CN101888770B - A kind of flexible conducting material substrate and its implementation - Google Patents
A kind of flexible conducting material substrate and its implementation Download PDFInfo
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- CN101888770B CN101888770B CN201010223503.7A CN201010223503A CN101888770B CN 101888770 B CN101888770 B CN 101888770B CN 201010223503 A CN201010223503 A CN 201010223503A CN 101888770 B CN101888770 B CN 101888770B
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- conducting material
- flexible conducting
- grid
- fixing glue
- protruding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a kind of flexible conducting material substrate, comprising: the protruding grid and the fixing glue grid that are arranged at flexible conducting material substrate side.The present invention also also discloses a kind of implementation method of flexible conducting material substrate, uses described structure and method while guarantee flexible conducting material installs fastness, can meet the reliability requirement to flexible conducting material conduction.
Description
Technical field
The present invention relates to electromagnetic shielding material, particularly relate to electromagnetic shielding material substrate and its implementation of a kind of compliant conductive.
Background technology
Along with the fast development of electronic technology, electronic product emerges in an endless stream, and is also day by day improving the electrostatic defending of electronic product and the requirement of electromagnetic wave shielding function.According to the operation principle of electronic circuit, as long as there is alternating current to exist, just will inevitably generate electromagnetic waves radiation.Electromagenetic wave radiation all can work the mischief to the integrality of signal and the reliability etc. of circuit, therefore, derives the method for various electromagnetic wave shielding.
At present, the method for electromagnetic wave shielding is mainly divided into electric screen and magnetic screen; Wherein, described electric screen uses electric conducting material by electromagnetic radiation region overlay or parcel, forms the structure of similar Faraday cage, by the mode of electric field shielding by electromagnetic wave shielding; Described magnetic screen adopts magnetic shielding material, as ferrite etc., by the mode of armoured magnetic field by electromagnetic wave shielding.
Existing electrical shielding material comprises hardmetal good conductor and flexible conducting material, and described hardmetal good conductor can be processed to the cavity of solid shape, then will the circuit of conductively-closed be needed to be placed in one; Described flexible conducting material can be conductive fabric or conductive metal film etc., because flexible conducting material has plasticity and easy process and assemble, is widely used in the electronic products such as mobile terminal.
In the application process of flexible conducting material, the fastness of install flexible conducting material and the reliability of conduction there are certain requirements.Corresponding fastness of installing, existing solution is: one side fixing glue being coated in flexible conducting material, and the one side this being scribbled fixing glue is pasted onto on the region that need shield.But, because fixing glue is not good conductor, the ground level good contact around flexible conducting material and conductively-closed region cannot be made, therefore, if only can only realize the fastness of installing by fixing glue, and the reliability of conduction cannot be met.
In order to address this problem, existing method be in fixing glue doping metals particle or conductive fiber to improve the problem of fixing glue poorly conductive, but owing to being also wrapped in fixing glue around discrete metallic particles or conductive fiber, certain pressure need be applied to flexible conducting material, with guarantee fund's metal particles, conductively-closed region is connected with flexible conducting material.But conductive effect corresponding to different pressure sizes is also different, and in use pressure size is difficult to control, and therefore, is difficult to reach the requirement to flexible conducting material conduction reliability.
Summary of the invention
In view of this, main purpose of the present invention is to provide a kind of flexible conducting material substrate and its implementation, while guarantee flexible conducting material installs fastness, can meet the reliability requirement to flexible conducting material conduction.
For achieving the above object, technical scheme of the present invention is achieved in that
The invention provides a kind of flexible conducting material substrate, comprising: the protruding grid and the fixing glue grid that are arranged at flexible conducting material substrate side; Wherein,
Described protruding grid, comprises multiple projection arranged in length and breadth, is connected with the ground level around conductively-closed region;
Described fixing glue grid, is fixed on conductively-closed region.
Wherein, described projection is regular stereochemical structure or is irregular stereochemical structure.
Wherein, described flexible conducting material is conduction dry goods flexible conducting material or conductive metal film class flexible conducting material.
Wherein, the protruding grid of described flexible conducting material and described fixing glue Box junction distribute.
Wherein, the distance between described adjacent protrusion, according to needing the electromagnetic wavelength of conductively-closed to arrange, is directly proportional to electromagnetic wavelength.
Wherein, the thickness of described projection is identical with the thickness of fixing glue grid; Or there is thickness difference between projection thickness and fixing glue web thickness, described thickness difference is arranged according to the retractility of both respective material.
Present invention also offers a kind of implementation method of flexible conducting material substrate, the method comprises:
Flexible conducting material substrate plane arranges protruding grid, and places fixing glue in groove between the protruding grid of flexible conducting material, form fixing glue grid.
Wherein, described flexible conducting material is conduction dry goods flexible conducting material or conductive metal film class flexible conducting material; Accordingly, the described method arranging the protruding grid of flexible conducting material, is specially:
The protruding grid of flexible conducting material is produced by the mode weaving stamp; Or,
The good ductility of metal material self is relied on to stamp out protruding grid by machining.
Wherein, described formation fixing glue grid is:
Utilize the mode of specific mould or use machining, produce the fixing glue grid that Box junction protruding with flexible conducting material mates.
In such scheme, the projection of the protruding grid of described formation is regular stereochemical structure or is irregular stereochemical structure.
Flexible conducting material substrate provided by the invention and its implementation, flexible conducting material substrate plane arranges protruding grid; Place fixing glue in groove between the protruding grid of flexible conducting material, form fixing glue grid.The protruding grid of the flexible conducting material that the present invention is arranged and flexible conducting material substrate are one, there is good electric conductivity each other, when flexible conducting material of the present invention is fixed on conductively-closed region, ground level good contact around dense protruding grid and conductively-closed region, can realize the conductivity that flexible conducting material is good.
In addition, fixing glue is filled in the groove between the protruding grid of described flexible conducting material by the present invention, and the fixing glue grid of formation mates with protruding Box junction, and, the surface of all projections of the protruding grid glue that can not be fixed covers, and flexible conducting material therefore can be avoided to be fixed glue isolation; Meanwhile, flexible conducting material also can firmly be fixed on conductively-closed region by fixing glue grid, ensures the installation fastness of flexible conducting material.
Accompanying drawing explanation
Fig. 1 is the perspective view of flexible conducting material substrate of the present invention;
Fig. 2 is the implementation method schematic flow sheet of flexible conducting material substrate of the present invention.
Embodiment
Basic thought of the present invention is: in flexible conducting material substrate plane, arrange protruding grid; Place fixing glue in groove between the protruding grid of flexible conducting material, form fixing glue grid.
Wherein, the protruding grid of described flexible conducting material and flexible conducting material substrate are one; The protruding grid of described flexible conducting material and described fixing glue Box junction distribute, that is: each protruding of the protruding grid of flexible conducting material is dispersed with fixing glue around; Distance between described flexible conducting material adjacent protrusion is according to needing the electromagnetic wavelength of conductively-closed to arrange.
The projection of flexible conducting material of the present invention can be set to the regular texture such as cylinder, cube, or also can be set to other irregular structure.Below for the projection of flexible conducting material for cube structure, the structure of flexible conducting material of the present invention is described.
Fig. 1 is the perspective view of flexible conducting material substrate of the present invention, as shown in Figure 1, comprising: the protruding grid and the fixing glue grid that are arranged at flexible conducting material substrate side; Wherein,
Described protruding grid, the projection arranged in length and breadth by several forms, and is connected with the ground level around conductively-closed region, realizes the conductivity of flexible conducting material; Ground level around described conductively-closed region is positioned on the plane of protruding grid place shown in Fig. 1, and be close to protruding grid, here, in order to the structure of the protruding grid of clear expression and fixing glue grid, the structure of the ground level around conductively-closed region is not provided in FIG.
Described fixing glue grid, is fixed on conductively-closed region, realizes the installation fastness of flexible conducting material.
Shown in Fig. 1,11 is flexible conducting material substrate; 12 is a projection of flexible conducting material substrate, is cube structure; 13 is fixing glue grid.Wherein, described flexible conducting material projection 12 repeats, and some projections arranged in length and breadth form the protruding grid of flexible conducting material, and the surface of described flexible conducting material projection 12 does not have fixing glue; Described flexible conducting material substrate 11 and the protruding grid of flexible conducting material are one, have good electric conductivity each other.
Fixing glue of the present invention is filled in the groove between the protruding grid of described flexible conducting material, form fixing glue grid 13, and the surface of described flexible conducting material projection 12 does not have fixing glue, fixing glue grid 13 is different from the fixing glue that existing full wafer covers, therefore can avoid flexible conducting material be fixed glue isolation, the conductivity of flexible conducting material can not be affected.
In actual application, by described fixing glue grid 13, flexible conducting material is pasted and fixed on conductively-closed region, installs firmly; Meanwhile, the ground level good contact around the protruding grid of flexible conducting material and conductively-closed region, realizes the conductivity that flexible conducting material is good.
S shown in Fig. 1 is the distance between flexible conducting material adjacent protrusion, and this distance is according to needing the electromagnetic wavelength of conductively-closed to arrange, concrete, if the electromagnetic wavelength of conductively-closed is λ, so, can arrange S and λ proportional; λ is longer, and the S of setting is also larger, and proportionality coefficient between the two can be arranged arbitrarily; Certainly, concerning same λ, S is less, and shield effectiveness is better.
T shown in Fig. 1 is the thickness of fixing glue grid, is also the thickness of flexible conducting material projection.Certainly, the thickness of described fixing glue grid and flexible conducting material projection can be slightly different, that is: both roughly at grade, thickness difference is between the two about about 10% of gross thickness; Certainly, according to the difference of material, described thickness difference also can change to some extent.Because flexible conducting material and fixing glue have certain retractility, in other words elasticity, as long as when flexible conducting material is fixed on conductively-closed region, both all can good contact conductively-closed region.In actual applications, the size by adjusting T realizes the fastness of installing and the balance of conducting electricity between formedness, and such as: if T is smaller, conductivity is then quite a lot of, and fastness is just poorer; If T is larger, fastness is then better, and conductivity is just poor.
Below the implementation method of flexible conducting material of the present invention is described in detail.
Fig. 2 is the implementation method schematic flow sheet of flexible conducting material substrate of the present invention, and as shown in Figure 2, the performing step of the method is as follows:
Step 201: protruding grid is set in flexible conducting material substrate plane;
Be specially: protruding grid is set in traditional flexible conducting material substrate plane, for conduction dry goods flexible conducting material, the protruding grid of flexible conducting material can be produced by the mode weaving stamp; For conductive metal film class flexible conducting material, the good ductility of metal material self can be relied on to stamp out protruding grid by machining.
Wherein, the projection of described flexible conducting material can be set to the regular texture such as cylinder, cube, or also can be set to other irregular structure.
Step 202: fixing glue grid is set;
Be specially: the mode utilizing specific mould or use machining, produce the fixing glue grid that Box junction protruding with flexible conducting material mates, the thickness of fixing glue grid is roughly the same with the thickness of the protruding grid of flexible conducting material.
Step 203: fixing glue grid is assembled on the flexible conducting material substrate being provided with protruding grid;
Be specially: fixing glue grid is filled in the groove between the protruding grid of flexible conducting material, and is fixed on flexible conducting material substrate by the viscosity of fixing glue self, during assembling, avoid the surface of the flexible conducting material projection glue that is fixed to cover.
The above, be only preferred embodiment of the present invention, be not intended to limit protection scope of the present invention, and all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a flexible conducting material substrate, is characterized in that, comprising: the protruding grid and the fixing glue grid that are arranged at flexible conducting material substrate side; Wherein,
Described protruding grid, comprises multiple projection arranged in length and breadth, is connected with the ground level around conductively-closed region;
Described fixing glue grid, formed by the fixing glue in groove between described protruding grid, and is fixed on conductively-closed region.
2. flexible conducting material substrate according to claim 1, is characterized in that, described projection is regular stereochemical structure or is irregular stereochemical structure.
3. flexible conducting material substrate according to claim 1 and 2, is characterized in that, described flexible conducting material is conduction dry goods flexible conducting material or conductive metal film class flexible conducting material.
4. flexible conducting material substrate according to claim 1 and 2, is characterized in that, the protruding grid of described flexible conducting material and described fixing glue Box junction distribute.
5. flexible conducting material substrate according to claim 1 and 2, is characterized in that, the distance between described adjacent protrusion, according to needing the electromagnetic wavelength of conductively-closed to arrange, is directly proportional to electromagnetic wavelength.
6. flexible conducting material substrate according to claim 1 and 2, is characterized in that, the thickness of described projection is identical with the thickness of fixing glue grid; Or there is thickness difference between projection thickness and fixing glue web thickness, described thickness difference is arranged according to the retractility of both respective material.
7. an implementation method for flexible conducting material substrate, is characterized in that, the method comprises:
Flexible conducting material substrate plane arranges protruding grid, and places fixing glue in groove between the protruding grid of flexible conducting material, form fixing glue grid and be fixed on conductively-closed region;
Wherein, described protruding grid, comprises multiple projection arranged in length and breadth, is connected with the ground level around conductively-closed region.
8. the implementation method of flexible conducting material substrate according to claim 7, is characterized in that, described flexible conducting material is conduction dry goods flexible conducting material or conductive metal film class flexible conducting material; Accordingly, the described method arranging the protruding grid of flexible conducting material, is specially:
The protruding grid of flexible conducting material is produced by the mode weaving stamp; Or,
The good ductility of metal material self is relied on to stamp out protruding grid by machining.
9. the implementation method of the flexible conducting material substrate according to claim 7 or 8, is characterized in that, described formation fixing glue grid is:
Utilize the mode of specific mould or use machining, produce the fixing glue grid that Box junction protruding with flexible conducting material mates.
10. the implementation method of the flexible conducting material substrate according to claim 7 or 8, is characterized in that, the projection of the protruding grid of described formation is regular stereochemical structure or is irregular stereochemical structure.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010223503.7A CN101888770B (en) | 2010-07-07 | 2010-07-07 | A kind of flexible conducting material substrate and its implementation |
| PCT/CN2010/077145 WO2012003664A1 (en) | 2010-07-07 | 2010-09-20 | Flexible conductive material substrate and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010223503.7A CN101888770B (en) | 2010-07-07 | 2010-07-07 | A kind of flexible conducting material substrate and its implementation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101888770A CN101888770A (en) | 2010-11-17 |
| CN101888770B true CN101888770B (en) | 2015-08-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010223503.7A Active CN101888770B (en) | 2010-07-07 | 2010-07-07 | A kind of flexible conducting material substrate and its implementation |
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| CN (1) | CN101888770B (en) |
| WO (1) | WO2012003664A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576692B (en) * | 2014-11-24 | 2018-01-30 | 深圳市华星光电技术有限公司 | Conductive flexible substrate and preparation method thereof and OLED display and preparation method thereof |
| CN104853577B (en) * | 2015-05-13 | 2018-06-15 | 李金明 | Ultra-thin electromagnetic shields film production process |
| CN107690261B (en) * | 2017-07-31 | 2019-10-01 | Oppo广东移动通信有限公司 | A kind of attaching method of graphite flake mounting structure, mobile terminal and graphite flake mounting structure |
| CN107767775B (en) * | 2017-11-30 | 2020-05-19 | 广州国显科技有限公司 | Flexible display module |
| CN110831418A (en) * | 2018-08-09 | 2020-02-21 | 鸿富锦精密工业(武汉)有限公司 | Case panel and case adopting same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5528001A (en) * | 1992-02-14 | 1996-06-18 | Research Organization For Circuit Knowledge | Circuit of electrically conductive paths on a dielectric with a grid of isolated conductive features that are electrically insulated from the paths |
| US6054647A (en) * | 1997-11-26 | 2000-04-25 | National-Standard Company | Grid material for electromagnetic shielding |
| CN1922948A (en) * | 2004-02-27 | 2007-02-28 | 三菱瓦斯化学株式会社 | Radio wave absorber and manufacturing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10294583A (en) * | 1997-04-16 | 1998-11-04 | Seiwa Electric Mfg Co Ltd | Electromagnetic wave shielding gasket |
| JPH10294586A (en) * | 1997-04-18 | 1998-11-04 | Dainippon Printing Co Ltd | Magnetism-proof card case |
-
2010
- 2010-07-07 CN CN201010223503.7A patent/CN101888770B/en active Active
- 2010-09-20 WO PCT/CN2010/077145 patent/WO2012003664A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5528001A (en) * | 1992-02-14 | 1996-06-18 | Research Organization For Circuit Knowledge | Circuit of electrically conductive paths on a dielectric with a grid of isolated conductive features that are electrically insulated from the paths |
| US6054647A (en) * | 1997-11-26 | 2000-04-25 | National-Standard Company | Grid material for electromagnetic shielding |
| CN1922948A (en) * | 2004-02-27 | 2007-02-28 | 三菱瓦斯化学株式会社 | Radio wave absorber and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101888770A (en) | 2010-11-17 |
| WO2012003664A1 (en) | 2012-01-12 |
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