CN102443783B - 用于大面积等离子增强化学气相淀积的气体分配板组件 - Google Patents
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Abstract
本发明提供一种用于在处理腔中分配气体的气体分配板的实施例。在一实施例中,一气体分配板包括一扩散板,该扩散板具有多个在该扩散板一上游侧与一下游侧之间通过的气体通道。这些气体通道中的至少一个包括由一节流孔连接的一第一孔和一第二孔。该第一孔从该扩散板的上游侧延伸,而该第二孔从该扩散板的下游侧延伸。该节流孔具有分别小于该第一和第二孔的直径。
Description
本发明专利申请是国际申请号为PCT/US2004/011477,国际申请日为2004年4月14日,进入中国国家阶段的申请号为200480005271.0,名称为“用于大面积等离子增强化学气相淀积的气体分配板组件”的发明专利申请的分案申请。
技术领域
本发明的实施例一般涉及一种用于在处理腔中分配气体的气体分配板组件及方法。
背景技术
液晶显示器或平板通常用于有源矩阵显示器(如计算机与电视监视器)。通常,平板包括二层玻璃板,二层玻璃板之间夹置一层液晶材料。至少一玻璃板包括连接至电源供应器的设置于该玻璃板上的至少一导电膜。从电源供应器供应至该导电膜的电源改变该液晶材料的方向,在显示器上产生可视图案,如文字或图形。一种常常用以生产平板的制造过程是等离子增强化学气相淀积(PECVD)。
等离子增强化学气相淀积通常是用于在如平板或半导体晶片的基材上淀积薄膜。等离子增强化学气相淀积一般是通过将前体气体(precursorgas)引入含有平板的真空腔而实现。该前体气体通常是被向下引导通过一位置靠近腔顶部的分配板。通过从一个或多个连接至该腔的射频(RF)来源向该腔施加的射频功率,在该腔内的前体气体获得能量(如激发)成为等离子。被激发气体反应后,在位于温度控制基材支撑件上的平板表面上形成一层材料。在平板容置一层低温多晶硅的应用中,该基材支撑件可被加热至超过摄氏400度。在反应中产生的挥发性副产品会经过排气系统从该腔抽吸出去。
由PECVD技术加工的平板通常较大,常常超过370毫米x470毫米并延伸超过1平方米尺寸的范围。可预见在不远的未来大面积基材将接近并超过4平方米。特别是与用于200毫米和300毫米半导体晶片处理的气体分配板相比,用以在平板上提供均匀过程气流的气体分配板在尺寸上成比例地大。
用于平板处理的大型气体分配板具有一些导致制造费用高的制造问题。例如,通过气体分配板形成的气流孔的直径,相对于该气体分配板的厚度较小(例如一通过1.2英寸厚板的0.062英寸直径孔),导致在孔形成时钻头断裂情况高频率地发生。移走断裂钻头既耗时而且可能造成整个气体分配板损伤。此外,由于通过气体分配板而形成的气流孔数目正比于平板的尺寸,所以形成于各板内的大量的孔在制造该板时不利地造成故障的可能性高。再者,高数量的孔与最少化钻头断裂需要的关注结合,会导致较长的制造时间,因而提高制造成本。
由于材料与制造气体分配板的成本很高,以可有效率并成本经济地制造的配置,来研发气体分配板将是有益的。再者,由于为配合处理超过1.2平方米的平板,下一代气体分配板的尺寸会增加,所以上述问题的解决越来越重要。
虽然满足设计大型气体分配板的成本考虑很重要,但是性能特性必定不能忽略。例如,气流孔的配置、位置与密度直接地影响到淀积性能,如淀积均匀性和清洗特性。例如,如果通过气体分配板形成的气流孔产生太多的背压,则用以清洗该板的游离氟再结合的倾向会提高,从而不利地降低清洗的效果。再者,因为氟通常是膜污染物,所以气体分配板的表面积应构成为促进通过气体分配板的良好流动,同时提供氟附着于该板的最小面积。
因此,需要经过改进的气体分配板组件。
发明内容
本发明提供一种用于在处理腔中分配气体的气体分配板的多个实施例。在一个实施例中,气体分配板包括扩散板,扩散板具有多个在该扩散板的上游侧与下游侧之间流通的气体通道。该气体通道中的至少一个包括由节流孔连接的第一孔与第二孔。该第一孔从扩散板的上游侧延伸,而该第二孔从下游侧延伸。该节流孔具有分别小于第一孔或第二孔的直径的直径。
附图说明
本发明的教导可以通过考虑以下结合附图的详细说明而容易地了解,附图中:
图1是具有本发明的气体分配板组件的一实施例的示例性处理腔的剖面示意图;
图2是图1中所示气体分配板组件的部分剖面图;
图3是一气体分配板组件的另一实施例的部分剖面图;
图4是图2中的气体分配板组件的部分俯视图;
图5是包括一扩散板组件的气体分配板组件的另一实施例的部分剖面图;及
图6是图5中的气体分配板组件的一实施例的另一部分剖面图。
为有助于了解,尽可能地使用相同的附图标记来表示附图中共有的相同组件。
具体实施方式
本发明一般提供一种用于在处理腔中提供气体传送的气体分配板组件。本发明以下的示范性说明是参考一配置用于处理大面积基材的等离子增强化学气相淀积系统,如来自AKT(美国加州圣塔克拉市应用材料公司的分部)的等离子增强化学气相淀积(PECVD)系统。然而,应了解本发明可应用在其它系统配置中,如刻蚀系统、其它化学气相淀积系统及任何需要在一处理腔中分配气体的其它系统,包括配置成处理圆形基材的那些系统。
图1是一等离子增强化学气相淀积系统100的一实施例的剖面图。系统100一般包括一连接至一气源104的处理腔102。处理腔102具有部分地限定一过程容积112的壁106与一底部108。过程容积112典型地是经过在壁106上的一端口(未示出)存取,该端口有助于一基材140移入与移出处理腔102。壁106与底部108典型地是从一整块铝或其它与处理能兼容的材料制成。壁106支撑一盖组件110,该盖组件110含有一将过程容积112连接至一排气口(包括各种未示出的抽吸组件)的抽吸加压通气室114。
一温度控制基材支撑组件138居中置于处理腔102内。支撑组件138在处理中支撑玻璃基材104。在一实施例中,基材支撑组件138包括一铝本体124,该铝本体124封装至少一个内嵌式加热器132。
设置于支撑组件138内的加热器132(如一电阻元件)连接至一电源130且可控制地加热支撑组件138和位于支撑组件138上的玻璃基材140至一预定温度。典型地在一CVD过程中,根据待淀积材料的淀积处理参数而定,加热器132将玻璃基材140维持在介于约摄氏150度到至少约460度之间的均匀温度。
通常,支撑组件138具有一底侧126与一上侧134。上侧134支撑玻璃基材140。底侧126具有一与该底侧126连接的主轴142。主轴142将该支撑组件138连接至一提升系统(未示出),该提升系统在一升高的处理位置(如图示)和一有助于将基材传送至处理腔102和自处理腔102传送的较低位置之间移动支撑组件138。另外主轴142提供一导管,供支撑组件138与系统100其它组件之间的电线与热电偶导线用。
一波纹管146连接在支撑组件138(或主轴142)与处理腔102的底部108之间。该风箱146提供在腔容积112与处理腔102外部的大气之间的真空密封,同时有助于支撑组件138的垂直运动。
支撑组件138通常是接地的,使得由一电源122供给位于盖组件110与基材支撑组件138之间的气体分配板组件118(或位于该腔的盖组件中或附近的其它电极)的射频功率,可激发出现在支撑组件138与分配板组件118间的过程容积112内的气体。来自电源122的射频功率通常是经过选择与该基材的尺寸相称,以驱动该化学气相淀积过程。
另外支撑组件138支撑一限制周边的遮蔽框架148。通常遮蔽框架148防止在玻璃基材140与支撑组件138的边缘淀积,使得基材不会粘到支撑组件138。
支撑组件138具有多个穿通设置的孔128,以容纳多个个提升销150。提升销150通常是由陶瓷或经阳极电镀的铝构成。通常当提升销是在一正常位置(即相对支撑组件138抽回)时,提升销150具有实质上与支撑组件138的一上侧134齐平或稍为凹下的第一端。该第一端典型地呈喇叭状以防止提升销150掉下通过孔128。此外,提升销150具有一延伸超过支撑组件138的底侧126的第二端。提升销150可由一提升板154相对支撑组件138加以致动,以从支撑面130突出,因而将基材置放在一与支撑组件138分开的位置。
提升板154是置于基材支撑组件138的底侧126与处理腔102的底部108之间。提升板154借助一环绕部分主轴142的轴环156连接至一致动器(未示出)。波纹管146包括一上部168与一下部170,允许主轴142与轴环156独立移动,同时维持过程容积112与处理腔102外部的环境隔离。通常,当支撑组件138与提升板154彼此相对移近时,提升板154会被致动以造成提升销150从上侧134伸出。
盖组件110为过程容积112提供一上部边界。盖组件110通常可移除或开启,以维修处理腔102。在一实施例中,该盖组件110是由铝制造。
盖组件110包括一连接至外部抽吸系统(未示出)的形成于盖组件110内的抽吸加压通气室114。抽吸加压通气室114是用以均匀地将气体和处理副产物从过程容积112引导出处理腔102。
盖组件110典型地包括一进入口180,由气源104提供的过程气体是经过该进入口180导入处理腔102。进入口180也连接至一清洗源182。清洗源182通常提供一清洁剂(如游离氟),该清洁剂导入处理腔102,以从处理腔硬件(包括气体分配板组件118)移除淀积副产品及薄膜。
气体分配板组件118连接至盖组件110的内侧120。气体分配板组件118通常是经配置以充分跟随玻璃基材140的轮廓,例如用于大面积基材的多边形与用于晶片的圆形。气体分配板组件118包括一穿孔区域116,经过该区域由气源104供应的过程气体与其它气体被传送至过程容积112。气体分配板组件118的穿孔区域116经配置以提供通过气体分配板组件118进入处理腔102的气体的均匀分配。可采用受益于本发明的一气体分配板组件,在2001年8月8日由Keller等申请的09/922,219号美国专利;由Blonigan等于2002年5月6日申请的10/140,324号;2003年1月7日申请的第10/337,483号;及2002年11月12日授予White等的6,477,980号美国专利中记载,因此通过引用全部被合并进本发明。
气体分配板组件118典型地包括由一悬挂板160悬挂的扩散板158。扩散板158与悬挂板160可替换地包含一单一构件(如图3中的气体分配板组件300所示)。多个气体通道162是通过扩散板158而形成,以允许通过气体分配板组件118并进入过程容积112的气体的预定分配。悬挂板160维持扩散板158与盖组件110的内表面120为空间分离的关系,因而在扩散板158与盖组件110的内表面120之间限定一加压通气室164。加压通气室164允许气体流经盖组件110以均匀地分布在扩散板158的整个宽度,使得气体均匀地供应至中央穿孔区域116之上,而且以一均匀分配方式流过气体通道162。
悬挂板160典型地由不锈钢、铝或镍或其它射频传导材料制造。悬挂板160包括一中央孔径166,中央孔径166有助于使气体无障碍地从形成于盖组件110中的气体进入口180流过悬挂板160,并流过扩散板158的气体通道162。悬挂板160通常提供一安装面,用于将扩散板158连接至盖组件110或腔壁106。
扩散板158典型地由不锈钢、铝或镍或其它射频传导材料制造。扩散板158被配置成一厚度,该厚度可维持跨孔径166的足够平坦度而不会不利地影响基材处理。在一实施例中,扩散板158具有约1.2英寸的厚度。
图2是扩散板158的部分剖面图。扩散板158包括一面对盖组件110的第一或上游侧202,及一面对支撑组件138的相对的第二或下游侧204。在一实施例中,扩散板158由铝制造而且在至少该下游侧204上经阳极电镀。已发现下游侧204的阳极电镀可提高等离子的均匀性。上游侧202可选地不经阳极电镀以限制在清洗时氟的吸收,氟随后在处理中会被释放出并成为一污染源。
在一实施例中,各气体通道162由经一节流孔214连接至一第二孔212的第一孔210限定,节流孔214、第二孔212与第一孔210经组合以形成一通过气体分配板158的流体路径。第一孔210从气体分配板158的上游侧202延伸一第一深度230至一底部218。第一孔210的底部218可为渐缩、成斜面、切角或成圆角,以使气体从第一孔流进节流孔210时的流动限制最小。第一孔210通常具有一约0.093英寸至约0.218英寸的直径,而且在一实施例中为约0.156英寸。
第二孔212是形成于扩散板158中,且从下游侧204延伸一约0.250英寸至约0.375英寸的深度232。第二孔212的直径通常约0.187英寸至约0.375英寸,而且可呈约22到至少35度的角度216的喇叭状。在一实施例中,第二孔212具有0.320英寸的直径,且该喇叭状角度216为约35度。在另一实施例中,相邻第二孔212的孔边缘282间的距离280为约25到约85毫英寸。第一孔210的直径通常(但不限于)至少等于或小于第二孔212的直径。第二孔212的底部220可为渐缩、成斜面、切角或成圆角,以使气体从节流孔214流出进入第二孔212时的压力损失最小。再者,当节流孔214接近下游侧204以使第二孔212和面对基材的下游侧的暴露表面积最小时,扩散板158暴露于腔清洁过程中提供的氟的下游侧面积会减少,因而减少淀积膜的氟污染的发生。
节流孔214通常连接第一孔210的底部218和第二孔212的底部220。该节流孔通常具有约0.25毫米至约0.76毫米的直径(约0.02至约0.3英寸),而且典型地具有约0.040至约0.085英寸的长度234。节流孔214的长度234与直径(或其它几何形状特性)是加压通气室164的背压的主要来源,加压通气室164促进跨扩散板158的上游侧202的气体的均匀分配。节流孔214典型地在多个气体通道162之间均匀配置,然而,通过节流孔214的限制在气体通道162之间可被不同地配置,以促进相对于另一区域更多的气体流过扩散板158的一区域。例如,在靠近气体分配板158的周边206的这些气体通道262中,节流孔214可具有一较大的直径和/或一较短的长度234,使得较多气体流过穿孔区116的边缘,以增加玻璃基材的周边的淀积率。
当节流孔214的长度234相当短,而且位于二个较大直径孔210、212之间时,节流孔214可有效地在气体分配板158内制造,并具有最小的钻头断裂可能性。因此,相比于在穿孔区域形成上千气体通道时经常发生钻头断裂且须从分配板抽出而产生费用的常规气体分配板,本发明的气体分配板158能以一减低的成本制造。再者,因为气体分配板158直接暴露于经由盖组件110进入的清洁剂的上游侧202的表面积,比气流节流孔直接形成于该板上游侧的常规气体分配板小得多,所以经阳极电镀的气体分配板158在经过清洁循环的过程时具有减少氟停留的倾向,因而减少在处理中可能释放的氟量。
节流孔214提供的整体限制直接影响扩散板158的上游背压,而且因此应配置以防止在清洗中使用的游离氟再结合。就这点而言,节流孔的直径应与孔的数量平衡。当增加节流孔直径以允许使用较少的孔并实现减低的制造成本时,相邻第二孔212的边缘282之间的间隔可在约25至约50毫英寸的较低范围中选择,以达到比常规具有较大气流孔密度的扩散板更均匀的淀积性能。
在图2的实施例中,悬挂板160与扩散板158是以一有助于扩散板158的热膨胀与收缩的方式连接,而没有翘曲、变形或以影响气流通过气体分配板组件118的均匀性的方式不利地对扩散板158施加力。在一实施例中,悬挂板160是一多边形框架,该多边形框架包括一从主体262向外延伸的第一凸缘264,与一在第一凸缘264相反的方向往内延伸的第二凸缘260。另一选择是,悬挂板160可为一有凸缘的圆柱。第一凸缘264包括多个安装孔266,每个安装孔对准一形成于盖组件110内的螺孔278。孔固定件268分别通过安装孔266,且螺旋入螺孔278以将悬挂板160固定至盖组件110。
第二凸缘260包括多个分别维持一定位销244的在第二凸缘260内形成的孔270。定位销244(其中之一显示于图2中)从第二凸缘260朝第一凸缘264与盖组件110的内表面120向上延伸。通过扩散板158形成的孔或槽246适于分别容置一定位销244。
此外请参考图4中所示的悬挂板160的部分俯视剖面图,在扩散板158中的槽246相对于定位销244足够大,以允许扩散板158相对于定位销244移动,从而有助于补偿在扩散板158、悬挂板160与盖组件110间的热膨胀差异。如图4所示,槽246典型地在正交方向沿扩散板158的各侧定位,以配合板组件118沿两个轴向的膨胀。或者是,槽246可径向地配置用于圆形气体分配板。因此,当气体分配板组件118加热及冷却时,扩散板158相对盖组件110自由地移动,因而维持没有扭曲或其它受力,扭曲或其它受力可能导致分配板组件118翘曲或改变通过分配板组件118的气流模式。另一选择是,槽可形成在悬挂板160中,以容置从扩散板158延伸的销。
图5是气体分配板组件500的另一实施例的部分剖面图。气体分配板组件500包括安装于类似上述的盖组件110的一悬挂板160与一扩散板组件502。扩散板组件502包括一连接至扩散板506的调整板504。多个气体通道508通过调整板504与扩散板506形成,以从一界定于气体分配板组件500与盖组件110之间的加压通气室510,分散气体至一处理腔的处理区域512。
气体通道508经配置成类似于上述的气体通道162,除了各气体通道508的上游部分通过调整板504形成,而下游部分在扩散板506中形成。例如,至少一部分第一孔520形成于调整板504内,而至少一部分第二孔522形成于扩散板506中。一流动地连接第一与第二孔520、522的节流孔524,可至少部分地形成于调整板504或扩散板506中的至少一个中。
在图5所示实施例中,第一孔520通过调整板504且部分在扩散板506中形成。第二孔522与节流孔524在扩散板506内形成。因为节流孔524的孔长度与深度(即,在一板内的位置)最小,在各板504、506中分别制造孔与节流孔520、522、524允许更有效率的制造,进一步减少钻头断裂的发生,因而更减少制造成本。
多个定位特征546被设置于调整板504与扩散板506间,以确保形成于调整板504与扩散板506内的气体通道508的各部分的配合与对准。在一实施例中,定位特征546是多个定位销544(已显示其中之一),定位销544置于调整板504与扩散板506间。在图5所示的实施例中,定位销544从扩散板506延伸且啮合一配合衬套542,该配合衬套542压配入通过调整板504的开口。销544可加以定位,使得气体通道508的对准,及在调整板504与扩散板506相对于盖组件110的预定方位得以确保。调整板504与扩散板506可以任何方式固设在一起,包括固定件、铆钉、螺丝、软焊、焊接、粘着、夹具与其类似方式。
图6是包括多个气体通道660的扩散分配板组件650的另一实施例的部分剖面图,多个气体通道650通过一调整板652与一扩散板654形成,其中调整板652可移动地固定于扩散板654。在图6的实施例中,调整板652与扩散板654是借助一分离式固定件系统600(图6中显示其一)以规则间隔连接。气体通道660是以类似上述气体通道508的方式配置。
各分离式固定件系统600包括一固定件602与一配合螺帽604,二者通常均由铝或其它适合材料制造。在使用铝固定件以最小化固定件材料对处理的影响是有利的应用中,分离式固定件系统600允许调整板652与扩散板654分开,而传统铝固定件将会卡住而需要移除和再螺旋入组件。此允许更换调整板652以改变气体通道660的流动特征,因而允许分配板组件650适合为一特定过程修改而无须更换整个组件。此特征在先前组合的由Blonigan等于2003年1月7日申请的10/337,483号美国专利申请(事务所档号7651号)中进行详述讨论。
在一实施例中,固定件602具有一头部606、一柄部608及一螺纹部分610。头部606典型地置于一形成在调整板652上表面614内的平底扩孔612内。一孔616是通过调整板652形成,与平底扩孔612同心,以容置固定件602的柄部608。柄部608通过一通过扩散板654形成并与孔616同心地对准的孔618。柄部608通常包括一当固定件602承受一超过一预定量的扭矩时可适于剪切的颈部620。
螺帽604典型地置于一形成在与调整板652相对的扩散板654下游侧624的槽622中。槽622是与一通过扩散板654形成的孔618连通。柄部608通过孔616、618,以在槽622中露出螺纹部分610。置于槽622中的螺帽604与固定件602的螺纹部分610配合。槽622经配置以当固定件602被螺紧而迫使板652、654彼此靠紧时,防止螺帽604旋转。此外,扩散板组件650的双板配置借助在制造时充分降低形成节流孔694所需的距离,进一步有利于经济地制造气体通道660,因而进一步减少制造时钻头断裂的发生。
因此,本发明已提供一制造经济的气体分配板组件。再者,该气体分配板组件通过改变横跨该板宽度的节流孔配置和/或通过更换该组件的一个板,而有利地允许调整气体流动特征。
虽然已经示出和详细说明结合本发明教导的几个较佳实施例,但是本领域技术人员可容易地想出很多其他变化的实施例,而仍结合以上教导。
Claims (20)
1.一种用于处理腔的气体分配板组件,包括:
扩散板,所述扩散板具有上游侧和下游侧;以及
多个在所述扩散板的所述上游侧与下游侧之间通过的同心气体通道,其中,每一个气体通道具有:
第一孔,所述第一孔从该上游侧延伸且具有第一直径,所述第一孔具有渐缩、斜面、圆角或切角中的至少一种的底部;
喇叭状的第二孔,所述第二孔从所述下游侧延伸且具有第二直径,所述第二孔具有渐缩、斜面、圆角或切角中的至少一种的底部;以及
节流孔,所述节流孔与所述第一孔与喇叭状的第二孔的底部流体连接并具有比所述第一孔与所述第二孔小的直径,其中所述节流孔中的至少一个具有与其它节流孔中的至少一个不同的流动限制特性。
2.如权利要求1所述的气体分配板组件,其特征在于,所述扩散板的周边处的一部分节流孔具有与所述扩散板的中心处的一部分节流孔的流动限制特性不同的流动限制特性。
3.如权利要求1所述的气体分配板组件,其特征在于,所述上游侧是未阳极电镀的铝,而下游侧经过阳极电镀。
4.如权利要求1所述的气体分配板组件,其特征在于,所述的扩散板组件进一步包括:
第一板,具有该气体通道的该第一孔的至少一部分形成于该第一板内;及
第二板,连接至该第一板,且具有该气体通道的该第二孔的至少一部分形成于该第二板内。
5.如权利要求1所述的气体分配板组件,进一步包括:
悬挂板,具有实质多边形孔径并适于支撑处理腔中的扩散板。
6.如权利要求5所述的气体分配板组件,进一步包括:
若干个在该悬挂板与扩散板之间延伸的销,这些销中的至少一个以容纳热膨胀之差的方式与形成在所述悬挂板或扩散板之一中的槽的配合。
7.如权利要求1所述的气体分配板组件,其特征在于,所述扩散板是多边形。
8.如权利要求1所述的气体分配板组件,其特征在于,所述扩散板的周边处的一部分节流孔的直径大于所述扩散板中的剩余节流孔的直径。
9.如权利要求1所述的气体分配板组件,其特征在于,所述扩散板的周边处的一部分节流孔的长度小于所述扩散板中的剩余节流孔的长度。
10.一种用于处理腔的气体分配板组件,包括:
扩散板组件,具有铝上游侧和下游侧;以及
多个在所述扩散板组件的所述上游侧与下游侧之间通过的同心气体通道,其中,每一个气体通道具有:
第一孔,所述第一孔具有从该上游侧延伸的第一直径;
节流孔,所述节流孔与所述第一孔的底部流体连接;以及
喇叭状的第二孔,所述第二孔具有从所述节流孔延伸到所述下游侧的第二直径,其中所述节流孔的直径小于所述第一直径和第二直径,且形成为通过所述扩散板的所述节流孔中的至少一个具有与其它节流孔中的至少一个不同的流动限制特性。
11.如权利要求10所述的气体分配板组件,其特征在于,所述第一孔的底部是渐缩、斜面、圆角或切角中的至少一种。
12.如权利要求11所述的气体分配板组件,其特征在于,所述第二孔的底部是渐缩、斜面、圆角或切角中的至少一种。
13.如权利要求10所述的气体分配板组件,其特征在于,所述下游侧具有经过阳极电镀的涂层,且所述上游侧是未阳极电镀的铝。
14.如权利要求10所述的气体分配板组件,其特征在于,所述下游侧和上游侧具有经过阳极电镀的涂层。
15.如权利要求10所述的气体分配板组件,其特征在于,所述扩散板组件进一步包括:
第一板,具有该气体通道的该第一孔的至少一部分形成于该第一板内;及
第二板,连接至该第一板,且具有该气体通道的该第二孔的至少一部分形成于该第二板内。
16.如权利要求10所述的气体分配板组件,其特征在于,进一步包括:
悬挂板,具有限定一实质多边形孔径的向内延伸凸缘,其中该悬挂板的该凸缘适于支撑该扩散板组件。
17.如权利要求16所述的气体分配板组件,进一步包括:
若干个在该悬挂板与扩散板之间延伸的销,这些销中的至少一个置于形成在所述悬挂板或扩散板之一中的槽内。
18.如权利要求10所述的气体分配板组件,其特征在于,所述扩散板是多边形。
19.如权利要求18所述的气体分配板组件,其特征在于,所述扩散板的周边处的一部分节流孔的直径大于所述扩散板中的剩余节流孔的直径。
20.如权利要求18所述的气体分配板组件,其特征在于,所述扩散板的周边处的一部分节流孔的长度小于所述扩散板中的剩余节流孔的长度。
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Also Published As
Publication number | Publication date |
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CN102443783A (zh) | 2012-05-09 |
JP2010077537A (ja) | 2010-04-08 |
TW200500492A (en) | 2005-01-01 |
WO2004094693A3 (en) | 2005-02-10 |
CN1754008A (zh) | 2006-03-29 |
TWI276701B (en) | 2007-03-21 |
US6942753B2 (en) | 2005-09-13 |
WO2004094693A2 (en) | 2004-11-04 |
US20040206305A1 (en) | 2004-10-21 |
JP5302865B2 (ja) | 2013-10-02 |
KR100696021B1 (ko) | 2007-03-16 |
KR20050096111A (ko) | 2005-10-05 |
JP2006515039A (ja) | 2006-05-18 |
CN1754008B (zh) | 2012-01-11 |
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