well, and the heat that can expeditiously light source be sent is transferred to radiating surface.Its result can improve the heat dispersion of light source, and it is overheated effectively to suppress light source.
To in explanation subsequently, set forth other purposes of the present invention and advantage, part purpose and advantage are conspicuous in explanation, maybe can learn through putting into practice the present invention.The object of the invention and advantage can realized and obtain to instrument and device (if the chemical case of the device here is exactly a composition) by means of the application's case is specialized.
Description of drawings
Incorporate into and constitute standard a part these description of drawings various embodiments of the present invention, and this embodiment together with above general introduction and following each embodiment is intended to explain principle of the present invention.
Fig. 1 is the stereogram of the lamp of the present invention's the 1st example.
Fig. 2 is the profile of the lamp of the present invention's the 1st example.
Fig. 3 is the profile that lamp socket, outer component and the translucent cover in expression the present invention the 1st example is in the lamp when being spaced from each other state.
Fig. 4 is the profile along the F4-F4 line of Fig. 2.
Fig. 5 is the profile along the F5-F5 line of Fig. 2.
Fig. 6 is the stereogram of the lamp of the present invention's the 2nd example.
Fig. 7 is the profile of the lamp of the present invention's the 2nd example.
Fig. 8 is the profile of the lamp of the present invention's the 3rd example.
Fig. 9 is the profile of the lamp of the present invention's the 4th example.
Figure 10 is the profile that lamp socket, outer component and the translucent cover in expression the present invention the 4th example is in the lamp when being spaced from each other state.
Figure 11 is the profile along the F11-F11 line of Fig. 9.
Figure 12 is the profile of the present invention's the 5th example lamp.
Figure 13 is the profile of the lamp of the present invention's the 6th example.
Figure 14 is the profile along the F14-F14 line of Figure 13.
Figure 15 is the profile that the position of lead and insulating cylinder concerns in expression the present invention the 6th example.
Figure 16 front view that to be the distributing board that supports light emitting diode in expression the present invention the 6th example concern with the position of light source support.
Figure 17 is the plane of employed insulating component in the present invention's the 6th example.
Figure 18 is the profile along the F18-F18 line of Figure 17.
Figure 19 is the profile along the F19-F19 line of Figure 17.
Figure 20 is the stereogram of employed insulating cylinder in the present invention's the 6th example.
Figure 21 is the profile of the lamp of the present invention's the 7th example.
Figure 22 is illustrated in the present invention's the 7th example, the profile of the position of the light source support of outer component, light source, light source outer cover and fixator relation.
Figure 23 is illustrated in the present invention's the 7th example, the profile of the position of light source outer cover, fixator and heat insulation outer cover relation.
Figure 24 is illustrated in the present invention's the 7th example, decomposes the stereogram of the position relation of outer component, heat transfer plate and light source.
Figure 25 is illustrated in the stereogram that decomposes the light source outer cover in the present invention's the 7th example.
Figure 26 is the profile of the present invention's the 8th example lamp.
Figure 27 is the plane of the lamp of the present invention's the 8th example.
Figure 28 is the profile of the lamp of the present invention's the 9th example.
Figure 29 is the plane of the lamp of the present invention's the 9th example.
1,100: lamp 2,101: outer component
3,102: light source 4: translucent cover
4b, 42b, 81a, 81b, 81c, 81d: edge portion
4a, 42a: opening 5,105: lamp circuit
6,106: insulating component 7,107: lamp socket
8,110: perisporium 8a: button ends groove
9,111: end wall 10,112: radiating surface
11,113: light source support 11a, 63,114: supporting surface
12: resettlement section 12a, 116a: openend
14,142,148a, 148b: screw 16a, 16b, 98,122a, 122b: through hole
18: light emitting diode 19,160: distributing board
20: insulated substrate 20a, 28a: the 1st
20b, 28b: the 2nd 21: patterned layer
22,24: protective layer 23: thermal diffusion layer
23a, 23b, 23a, 23d, 89a, 89b: zone
25: bottom 26: screw
28: distributing board 29,161: circuit component
30a, 30b, 162a, 162b: lead 32a, 163a: surrounding wall portion
32b: the locking wall 33a of portion, 33b: through hole
35,167: metal system outer cover of lamp holder 36,168: connecting elements
36a: outer peripheral face 37: leading section
38,170: fasten projection 39,62,93,157: order difference part
41a: reflecting part 41b: light projection unit
43: optical reflection film 45: retainer
46,165: the space
61,123a, 123b, 147a, 147b, 151a, 151b, 152: protuberance
83: capacitor 84: chip element
87a, 87b: guide part 88,149: buckling groove
91: minor diameter part 92: large-diameter portion
94: insulating cylinder 95: inserting hole
96: heart yearn 97: insulating barrier
103: light source outer cover 104: the outer cover fixator
108: heat insulation outer cover 121,173: male screw portion
127: light-emitting component 128: cover glass
129: island areas 82a, 132a, 132b: the 1st buckling parts
82b, 133a, 133b: the 2nd buckling parts 135: heat transfer plate
136a, 36b, 136c, 136d, 136e, 136f, 136e: sliding part
138: lens 139: lens fixture
140: light reflection surface 141: the light emission face
143: lip portions 144: light entrance face
146a, 146b: fixator element 150: accept portion
155: press section 158,174: box thread portion
163b: closure wall portion 167: outer cover of lamp holder
175: buckling parts 176,221: thermal dissipating path
177: exhaust outlet 178: air entry
201: the 2 fin of 200: the 1 fin
203: the 2 edge outer covers of 202: the 1 edge outer covers
220: urceolus 221a: an end
221b: the other end
The specific embodiment
Below referring to figs. 1 through Fig. 5 the present invention's the 1st example is described.
Fig. 1 and Fig. 2 disclose the lamp 1 that has compatible electric light shape with incandescent lamp.Lamp 1 comprises outer component 2, light source 3, translucent cover 4, lamp circuit 5, insulating component 6 and lamp socket 7.
Outer component 2 usefulness for example have the metal material of excellent heat conductivity property as the aluminium and make.Like Fig. 2 and shown in Figure 3, outer component 2 comprises perisporium 8 and end wall 9.Perisporium 8 and end wall 9 are shaped to one each other.Perisporium 8 forms cylindric.The outer peripheral face of perisporium 8 becomes the radiating surface 10 that is exposed to lamp 1 outside.Radiating surface 10 forms the taper that reduces one by one along the direction external diameter that axially passes through of perisporium 8.
One end of end wall 9 sealing perisporiums 8.End wall 9 forms discoideus light source support 11.Light source support 11 comprises the smooth supporting surface 11a that exposes in outer component 2 outsides.
In the 1st example, also can implement annular knurl, make this radiating surface 10 tumbling (crepe finish) the radiating surface 10 of outer component 2.Thus, can increase the area of dissipation of radiating surface 10.And then, also can prevent that the diaphragm that gets rusty is coated to radiating surface 10 with being used to.When diaphragm is black, heat is dispersed into the atmosphere from radiating surface 10.
Like Fig. 2 and shown in Figure 3, outer component 2 comprises resettlement section 12 (receptacle).Resettlement section 12 determines through the space that is surrounded by perisporium 8 and end wall 9, and is positioned at the inboard of radiating surface 10.Resettlement section 12 comprises and end wall 9 opposing open end 12a.Openend 12a is positioned at the other end of perisporium 8.
Perisporium 8 comprises and exposes in the resettlement section 12 inner peripheral surface.Form button at this inner peripheral surface and end groove 8a.Button ends the openend 12a that groove 8a is positioned at resettlement section 12, and continues at the circumferencial direction of perisporium 8.Peripheral part at end wall 9 forms recess 14.Recess 14 forms circular with the mode of ambient light source support portion 11, and at foreign side's opening of outer component 2.
To shown in Figure 4, form a screw 15 and a pair of through hole 16a, 16b like Fig. 2 in light source support 11.Screw 15 is positioned at the central authorities of light source support 11.Through hole 16a, 16b with the centre across the configuration that is parallel to each other of the mode of screw 15.Screw 15 1 ends and through hole 16a, 16b one end are at the supporting surface 11a of light source support 11 opening.Screw 15 other ends and through hole 16a, the 16b other end be 12 openings in the resettlement section.
Like Fig. 4 and shown in Figure 5, light source 3 comprises and forms for example four light emitting diodes 18 of chip (chip) shape.Light emitting diode 18 is an example of spot light, and is installed on the discoideus distributing board 19 with the mode that is listed as two row.Distributing board 19 comprises insulated substrate 20.Insulated substrate 20 comprises the 1st 20a and the 2nd 20b.The 2nd 20b is positioned at the opposition side of the 1st 20a.
Range upon range of on the 1st 20a top of insulated substrate 20 have patterned layer 21 (pattern layer) and a protective layer 22 (resist layer).Patterned layer 21 is for example by like the metal forming of copper and form.Protective layer 22 overlay pattern layers 21.Range upon range of on the top of the 2nd 20b of insulated substrate 20 have thermal diffusion layer 23 and a protective layer 24.Thermal diffusion layer 23 is for example used like the metal forming with excellent heat conductivity property of copper and is formed.Thermal diffusion layer 23 guarantees that than being used to the patterned layer 21 of thermal capacity is thick.As shown in Figure 5, thermal diffusion layer 23 is divided into 23a, 23b, 23c, four zones of 23d.Zone 23a, 23b, 23c, 23d is corresponding with the installation site of light emitting diode 18 and be spaced from each other.Protective layer 24 cover heating diffusion layers 23.Each light emitting diode 18 is installed on the 1st 20a of insulated substrate 20, and electrically connects with patterned layer 21.
Can use as distributing board 19, the form person of patterned layer, thermal diffusion layer and protective layer is for example arranged in the metal substrate laminated with excellent heat conductivity property.Yet consider cost, comparatively ideal is can use as insulated substrate 20 to be mixed with the for example epoxy resin of glass powder (epoxy) system resin substrate, also can use the form person that patterned layer, thermal diffusion layer and protective layer are arranged in this resin substrate laminated.
Distributing board 19 with its thermal diffusion layer 23 towards the state of the supporting surface 11a of light source support 11 and be overlapped in light source support 11.Distributing board 19 is fixed on the light source support 11 through screw 26.Screw 26 connects the central authorities of distributing board 19 and is screwed into screw 15.Be screwed into through this, distributing board 19 is adjacent to the supporting surface 11a of base plate supports portion 11, and distributing board 19 and 11 thermally coupleds of base plate supports portion.
Therefore, the heat that light emitting diode 18 sends is delivered to thermal diffusion layer 23 from insulated substrate 20, and fully is diffused into each corner of thermal diffusion layer 23.The heat that is diffused into thermal diffusion layer 23 can be delivered to light source support 11 through protective layer 24.
According to the 1st example, be formed with heat conduction path from distributing board 19 to supporting surface 11a in the light source support 11 of outer component 2.For the thermal resistance of this heat conduction path is suppressed for less, comparatively ideal is that filling is the heat-conducting substance as the grease (grease) of principal component with silicon (silicon) for example between distributing board 19 and supporting surface 11a.
Translucent cover 4 for example is a plastic orbicule (globe), at one end forms to have the hemispherical of opening 4a.Translucent cover 4 embeds the recess 14 of outer component 2 through determining the 4b of edge portion of opening 4a, is supported on thus on this outer member 2.Translucent cover 4 hides light source support 11, light emitting diode 8 and distributing board 19.Therefore light emitting diode 18 is relative with the inner face of translucent cover 4.
Lamp circuit 5 usefulness are so that light emitting diode 18 throws light on, and it makes a modular unitization.As shown in Figure 2, lamp circuit 5 comprises distributing board 28 and a plurality of circuit component 29.Distributing board 28 comprises the 1st 28a and is positioned at the 2nd 28b of the 1st 28a opposition side.Circuit component 29 is installed on the 1st 28a of distributing board 28.Each circuit component 29 comprises a plurality of conductor terminals.Conductor terminal connects distributing board 28, and is welded in the conductive pattern (not shown) that is printed on the distributing board 28.
Lamp circuit 5 is housed in the resettlement section 12 of outer component 2.Lamp circuit 5 comprises, with two lead 30a, the 30b of light emitting diode 18 electric connections and the lead (not shown) that electrically connects with lamp socket 7. Lead 30a, 30b are applied in through hole 16a, the 16b that end wall 9 opens and import to distributing board 19.Lead 30a, 30b are connected in the patterned layer 21 of distributing board 19 through methods such as welding.Therefore, as shown in Figure 2, about translucent cover 4 be positioned at lamp 1 on the outer component 2 towards, lamp circuit 5 through lead 30a, 30b and hang down from light source support 11.
Insulating component 6 is examples that between outer component 2 and lamp circuit 5, make the insulating barrier of electric insulation.Insulating component 6 is to use the moulding article of synthetic resin material as the polybutylene terephthalate (polybutyleneterephthalate) for example.As shown in Figure 2, insulating component 6 forms cup-shaped (cup), this cup-shaped 32b of closure wall portion that comprises cylindric surrounding wall portion 32a and this surrounding wall portion of sealing 32a one end.Form through lead 30a, a pair of through hole 33a of 30b, 33b at the 32b of closure wall portion.The axial length A of insulating component 6 is shorter than the axial length B of ending the outer component 2 of groove 8a from the light source support 11 of outer component 2 to button.
Insulating component 6 embeds in the resettlement section 12 from the openend 12a of resettlement section 12.Thus, the surrounding wall portion 32a of insulating component 6 covers the inner peripheral surface of outer component 2 perisporiums 8, and the 32b of closure wall portion of insulating component 6 covers the inner face of the end wall 9 of outer component 2.Therefore, insulating component 6 separates outer component 2 and lamp circuit 5.
Lamp socket 7 is used for electric current supply to lamp circuit 5.Lamp socket 7 comprises metal system outer cover of lamp holder 35 and the connecting elements 36 that is fixed on outer cover of lamp holder 35.Outer cover of lamp holder 35 is screwed into the lamp socket of not shown ligthing paraphernalia with detachable mode.Connecting elements 36 is to use the moulding article of synthetic resin material as the polybutylene terephthalate for example, and has electrical insulating property.Connecting elements 36 forms hollow cylindrical, and comprises the outer peripheral face 36a of arc-shaped bend.
As shown in Figure 2, connecting elements 36 comprises the inboard leading section 37 of openend 12a that embeds resettlement section 12.Outer peripheral face at leading section 37 forms fastening projection 38.Groove 8a fastens with only detaining when leading section 37 being embedded into openend 12a inboard to fasten projection 38.Through this fastening, outer component 2 is connected with coaxial shape with lamp socket 7.And then connecting elements 36 is between outer cover of lamp holder 35 and outer component 2, and above-mentioned electric insulation between the two and heat insulation.
Be connected at connecting elements 36 under the state of outer component 2, connecting elements 36 outer peripheral face 36a are connected with the radiating surface 10 of outer component 2.And then, at the root portion formation order difference part 39 of leading section 37.Order difference part 39 comprises flat horizontal surface, and it continues at connecting elements 36 circumferencial directions, and extends in the diametric(al) of connecting elements 36.When the leading section 37 with connecting elements 36 was inserted into the openend 12a of resettlement section 12, order difference part 39 can touch openend 12a.Thus, as far as resettlement section 12, the insertion amount of the leading section 37 of connecting elements 36 can be restricted.
Simultaneously, the insertion amount of restriction leading section 37 will produce space S thus between the surrounding wall portion 32a of the leading section 37 of this connecting elements 36 and insulating component 6.Owing to have a space S,, can eliminate 37 pairs of insulating components of leading section 6 and produce and disturb these bad situations for example when fastening before projection 38 and button end groove 8a and fasten.In other words, can prevent to follow the dimensional tolerance (dimensional tolerance) of connecting elements 36 and outer component 2 to produce fastening projection 38 and detain the fastening that ends groove 8a bad.Thus, can lamp socket 7 be connected securely the openend 12a of resettlement section 12.
In the lamp 1 of the 1st example, if lamp 1 is lit a lamp, then light emitting diode 18 will generate heat.Light emitting diode 18 is except that can cooling off, also cooling off in the following manner through the cross-ventilation that in translucent cover 4, produces.
The heat that light emitting diode 18 is sent is delivered to the light source support 11 of outer component 2 through distributing board 19.Be delivered to the heat of light source support 11, be delivered to radiating surface 10 through perisporium 8, and be dispersed into lamp 1 outside through radiating surface 10 from end wall 9.
Accept the light source support 11 of the heat that light emitting diode 18 sent, it is to be configured as one with the perisporium with radiating surface 10 8.So, can not have the heat conducting bonding part of overslaugh from light source support 11 to radiating surface on 10 the heat conduction path, thereby can the thermal resistance of heat conduction path suppressed for less.Therefore, can the heat of the light emitting diode that is delivered to light source support 11 18 be dispersed into radiating surface 10 expeditiously.
In addition, in the 1st example, form the recess 14 of the ring-type of ambient light source support portions 11 at the end wall of outer component 29, this recess 14 is at foreign side's opening of outer component 2.Thus, can increase the surface area of outer component 2 through having recess 14,, still can increase the heat dissipation capacity of outer component 2 although need the shape of restriction outer component 2 from the appearance requirement of lamp 1.
This result can improve the cooling performance of light emitting diode 18, and can prevent that light emitting diode 18 is overheated.The luminous efficiency that therefore, can suppress light emitting diode 18 descends and the life-span of light emitting diode 18 is prolonged.
In addition, because light emitting diode 18 is installed on the distributing board 19 with thermal diffusion layer 23, so the heat that light emitting diode 18 is sent will be diffused into each corner of distributing board 19 through the thermal diffusion layer 23 of distributing board 19.Therefore, the heat that can light emitting diode 18 be sent is delivered to light source support 11 from the wider range of distributing board 19.Therefore, heat will be transmitted to light source support 11 from light emitting diode 18 well, and the cooling performance of light emitting diode 18 is further improved.
In addition, the lamp 1 of the 1st example has the resettlement section 12 of collecting point circuit for lamp 5 in outer component 2 inboards.Thus, need not with outer component 2 and lamp circuit 5 be configured in side by side each other lamp 1 axially on.Therefore, the axial length of lamp 1 is shortened, and small-sized lamp 1 can be provided.
Meanwhile, be housed in the lamp circuit 5 of resettlement section 12, through insulating component 6 and outer component 2 electric insulations.Thus, can be through improving heat dispersion with the outer component 2 of made, and can be with lamp circuit 6 outer component 2 inside of packing into.
The cup-shaped insulating component 6 that makes electric insulation between outer component 2 and the lamp circuit 5 is moulding article of synthetic resin material, and thermal conductivity is lower than outer component 2.Therefore, can be from outer portion material 2 hot grazing point circuit for lamp 5, and suppress the heat that light emitting diode 18 sent and be delivered to lamp circuit 5 from outer component 2.Its result can protect lamp circuit 5 that itself and the heat of being sent from light emitting diode 18 are separated.Thus, can prevent the faulty operation of lamp circuit 5, and the life-span of lamp circuit 5 is prolonged.
The resettlement section 12 of collecting point circuit for lamp 5 is surrounded by outer component 2, perisporium 8 and end wall 9, and the openend 12a of resettlement section 12 is by lamp socket 7 sealings.In other words, lamp circuit 5 is housed in the space that is separated by outer component 2 and lamp socket 7, and lamp 1 air outside flows this space of can not flowing through.Thus, can avoid causing producing in the air of leaky (tracking) dust attached on the lamp circuit 5.
Fig. 6 and Fig. 7 disclose the present invention's the 2nd example.
This 2nd example, different about the item of outer component 2 and translucent cover 4 with above-mentioned the 1st example.In addition, the structure of lamp 1 and structure obtained thus useful technique effect are identical with the 1st example.Therefore, in the 2nd example, to paying same reference marks, and omit its explanation with the same structure division of the 1st example.
Like Fig. 6 and shown in Figure 7, in the lamp 1 of the 2nd example, the external diameter of the perisporium 8 of outer component 2, except with the end of the openend 12a adjacency of the resettlement section 12 of outer component 2, the external diameter of perisporium 8 is all fixed.Therefore outer component 2 forms straight cylindrical.
Moreover, comprise reflecting part 41a and light projection unit 41b as the orbicule of translucent cover 4.Reflecting part 41a comprises towards the opening 42a of light source support 11 openings and determines the 42b of edge portion of this opening 42a.The 42b of edge portion embeds in the recess 14 of outer component 2.Reflecting part 41a forms the taper that extends with the mode that begins diameter from the 42b of edge portion and increase one by one.Optical reflection film 43 arranged in that the inner face of this reflecting part 41a is range upon range of.
Light projection unit 41b is to form as one with reflecting part 41a ways of connecting and reflecting part 41a.Light projection unit 41b and optical reflection film 43 and light emitting diode 18 are relative.
Can use optical reflection film 43 to make and reflect through the translucent cover 4 of shape like this to light projection unit 41b from the part light of light emitting diode 18 radiation.Therefore, utilize light projection unit 41b to make and carry out optically focused, and it is projected the outside of lamp 1 from most of light of light emitting diode 18 radiation.
As shown in Figure 7, outer component 2 is provided with retainer 45 in the bight that is determined by perisporium 8 and end wall 9.Retainer 45 forms from the inner peripheral surface of perisporium 8 outstanding, and the ring-type that is connected with the circumferencial direction of perisporium 8.Retainer 45 is not to be defined in ring-type.For example, can be with the circumferencial direction that is configured in perisporium 8 from the outstanding a plurality of retainers of perisporium 8 inner peripheral surfaces with the mode of devices spaced apart.
Retainer 45 internal diameters are less than the external diameter of the 32b of closure wall portion of insulating component 6.Therefore, even under the state of the resettlement section 12 that insulating component 6 is embedded outer component 2, retainer 45 is also between the 32b of closure wall portion of end wall 9 and insulating component 6.Its result, the light source support 11 on the end wall 9 is spaced from each other with insulating component 6, and in the above-mentioned space 46 that has between the two.
According to the lamp 1 of the 2nd example, owing to have space 46, can the light source support 11 of the heat that receives light emitting diode 18 be remained on insulating component 6 and be non-contacting state.Therefore, space 46 will be delivered to the heat insulation of insulating component 6 from light source support 11 as overslaugh heat and play a role with the space, and the heat that light emitting diode 18 is sent will be difficult to directly be delivered to insulating component 6 from light source support 11.
Therefore, although the lamp circuit 5 that accommodate outer component 2 inside can receive the heat of being sent by light emitting diode 18, still can the heat affecting to lamp circuit 5 be suppressed for minimum.So, can prevent the faulty operation of lamp circuit 5, and the life-span of lamp circuit 5 is prolonged.
Fig. 8 discloses the present invention's the 3rd example.
This 3rd example is different from above-mentioned the 1st example with respect to the fixing means of the translucent cover 4 of outer component 2.In addition, the structure of lamp 1 and structure obtained thus useful technique effect and the 1st example are same.Therefore, in the 3rd example, to paying same reference marks, and omit its explanation with the same structure division of the 1st example.
As shown in Figure 8, the 4b of edge portion of translucent cover 4 for example is to be the recess 14 that bonding agent 51 is fixed on outer component 2 through silicon.Bonding agent 51 is filled in the recess 14.Recess 14 forms with the mode of ambient light source support portion 11, and compares the direction depression towards lamp socket 7 with the supporting surface 11a of permanent wiring plate 19.So, to compare with the light emitting diode 18 on the distributing board 19, bonding agent 51 is arranged on the position of deflection lamp socket 7 directions.
According to the lamp 1 of the 3rd example, translucent cover 4 is fixed on the bonding agent 51 of outer component 2, it is filled in the recess 14 that the supporting surface 11a than light source support 11 caves in more.So, will be difficult to directly inject bonding agent 51 from the light of light emitting diode 18 radiation.Therefore, even contain ultraviolet ray in the light of light emitting diode 18 radiation, also can prevent the deterioration of bonding agent 51.Thereby can translucent cover 4 be firmly held on the outer component 2 for a long time.
Fig. 9 to Figure 11 discloses the present invention's the 4th example.
In this 4th example, light source support 11 shapes of outer component 2 are different from above-mentioned the 3rd example.In addition, the structure of lamp 1 and structure obtained thus useful technique effect and the 1st example are same.Therefore, in the 3rd example to the 1st and the 3rd example in same structure division pay same reference marks, and omit its explanation.
To shown in Figure 11, the end wall 9 of outer component 2 has the protuberance of giving prominence to towards translucent cover 4 from light source support 11 61 like Fig. 9.Protuberance 61 forms discoid less than light source support 11 1 circle.Protuberance 61 forms as one with end wall 9, and surrounds through the recess 14 that translucent cover 4 is installed and to be coaxial shape.So, between protuberance 61 and light source support 11, form an order difference part 62.Order difference part 62 forms in continuous circular of the circumferencial direction of protuberance 61.
Front end at protuberance 61 forms smooth supporting surface 63.Supporting surface 63 is compared with the end wall 9 of outer component 2 and is more got into translucent cover 4 inboards.Thus, supporting surface 63 is highly suitable apart from the degree and the raised part 61 of recess 14.
In the 4th example, the distributing board 19 that light emitting diode 18 is installed is fixed on the central portion of supporting surface 63 through screw 26.Distributing board 19 thermally coupleds are in supporting surface 63.And then screw 15 and through hole 16a, 16b run through protuberance 61 and at supporting surface 63 openings.
According to the lamp 1 of the 4th example,, fixed distributing board 19 at the front end face 63 of this protuberance 61 with light emitting diode 18 at the protuberance 61 that light source support 11 formation of outer component 2 are given prominence to translucent cover 4.Therefore, light emitting diode 18 squints to compare the modes that more get into translucent cover 4 inboards with the end wall 19 of outer component 2.Therefore, can the light from light emitting diode 18 radiation be imported to translucent cover 4 inboards expeditiously, and then be dispersed into the outside of translucent cover 4.
Moreover, owing to have protuberance 61, so the surface area of light source support 11 and thermal capacity increase.Thus, although limited the shape of outer component 2 from lamp 1 appearance requirement, still can increase the heat dissipation capacity of outer component 2.Its result can improve the cooling performance of light emitting diode 18, suppresses the decline of luminous efficiency, and the life-span of light emitting diode 18 is prolonged.
Meanwhile, to be filled in the projecting height of degree and protuberance 61 of bonding agent 51 of recess 14 suitable for light emitting diode 18 distance.In other words, interdicted by the peripheral part of protuberance 61 from the light of light emitting diode 18, and be difficult to be directly incident on bonding agent 51 from the light of light emitting diode 18 radiation towards recess 14.
Therefore, even, also can prevent the deterioration of bonding agent 51 from the light of light emitting diode 18 radiation, containing ultraviolet ray.Therefore, can translucent cover 4 be firmly held on the outer component 2 for a long time.
Figure 12 discloses the present invention's the 5th example.
In this 5th example, the shape of the light source support 11 of outer component 2 is different from above-mentioned the 2nd example.In addition, the structure of lamp 1 and structure obtained thus useful technique effect and the 2nd example are same.Therefore in the 5th example, to paying same reference marks, and omit its explanation with the same structure division of the 2nd example.
Shown in figure 12, the end wall 9 of outer component 2 has the protuberance of giving prominence to towards translucent cover 4 from light source support 11 71.Protuberance 71 forms discoid than the little circle of light source support 11.Protuberance 71 forms as one with end wall 9, and is coaxial shape by the recess that embeds translucent cover 4 14 encirclements.So, between protuberance 71 and light source support 11, form an order difference part 72.Order difference part 72 forms on the circumferencial direction of protuberance 71 continuous circular.
Form smooth supporting surface 73 at protuberance 71 front ends.Supporting surface 73 is compared the inboard of the reflecting part 41a that more gets into translucent cover 4 with the end wall 9 of outer component 2.Thus, supporting surface 73 is equivalent to the height of raised part 71 apart from the degree of recess 14.
In the 5th example, the distributing board 19 of light emitting diode 18 is installed, it is fixed on the central portion of supporting surface 73 through screw 26.Distributing board 19 thermally coupleds are in supporting surface 63.And then screw 15 and through hole 16a, 16b connect protuberance 71 and at supporting surface 73 openings.
According to the lamp 1 of the 5th example, light emitting diode 18 is compared the reflecting part 41a that more gets into translucent cover 4 with the end wall 19 of outer component 2 inboard.So, can the light from light emitting diode 18 radiation be imported translucent cover 4 inboards expeditiously.Thus, can make light reflex to the direction of transmittance section 41b, and can emit to the outside of translucent cover 4 from transmittance section 41b through optical reflection film 43 from light emitting diode 18.
And then, owing to have protuberance 71, so can increase the surface area and the thermal capacity of light source support 11.Therefore, although consider the appearance requirement of lamp 1, and the shape of restriction outer component 2 still can increase the heat dissipation capacity of outer component 2.Its result can improve the cooling property of light emitting diode 18 and suppress luminous efficiency decline, and the life-span of light emitting diode 18 is prolonged.
Figure 13 to Figure 20 has disclosed the present invention's the 6th example.
The difference of this 6th example and above-mentioned the 1st example mainly is that as far as the resettlement section 12 of outer component 2, the method for supporting of lamp circuit 5 is different.In addition, the structure of lamp 1 and structure obtained thus beneficial technical effects are all same with the 1st example.Thus, in the 6th example, use same reference marks, and omit its explanation for the component part identical with the 1st example.
Like Figure 13 and shown in Figure 14, constitute the distributing board 28 of lamp circuit 5, form the perisporium 8 of outer component 2 axially on be the rectangle of elongate.Distributing board 28 has the 1st to the 4th 81a of edge portion, 81b, 81c, 81d.The the 1st and the 2nd 81a of edge portion, 81b extend axially along perisporium 8.The the 3rd and the 4th 81c of edge portion, 81d extend along the diametric(al) of perisporium 8.The 3rd 81c of edge portion touches the 32b of closure wall portion of insulating component 6.The 4th 81d of edge portion is relative with lamp socket 7.
The bight that is determined at the 1st 81a of edge portion and the 4th 81d of edge portion by distributing board 28 forms the 1st buckling parts 82a.Equally, the bight that is determined by the 2nd 81b of edge portion and the 4th 81d of edge portion of distributing board 28 forms the 2nd buckling parts 82b.The the 1st and the 2nd buckling parts 82a, 82b are cut to the right angle through two bights with distributing board 28 respectively and form.The the 1st and the 2nd buckling parts 82a, 82b are not limited to otch.For example also can be respectively arranged with to the outstanding protuberance of perisporium 8 in two bights of distributing board 28, and with raised part as the 1st and the 2nd buckling parts 82a, 82b.And then, also can two bights of distributing board 28 directly be used as the 1st and the 2nd buckling parts 82a, 82b.
Distributing board 28 from the resettlement section 12 openend 12a inboard and give prominence to towards the connecting elements of lamp socket 7 36.In other words, distributing board 28 is crossed between outer component 2 and the lamp socket 7 and its 4th edge 81d of portion entering connecting elements 36 inboards.
Shown in figure 13, the circuit component 29 that constitutes lamp circuit 5 contains capacitor 83 (condensor).Capacitor 83 has thermo-labile, and if characteristic overheated then that the life-span can shorten.Capacitor 83 is installed in the end that is adjacent to the 4th 81d of edge portion among the 1st 28a of distributing board 28 through methods such as welding.
And then the conductor terminal of each circuit component 29 runs through distributing board 28 and outstanding from the 2nd 28b of distributing board 28.At this 2nd 28b a plurality of chip elements 84 are installed.
Shown in figure 14, be formed with a pair of retainer 85a, 85b at the inner peripheral surface of connecting elements 36. Retainer 85a, 85b are with outstanding from connecting elements 36 inner peripheral surfaces with the 1st and the 2nd buckling parts 82a, the 82b corresponding mode of distributing board 28. Retainer 85a, 85b are contacted with the 1st and the 2nd buckling parts 82a, the 82b of distributing board 28.Thus, distributing board 28 is clipped between the end wall 9 of retainer 85a, 85b and outer component 2 of lamp socket 7.
To shown in Figure 19, be formed with a pair of guide part 87a, 87b like Figure 17 at the surrounding wall portion 32a of insulating component 6 inner peripheral surface.Guide part 87a, 87b are relative on the diametric(al) of surrounding wall portion 32a, and outstanding from the interior week of surrounding wall portion 32a.And guide part 87a, 87b extend axially along surrounding wall portion 32a's.
Form buckling groove 88 at each guide part 87a, 87b.Slidably chimeric the 1st and the 2nd 81a of edge portion, the 81b that distributing board 28 is arranged in the buckling groove 88, and extending axially along surrounding wall portion 32a always.Buckling groove 88 1 ends are by the 32b of the closure wall portion sealing of insulating component 6.The other end of buckling groove 88 is to the other end opening of surrounding wall portion 32a.
For resettlement section 12 that lamp circuit 5 is packed into, as front end, it is inboard under this state, distributing board 28 to be inserted into the surrounding wall portion 32a of insulating component 6 with the 3rd 81c of edge portion of distributing board 28.The insertion of this distributing board 28 operation, it is that the 1st and the 2nd 81a of edge portion, 81b with this distributing board 28 is inserted into buckling groove 88.Rear flank in distributing board 28 is inserted into surrounding wall portion 32a, then the 3rd 81c of edge portion of distributing board 28 will touch the 32b of closure wall portion of insulating component 6.Therefore, need not to carry out special consideration and the insertion amount that can determine 28 pairs of insulating components 6 of distributing board.Therefore, pack into the operability of resettlement section 12 of lamp circuit 5 is better.
Distributing board 28 is inserted into after the surrounding wall portion 32a inboard of insulating component 6, the connecting elements 36 of lamp socket 7 is connected to the openend 12a of outer component 2.Connect through this, make the retainer 85a of connecting elements 36,85b contact with the 1st and the 2nd buckling parts 82a, the 82b of distributing board 28.Thus, distributing board 28 can be clipped between end wall 11 and retainer 85a, the 85b of outer component 2, and can perisporium 8 axially not the mode of transfer point circuit for lamp 5 keep this lamp circuit 5.Meanwhile because the buckling groove 88 that the 1st and the 2nd 81a of edge portion of distributing board 28,81b are entrenched in insulating component 6, so can the circumferencial direction of perisporium 8 not transfer point circuit for lamp 5 mode and keep this lamp circuit 5.And then, if further strengthen the 1st 81a of edge portion and buckling groove 88 chimeric of distributing board 28, then can be only through the chimeric of the 1st 28a of edge portion and buckling groove 88 with on the circumferencial direction of perisporium 8 not the mode of transfer point circuit for lamp 5 keep this lamp circuit 5.
Thereby lamp circuit 5 remains in the resettlement section 12 of outer component 2 with irremovable mode.
Shown in figure 13, the distributing board 28 of lamp circuit 5, it is two regional 89a, 89b that the inside of the surrounding wall portion 32a of insulating component 6 is separated along diametric( al).Zone 89a, 89b be to inner space 90 openings of lamp socket 7, and be interconnected through this space 90.
The the 1st and the 2nd 28a of distributing board 28,28b all do not point to the light source support 11 of accepting the heat that light emitting diode 18 sent, and relative with the surrounding wall portion 32a of insulating component 6.So, the welding portion of the conductor terminal of circuit component 29 and distributing board 28, it can suppress the heat affecting to welding portion away from the 32b of closure wall portion of the insulating component 6 that joins with light source support 11.
And then, being adjacent to the capacitor 83 of the 4th 81d of edge portion of distributing board 28, it gets into lamp socket 7 inner spaces 90, and is away from the light source support 11 that receives the heat that light emitting diode 18 sent.So heat labile capacitor 83 will be difficult to receive the influence of the heat that light emitting diode 18 sent, and can improve the persistence of capacitor 83.
In addition because the part of lamp circuit 5 gets into the inboard space 90 of lamp socket 7, so can make insulating component 6 and outer component 2 axially on length shorten.Thus, can help realizing the miniaturization of lamp 1.If outer portion material 2 axially on length shorten, the area that then will produce radiating surface 10 reduces this drawback.As its countermeasure, also can become big through external diameter, and remedy the part that these radiating surface 10 areas are reduced outer component 2.
Like Figure 13 and shown in Figure 16, the circuit component 29 that is installed in the 1st 28a of distributing board 28 can be higher than the chip element 84 that is installed in the 2nd 28b.Thus, the distributing board 28 described in this example, it is with the mode of the regional 89a between the 1st 28a and the insulating component 6 surrounding wall portion 32a greater than the regional 89b between the 2nd 28b and the insulating component 6 surrounding wall portion 32a, and squints for lamp 1 center line X1.
Consequently, can make higher circuit component 29 as much as possible away from the perisporium 8 of outer component 2, circuit component 29 will be difficult to receive the heat affecting of being sent by light emitting diode 18 that is delivered to perisporium 8.Meanwhile, even between the 2nd 28b and outer component 2 perisporiums 8, be provided with regional 89b, also can be in guaranteeing volume in a way.Thus, even the conductor terminal of circuit component 29 is outstanding to regional 89b from the 2nd 28b of distributing board 28, conductor terminal also is difficult to receive the heat affecting of being sent by light emitting diode 18 that is delivered to perisporium 8.Thereby, can prevent that the welding portion of conductor terminal and distributing board 28 is overheated.
According to the lamp in the 6th example 1, the distributing board 28 of lamp circuit 5 be with the 1st and the 2nd 28a, 28b respectively with the relative state of inner peripheral surface of the surrounding wall portion 32a of insulating component 6, and be contained in the resettlement section 12 of outer component 2.Therefore, the 1st of distributing board 28 the 28a or the 2nd 28b can be not relative with the 32b of closure wall portion of insulating component 6.
Therefore; Need not between distributing board 28 and the 32b of closure wall portion, to form roughly sealed space the heat that lamp circuit 5 is sent or also be difficult to accumulate in the end of the resettlement section 12 that is adjacent to light source support 11 from the heat that light emitting diode 18 is delivered to light source support 11.Thereby, can prevent that light source support 11 is overheated, and can help improving the cooling performance of light emitting diode 18.
In addition, because distributing board 28 strides across lamp socket 7 from outer component 2, so the size of distributing board 28 can not receive the restriction of insulating component 6 internal diameters.Thus, the size or the increase that can increase decision distributing board 28 are arranged in the free degree on the distribution version 28 with circuit component 29, and can be easy to carry out the circuit design of lamp circuit 5.
And then, disclosed the structure that prevents to produce between outer component 2 and lead 30a, the 30b short circuit in the 6th example.
Like Figure 14 and shown in Figure 15, a pair of through hole 16a, the 16b that are positioned at light source support 11 have minor diameter part 91, large-diameter portion 92 and order difference part 93 respectively.Order difference part 93 is positioned at the border of minor diameter part 91 and large-diameter portion 92.
Chimeric respectively among through hole 16a, the 16b have an insulating cylinder 94.Insulating cylinder 94 is for example had the synthetic resin made of electrical insulating property like this by polybutylene terephthalate.Thereby insulating cylinder 94 strides across minor diameter part 91 and covers through hole 16a, 16b inner face with large-diameter portion 92.
Insulating cylinder 94 has the inserting hole 95 that passes lead 30a, 30b.Inserting hole 95 is connected in through hole 33a, the 33b of insulating component 6.Shown in figure 15, with the through hole 33a of inserting hole 95, the edge of opening of 33b adjacency, it utilizes diameter to pass through tangent plane (chamfering) and is expanded.Thus, can with lead 30a, 30b from through hole 33a, when 33b imports to inserting hole 95, prevent that lead 30a, 30b are stuck in the edge of opening of inserting hole 95.
Insulating cylinder 94 is embedded into through hole 16a, the 16b from the supporting surface 11a direction of light source support 11.Through distributing board 28 is fixed on the supporting surface 11a, and make insulating cylinder 94 be clipped between the order difference part 93 of this distributing board 28 and through hole 16a, 16b.Thus, can insulating cylinder 94 be remained on the light source support 11.Thereby, need not insulating cylinder 94 is bonded on the light source support 11, and can be easy to carry out the assembly operation of lamp 1.
Lead 30a, 30b have heart yearn 96 that for example uses copper cash and the insulating barrier 97 that covers this heart yearn 96.Insulating barrier 97 is removed at the leading section of lead 30a, 30b.Therefore, at the leading section of lead 30a, 30b, heart yearn 96 exposes the outside at insulating barrier 97.The heart yearn 96 that exposes through the welding etc. method be electrically connected at distributing board 28.
When removing insulating barrier 97, if in the scope of removing insulating barrier 97, produce inequality, heart yearn 96 length of then exposing from insulating barrier 97 will produce change.Therefore, for example shown in Figure 15, with lead 30a when through hole 33a imports through hole 16a, it is inboard that the heart yearn 96 that exposes can be positioned at through hole 16a.Be entrenched in insulating cylinder 94 among the through hole 16a between heart yearn that exposes 96 and through hole 16a, and make electric insulation between the heart yearn 96 that exposes and the light source support 11.
Thereby, produce short circuit between heart yearn 96 that insulating cylinder 94 capable of using prevents to expose and the light source support 11.
The heart yearn 96 that exposes inserts a pair of through hole of opening to distributing board 19 98 from inserting hole 95, and passes through hole 98 and import on the distributing board 19.Heart yearn 96 front ends that expose are welded in the island areas (land) (not shown) that is formed on the distributing board 19.
The distributing board 28 of lamp circuit 5 is offset from lamp center line X1 as stated.Thus, shown in figure 16, can make each through hole 98 between adjacent regional 23a, 23b and the 23c of thermal diffusion layer 23,23d.Thus, although through hole 98 runs through distributing board 19, still can not reduce the area of thermal diffusion layer 23.Thereby, can the heat that light emitting diode 18 is sent be delivered to light source support 11 expeditiously through diffusion layer 23, and it is overheated to suppress light emitting diode 18.
Figure 21 to Figure 25 has disclosed the present invention's the 7th example.
Lamp 100 in the 7th example has outer component 101, light source 102, light source outer cover 103, outer cover fixator 104, lamp circuit 105, insulating component 106, lamp socket 107 and heat insulation outer cover 108.
Outer component 101 is to use the metal material that has an excellent heat conductivity property as aluminium to process.Shown in figure 24, outer component 101 has perisporium 110 and end wall 111.Perisporium 110 and end wall 111 form as one.Perisporium 110 forms the cylindric of external diameter almost fixed.The outer peripheral face of perisporium 110 becomes radiating surface 112.
End wall 111 sealing perisporiums 110 1 ends.End wall 111 forms discoideus light source support 113.Light source support 113 has smooth supporting surface 114 at the opposition side of perisporium 110.
Inboard at outer component 101 forms resettlement section 116.The space that resettlement section 116 is surrounded by perisporium 110 and end wall 111 and determining, and this resettlement section 116 is positioned at radiating surface 112 inboards.Bight being determined by perisporium 110 and end wall 111 forms retainer 117.Retainer 117 forms circular, and it is projected into perisporium 110 inboards, and on the circumferencial direction of perisporium 110, continues.
Resettlement section 116 has and end wall 111 opposing open end 116a.Openend 116a is positioned at the other end of perisporium 110.Inner peripheral surface at perisporium 110 forms only groove 118 of button.Button ends groove 118 and forms circularly, and it is positioned at resettlement section 116 openend 116a and on the circumferencial direction of perisporium 10, continues.
Peripheral part at end wall 111 forms recess 119.Recess 119 forms the circular of coaxial shape ambient light source support portion 113.Inner peripheral surface at recess 119 forms male screw portion 121.Also can form box thread portion, and replace this male screw portion 121 at recess 119 outer peripheral faces.
Shown in figure 24, at a pair of through hole 122a of supporting surface 114 formation, 122b and a pair of protuberance 123a, the 123b of light source support 113.Through hole 122a, 122b are configured in the diametric(al) of light source support 113 there to be spaced mode.Protuberance 123a, 123b form for example cylindric, and vertically outstanding from supporting surface 114.Protuberance 123a, 123b are configured in the diametric(al) of light source support 113 there to be spaced mode.The also column direction of the also column direction of through hole 122a, 122b and protuberance 123a, 123b intersects vertically.
To shown in Figure 24, light source 102 has bottom 125 (base), distributing board 126 and shaped like chips light-emitting component 127 like Figure 21.Bottom 125 usefulness are processed as the metal material that aluminium alloy has excellent heat conductivity property.Distributing board 126 is overlapping with bottom 125.Light-emitting component 127 is a light emitting diode for example, is installed in distributing board 126 central authorities.
Light-emitting component 127 is covered by transparent hemispherical cover glass 128.And then distributing board 126 has a plurality of island areas 129.Island areas 129 to be surrounding the mode of cover glass 128, and have at interval and and be listed in the circumferencial direction of distributing board 126.Distributing board 126 is except that cover glass 128 and island areas 129 parts, itself and cover by not illustrated insulating barrier.
Shown in figure 24, in the bottom 125 and distributing board 126 peripheral parts form couple of conductor and insert the logical 131a of portion, 131b and a pair of the 1st buckling parts 132a, 132b and a pair of the 2nd buckling parts 133a, 133b.Lead is inserted the logical 131a of portion, 131b and the 1st buckling parts 132a, 132b and the 2nd buckling parts 133a, 133b and is respectively the U-shaped otch.Lead is inserted the logical 131a of portion, 131b and the 1st buckling parts 132a, 132b and the 2nd buckling parts 133a, 133b might not be an otch, also can be for example circular port.
Lead is inserted the logical 131a of portion, 131b and the 1st buckling parts 132a, 132b and the 2nd buckling parts 133a, 133b, is to exist gapped mode each other and bottom being listed in 125 and the circumferencial direction of distributing board 126.In other words, the slotting logical 131a of portion of lead, 131b and the 1st buckling parts 132a, 132b and the 2nd buckling parts 133a, 133b lay respectively between the adjacent island areas 129.
Like Figure 21 and shown in Figure 22, the bottom 125 of light source 102 is overlapping with the supporting surface 114 of light source support 113.Rubber-like heat transfer plate 135 is between the supporting surface 114 and bottom 125 of light source support 113.Heat transfer plate 135 is to be the resin sheeting of principal component with for example silicon, and forms discoideus than light source 102 big circles.Heat transfer plate 135 thermally coupleds are between the bottom 125 and light source support 113 of light source 102.
A plurality of sliding part 136a, 136b, 136c, 136d, 136e, 136f are formed on the peripheral part of heat transfer plate 135 at circumferencial direction there to be spaced mode.Sliding part 136a, 136b, 136c, 136d, 136e, 136f for example are the U-shaped otch.Sliding part 136a, 136b insert the logical 131a of portion, 131b corresponding to lead, and sliding part 136c, 136d are corresponding to the 1st buckling parts 132a, 132b.And then, sliding part 136e, 136f is corresponding to the 2nd buckling parts 133a, 133b.
Be clipped under the state between light source support 113 and the bottom 125 at heat transfer plate 135, be entrenched in the 1st buckling parts 132a, 132b securely from sliding part 136c through heat transfer plate 135 of the outstanding protuberance 123a of supporting surface 114,123b, 136d.Chimeric through this, can stop circumferencial direction and diametric move of light source 102 in light source support 113.The result is that light-emitting component 127 will be positioned on the center line of outer component 101, and the slotting logical 131a of portion of lead, 131b and sliding part 136a, 136b will overlap.
Like Figure 21 and shown in Figure 22, light source outer cover 103 has lens 138 and lens fixture 139.Lens 138 are used to control the luminous intensity distribution (luminous intensitydistribution) of lamp 101, and it is shaped to one by for example transparent material such as glass or synthetic resin.
Lens 138 have light reflection surface 140, light emission face 141, recess 142 and lip portions 143.Light reflection surface 140 forms for example dome shape.Light emission face 141 is plane and relative with light reflection surface 140.Recess 142 to be inserting the mode of cover glass 128, from the central portion of light reflection surface 140 to light emission face 141 depressions.Recess 142 has the light entrance face 144 that surrounds cover glass 128.Lip portions 143 is outstanding to the diametric(al) outside of lens 138 from the outer peripheral face of lens 138.Lip portions 143 is adjacent to light emission face 141, and on the circumferencial direction of lens 138, continues.
Lens fixture 139 is the part that separates with lens 138, and forms the cylindric of encirclement lens 138.Shown in figure 25, lens fixture 139 has a pair of fixator element 146a, 146b.Fixator element 146a, 146b are for example made by the non-light transmittance synthetic resin material with electrical insulating property, and form the semicircle tubular respectively.
Fixator element 146a, 146b have a pair of protuberance 147a, 147b and a pair of recess 148a, 148b respectively.Protuberance 147a, the 147b of one side fixator element 146a is fitted to recess 148a, the 148b of opposite side fixator element 146b.Protuberance 147a, the 147b of opposite side fixator element 146b is fitted to recess 148a, the 148b of a side fixator element 146a.Chimeric through this, fixator element 146a, 146b are corresponding each other outstanding, and can be assembled into cylindric lens fixture 139.
Form buckling groove 149 at lens fixture 139 inner peripheral surfaces.Buckling groove 149 is positioned at along lens fixture 139 end on axially, and on the circumferencial direction of lens fixture 139, continues.Along the axial other end of lens fixture 139, form the portion that accepts 150 and a pair of protuberance 151a, 151b.
It is relative with the peripheral part of the distributing board 126 of light source 102 to accept portion 150, and has a plurality of otch 152.Otch 152 is with island areas 129 corresponding mode of light source 102 and compartment of terrain and be listed in the circumferencial direction of lens fixture 139. Protuberance 151a, 151b are corresponding with the 2nd buckling parts 133a, the 133b of light source 102, and outstanding to light source 102 from the other end of lens fixture 139.
Shown in figure 25, fixator element 146a, 146b give prominence to be clipped in the state between the lens 138 each other.Thus, the lip portions 143 of lens 138 embeds buckling groove 149, and is clipped between fixator element 146a, the 146b.The result is that lens 138 will remain on the inboard of lens fixture 139, and an end of the light emission face 141 sealing lens fixtures 139 of lens 138.
Like Figure 21 and shown in Figure 22, light source outer cover 103 and the light source support 113 of outer component 101 between clamping light source 102 is arranged.More detailed, that is, the portion that accepts 150 of lens fixture 139 is connected in the distributing board 126 of light source 102 with the mode of avoiding island areas 129.And then, be entrenched in the 2nd buckling parts 133a, the 133b of light source 102 securely from lens fixture 139 outstanding protuberance 151a, 151b.Chimeric through this, can stop light source outer cover 103 on the circumferencial direction of light source 102 and diametric(al), to move.Thus, the cover glass 128 that is used for covering luminous element 127 gets into the recess 142 of lens 138, and lead is inserted the logical 131a of portion, 131b or the 1st buckling parts 132a, 132b overlaps with the otch of accepting portion 150 152.
Therefore, light source outer cover 103, with the optical axis X2 of lens shown in figure 21 138 and light-emitting component 127 mode consistent with each other, decision is with respect to the position of light source 102.
Shown in figure 21, outer cover fixator 104 is cylinder or angle tubular by the metal material moulding that has excellent heat conductivity property as aluminium alloy.Outer cover fixator 104, its external diameter equate with the external diameter of outer component 101, and have the internal diameter and the length that can cover light source 102 and light source outer cover 103 continuously.
Form press section 155 at outer cover fixator 104 1 ends.Press section 155 is inner peripheral surface from outer cover fixator 104 a side-prominent bead in diametric(al).Other end existence at outer cover fixator 104 forms the circular connecting portion of coaxial shape 156.Connecting portion 156 is outstanding to the recess 119 of outer component 101 from the other end of outer cover fixator 104.The diameter of connecting portion 156 is less than the diameter of outer cover fixator 104.Border at this connecting portion 156 and outer cover fixator 104 other ends forms order difference part 157.Order difference part 157 has the plane that on the circumferencial direction of outer cover fixator 104, continues.
Inner peripheral surface at connecting portion 156 forms box thread portion 158.Box thread portion 158 can be screwed into the male screw portion 121 of recess 119.Form box thread portion when replacing the situation of male screw portion 121 at the outer peripheral face of recess 119, also can form male screw portion at the outer peripheral face of connecting portion 156.
Outer cover fixator 104 through box thread portion 158 being screwed into the male screw portion 121 of recess 119, is linked to outer component 101 thereby be coaxial shape.Follow being screwed into of outer cover fixator 104, the press section 155 of outer cover fixator 104 can touch an end of lens fixture 139.Thus, lens fixture 139 will be to light source support 113 extruding of outer component 102.So, the press section 155 of outer cover fixator 104 remain and light source 102 between clamping light source outer cover 103.
Like Figure 21 and shown in Figure 22, when outer cover fixator 104 was connected in outer component 102, the peripheral part of the end wall 111 of outer component 102 then can touch the order difference part 157 of outer cover fixator 104.Thus, outer component 102 can increase with the contact area of outer cover fixator 104, and the heat conduction path from outer component 102 to outer cover fixator 104 can increase.
Lamp circuit 105 is used to make light-emitting component 127 to throw light on, and it is housed in the resettlement section 116 of outer component 102.Through lamp circuit 105 being housed in outer component 101 inboards, and need not with this outer member 101 and lamp circuit 105 be configured in side by side each other lamp 100 axially.Thus, the axial length of lamp 100 is shortened, and can obtain miniature lamp 100.
Shown in figure 21, lamp circuit 105 has distributing board 160 and a plurality of circuit component 161.Lamp circuit 105 is electrically connected at light source 102 through two lead 162a, 162b shown in figure 24. Lead 162a, 162b import on the distributing board 126 of light source 102 through the slotting logical 131a of portion of the lead of light source 102,131b from through hole 122a, the 122b of light source support 113. Lead 162a, 162b front end are welded on respectively on two island areas 129.
Insulating component 106 is an example of the insulating barrier of electric insulation between outer component 101 and lamp circuit 105.Insulating component 106 moulding article for using the such synthetic resin material of polybutylene terephthalate for example to process.Shown in figure 21, insulating component 106 forms cup-shaped, this cup-shaped 163b of closure wall portion that has surrounding wall portion 163a cylindraceous, reaches this surrounding wall portion of sealing 163a one end.
Insulating component 106 embeds in the resettlement section 116 from the openend 116a of resettlement section 116.Thus, the inner peripheral surface of the perisporium 110 of the surrounding wall portion 163a of insulating component 116 contact outer component 101, and the 163b of closure wall portion of insulating component 116 touches retainer 117.Retainer 117 is between the 163b of closure wall portion of light source support 113 and insulating component 116.So light source support 113 is spaced from each other with the 163b of closure wall portion, and in the above-mentioned space 165 that exists between the two.
Owing to have space 165, therefore can thermally coupled be remained the state that does not contact insulating component 106 in the light source support 113 of light source 102.So space 165 will be carried out heat conducting heat insulationly work with the space from light source support 113 to insulating component 106 as overslaugh, the heat that light source 102 is sent is difficult to directly be delivered to insulating component 106 from light source support 113.
Thereby,, still can protect the lamp circuit 105 and the heat of light source 102 to separate although within the outer component 101 of the heat that receives light source 102, contain lamp circuit 105.Thus, the faulty operation of lamp circuit 105 can be prevented, and the life-span of lamp circuit 105 can be prolonged.
The 163b of closure wall portion of insulating component 106 has not illustrated a pair of through hole.Because through lead 162a, 162b, therefore will run through the 163b of closure wall portion and in the through hole to resettlement section 116 and space 165 openings.
Lamp socket 107 is used for electric current supply to lamp circuit 105.Lamp socket 107 has metal outer cover of lamp holder 167 and is fixed on the connecting elements 168 of outer cover of lamp holder 167.Outer cover of lamp holder 167 is connected on the lamp socket of ligthing paraphernalia with detachable mode.Lamp 100 described in the 7th example, shown in figure 21, be installed on the lamp socket with lamp socket 107 state up.
Connecting elements 168 moulding article for using the such synthetic resin material of polybutylene terephthalate for example to process.Connecting elements 168 has electrical insulating property, and its thermal conductivity is lower than outer component 101.
Connecting elements 168 has the inboard leading section 169 of openend 116a that embeds resettlement section 116.Form fastening projection 170 at leading section 169 outer peripheral faces.When leading section 169 is embedded rear flank in the openend 116a, groove 118 fastens with only detaining to fasten projection 170.Through this fastening, outer component 101 is connected with coaxial shape with lamp socket 107.And then connecting elements 168 is between outer cover of lamp holder 167 and outer component 101, and between is electrically insulated and heat insulation.
Shown in figure 21, connecting elements 168 has the peripheral part 171 of diameter greater than leading section 169.Peripheral part 171 is to be coaxial shape in the diametric(al) outside of outer component 101 to give prominence to.Peripheral part 171 at connecting elements 168 forms circular supporting walls 172.Supporting walls 172 surrounds the leading section 169 of connecting elements 168 with coaxial shape.Outer peripheral face at supporting walls 172 forms male screw portion 173.
The moulding article of heat insulation outer cover 108 for using synthetic resin material for example to process, and formation hollow is cylindric.The thermal conductivity of heat insulation outer cover 108 is lower than outer component 101.Shown in figure 21, heat insulation outer cover 108 has internal diameter and the length that can surround outer component 101 and outer cover fixator 104 with coaxial shape.
Inner peripheral surface at heat insulation outer cover 108 1 ends forms box thread portion 174.And then, at the other end formation buckling parts 175 of heat insulation outer cover 108.Buckling parts 175 is inner peripheral surface from the other end of heat insulation outer cover 108 a side-prominent bead in diametric(al).Buckling parts 175 internal diameters are less than the external diameter of outer cover fixator 104.
The box thread portion 174 of heat insulation outer cover 108 is screwed into the male screw portion 173 of connecting elements 168.Be screwed into through this, the buckling parts 175 of heat insulation outer cover 108 will be stuck in an end of outer cover fixator 104.Thus, heat insulation outer cover 108 surrounds the state of outer position 101 and outer cover fixator 104 with coaxial shape, and is connected in the connecting elements 168 of lamp socket 107.
Forming thermal dissipating path 176 between heat insulation outer cover 108 and the outer component 101 and between heat insulation outer cover 108 and the outer cover fixator 104.Thermal dissipating path 176 surrounds outer component 101 and outer cover fixators 104, and lamp 100 axially on continuity.
Thermal dissipating path 176 1 ends are by peripheral part 171 sealings of connecting elements 168.Peripheral part 171 at connecting elements 168 forms a plurality of exhaust outlets 177.Exhaust outlet 177 is located on the circumferencial direction of connecting elements 168 there to be mode at interval side by side, and is communicated in an end of thermal dissipating path 176.The other end of thermal dissipating path 176 is by buckling parts 175 sealings of heat insulation outer cover 108.Buckling parts 175 at heat insulation outer cover 108 forms a plurality of air entries 178.Air entry 178 is located on the circumferencial direction of heat insulation outer cover 108 there to be spaced mode side by side, and is communicated in the other end of thermal dissipating path 176.
In the 7th example, at the buckling parts 175 formation air entries 178 of heat insulation outer cover 108.The other end at heat insulation outer cover 108 forms a plurality of protuberances that join with outer cover fixator 104 1 ends, and the space between the protuberance of adjacency is replaced this air entry 178 as air entry.Equally, also can be formed on a plurality of through holes of thermal dissipating path 176 upper sheds at the other end of heat insulation outer cover 108, and with through hole as air entry.
And then, be formed on a plurality of through holes of thermal dissipating path 176 upper sheds at an end of heat insulation outer cover 108, and above-mentioned through hole replaced the exhaust outlet 177 that in lamp socket 107, forms as exhaust outlet.
Secondly, explain with regard to the assembling sequence of lamp 100.
At first, 11 embed insulating components 106 in the resettlement section of outer component 101, and the resettlement section 116 inboard collecting point circuit for lamp 105 that cover at insulating component 106 thus.Two lead 162a that secondly, will draw from lamp circuit 105,162b imports to light source support 113 from the through hole of the 163b of closure wall portion through hole 122a, 122b.
After this, heat transfer plate 135 is loaded on the supporting surface 114 of light source support 113, and the bottom 125 of light source 102 is overlapped on the heat transfer plate 135.At this moment, with the protuberance 123a of light source support 113,123b embeds light source 102 through sliding part 136c, the 136d of heat transfer plate 135 the 1st buckling parts 132a, 132b.Thus, determined the relative position of light source 102 with light source support 113.And then, the lead 162a that imports to through hole 122a, 122b, 162b are imported to two island areas 129 of adjacency, and are welded in above-mentioned island areas 129 through the slotting logical 131a of portion of the lead of light source 102,131b.
Secondly, light source outer cover 103 is loaded on the distributing board 126 of light source 102.At this moment, make the 2nd buckling parts 133a, the 133b that is fitted to light source 102 from lens fixture 139 outstanding protuberance 151a, 151b.Chimeric through this, determined the relative position of light source 102 with light source outer cover 103.Thereby the optical axis X2 of lens 138 will be consistent with the center of light-emitting component 127, and can the conflict peripheral part of distributing board 126 of the portion that accepts 150 of lens fixture 139.
Secondly, the male screw portion 121 through the box thread portion 158 with outer cover fixator 104 is screwed into outer component 102 is connected in outer component 101 with this outer cover fixator 104 with coaxial shape thus.Follow the connection of outer cover fixator 104, will a conflict end of lens fixture 139 of the press section 155 of outer cover fixator 104, and with lens fixture 139 extruding to light source support 113.Its result, light source 102 scioptics fixators 139 are expressed to the supporting surface 114 of light source support 113, and heat transfer plate 135 is clipped between the bottom 125 of supporting surface 114 and light source 102 securely.
Because heat transfer plate 135 produces strain, therefore will be close to this supporting surface 114 and bottom 125.Thus, get rid of the heat conducting space of 125 of overslaugh supporting surface 114 and bottoms, and heat is conducted between supporting surface 114 and bottom 125 well.In other words, with the contrast of not using heat transfer plate 135, can improve from light source 102 to light source support 113 heat conductivility.
Meanwhile, through making the bounce of heat transfer plate 135 elastic return, make the interlock of box thread portion 158 and male screw portion 121 become strong to original form.Thus, outer cover fixator 104 will be difficult to relax.
For example when the higher situation of the precision of supporting surface 114 and bottom 125, can save heat transfer plate 135.And then, also can use with for example silicon to be the electric conductivity grease replacement heat transfer plate 135 of principal component.
When light source 102 is pressed to light source support 113, with outer cover fixator 104 be screwed into and revolving force, will act on light source outer cover 103 and light source 102.Light source 102 as stated, chimeric through protuberance 123a, 123b and the 1st buckling parts 132a, 132b, the relative position between decision and the light source support 113.Equally, even be light source outer cover 103, also can be through the chimeric relative position that decides light source 102 of protuberance 151a, 151b and the 2nd buckling parts 133a, 133b.
Therefore, light source outer cover 103 and light source 102 can not rotate along with outer cover fixator 104.Thereby the excessive strength that causes producing broken string and crack can not be applied to the island areas 129 of light source 102 and the welding portion of lead 162a, 162b.Thereby the welding portion stress application of guiding line 162a, 162b and island areas 129 also can not assembled this lamp 100.
Secondly, lamp socket 107 is installed in outer component 101.Installation exercise carries out as follows,, the leading section of lamp socket 107 169 is embedded the openend 116 of outer components 101 that is, and makes and fasten projection 170 and be fastened on and end groove 118.
When lamp socket 107 was installed in outer component 101, lamp circuit 105 received by the strength of connecting portion material 168 extruding of lamp socket 107 to light source support 113 directions sometimes.This power is delivered to light source 102 through lead 162a, 162b.
Light source 102 is clipped between light source outer cover 103 and the light source support 113.Therefore, promptly exerting all one's strength is applied to light source 102 through lead 162a, 162b, and light source 102 also can not break away from the supporting surface 114 of light source support 113.Therefore, can keep the compactness between light source 102 and the light source support 113, and also can make the optical axis X2 of lens 138 can not depart from luminous sub-prime 127 centers.
At last, heat insulation outer cover 108 is mounted and fixed on the outside of outer component 101 and outer cover fixator 104, and the box thread portion 174 of heat insulation outer cover 108 is screwed into the male screw portion 173 of connecting elements 168.Be screwed into through this, the buckling parts 175 of heat insulation outer cover 108 can be stuck in an end of outer cover fixator 104.Its result surrounds the outer position 101 of heat insulation outer cover 108 and the state connection lamp socket 107 of outer cover fixator 104 with coaxial shape, thereby accomplishes the assembling of lamp 100.
Under the state of accomplishing assembling lamp 100, will be arranged in heat insulation outer cover 108 inboard thermal dissipating paths 176 and be opened in atmosphere through air entry 178 and exhaust outlet 177.
In the lamp 100 of the 7th example, if lamp 100 is thrown light on, then light-emitting component 127 will generate heat.The heat that light-emitting component 127 is sent can be delivered to light source support 113 through heat transfer plate 135 from the bottom 125 of light source 102.The heat that is delivered to light source support 113 is delivered to radiating surface 112 from end wall 110 through perisporium 110, and is dispersed into thermal dissipating path 176 from this radiating surface 112.
Because receive the light source support 113 of the heat that light-emitting component 127 sent, it is shaped to one with the perisporium 110 with radiating surface 112, so do not have the heat conducting bonding part of overslaugh from light source support 113 to radiating surface on 112 the heat conduction path.So, can the thermal resistance of heat conduction path be suppressed for less, and the heat that can expeditiously the light-emitting component that is delivered to this light source support 113 127 be sent is dispersed into radiating surface 112.Meanwhile, because all surfaces of radiating surface 112 all is exposed to thermal dissipating path 176, therefore can overslaugh not dispel the heat from radiating surface 112.Thereby, can improve the cooling performance of light-emitting component 127.
And then, because metal system outer cover fixator 104 is screwed into outer component 101, therefore can make outer component 101 and 104 thermally coupleds of outer cover fixator through the occlusion portion of box thread portion 174 and male screw portion 173.So the heat of outer component 101 also can be delivered to outer cover fixator 104, and from then on the outer peripheral face of outer cover fixator 104 is dispersed into thermal dissipating path 176.Therefore, outer cover fixator 104 capable of using increases the area of dissipation of lamp 100, and can further improve the cooling performance of this light-emitting component 127.
Shown in figure 21, if the heat of light-emitting component 127 is distributed, then will produce ascending air at thermal dissipating path 176 on thermal dissipating path 176.Thus, lamp 100 air outside then suck thermal dissipating path 176 through the air entry 178 that is positioned at lamp 100 lower ends.Suck the air of thermal dissipating path 176, flow through behind the thermal dissipating path 176, be discharged to the atmosphere from exhaust outlet 177 with mode from top to bottom.
The radiating surface 112 of the outer peripheral face of outer cover fixator 104 and outer component 101 is to be exposed to thermal dissipating path 176.So, be delivered to the heat of the light-emitting component 127 of outer cover fixator 104 and outer component 101, will carry out heat exchange through air and distribute with the thermal dissipating path 176 of flowing through.Thus, can make outer cover fixator 104 and outer component 101 coolings through air, and it is overheated to suppress this light-emitting component 127.Thereby the luminous efficiency that can suppress light-emitting component 127 descends, and can prolong the life-span of light-emitting component 127.
Covering the heat insulation outer cover 108 of outer cover fixator 104 and outer component 101, is the synthetic resin made that is lower than outer component 101 by thermal conductivity.Therefore, the heat of outer cover fixator 104 and outer component 101 will be difficult to be delivered to heat insulation outer cover 108, and make the temperature of heat insulation outer cover 108 be lower than outer component 101.
According to the 7th example, the connecting elements 168 that is screwed into heat insulation outer cover 108 is processed for synthetic resin, so connecting elements 168 heat insulation between outer component 101 and heat insulation outer cover 108.And then the buckling parts 175 that is contacted with the heat insulation outer cover 108 of outer cover fixator 104 has air entry 178.Thus, even the heat of outer cover fixator 104 is delivered to the buckling parts 175 of heat insulation outer cover 108, buckling parts 175 also can cool off through the air that flows into thermal dissipating path 176 from air entry 178.Thereby heat insulation outer cover 108 will be difficult to receive the heat affecting of outer cover fixator 104, and can suppress the temperature rising of heat insulation outer cover 108.
According to the lamp 100 of the 7th example, when carrying out the situation of lamp replacing when for example lamp 100 is lit a lamp or after turning off the light at once, the operator promptly uses and holds heat insulation outer cover 108 in hand, also can not feel boiling hot.Thus, can not produce the operator because too boiling hot and misgivings that lamp 100 will be dropped, and can carry out the replacing operation of lamp 100 safely.
In the 7th example, also can form a plurality of minute apertures at heat insulation outer cover 108.And then, also can be axially or form a plurality of slits on the circumferencial direction and replace the hole along heat insulation outer cover 108.
Figure 26 and Figure 27 have disclosed the present invention's the 8th example.
In the 8th example, the structure that is used to distribute the heat of outer component 101 and outer cover fixator 104 is different from the 7th example.In addition, the structure of lamp 100 and structure obtained thus useful technique effect are all same with the 7th example.Thus, pay same reference marks for the component part identical in the 8th example, and omit its explanation with the 7th example.
Lamp 100 described in the 8th example replaces the heat insulation outer cover 108 of the 7th example and has following structure.Like Figure 26 and shown in Figure 27, outer component 101 has a plurality of the 1st fin 200.The 1st fin 200 is given prominence to radial from the radiating surface 112 of outer component 101.The 1st fin 200 extends on the direction of principal axis of outer component 101, and arranged side by side on the circumferencial direction of outer component 101 there to be spaced mode.
Outer cover fixator 104 has a plurality of the 2nd fin 201.The 2nd fin 201 is radial outstanding from the outer peripheral face of outer cover fixator 104.The 2nd fin 201 extends axially along outer cover fixator 104, and to exist spaced mode side by side on the circumferencial direction of outer cover fixator 104.
The 1st fin 200 and the 201 mutual axial continuities of the 2nd fin along lamp 100.Thus, 200, the 201 mutual thermally coupleds of the 1st and the 2nd fin, and directly expose in lamp 100 outsides.
The front-end edge of the 1st fin 200 is covered by the 1st edge outer cover 202.Equally, the 2nd fin 201 front-end edges are covered by the 2nd edge outer cover 203.The the 1st and the 2nd edge outer cover 202,203 is by the synthetic resin made.The thermal conductivity of the 1st and the 2nd edge outer cover 202,203 also is lower than outer component 101 and outer cover fixator 104.
According to the lamp 100 of the 8th example, because of having the 1st fin 200, and can increase the area of dissipation of the radiating surface 112 of outer component 101.Equally, because of there being the 2nd fin 201, and can increase the area of dissipation of the outer peripheral face of outer cover fixator 104.Thus, can the heat of the light-emitting component 127 that is delivered to outer component 101 and outer cover fixator 104 be dispersed into expeditiously lamp 100 outsides.Thereby the luminous efficiency that can suppress light-emitting component 127 descends, and can prolong the life-span of light-emitting component 127.
And then the thermal conductivity of the 1st and the 2nd edge outer cover 202,203 is lower than outer component 101 and outer cover fixator 104, and the 1st and the 2nd edge outer cover 202,203 is used to cover the front-end edge of the 1st and the 2nd fin 200,201.Therefore, the heat of outer component 101 and outer cover fixator 104 will be difficult to be delivered to the 1st and the 2nd edge outer cover 202,203, and can make the temperature of the 1st and the 2nd edge outer cover 202,203 be lower than outer component 101 and outer cover fixator 104.
The result is, when changing lamp at once when for example lamp 100 is lit a lamp or after turning off the light, even the operator can not feel boiling hot with holding the 1st and the 2nd fin 200,201 in hand yet.Thereby can there be the operator because feel too boiling hot and misgivings that lamp 100 is dropped, and can changes lamp 100 safely.
Figure 28 and Figure 29 disclose the present invention's the 9th example.
The 9th example is the situation that the 8th example further develops, identical in the structure of lamp 100 and the 8th example.Thus, pay identical reference marks for the structure division identical in the 9th example, and omit its explanation with the 8th example.
Lamp 100 described in the 9th example has the urceolus 220 that surrounds the 1st and the 2nd fin 200,201.Urceolus 220 forms the hollow cylindrical of diameter greater than outer component 101 and outer cover fixator 104.Urceolus 220 has the length of crossing over outer cover fixator 104 from the perisporium 110 of outer component 101.The inner peripheral surface of urceolus 220 and the 1st and the 2nd edge outer cover 202,203 join.Thus, urceolus 220 cross over adjacent the 1st and the 2nd fin 200, between 201.
In other words, urceolus 220 clampings the 1st fin 200 and relative, and clamping the 2nd fin 201 and relative with the outer peripheral face of outer cover fixator 104 with radiating surface 112.Thus, forming thermal dissipating path 221 between the radiating surface 112 of outer component 101 and the urceolus 220 and between the outer peripheral face of outer cover fixator 104 and the urceolus 220.Thermal dissipating path 221 lamp 100 axially on continuity.The the 1st and the 2nd fin 200,201 is exposed to thermal dissipating path 221.Thermal dissipating path 221 has an end 221a and other end 221b.When with lamp socket 107 state up lamp 100 being lit a lamp, an end 221a of thermal dissipating path 221 is from the lower end of the 2nd fin 201 and at the atmosphere split shed.Equally, when lamp 100 being lit a lamp with lamp socket 107 state up, the other end 221b of thermal dissipating path 221 from the upper end of the 1st fin 200 at the atmosphere split shed.
Urceolus 220 is the made that are lower than outer component 101 and outer cover fixator 104 by thermal conductivity.Comparatively ideally be, for example, when using heat-shrinkable synthetic resin material to form urceolus 220, urceolus 220 be mounted and fixed on after the outer component 101 and outer cover fixator 104 outsides, heat urceolus 220 again and make its thermal contraction.Thus, the inner peripheral surface of urceolus 220 will be extruded to the 1st and the 2nd edge outer cover 202,203, and urceolus 220 will be combined as a whole with outer component 101 and outer cover fixator 104.Thereby, can be easy to carry out the installation exercise of urceolus 220.
In the lamp 100 described in the 9th example,, then will produce ascending air at thermal dissipating path 221 if the heat of light-emitting component 127 is dispersed into thermal dissipating path 221.Thus, lamp 100 air outside will be sucked by an end 221a of thermal dissipating path 221.Be drawn into the air in the thermal dissipating path 221, flow through after the thermal dissipating path 221, be dispersed into the atmosphere from the other end 221b of thermal dissipating path 221 with mode from bottom to top.
Thus, be delivered to the heat of the light-emitting component 127 of outer cover fixator 104 and outer component 101, it carries out heat exchange through the air with the thermal dissipating path 221 of flowing through and distributes.Thus, outer cover fixator 104 cooling that can make outer component 101 and have the 2nd fin 201 through air with the 1st fin 200, and it is overheated to suppress light-emitting component 127.Thereby the luminous efficiency that can suppress light-emitting component 127 descends, and can prolong the life-span of light-emitting component 127.
Moreover urceolus 220 is a synthetic resin system, and its thermal conductivity is lower than outer component 101 and outer cover fixator 104.So the heat of outer component 101 and outer cover fixator 104 will be difficult to be delivered to urceolus 220, and can make the temperature of urceolus 220 be lower than outer component 101 and outer cover fixator 104.
The result is, when changing lamp at once when for example lamp 100 is lit a lamp or after turning off the light, even the operator with holding urceolus 220 in hand, can not feel boiling hot yet.Thus, can there be the operator because too boiling hot and misgivings that lamp 100 is dropped, and can changes lamp 100 safely.
Therefore, have the knack of this person and can understand other advantages and modification, in the broadest sense, the present invention is not limited thereto concrete example and the typical example that the place is disclosed and described.So, under the situation of aim that does not break away from the claim of being added and corresponding person thereof or scope, can carry out various modifications.

Claims (7)

1. lamp is characterized in that said lamp comprises:
Outer component with thermal conductivity; Above-mentioned outer component comprises light source support, expose at the outside radiating surface of above-mentioned outer component and to be arranged on above-mentioned radiating surface inboard and be provided with the resettlement section of openend at the opposition side of above-mentioned light source support, and above-mentioned light source support and above-mentioned radiating surface are integrally formed;
Lamp circuit comprises the circuit substrate of assembling circuit part;
Resinous connecting elements, the outer peripheral face of its leading section is formed with the fastening projection, when this leading section is embedded into openend inboard of above-mentioned outer component, utilizes this to fasten projection and is fastened;
Be connected to the lamp socket of above-mentioned outer component through above-mentioned connecting elements;
The light source that on above-mentioned light source support, is supported, foregoing circuit substrate are lit a lamp above-mentioned light source, above-mentioned light source when lighting a lamp, generate heat and thermally coupled in above-mentioned light source support; And
Be arranged on the translucent cover on the above-mentioned light source support with the mode that covers above-mentioned light source.
2. lamp as claimed in claim 1 is characterized in that,
The inboard of the openend of above-mentioned outer component is formed with button and ends groove, and the fastening projection that this button ends groove and above-mentioned connecting elements is interlocked.
3. lamp as claimed in claim 2 is characterized in that,
Be formed with electric insulation layer between above-mentioned resettlement section and the lamp circuit.
4. lamp as claimed in claim 3 is characterized in that,
Above-mentioned outer component comprises above-mentioned light source support and above-mentioned resettlement section end wall spaced apart from each other is provided with the heat insulation space of using between above-mentioned end wall and above-mentioned electric insulation layer.
5. lamp as claimed in claim 1 is characterized in that,
Above-mentioned outer component comprises the recess around above-mentioned light source support; Above-mentioned translucent cover comprises the edge portion that embeds above-mentioned recess; And utilize the bonding agent be filled in above-mentioned recess and the edge portion of above-mentioned translucent cover is fixed in the above-mentioned recess, the above-mentioned recess that is filled with above-mentioned bonding agent is compared the opposition side of more being partial to above-mentioned translucent cover with above-mentioned light source.
6. lamp as claimed in claim 5 is characterized in that,
Above-mentioned light source support comprises with above-mentioned recess compares the protuberance of more giving prominence to towards above-mentioned translucent cover, and raised part comprises to be exposed at the inboard front end face of above-mentioned translucent cover, and above-mentioned light source is arranged on above-mentioned front end face.
7. lamp as claimed in claim 1 is characterized in that,
Above-mentioned light source is a light emitting diode.
CN200910176109XA 2005-04-08 2006-04-07 Lamp Active CN101660739B (en)

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JP2005221571A JP4482706B2 (en) 2005-04-08 2005-07-29 Light bulb lamp
JP2005221688 2005-07-29
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JP2005221688A JP4725231B2 (en) 2005-04-08 2005-07-29 Light bulb lamp
JP2005-371406 2005-12-26
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