CN101699618B - Anti-vulcanization process method for thick-film BGA - Google Patents
Anti-vulcanization process method for thick-film BGA Download PDFInfo
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- CN101699618B CN101699618B CN2009102187774A CN200910218777A CN101699618B CN 101699618 B CN101699618 B CN 101699618B CN 2009102187774 A CN2009102187774 A CN 2009102187774A CN 200910218777 A CN200910218777 A CN 200910218777A CN 101699618 B CN101699618 B CN 101699618B
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Abstract
The invention provides an anti-vulcanization process method for a thick-film BGA, which comprises the steps of: printing a conductor and a resistor on a ceramic substrate first, and then printing protective glass on the conductor, wherein the protective glass after molding exactly covers the edge of a conductor layer; designing a screen opening of printing solder paste, and making the printing solder paste completely cover an exposed conductor pad; and planting balls on a thick-film chip printed with the solder paste, making the solder paste completely cover the exposed conductor during the ball plantation, and finally finishing the welding through hot air reflow soldering. When various layers of films are printed, the printing pressure is between 2.5 and 6.5Kg, and the leveling time is between 5 and 10 minutes. The process method not only can meet the design requirement of basic performance, but also has good anti-vulcanizing protective measures, and improves the reliability of products.
Description
Technical field
The present invention relates to the thick film screen printing ceramic circuit board, relate in particular to the preparation method of the BGA potted element in the thick-film electronic encapsulation technology.
Background technology
Variation, industrial expansion along with global climate; Element sulphur concentration increases gradually in the air; Palladium-silver conductor in the thick-film electronic product is exposed in the air, is easy to receive the influence of sulfurization, and promptly silver (Ag) reacts with airborne sulphur (S) in the conductor; The conductor layer structure just changes thereupon in the thick film products, finally causes product failure.To this situation, just the anti-sulfidation corrosion ability of thick-film electronic product, equipment is had higher requirement.Former BGA resistor network product is only paid attention to properties of product, and has ignored the importance of anti-sulfuration, causes the anti-sulfidation corrosion ability of product to can not get strong protection, and product has received constraint useful life.
Summary of the invention
The objective of the invention is to overcome the shortcoming of prior art, a kind of anti-vulcanization process method for thick-film BGA is provided, can not only satisfy the key property designing requirement, and have the good anti-vulcanizing safeguard measure, improved properties of product, prolonged useful life of product.
The technical scheme that realizes the object of the invention is: a kind of anti-vulcanization process method for thick-film BGA, and at first printed conductor, resistance on ceramic substrate print cover glass then on conductor, and cover glass just covers the conductor layer edge after being shaped; Design and printing soldering paste half tone opening covers the printing soldering paste fully and exposes conductor pad; Thick film chip to printing soldering paste is planted ball, and soldering paste covers fully and exposes conductor when planting ball, and welding is accomplished in weldering through hot air reflux at last; When printing each tunic layer, squeegee pressure is: 2.5～6.5Kg, flow time: 5～10 minutes.
The Application and Development of novel BGA Package element (BGA); With small product size advantage little, simple for assembly process; In surface mount device, occupied certain status, application surface progressively enlarges, and then has promoted the development of high density, high-performance, multi-functional packaging technology.In recent years, BGA widely applies, and lays a good foundation for multi-chip module (MCM) gets into mass production.This packing forms of BGA is applied on the thick film resistor network product, has reduced the product area, improved the complete machine packaging density at present.Product and then introduce anti-sulfuration protection has improved the resistance to corrosion of product, has improved reliability, and product obtains powerful guarantee useful life.
Description of drawings
Fig. 1 is a BGA Package resistor network component structure sketch map of the present invention.
Embodiment
According to the difference after counting yield technical requirement and each graphic designs size and the actual print; Each rete figure of product and the physical relationship between each layer pattern have been designed; Confirmed the optimum intersection figure of product design; Accomplish product design through planting technologies such as ball, Reflow Soldering then, reached designing requirement.Fig. 1 is the BGA structural representation of producing by process of the present invention; On ceramic substrate 1, divide three rows to be implanted with 27 soldered balls 4; 9 soldered balls 4 of every row; One conductor layer 2 is arranged in the bottom of each soldered ball 4, between three row's soldered balls 4, resistive layer 5 is arranged, on other position of resistive layer 5 and ceramic substrate, be coated with glassy layer 3.
At first printed conductor, resistance on ceramic substrate print cover glass then on conductor, just cover the conductor layer edge after the cover glass moulding.The assurance soldering paste covers fully and exposes conductor when planting ball, has so just played the good anti-vulcanizing effect.
When printing each tunic layer, in strict accordance with the printing of design drawing layer size, each layer all must be in microscopically microscopy contraposition more than 10 times; Guarantee the accuracy of each layer contraposition; And strict control printing dynamics, flow time guarantee that conductor film forming thickness is 18 ± 3 μ m behind the sintering, and cover glass film forming thickness is 10 ± 3 μ m; The conductor pad radius is 0.52 ± 0.02mm, makes cover glass cover conductor edge.Design and printing soldering paste half tone opening is 0.6mm then; The printing soldering paste covers fully and exposes conductor pad; Selecting diameter is the soldered ball of 0.55mm, and the half tone opening is that the ball chuck tool of planting of 0.65mm is planted ball to the thick film chip that prints soldering paste, and welding is accomplished in weldering through hot air reflux at last.
Squeegee pressure is: 2.5～6.5Kg
Flow time: 5～10 minutes
Claims (1)
1. an anti-vulcanization process method for thick-film BGA is characterized in that at first printed conductor, resistance on ceramic substrate, on conductor, prints cover glass then, just covers the conductor layer edge after the cover glass moulding; Design and printing soldering paste half tone opening covers the printing soldering paste fully and exposes conductor pad; Thick film chip to printing soldering paste is planted ball, and soldering paste covers fully and exposes conductor when planting ball, and welding is accomplished in weldering through hot air reflux at last; When printing each tunic layer, squeegee pressure is: 2.5～6.5Kg, flow time: 5～10 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102187774A CN101699618B (en) | 2009-11-03 | 2009-11-03 | Anti-vulcanization process method for thick-film BGA |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102187774A CN101699618B (en) | 2009-11-03 | 2009-11-03 | Anti-vulcanization process method for thick-film BGA |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101699618A CN101699618A (en) | 2010-04-28 |
| CN101699618B true CN101699618B (en) | 2012-01-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN2009102187774A Active CN101699618B (en) | 2009-11-03 | 2009-11-03 | Anti-vulcanization process method for thick-film BGA |
Country Status (1)
| Country | Link |
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| CN (1) | CN101699618B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157624A (en) * | 2013-05-14 | 2014-11-19 | 肖步文 | Bump chip and manufacturing technology thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000286365A (en) * | 1999-03-30 | 2000-10-13 | Mitsubishi Gas Chem Co Inc | Printed wiring board for extremely thin bga semiconductor plastic package |
| US6818980B1 (en) * | 2003-05-07 | 2004-11-16 | Asat Ltd. | Stacked semiconductor package and method of manufacturing the same |
| CN1574257A (en) * | 2003-06-09 | 2005-02-02 | 三洋电机株式会社 | Semiconductor device and manufacturing method thereof |
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2009
- 2009-11-03 CN CN2009102187774A patent/CN101699618B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000286365A (en) * | 1999-03-30 | 2000-10-13 | Mitsubishi Gas Chem Co Inc | Printed wiring board for extremely thin bga semiconductor plastic package |
| US6818980B1 (en) * | 2003-05-07 | 2004-11-16 | Asat Ltd. | Stacked semiconductor package and method of manufacturing the same |
| CN1574257A (en) * | 2003-06-09 | 2005-02-02 | 三洋电机株式会社 | Semiconductor device and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101699618A (en) | 2010-04-28 |
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