CN102176375B - Plated terminal - Google Patents

Abstract

The invention discloses an improved wire terminal component for a multilayer electronic component, which is the wire terminal plated with the single chip component to eliminate or significantly simplify the request of the typical thick film wire terminal. The terminal technology eliminates many problems of the typical wire terminal and forms more wire terminals with thinner distances; the technology is especially beneficial for the small electronic component. Portions of the electrodes and anchor tabs are exposed along the periphery of the electronic component in respective groups and thin-film plated deposition is formed thereon by electroless plating techniques. A solder dam layer is provided over a given component surface and formed to expose predetermined areas where solder barrier and flash materials may be deposited before attaching solder performs.; Some embodiments include plated terminations substantially covering selected component surfaces to facilitate with heat dissipation and signal isolation for the electronic components. The technology can use the plurality of single multilayer structures and uses sorts of plating technologies and wire terminal material in the plating wire terminal.

Description

Plated terminal

The application be that April 8, application number in 2004 are 200410032548.0 the applying date, denomination of invention divides an application for the application for a patent for invention of " plated terminal ".

Technical field

The present invention relates generally to the improvement terminals parts for multilayer electronic component, relate in particular to for such as the multi-layered electronic parts of capacitor, resistor etc. or be used for the plated terminal of integrating passive components.Terminal design of the present invention adopts the selectivity setting of inside and/or outer electrode joint, thereby is convenient to the formation that plating is electrically connected.Preferably carry out the outside and connect, eliminate or obviously simplify thus the use of typical thick film metallization end band.

Background technology

Many hyundai electronics component encapsulations become monolithic device, and can comprise discrete component or a plurality of element in the one single chip encapsulation.An object lesson of this monolithic device is multi-layer capacitor or array of capacitors, for disclosed technology, is the multi-layer capacitor with interdigital interior electrode layer and corresponding electrode nipple especially noticeablely.The example that comprises the multi-layer capacitor of interdigitated capacitors (IDC) technical characterictic can be with reference to U.S. Patent No. 5,880,925 (people such as DuPr é) and 6,243,253B1 (people such as DuPr é).Other monolithic electronic element is corresponding to the device that a plurality of passive components is integrated in the single chip architecture.This integrated passive components can provide the selected combination of resistor, capacitor, inductor and/or other passive component, and these elements form sandwich construction and are encapsulated as monolithic electronics.

Often need selectivity terminals (selective termination) in order to be electrically connected for each monolithic electronic element forms.Need multiple terminals (multiple termination) so that the electrical connection from the different electronic components of integrated monolithic device to be provided.Also often multiple terminals are combined with IDC and other multiple tier array, in order to reduce undesirable inductance level.A typical way that forms multiple terminals in sandwich type element is to hole by the selection area that passes chip structure, and uses the electric conducting material filling vias, is electrically connected so that form among the selected electrode part of device divides.

Another mode that forms external terminal for device of the present invention is the expose portion that the thick film tape of the silver in the glass basis or copper is applied to interior electrode layer, then at the additional metal level of the upper plating of terminals band (termination stripe), so that parts can be welded on the substrate.In U.S. Patent No. 5,021, disclose among 921 (people such as Sano) and had by the terminals of sintering and the example of the electronic component of the film formed outer electrode of metal of plating thereon.Using of terminals often is difficult to control, and can become the obstacle that reduces chip size.U.S. Patent No. 6,232,144B1 (McLoughlin) and 6,214,685B1 people such as () Clinton relate to the method that forms terminals at the selection area of electronic device.

The size that electronic component constantly shrinks is so that the particularly difficulty that becomes with required precision printed wiring end band in presumptive area.Generally provide thick film metallization end band with machine, the chip and described machine can be held, and the terminals of selection are provided with custom-designed wheel.U.S. Patent No. 5,944,897 (Braden), 5,863,331 (people such as Braden), 5,753,299 (people such as Garcia) and 5,226,382 (Braden) disclose about mechanical part and the step of terminals band are provided to chip structure.For the electronic chip device, the increase of the quantity of the reduction of component size or terminals contact can make particularly outstanding that the resolution limit in the traditional wired end processing becomes.

Can occur other problem when attempting to provide the selectivity terminals comprises: the skew of terminal pads, the mistake of terminals are located so that the internal electrode joint exposes or misses fully, and are lost in the terminal portion around the lap.But when the coating of the coating shape terminals material that applies is too thin or when a part of terminals coating is coated onto on another and causes the terminal pads short circuit, can cause other problem again.These and other problem that centers on the electronics terminals setting of monolithic device proposes and need to provide cheap and effective terminals parts for electronic chip component.

Miniaturization along with element, for the terminals that are not shorted together each other are provided, when particularly near circuit board, locating a plurality of element, U.S. Patent No. 6,380,619 (people such as Ahiko) provide a kind of chip-shaped electronic part, and it has the outer electrode that the side with preset distance and ceramic substrate separates.More specifically, it discloses the electronic component with three side terminal relative with five more traditional side terminal.This element with three side terminal is easier to the setting that concerns adjacent one another are, and can different component terminals be shorted together.The disclosed embodiment of the people such as Ahiko comprises to the thin dew part of single electrode and uses electroplating film.

The another kind of known selection relevant with the terminals application comprises a plurality of single base components and mask alignment.Can pack parts in the custom-designed anchor clamps into, disclosed among 076 people such as () Lutz for example in U.S. Patent No. 4,919, then by the mask element sputter.Therefore the manufacturing process that this is normally very expensive is desirable to provide other effectively and the terminals with more expensive benefit.

U.S. Patent No. 5,880,011 (people such as Zablotny), 5,770,476 (Stone), 6,141,846 (Miki) and 3,258,898 (Garibotti) relate separately to the formation for the terminals of various electronic components.

Other reference background document that relates to the method that is used to form multilayerceramic device comprises U.S. Patent No. 4,811,164 (people such as Ling), 4,266,265 (Maher), 4,241,378 (Dorrian) and 3,988,498 (Maher).

Although understood various schemes and selectable unit (SU) in the field of electronic component and terminals thereof, do not had a kind of design to show and contain all situations discussed herein fully.Accordingly, the disclosure of all above-mentioned United States Patent (USP)s all is introduced among the application as its reference.

Summary of the invention

The present invention's understanding has also been stated various above-mentioned shortcomings and other specified scheme about electric connection terminal and correlation technique.Therefore, in a broad sense, the main purpose of disclosure technology is the improvement terminals parts for electronic component.Particularly, be that plating forms to disclosed terminals parts, and be designed to eliminate or obviously simplify thick film tape that described thick film tape typically partly prints along the monolithic device that is used for terminals.

Another main purpose of disclosure technology provides a kind of method, with the employing that is guided through the internal electrode joint and the selectivity of additional anchored joint the formation plated terminal is set.Internal electrode joint and additional anchored joint can be convenient to guarantee the formation of safe and reliable outside coating layer.The anchored joint that does not generally provide internal electrical to connect can be set, in order to improve the deposition of connectivity, better mechanical integraty and the coating material of external terminal.

Another main purpose of the present invention provides the terminals parts for electronic component, thereby elimination or simplification thick film metallization end band commonly used only need plated terminal to realize that outer electrode connects.According to disclosed technology, coating material can comprise metallic conductor, resistance material and/or semi-conducting material.

Another main purpose of this invention terminals technology is, can use the terminals parts according to different multilayer monolithic devices, the multilayer monolithic device for example comprises the low many ceramic capacitors of inductance and array of capacitors, multilayer ceramic capacitor and array of capacitors and integrated passive components.Integrated passive components can comprise the selected combination of resistor, capacitor, rheostat, inductor, balun, connector and/or other passive component.

The advantage of disclosed invention is, need not to adopt the mechanical terminals parts that just can obtain for electronic component of terminals, therefore possesses the ability of producing the external terminal with the level of resolution that can't obtain in other situation.This improved terminals resolution can also provide more terminals and have the more terminals of thin space in given element area.

The general purpose of present technique provides the terminals parts, and it can be based on reducing the sensitiveness that scolder is leached and reducing insulation resistance and realize effective welding.The structure of exposing electrode part and anchored joint part is designed, so that the selected adjacent blank area that exposes covers with the plated terminal material, and among different terminals are located, do not have undesirable bridge joint.

Another object of the present invention is to, use disclosed technology according to the difference (comprising the quantity and the position that change external terminal) of different terminal structures.Form plated terminal according to various coating technology described here, the position that can certainly determine by the existence of the conductive component that exposes in the periphery of electronic component.

Another purpose of plated terminal technology of the present invention is to realize manufacturing more cheap, more effective electronic component in favourable reliable mode.

Listed in this detailed description, perhaps those skilled in the art can find out at an easy rate according to the description at this, other purpose of the present invention and advantage.And those skilled in the art will also be understood that, in the situation that does not break away from essence of the present invention and scope, dependence is to its reference, in the practice of different embodiment neutralizes the employing of disclosed technology, can carry out making amendment at these parts specifically described, for reference, that discuss and changing.This variation can comprise function, operation or the mutually replacement of antidirection finding for the replacement of shown in those, incorporated by reference or the equivalent device discussed and parts or material and various parts, feature etc., but is not limited to this.

In addition, different embodiments of the invention and different preferred embodiment can be understood and disclosed parts or element or its equivalent various combinations or the structure of (comprising the not shown in figures or parts in introduction, mentioned or the combination of structure) can be comprised.

The first exemplary embodiments of the present invention relates to a kind of multilayer electronic component with chemical plating wiring.This multilayer electronic component can preferably include a plurality of insulated substrates, wherein is inserted with a plurality of electrodes.Each corresponding electrode preferably has at least one from its blank area that extends out, and exposes along the selected edge of a plurality of insulated substrates.Selected exposed electrode blank area is preferably stacked with preset distance each other, so that a plurality of chemical plating terminals can form along the periphery of electronic component.In some typical embodiment, electrode and each blank area can be according to the interdigital structure settings, wherein electrode nipple partly extend to (such as, but not limited to), two or four side of electronic component.In other exemplary embodiments, electrode can be arranged in the structure that is generally T shape and/or J-shaped.

The another kind of related embodiment of disclosed technology relates to a kind of electronic component such as above-mentioned the first exemplary embodiments, also comprises additional anchored joint.In this exemplary embodiments, anchored joint can also between be inserted between a plurality of substrate layers, and expose in the precalculated position, so that the formation of plated terminal is by the electrode nipple part that exposes and the anchored joint guiding that exposes.By exposed contacts and fully stacking with the exposed contacts at least one end face of the dielectric material body of the lamination of exposed contacts alignment and the bottom surface are set, stretch out along the side of whole exposure and one of be wound in electronic component end face and the bottom surface or both formation of plated terminal becomes possibility, and usually (not always) expectation.The J-shaped of gained or U-shaped terminals provide the pad of being convenient to installing electronic elements on printed circuit board (PCB) or other installation site.In addition, the exposed contacts that exposes along whole side but be not wound to end face and/or bottom surface can form by in each angular radius part of device anchored joint being set, and is convenient to thus still to realize the formation of the little pad terminals of the good bond between scolder and printed circuit board (PCB) or other installation surface.

In exemplary embodiments more of the present invention, terminals comprise one or more plated terminal material layer, are provided with additional terminals layer on its top.An example of this multilayer interconnection end is corresponding to the initial copper coating layer of each layer back that is connected on nickel and tin, and it can also be according to disclosed method plating.

Another kind of exemplary embodiments of the present invention is corresponding to comprising corresponding a plurality of the first and second ceramic layers, a plurality of electrode and the multilayer electronic component of one deck plated terminal material at least.Be inserted with a plurality of the first ceramic layers, with the formation intraware, and the second ceramic layer is arranged on the opposing outer face of intraware, to form the cover layer of electronic component Electrode selectivity.The anchored joint of electric insulation is embedded among the first and/or second ceramic layer alternatively, with further nucleation and guide the formation of plated terminal material.

Another exemplary embodiments of the present invention relates to a kind of interdigitated capacitors, comprises electrode and the dielectric layer of a plurality of insertions, and it is characterized in that corresponding top layer and the bottom.Top layer and the bottom of multilayer interdigitated capacitors preferably include thickness greater than the dielectric covering layer of other dielectric layer in the laminated construction.Each corresponding electrode layer comprises a plurality of electrode nipples that extend to the selected side of interdigitated capacitors.Electrode nipple preferably is exposed in the laminate portion at the select location place of the side of capacitor.Anchored joint preferably is embedded in the top and bottom cover layer, and is embedded in the active layer alternatively, so that the joint lamination that exposes extends along the part of the whole side of multilayer device.External terminal can be subsequently along exposed contacts lamination plating, and one of can be wound in top layer and the bottom or both, if the anchored joint location thereon, and usually aligns with the lamination of exposed inner joint.The exposed contacts of extending along whole side and not being wound to top and/or the bottom can comprise the anchored joint in tectal each angular radius part of device top and bottom, is convenient to thus form and printed circuit board (PCB) or other are installed the little pad terminals that the surface forms good solder bonds.

The invention still further relates to and form the method relevant according to the multilayer electronic component of disclosed technology.An exemplary embodiments of this method comprises the steps, a plurality of electronic components are set, and chemical plating groove liquid is set, and electronic component is immersed the scheduled time in the chemical plating groove liquid.Electronic component comprises respectively a plurality of ceramic substrate layers that optionally are inserted with a plurality of internal electrodes.The selected part of internal electrode is exposed to along the position of each electronic component periphery, so that the immersion of chemical plating groove liquid can make the terminals deposition of material on a plurality of electronic components, to form the bridge joint terminals to each element.

Other exemplary steps according to the present invention comprises the step that element is immersed the selected face of cleaning electronic component before the chemical plating groove liquid, such as by chemical polishing.Another exemplary steps is corresponding to dividing the step of using activated material to the electrode part that exposes, such as immersing slaine, photoetching composition Organometallic precursor, silk screen printing or ink-jet palladium deposition and/or electrophoresis metal deposition.Another exemplary steps is corresponding to heating or annealing steps, to strengthen the plated terminal material to the adhesive force of electronic component.

Needn't can comprise that in other embodiments of the invention that this overview section is expressed also combination is with reference to the combination of the various schemes of the feature in the above-mentioned overview section or parts and/or the further feature of discussing and parts in this specification.

When describing the application's remainder, those skilled in the art will understand characteristics and scheme and other content of these embodiment better.

Description of drawings

In the specification that is described with reference to the drawings, for having listed, those skilled in the art comprise the of the present invention complete of its preferred forms and the explanation that can express, in the accompanying drawing:

Figure 1A represents the overall top exploded view for the known typical electrode layer structure of multilayer interdigitated capacitors;

Figure 1B represents to have the overall side perspective view of typical multilayer interdigitated capacitors of the interior electrode layer structure of the known typical embodiment shown in Figure 1A;

Fig. 2 A represents the overall top exploded view for the typical internal electrode layer of multilayer interdigitated capacitors according to the present invention and anchored joint structure;

Fig. 2 B represents to have internal electrode and the anchored joint overall side perspective view according to typical multilayer interdigitated capacitors of the present invention partly shown in Fig. 2 A;

Fig. 3 A represents the overall top exploded view for the known typical interior electrode layer structure of multi-layer capacitor;

Fig. 3 B represents for according to the typical internal electrode layer of multi-layer capacitor of the present invention and the overall top exploded view of anchored joint structure;

Fig. 4 A represents to have internal electrode and the anchored joint overall side perspective view according to typical multi-layer capacitor of the present invention partly as shown in Fig. 3 B;

Fig. 4 B represents the overall side perspective view according to typical multilayer interdigitated capacitors of the present invention, it is characterized in that internal electrode and the anchored joint part exposed in four selected sides of typical capacitor structure;

Fig. 5 A and 5B represent respectively the overall top view for the known electrodes layer structure of using at typical multi-layer capacitor embodiment;

Fig. 5 C represents to have the overall side perspective view such as the typical multi-layer capacitor embodiment of the electrode layer structure of the known typical form of Fig. 5 A and 5B;

Fig. 6 A and 6B represent respectively according to the present invention for the overall top view of the typical electrode layer structure of using at multi-layer capacitor embodiment;

Fig. 6 C has represented the overall side perspective view that has the typical multi-layer capacitor embodiment of electrode layer structure as shown in Figure 6A and 6B according to of the present invention;

Fig. 7 A represents to have the overall side perspective view of the typical capacitor array of exposed electrode joint;

Fig. 7 B represents to have the overall side perspective view according to the typical capacitor array of plated terminal of the present invention;

Fig. 8 A represents to have the overall side perspective view according to the typical multilayer interdigitated capacitors of plated terminal of the present invention;

Fig. 8 B represent along the planar cross-sectional line A-A of Fig. 8 A intercepting, have a side cross-sectional view according to the typical multilayer interdigitated capacitors of the typical plated terminal of disclosed technology;

Fig. 9 A represents to have the overall side view according to a little top perspective of the typical monolithic integrated passive components of the exposed electrode joint of disclosed technology and additional anchored joint;

Fig. 9 B represents to have the overall side view that pushes up a little perspective according to the typical monolithic integrated passive components of plated terminal of the present invention;

Figure 10 A represents to have for forming according to " I shape " terminals of disclosed technology and locates and the overall side cross-sectional views of the typical multilayer electronic component of the electrode that exposes and anchored joint;

Figure 10 B represents to have the overall side cross-sectional views of the typical multilayer electronic component of " I shape " terminals, and " I shape " terminals are all, and selected plating technic disclosed according to the present invention forms by Figure 10 A shown device is carried out in this way;

Figure 11 A represents to have for forming according to " J-shaped " terminals of disclosed technology and locates and the overall side cross-sectional views of the typical multilayer electronic component of the electrode that exposes and anchored joint;

Figure 11 B represents to have the overall side cross-sectional views of the typical multilayer electronic component of " J-shaped " terminals, and " J-shaped " terminals are all, and selected plating technic disclosed according to the present invention forms by Figure 11 A shown device is carried out in this way;

Figure 12 A represents to have for forming according to " U-shaped " terminals of disclosed technology and locates and the overall side cross-sectional views of the typical multilayer electronic component of the electrode that exposes and anchored joint;

Figure 12 B represents to have the overall side cross-sectional views of the typical multilayer electronic component of " U-shaped " terminals, and " U-shaped " terminals are all, and selected plating technic disclosed according to the present invention forms by Figure 12 A shown device is carried out in this way;

Figure 13 A and 13B represent respectively for multi-layer capacitor embodiment, according to the overall top view of typical electrode layer structure of the present invention;

Figure 13 C is for having the overall side perspective view of the typical multi-layer capacitor embodiment of the electrode layer structure shown in Figure 13 A and the 13B according to the present invention;

Figure 14 A and 14B represent respectively for multi-layer capacitor embodiment, according to the overall top view of typical electrode layer structure of the present invention; And

Figure 14 C is for having the overall side perspective view of the typical multi-layer capacitor embodiment of the electrode layer structure shown in Figure 14 A and the 14B according to the present invention.

Reusable Reference numeral represents same or analogous parts or element among the present invention in this specification and the accompanying drawing.

Embodiment

With reference to the summary of the invention part, the present invention relates to the improvement terminals parts for monolithic electronic element.

Terminal design of the present invention is in the structure that adopts the exposed electrode part, such as the monolithic capacitor array, comprise multi-layer capacitor, integrated passive components and other electronic chip structure of the exposed electrode part with interdigital electrode structure.Additional anchored joint can be embedded in this monolithic component, and so that current-carrying part in stacked a plurality of exposures to be provided, plated terminal can be formed in this exposure on the current-carrying part and arrange regularly along the periphery of device.

By top and/or basal surface at chip device extra anchored joint is set, can forms the plated terminal of coiling (wrap-around), these terminals extend to one or more top and bottom layers along chip side.The terminals of this coiling need in some applications, so that the welding of chip and printed circuit board (PCB) or other suitable substrate.The exposed contacts that is not wound to top and/or bottom along the extension of whole side can form by in each angular radius (corner radius) part of top device and bottom cover layer anchored joint being set, and is convenient to thus still can the less pad terminals of the good solder bonds of surface formation be installed with printed circuit board (PCB) or other.

Coating technology of the present invention can adopt according to a plurality of different monolithic components with the anchored joint parts.Figure 1A and 1B represent the scheme of existing interdigital electrode layer structure, and wherein electrode nipple usually extends to two selected sides of sandwich type element and exposes thereon.After this, with reference to figure 2A and 2B, express the scheme according to plated terminal of the present invention, it also relates to the sandwich type element embodiment of the exposure current-carrying part of two selected sides with device.

Fig. 3 A represents to have the scheme of the existing electrode layer structure of the electrode nipple that exposes in a selected side of multilayer electronic device.Fig. 3 B and 4A relate separately to the improvement of the exemplary embodiments that Fig. 3 A is represented, a kind of typical multi-layer capacitor is provided, and it has the internal electrode joint that exposes in a selected side of capacitor and according to unique anchored joint of present technique.Fig. 4 B relates to internal electrode joint with four selected sides of exposing element according to the present invention and the interdigital element of typical multilayer of anchored joint.

Another exemplary embodiments of the present invention relates to respectively at the multi-layer capacitor structure shown in Fig. 6 A to 6C, and these are respectively the improvement to the typical multi-layer capacitor structure of Fig. 5 A to 5C.Other example of multi-layer capacitor structure is respectively shown in Figure 13 A to 13C and the 14A to 14C.With reference to the typical capacitor array of Fig. 7 A and 7B, explain other embodiment of disclosed technology.Fig. 8 A and 8B then represent the scheme of plated terminal parts of the present invention, and Fig. 9 A and 9B relate to the typical integrated passive component that has according to selectivity terminals of the present invention.More especially can applicable example as disclosure technology, Figure 10 A and 10B show the scheme of " I shape " terminals, and Figure 11 A and 11B show the scheme of " J-shaped " terminals, and Figure 12 A and 12B show the scheme of " U-shaped " terminals.

It should be noted that each exemplary embodiments in this statement is not construed as limiting disclosed technology.Describe or the parts of explanation can be used for and the combining of other embodiment as the part among the embodiment, thereby obtain other embodiment.In addition, specific parts can exchange with similar device or the parts not mentioning but have identical, similar or an equivalent function.

To describe now the preferred embodiment of disclosed technology in detail.With reference to the accompanying drawings, Figure 1A is illustrated in the electrode layer 10 that adopts in multilayer interdigitated capacitors or the array of capacitors, have electrode nipple 14 and 12 existing typical structure.Electrode layer is arranged in parallel, and joint 14 stretches out from a plurality of layer, so that the electrode nipple that stretches out from alternating electrode layer 10 and 12 is along each column alignment.Typical case has been described four kind electrode layers with corresponding joint 14, and adopts the exemplary array of present technique can comprise in some cases more electrode layer and corresponding joint.(by selecting the quantity of electrode) this parts provide to consist of has the selection of the capacity cell of capacitance on a large scale.

The typical electrode layer structure of Figure 1A is not the expression of the capacitor embodiment that finishes.On the contrary, Figure 1A provides the reference of the middle scheme of relevant typical capacitor and array of capacitors structure.Can be according to the electrode layer structure that adopts Figure 1A in the typical multilayer interdigitated capacitors shown in Figure 1B for example.

Interdigitated capacitors usually shown in Figure 1A, a plurality of electrode layers that are arranged in the dielectric material body 18 consist of, dielectric material body 18 is for example seen in the typical interdigitated capacitors structure 16 of Figure 1B.Electrode layer 10 and 12 is arranged in the dielectric material 18, so that electrode nipple 14 extends to the both sides of IDC device 16 and exposes thereon.The typical material that is used for the kind electrode layer can comprise platinum, nickel, Pd-Ag alloy or other conductive materials that is fit to.Dielectric material 18 can comprise barium titanate, zinc oxide, have low baking temperature glass aluminium oxide or other suitable pottery or the glassy bond material of (low-fire glass).Alternatively, dielectric material can be organic compound, for example is typically used as the epoxy resin (wherein mix or unmixed pottery, be with or without glass fibre) of circuit board material or other plastics of Chang Zuowei dielectric material.In these cases, electric conductor is Copper Foil normally, and this Copper Foil is carried out chemical etching so that figure to be provided.

Alternatively, can think the sandwich construction that electrode layer in the part 20 that typical IDC device 16 is devices and dielectric layer replace.IDC 16 another characteristic features are that top layer dielectric layer 22 and bottom dielectric layer 24 are thicker than other dielectric layer part of IDC structure 16 usually.This dielectric layer 22 and 24 serves as cover layer with protection device, and the volume that enough sizes are provided to be to stand the stress of glass/metal imitation frosted glass (frit), and described imitation frosted glass can be sintered on the capacitor body.Known capacitor embodiment adopts the multilayer setting of Figure 1B, and the present invention utilizes the scheme of this structure 16 according to further feature disclosed herein.

Multilayer IDC element 16 for example combines those of Figure 1B of the existing typical electrode layer structure of Figure 1A, it is characterized in that electrode part 14 is exposed on two selected sides of IDC element 16.In sandwich type element, can adopt other typical internal electrode structure, so that the internal electrode part is exposed at the diverse location of device side and/or with varying number.

For example, consider at the typical internal electrode layer structure shown in the exploded view of Fig. 3 A.Electrode layer 26 and 28 alternately is provided with electrode nipple section 30, and it extends towards single preferential direction.For every group of electrode layer that replaces, electrode nipple 30 for example makes the joint 30 that stretches out from electrode layer 26 align with minute other two row preferably with the stepped construction setting.For the joint 30 of electrode layer 28, preferably keep identical aligned position.Adopt multi-layer capacitor or other passive component typical construction of the typical internal electrode structure of Fig. 3 A to become electrode nipple section 30 is exposed in the single selected side of element.

Another typical internal electrode layer structure is provided with the electrode nipple that exposes in four sides of the interdigital element of multilayer.This interior electrode layer can be similar to the structure shown in Figure 1A, and wherein each alternating electrode layer 10 and 12 has adjacent to the extra contacts part on each side of each layer of each side of extending connector portions 14.

In Fig. 5 A to 5C, show respectively another typical electrode layer structure and corresponding multi-layer capacitor embodiment.In dielectric material body 36, interleave more than first interior electrode layer 32 (for example shown in Fig. 5 A) and interior electrode layer 34 (for example shown in Fig. 5 B), form multi-layer capacitor 38, for example shown in Fig. 5 C.In this typical sandwich type element 38, one group of electrode layer 32 or 34 part 40 are exposed in the side 42 of element 38.Thus, the part of exposing other group electrode layer 32 or 34 at the device opposite side with side 42 relative (not shown)s.

Again with reference to Figure 1B, the typical conventional terminals that are used for IDC embodiment 16 and are used for other monolithic electronic element comprise that printing and sintering are at the thick film tape of silver, copper or other metal that is fit to of glass basis, at its top plating one deck nickel to help anti-leaching (leach), then plating one deck tin or solder alloy to be preventing the nickel oxidation, thus the terminals that easily welded.

According to such terminals, thick film tape usually also needs to be appropriate to shift the element that metal-to-metal adhesive is housed by terminals machinery and printing wheel or other and prints.This print hardware has the restriction of resolution, so that be difficult to apply thick film tape, and especially for less chip.For IDC 16 or other electron component, multiply by 60 mils along two groups of about 120 mils of the typical actual size in relative side (mil), thickness from top to bottom is about 30 mils.In the time need to offering the terminals that surpass four parts with this size or terminals need to be offered the parts of smaller szie, the level of resolution of dedicated wiring terminal tool often becomes the restriction of effective terminals band is provided.

The invention provides a kind of terminal design, wherein eliminate or providing of this typical thick film metallization end band significantly be provided.By eliminating unmanageable thick film tape, the needs for typical terminals print hardware have been avoided.According to disclosed technology, the terminals parts more concentrate on the coat of nickel, tin, copper etc., and it is formed on the thick film metallization end band usually.

Utilization is according to the plated terminal of disclosed technology, should be understood that can form along the periphery of element to have terminals with the outer electrode same widths that exposes.Used therein in the terminal design of prior art of thick film tape, terminals are usually wide than the outer electrode part that exposes, thereby the coincidence that solves exposed contacts is bad.Exposed electrode among the embodiment of this prior art usually must be enough narrow, thereby not only guarantee by terminals it to be covered fully, and will guarantee that adjacent terminals are not shorted together.According to the scheme of plated terminal of the present disclosure, the width of maximum internal electrode nipple has generation in the electronic component of low equivalent series inductance (ESL) advantage.

Consideration is at the typical capacitor array structure 44 shown in Fig. 7 A.Array of capacitors 44 is characterised in that a plurality of internal electrodes and corresponding electrode nipple 46 are imbedded in the dielectric material body 48.Opposite with the electrode layer of typical IDC structure 16, the electrode nipple 46 of array of capacitors 44 is usually corresponding to the internal electrode that separates.By array of capacitors 44 or other electronic component with the electrode nipple that similarly exposes are put into chemical plating solution, for example nickel or copper ion solution have preferably been realized the formation of plated terminal 50, shown in Fig. 7 B.Be exposed to and make the upper nickel of electrode nipple 46 depositions, copper, tin or other coat of metal that exposes in this solution.The deposition of the coating material that finally obtains preferably is enough to be implemented in the electrical connection between the adjacent electrode joint 46 in the lamination file.Distance between the adjacent electrode joint in the joint file preferably is no more than about 10 microns, to guarantee suitable plating.Distance between the adjacent columns lamination of electrode nipple 46 should be than this minimum range large at least 2 times, can not connect together to guarantee different terminals 50.In some embodiment of present technique, be about 4 times of distance between the adjacent electrode nipple that exposes 46 in specific lamination in the distance between the metallized adjacent columns lamination that exposes.Distance between the inner wire part of exposing by control can be controlled the connectivity of terminals, in order to form the terminals of bridge joint or non-bridge joint according to desirable terminal structure.

Thus according to the orientation direction plated terminal 50 of the electrode nipple 46 that exposes.Because the structure of the metalized portion of exposing by the selected peripheral position place on sandwich type element or array of capacitors 44 is determined the formation of plated terminal 50, therefore after this this phenomenon is called " certainly determining ".The internal electrode joint 46 that exposes also helps grappling terminals 50 to arrive the periphery of array of capacitors 44 ', and this is corresponding to the embodiment of the multi-layer capacitor that is added with plated terminal 50, and for example 44 of Fig. 7 A.Fall low-resistance additive by adding in plating bath, the complete plating that can further guarantee metal covers and is bonding.Another mechanism of cementability that be used for to strengthen forms the metal deposition layer of plated terminal of the present invention be after this according to as cure, the technological means such as laser treatment, UV exposure, microwave exposure, arc welding heat element.

For some element application, the plated terminal 50 that forms Fig. 7 B just can satisfy, but sometimes internally the metalized portion exposed of electrode nipple be not enough to form certainly definite terminals of present technique.In the case, it is favourable that the additional anchored joint of imbedding in the selected part of monolithic component is provided, or even necessary.Anchored joint is the short-range missile electric connection, does not generally provide electrical functions to element, but mechanically plays a crucial role and guarantee that additional plated terminal is peripheral along monolithic device.The combination of the anchored joint of exposing and the internal electrode that exposes part can provide enough metalized portion of exposing, and is more effective from determining terminals to set up.

For example, consider the decomposition texture of metalized portion in the typical case shown in Fig. 2 A.With the electrode layer 52 and 54 that the structure setting similar to the electrode layer of Figure 1A replaces, wherein electrode nipple section 56 stretches out from the select location of electrode layer 52 and 54.Additional anchored joint 58 also preferably is arranged in the plane identical with active electrode layer 52 and 54, makes them also be exposed to select location along sandwich type element, but does not provide internal electrical to connect.Additional anchored joint can also be arranged in the cover layer of sandwich type element and along selected side exposes, and makes it possible to form along what stretch out more than the element periphery certainly determine plated terminal.

With reference to figure 2B, sandwich type element 60 is corresponding to typical multi-layer capacitor embodiment according to the present invention.The part 62 of sandwich type element 60 preferably includes the typical interdigital electrode layer imbedded in the dielectric material portion and the anchored joint structure of Fig. 2 A.Along the exposed portions serve of the electrode nipple 56 of the solid line 56 presentation graphs 2A of part 62 peripheries, the anchored joint 58 of exposing along dotted line 58 expressions of part 62 peripheries.Additional anchored joint (not shown in Fig. 2 A) can be imbedded (by dotted line 68 its exposed portions serve of expression) in dielectric covering layer 64 and 66, so that the setting of the metalized portion of exposing further to be provided, so that according to the formation from determining plated terminal of the present invention.Inner anchored joint is preferably generally to align with the similar file of the lamination of internal electrode joint, so that all internal connections are arranged in the public lamination.

For some element application, preferred, terminals not only extend along the whole width of element, but also are wound to the top and bottom layer.In the case, outside anchored joint 70 can be on the top and bottom layer of multilayer IDC 60, so that plated terminal can form along the side and at the top and bottom layer segment, forms the pad that extends.For example, with exist among the IDC 60 expose electrode nipple 56 imbed internal electrode anchored joint 58 and 68 and the existing of outside anchored joint 70 (shown in Fig. 2 B) help the formation of the coating terminals 72 of reeling, shown in Fig. 8 A.

There are several different technology can be used to form potentially plated terminal, for example the terminals 72 on Fig. 8 A sandwich type element embodiment 74.As previously mentioned, first method wherein is exposed to plating bath to the electronic component with the current-carrying part that exposes, for example the electrolytic nickel take electrical bias as feature or electrolytic tin corresponding to electroplating or electrochemical deposition.Then element self is biased to and the opposite polarity polarity of plating bath, the conductive element in the plating bath is attracted in the metallization of component exposure.This coating technology that does not have polarity biasing is called chemical plating, can be combined employing such as the chemical plating solution of nickel or copper ion solution.

Pre-treatment step according to electroless plating technology (referring to that also some is such as the application of immersion plating) can adopt before electronic component is immersed given chemical plating solution sometimes.Be formed with the metallic electrode and/or anchored joint part of exposure at electronic component after, can carry out the chemical polishing step, with exposing of auxiliary intimate part.For example, when electrode and/or anchored joint part was made by nickel, chemical polishing can help chemically to remove not yet finished outer any nickel oxide (NiO) of placing formation of element.

Another example of the pre-treatment step that can also adopt according to disclosed electroless plating technology is the metal part that the activation device exposes, and is beneficial to the deposition of chemical plating material.Can be by electronic component being immersed palladium salt, light-composited film palladium Organometallic precursor (through mask or laser), silk screen printing or inkjet deposited palladium compound or electrophoresis palladium deposition.Should be understood that in this open activation based on palladium only be example as activated solution, it is generally used for the exposed electrode that formed by nickel or nickel-base alloy and/or the activation of blank area.In other embodiments, can adopt other activated solution.In another embodiment, can in the nickel China ink that forms electrode for capacitors, introduce palladium (Pd) impurity, to eliminate the Pd activation step that is used for chemical Cu deposition.Should also be understood that some in the above-mentioned activation method, such as Organometallic precursor, also help for increasing with the codeposition of the glass molds of the adhesive force of the ceramic matrix of electronics unit.

According to electrochemical deposition and electroless plating technology, preferably will immerse in the suitable plating bath such as the element of the IDC 74 of Fig. 8 A and continue the regular hour.Adopt specific embodiment of the present invention, the time that need to be no more than 15 minutes just is enough to make coating material to be deposited on the conductive site of exposing along element, like this, accumulation is enough to make coating material with the Directional Extension perpendicular to the conductive site of exposing, and sets up bridge joint in the selected adjacent current-carrying part that exposes.

The another kind of technology that can adopt according to the formation of this plated terminal of the present invention comprises the magnetic attraction technology of coating material.For example, by utilizing the magnetic of nickel, can attract similarly to conduct electricity exposed electrode joint and anchored joint to sandwich type element with being suspended in nickel particles in the electrolytic solution.Other material with same magnetic also can adopt in the formation of plated terminal.

About the exposed electrode joint that the plated terminal material is applied to sandwich type element and again technology of anchored joint comprise electrophoresis or electrostatic principle.According to this typical technology, tank liquor includes the particle of static electrification.Then utilize opposite charges to make with the IDC that exposes current-carrying part or the biasing of other sandwich type element and put into tank liquor, so that charged particle is deposited on the select location place on the element.This technology is specially adapted to the application in glass and other semiconductor or non-conducting material.In case upper these materials of deposition just can become electric conducting material to the material converting of deposition by the mode that enough heats is put on element by medium afterwards.

Be in such as the batch process of barrel plating or fluidized bed terminals technique, to be multiple electronic component ending in this associated advantages that openly is used to form most of method of plated terminal.Because the device manufacturing no longer needs optionally to use terminals through the terminals machinery of accurate structure, therefore this scheme is conducive to form more convenient and favourable component terminals.

Should also be understood that these electronic units become less, in the reality, can physically clamp these parts and become more infeasible to each end coated thick film metallization end simultaneously.

In addition, this film mode has caused lower dimensional flexibility, and dimensional flexibility is conducive to automatic processing.

Relate to the combination of above-mentioned coating technology according to a kind of specific process of the plated terminal of disclosed technology in order to formation.Can at first sandwich type element be immersed in the chemical plating solution, for example copper ion solution with at the initial copper layer of blank area deposition that exposes, provides larger contact-making surface.Then coating technology can transfer the electrochemistry plating system to, and this system allows to accumulate quickly copper on the selected part of this element.

According to the different available techniques of exposing metalized portion that are used for material is plated to the sandwich type element of present technique, can adopt dissimilar materials to form plated terminal, and form the electrical connection to the internal part of electric device.For example, can adopt such as the metallic conductor of nickel, copper, tin etc. and suitable resistive conductor or semi-conducting material, and/or by the combination of choosing in these different kind of material.

With reference to the special case of figure 8B discussion according to plated terminal of the present invention, wherein plated terminal comprises multiple different materials.Fig. 8 B provides according to the certain typical embodiment of plated terminal 72, along the sectional view of the element 74 of Fig. 8 A of the section curve A-A intercepting.Should be understood that terminals 72 can only comprise the first coating layer, and not at other layer shown in this example.Since for the number change of coating among the sandwich type element of Fig. 8 A and Fig. 8 B and the terminals embodiment may, therefore two minute other embodiment distinguish mark with 74 and 74 ', and this Reference numeral does not mean that other variation between two independent embodiment.

First step in the formation of the terminals shown in Fig. 8 B comprises in the chemical copper plating solution of element immersion such as nickel or copper ion solution, so that the layer of copper 76 or other metal along the periphery of element 74 ' deposition, exposes inner anchored joint 58 and 68 herein, from electrode layer 52 and 54 extended internal electrode joint and outside anchored joints 70.Then can cover resistance-polymeric material 78 in the joint area that is covered by the coat of metal 76, and then utilize metallic copper or other material 80 to carry out plating.In other exemplary embodiments, the terminals layer can be corresponding with solder barrier (for example, Ni solder barrier).In certain embodiments, layer 78 can form by the other nickel dam of plating on the top of initial coating 76 (for example, the copper of plating).The third typical wiring end layer 80 can with such as some corresponding embodiment of the conductive layer of Ni, the Ni/Cr of plating, Ag, Pd, Sn, Pb/Sn or other plated solder that is fit in.

Then another kind of optional plating electroplates electric resistance alloy at this coat of metal corresponding to forming the metal-plated coating.Coating layer can be separately or in conjunction with arranging, so that various plated terminal structure to be provided.The basic principle of this plated terminal is, consists of from determining plating by design and location along the exposure current-carrying part of element periphery.Should be understood that above-mentioned plated terminal with sandwich construction is not construed as limiting the application of the embodiment shown in Fig. 8 A and the 8B, and can according to shown in all, disclosed and other various electronic components use.

This particular orientation of internal electrode part and anchored joint can be provided with various structure, thereby be conducive to form according to plated terminal of the present invention.For example, consideration is with conductive structure in the typical case of Fig. 3 B of electrode layer 26 and 28.Electrode nipple 30 and inner anchored joint 82 can be arranged in the dielectric material body, thereby form the sandwich type element shown in similar Fig. 4 A.Additional inside anchored joint 84 and outside anchored joint 86 can also be provided.One of described coating technology forms plated terminal in order to the zone of exposing along metalized portion at sandwich type element 88.

Be expressed as element 90 among Fig. 4 B according to another typical sandwich type element of the solution of the present invention.Interior electrode layer is provided with four electrode nipples that stretch out the side to element 90.Additional internal anchored joint 94 can intersect with the electrode nipple 92 that exposes.Inner anchored joint 96 can be imbedded in the cover layer of element 90 so that the plated terminal of expansion to be provided in addition.The formation that has the terminals that help element top and/or bottom side coiling of outside anchored joint 98.This outside anchored joint 98 can directly be printed in the ceramic wafer or band that forms top layer substrate layer, thereby forms fully " imbedding " concordant with top layer substrate layer layer.By imbedding these parts of electronic component, the impact that terminals can more not be vulnerable to local damage or move unintentionally can also realize element global design more attractive in appearance.

Now, show the example that the different peripheral terminals shape of realization is set such as the selectivity by outside anchored joint with reference to Figure 10 A, 10B, 11A, 11B, 12A and 12B.Especially with reference to Figure 10 A, multilayer electronic component 150 have by corresponding the first electrode 152 and corresponding the second electrode 154 embody many to relative electrode.Each electrode layer is formed on the corresponding ceramic layer, also is provided with at least one anchored joint 156 on it.Additional anchored joint 158 can also be arranged in the dielectric covering layer, but not electrod assembly, so that the conductive region that exposes is along the whole installation of any side of sandwich type element 150.By the conduction anchored joint 158 that exposure is set and the selected corresponding angles 157 that arrive element 150, will be conducive to be generally the formation of " I shape " terminals 159a and 159b, shown in Figure 10 B in cover layer.This " I shape " terminals provide the terminals of the less pad that still can be connected with printed circuit board (PCB) or the good scolder of other installation surface formation, because terminals preferably extend to top and/or the bottom surface of element 150 fully.

Now, with reference to Figure 11 A and 11B, multilayer electronic component 160 have by corresponding the first electrode 162 and corresponding the second electrode 164 embody many to relative electrode.Each electrode layer is formed on the corresponding ceramic layer, also is provided with at least one anchored joint 166 on it.Additional anchored joint 168 can also be arranged in the dielectric covering layer, but not electrod assembly, so that the conductive region that exposes is along the whole installation of any side of sandwich type element 160.One that also preferably chooses in the top and bottom side of element 160 arranges outside anchored joint 165, thereby forms " J-shaped " terminals 169a and the 169b of gained according to technology of the present invention.This " J-shaped " terminals provide and have been used for that electronic component is installed in printed circuit board (PCB) or other installs lip-deep pad, and because pad only on the selected side of element 108, therefore provides predetermined element that orientation is installed.

Sometimes need to lack on the end face current-carrying part, for example, shield when contacting with heat shielding or RF on the surface, it will cause short circuit.

Now, with reference to Figure 12 A and 12B, multilayer electronic component 170 have by corresponding the first electrode 172 and corresponding the second electrode 174 embody many to relative electrode.Each electrode layer is formed on the corresponding ceramic layer, also is provided with at least one anchored joint 176 on it.Additional anchored joint 178 can also be arranged in the dielectric covering layer, but not electrod assembly, so that the conductive region that exposes is along the whole installation of any side of sandwich type element 170.Also preferably outside anchored joint 175 all is set in the top and bottom side of element 170 on both, thereby forms " U-shaped " terminals 179a and the 179b of gained according to technology according to the present invention.This " U-shaped " terminals provide any side that is used for electronic component to be installed in printed circuit board (PCB) or other installs lip-deep pad.

With reference to Figure 10 B, 11B and 12B, should be understood that corresponding terminals 159a, 159b, 169a, 169b, 179a and 179b can optionally form individual layer terminals or multilayer interconnection end.For example, each peripheral terminals of Figure 10 B, 11B and 12B can be corresponding with plated copper or the nickel of individual layer.Perhaps, this terminals can form the initiation layer with plated copper, then are each plated solder barrier layer and solder layer, for example nickel and ensuing tin.

The another kind of disclosure technology is used and is related to more generally sandwich type element structure, shown in Fig. 6 A, 6B and 6C.The electrode layer 100 of Fig. 6 A and the electrode layer 102 of Fig. 6 B are arranged in separately the T shape structure, and electrode nipple part 104 is stretched out from each electrode layer.Insert with dielectric layer when forming multilayerceramic device when electrode layer 100 and 102, shown in Fig. 6 C, each electrode nipple part 104 is exposed in two adjacent side of device 108.Anchored joint part 106 can also be arranged in the electrode aspect, so that the current-carrying part that exposes forms electrode plating along the relative peripheral side alignment of device 108 thereon thereby be beneficial to.Should be understood that around the selected angle of multilayer electronic component this terminals being set is difficult to use prior art terminals technique to realize usually.Those skilled in the art will also be understood that, the design of corner connection line end not only can form in device 108, but also can in other multiple specifically-built device, realize, and will also be understood that, similar with above-mentioned anchored joint, can only at an angle angle winding part be set, when needed, namely when the needs orientation feature.

Can adopt another example of multilayer electronic component of disclosure technology shown in Figure 13 A, 13B and 13C.The electrode layer 130 of Figure 13 A and the electrode layer 132 of Figure 13 B are arranged in separately the J-shaped structure, and electrode nipple part 134 is stretched out from each electrode layer.Insert with dielectric layer when forming multilayerceramic device when electrode layer 130 and 132, shown in Figure 13 C, each electrode nipple part 134 (solid line by correspondence represents) is being exposed along the select location place of device 138 top sides.Anchored joint part 136 can also be arranged on electrode aspect neutralization/or dielectric covering layer in so that additional exposure current-carrying part (being represented by dotted line corresponding among Figure 13 C) can be beneficial to form electrode plating thereon.Shown in Figure 13 A to 13C, adopt the element of " J-shaped " electrode to be conducive to have the application that intrinsic predetermined element is orientated, because terminals only are formed on the side of element.

Respectively to the carrying out variation a little of " J-shaped " electrode shown in Figure 13 A to 13C, corresponding to " T shape " electrode shown in Figure 14 A, 14B and the 14C.The electrode layer 140 of Figure 14 A and the electrode layer 142 of Figure 14 B are arranged in separately the T shape structure, and electrode nipple part 144 is stretched out from each electrode layer.When electrode layer 140 and 142 is inserted with dielectric layer when forming multilayerceramic device, shown in Figure 14 C, each electrode nipple part 144 (solid line by correspondence represents) is exposed at the select location place along the top and bottom side of device 148.Anchored joint part 146 can also be arranged on electrode aspect neutralization/or dielectric covering layer in so that additional exposure current-carrying part (being represented by dotted line corresponding among Figure 14 C) can be beneficial to form electrode plating thereon.

Fig. 9 A and Fig. 9 B illustrate another example of the embodiment of disclosed technology.Fig. 9 A represents integrated passive components 110, comprises the combination that is arranged on the passive component in the single single chip architecture.Integrated component 110 can comprise the selected combination of resistor, rheostat, capacitor, inductor, coupling, balun and/or other passive component.The passive component of various uniquenesses typically is characterised in that at least one conductive electrode shape part, and at least one electrode nipple part 112 is partly extended from this electrode shape, and exposes along the periphery of element 110.

Shown in Fig. 9 A, a plurality of different internal electrode setting shown in integrated passive components 110 can have.Corresponding electrode nipple 112 can be with symmetrical or asymmetric structure setting, and can be in every way in groups.Principal character is that the electrode nipple 112 that exposes is arranged in the element 110 to make things convenient for the formation of selective plating terminals.In addition, inner anchored joint 114 and/or outside anchored joint 116 can also be provided with integrated passive components, thereby consist of the setting of additional selectivity terminals.For example, consideration has the setting of exposing joint of Fig. 9 A of a plurality of internal electrode joints 112 that expose, inner anchored joint 114 and outside anchored joint 116.Preferably, this structure is provided to the formation of the plated terminal 120 that can realize a plurality of coated side terminals 118 in the coating solution that changes according to present disclosed technology and reel, shown in Fig. 9 B.Integrated passive components or multilayer electronic device 110 ' simply corresponding to respectively with the integrated passive components of additional plated terminal 118 and 120, for example 110 of Fig. 9 A.Therefore, can the joint of integrated passive components be designed, thereby can in Different electrodes and different elements layer, form plated terminal.

Should be understood that the monolithic component embodiment that represents respectively (comprise its in the middle of scheme) is only as the example shown of disclosed technology in Figure 1A to Fig. 9 B.In the example of majority, described four or a plurality of general electrodes series, but the quantity of electrodes series also can be more or less, this depends on desirable component structure.Can be according to disclosed technology, divide the formation plated terminal along any selection portion of any selected component side.This plated terminal can comprise individual layer plating electric conducting material, resistance material, semi-conducting material or the multiple layer combination of choosing from these materials.

Should be understood that inner anchored joint can optionally be used for different terminals with outside anchored joint, preferably provides the side terminal of different size or the terminals of coiling.When for application-specific, when the terminals of coiling were preferred, inside and outside the anchored joint parts of IDC embodiment shown and described herein for example can only adopt inner anchored joint parts.The various combination with inside and outside anchored joint of the electrode nipple that exposes on various different sandwich type elements can be produced the various potential terminal design for device.

Describe the while of the present invention in detail at the reference specific embodiment, should be understood that for a person skilled in the art, obtaining can to change at an easy rate present technique after the above-mentioned prompting, with embodiment is selected, variation and equivalent substitution.Therefore, the content of this specification only as example and and unrestricted, summary of the invention is not got rid of this modification of the present invention, variation and/or interpolation, this will be readily apparent to persons skilled in the art.

Claims (11)

1. multilayer electronic component comprises:

A plurality of insulated substrates, each insulated substrate has a upper surface and a lower surface, and described a plurality of insulated substrates are laterally delimited by the edge;

A plurality of electrodes insert between described a plurality of insulated substrate, and described a plurality of electrodes are characterised in that its blank area that exposes with predetermined to each other distance along at least one edge of described a plurality of substrates;

Wherein the distance between the adjacent head part in the joint longitudinal row is no more than 10 microns; And

At least one part of metal terminal material connects selected described blank area.

2. multilayer electronic component as claimed in claim 1, wherein selected described a plurality of electrodes and each blank area are pressed the Structural Tectonics of J-shaped.

3. multilayer electronic component as claimed in claim 1, wherein selected described a plurality of electrodes and each blank area are pressed the Structural Tectonics of T shape.

4. multilayer electronic component as claimed in claim 1, wherein selected described a plurality of electrodes and each electrode nipple are partly pressed the interdigital structure setting, electrode nipple partly is exposed on the selected side of multilayer electronic component, so that at least one part of described metal terminal material is formed on the described selected side of this multilayer electronic component.

5. multilayer electronic component as claimed in claim 1, wherein selected described a plurality of electrodes and each electrode nipple are partly pressed the interdigital structure setting, electrode nipple partly is exposed on two selected sides of multilayer electronic component, so that at least two parts of metal terminal material are respectively formed on described two selected sides of this multilayer electronic component.

6. multilayer electronic component as claimed in claim 1, wherein selected described a plurality of electrodes and each electrode nipple are partly pressed the interdigital structure setting, electrode nipple partly is exposed on four selected sides of multilayer electronic component, so that at least four parts of metal terminal material are respectively formed on described four selected sides of this multilayer electronic component.

7. multilayer electronic component as claimed in claim 1, wherein said electrode comprises nickel.

8. multilayer electronic component as claimed in claim 7, wherein said electrode also comprises palladium impurity.

9. multilayer electronic component as claimed in claim 1, at least one part of wherein said metal terminal material comprises copper.

10. multilayer electronic component as claimed in claim 1 also comprises the auxiliary connection end layer at least one part that sequentially is applied to described metal terminal material.

11. multilayer electronic component as claimed in claim 10, at least one part of wherein said metal terminal material comprises copper, and wherein said auxiliary connection end layer comprises nickel dam or tin layer.

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