CN102468552A - Slot used for semiconductor device - Google Patents
Slot used for semiconductor device Download PDFInfo
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- CN102468552A CN102468552A CN2011102721773A CN201110272177A CN102468552A CN 102468552 A CN102468552 A CN 102468552A CN 2011102721773 A CN2011102721773 A CN 2011102721773A CN 201110272177 A CN201110272177 A CN 201110272177A CN 102468552 A CN102468552 A CN 102468552A
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Abstract
The invention provides a slot used for a semiconductor device. In a condition of lowering a member (12) relatively to a slot body (10) to get close to the slot body (10), a joint part (26t) of a lever member (26, 26a) is utilized to use a positioning member (14) installed on the semiconductor device (DV), a movable side contact part (20m) of a contact terminal, and a contact part of a fixed side contact part (20f) to push the positioning member (14) in a method of separating temporarily.
Description
Technical field
The present invention relates to a kind of being used for uses slot with the semiconductor device that the semiconductor device that Gong to make an experiment is electrically connected with printed substrate.
Background technology
In the semiconductor device that is installed on electronic equipment etc.; Usually remove the latent defect of this semiconductor device for the stage before installing, for example carry out effectively to remove aging (burn in) test of the bad integrated circuit of initial actuating with slot by semiconductor device.
Confession is carried out the semiconductor device of this kind test with the so-called IC slot of slot, and is for example also of TOHKEMY 2004-111215 communique, this semiconductor device with slot configuration on printed substrate (test board).
For example in opening top type (open-top type) slot; Semiconductor device comprises with slot: socket body, its have be used for so that after the contact action the stated mode that can relatively move with respect to a pair of moving contact portion of contact terminal with member accommodate this contact and move the resettlement section with member; Align member; It has and is used to install for example BGA type (the Ball Grid Array as semiconductor device; The solder ball grid array) resettlement section of semiconductor device installation; This align member is directed to semiconductor device in the resettlement section, and the relative position with respect to contact terminal of the electrode part of location semiconductor device; Member use in contact action, and it can come and go along the direction of regulation with moving and be configured in the socket body, and a moving contact portion that is used to make contact terminal is close to each other or separate with another moving contact portion; The lid member, it is by the contact action driving mechanism with member, the manual operation power that will be produced by operating personnel or pass to contact by the operating physical force of the manipulator effect of portable transfer robot as actuating force and move and use member.
Socket body has the outstanding resettlement section of a pair of moving contact portion that supplies a plurality of contact terminals in the inboard.Each contact terminal is made up of the fixation side terminal of base end side and a pair of moving contact portion; This fixation side terminal is located at socket body accordingly with each electrode part of the semiconductor device of being installed; This moving contact portion combines with this fixation side terminal, optionally each electrode part of clamping or release semiconductor device.The action of a pair of moving contact portion and contact is correspondingly close to each other and each electrode part of clamping semiconductor device with moving of member, or discharges each electrode part of semiconductor device with mobile correspondingly being separated from each other of member with the contact action.
Contact action with member with the direction of motion of edge for example and the moving contact portion of each contact terminal roughly the mode that moves of the direction of quadrature be configured in the resettlement section of socket body.In addition, also of TOHKEMY 2004-47137 communique, the contact action that is configured in the mode that can move along the direction of motion of the moving contact portion of each contact terminal in the resettlement section of socket body also can supply actual use with member.
The contact action has the outstanding respectively peristome of moving contact portion that supplies each contact terminal in length and breadth in the inboard with member.Each peristome of different lines is separated wall respectively and separates.
In contact moves with member; Adjacent each peristome outstanding in the moving contact portion of each contact terminal that supplies same row is respectively equipped with moving contact press section (in TOHKEMY 2004-111215 communique, being called partition wall) to each other, and this moving contact press section is to form the mode of separating between a moving contact portion and another moving contact portion.In addition, between the contact action interior perimembranous with an end of member and the resettlement section of socket body, be provided with force application component, this force application component moves with member to contact so that contact moves the mode application of force that will turn back to initial position with member.
In addition, the contact action is connected with member and driving mechanism, and this drive member is by also the leverage component and the working shaft that can rotate of that kind shown in TOHKEMY 2004-111215 communique constitute.One end of the leverage component of this driving mechanism and the cam surface butt that is driven the lid member that descends.
Thus; End at leverage component correspondingly rotates with the down maneuver of lid member; When thereby the active force ground that makes contact action overcome force application part with member moves, above-mentioned moving contact press section so that a moving contact portion of each contact terminal and mode that another moving contact portion is separated from each other move.On the other hand, with the vertical motion of lid member correspondingly, utilize the reset force of the active force of force application part to make the contact action move to initial position with member.
The lid member is being supported on socket body with respect to the mode of socket body lifting action.In addition, the periphery ground of lid member encirclement align member has opening in the inboard.
In this structure; Under the situation when the semiconductor device of manipulator that will receive portable transfer robot or operating personnel's maintenances such as finger is installed in the resettlement section of align member through covering the opening of member in; At first; Utilize the manipulator etc. of portable transfer robot to make to cover member to drop to lowest positions, and this semiconductor device is descended.Thus, make contact action overcome with member force application part active force move.When the time comes, be maintained under the state of lowest positions with member in contact action, an outstanding moving contact portion and another moving contact portion are retained as the state that has separated.
Then; The semiconductor device utilization is carried from the whereabouts of specified altitude puts in the resettlement section at align member, thereby the electrode part of semiconductor device is positioned between the moving contact portion and another moving contact portion of each contact terminal that is held in separated position.
Then;, each electrode at semiconductor device makes under being configured in the state each other of a pair of moving contact portion of each contact terminal when covering member and rising; Utilize the reset force of the active force of force application part to make the contact action rise to initial position with member; Thereby moving contact rises on the press section, and a moving contact portion is close to each other with another moving contact portion.
Thereby each electrode part through with a pair of moving contact portion clamping semiconductor device of each contact terminal makes each electrode part of semiconductor device become the state that is electrically connected with each contact terminal.
The contact action is being remained under the state of lowest positions with member above-mentioned suchly; An outstanding moving contact portion is held under the situation of state separately with another moving contact portion, and the semiconductor device in the self-align member of top ends of a pair of moving contact portion carries the length of the outstanding regulation of the face of putting.
Under this kind situation, when the semiconductor device that for example makes semiconductor device drop to align member in the manual operation that utilizes operating personnel carried on the face of putting, mistake became the electrode part of the semiconductor device of inclination attitude and possibly interfere with the top ends of moving contact portion.Particularly when the weight of semiconductor device is heavier; For example when being that semiconductor device or the electrode sum of band radiator (heat spreader) is during greater than the bigger semiconductor device of 2200 size; Along with the top ends of the electrode part of this kind semiconductor device and moving contact portion is interfered, the top ends of a pair of moving contact portion possibly is out of shape or is damaged.
Summary of the invention
Consider above problem; The object of the present invention is to provide a kind of semiconductor device to use slot; This semiconductor device is used for the semiconductor device that Gong to make an experiment is electrically connected with printed substrate with slot; Can be when semiconductor device be installed, avoid the interference between the top ends of moving contact portion of electrode part and contact terminal of semiconductor device reliably.
In order to achieve the above object, semiconductor device of the present invention comprises with slot: socket body, and it has contact terminal, and this contact terminal has the terminal that is used for clamping semiconductor device optionally and a pair of contact chip portion that is electrically connected; Member is used in the contact action; It can be disposed at above-mentioned socket body movably; This contact action has the press section with member; This press section is used for making at least one contact chip portion of a pair of contact chip portion of above-mentioned contact terminal to move, thus make in a pair of contact chip portion of above-mentioned contact terminal contact chip portion and another contact chip portion relatively near or separate; Align member; Its with can with the action of above-mentioned contact with a pair of contact chip portion of member and above-mentioned contact terminal near or spaced manner be disposed at this contact action and use member; This align member has the semiconductor device resettlement section; This semiconductor device resettlement section is used for accommodating this semiconductor device with the mode that can load and unload, and is used to carry out the location with respect to a pair of contact chip portion of this contact terminal of the electrode part of this semiconductor device; Leverage component, it is configured in the action of above-mentioned contact with between member and the above-mentioned align member with the mode that can swing, be used to make this align member and this contact move with member near or separate; The lid member; It can be supported on above-mentioned socket body movably; The loading and unloading with respect to above-mentioned semiconductor device resettlement section of this lid member and above-mentioned semiconductor device make above-mentioned contact action move with the press section of member accordingly; Thereby the terminal butt of a pair of contact chip portion that makes above-mentioned contact terminal and this semiconductor device or separate; And when above-mentioned semiconductor device is installed in above-mentioned semiconductor device resettlement section; This lid member makes above-mentioned align member near the action of above-mentioned contact action with a pair of contact chip portion of member and above-mentioned contact terminal after the action that the above-mentioned align member that above-mentioned leverage component is let contain above-mentioned semiconductor device and above-mentioned contact action temporarily separate with a pair of contact chip portion of member and above-mentioned contact terminal.
Adopt semiconductor device of the present invention to use slot; The loading and unloading with respect to the semiconductor device resettlement section of lid member and semiconductor device make the contact action move with the press section of member accordingly; The a pair of contact chip portion that makes contact terminal is with the terminal butt of semiconductor device or separate; And when semiconductor device is installed in above-mentioned semiconductor device resettlement section; The lid member is after the action that align member that leverage component is let contain semiconductor device and contact a pair of contact chip portion with member and contact terminal of moving temporarily separates; Make this leverage component make the action of this align member and contact with a pair of contact chip portion of member and contact terminal near action; Thereby the terminal of semiconductor device not can with a pair of contact chip portion collision of contact terminal, therefore can be when semiconductor device be installed, avoid the interference between the top ends of moving contact portion of electrode part and contact terminal of semiconductor device.
Through the explanation (with reference to accompanying drawing) of following specific embodiment, further characteristic of the present invention becomes obvious.
Description of drawings
Fig. 1 is with the local partial sectional view of representing that amplifies of the major part of an example of slot with semiconductor device of the present invention.
Fig. 2 is the vertical view of the structure in the expression example shown in Figure 1.
Fig. 3 A is the cutaway view of the structure in the expression example shown in Figure 1, and Fig. 3 B is the enlarged drawing that the part of the example shown in Fig. 3 A is amplified expression.
Fig. 4 A is the cutaway view that supplies the action in the explanation example shown in Figure 1, and Fig. 4 B is the enlarged drawing that the part of the example shown in Fig. 4 A is amplified expression.
Fig. 5 is a vertical view of representing sliding component used in the example shown in Figure 1 with leverage component in the lump.
Fig. 6 is a vertical view of representing sliding component used in the example shown in Figure 1.
Fig. 7 A is a stereogram of representing leverage component used in the example shown in Figure 1, and Fig. 7 B is the end view of Fig. 7 A.
Fig. 8 A is the cutaway view that supplies the action in the explanation example shown in Figure 1, and Fig. 8 B is the enlarged drawing that the part of the example shown in Fig. 8 A is amplified expression.
Fig. 9 A is the cutaway view that supplies the action in the explanation example shown in Figure 1, and Fig. 9 B is the enlarged drawing that the part of the example shown in Fig. 9 A is amplified expression.
Embodiment
Fig. 1 with semiconductor device of the present invention with an example of slot with amplify expression in the lump as the printed substrate of test board (test board).In addition, in Fig. 1, represent as representative with 1 in the slot on printed substrate, to dispose a plurality of semiconductor devices.
Semiconductor device is configured in respectively on the assigned position in the conductive pattern with slot, and this conductive pattern is formed on the printed substrate 18 with regulation thickness of slab.The plated-through-hole group that the fixation side terminal soldering of the contact terminal of stating after being formed with confession on the assigned position in this conductive pattern is fixing.In addition, the hole that each alignment pin portion of the socket body of after being formed with confession around the conductive pattern, stating inserts.
Semiconductor device is as depicted in figs. 1 and 2 with slot, and main member comprises: socket body 10, and it is fixed on the above-mentioned printed substrate 18; A plurality of contact terminal 20ai (i=1～n, n are positive integer), the contact resettlement section that it is disposed at the central authorities in the socket body 10, be used for after the semiconductor device stated and the conductive pattern of printed substrate 18 be electrically connected; Lid member 12, it can be supported on socket body 10 up and down, the bolt lock mechanism of stating after being used for operating physical force passed to; Sliding component 22, it has align member 14, and this align member 14 is so that the mode that semiconductor device DV can load and unload is accommodated this semiconductor device DV, and the relative position with respect to contact terminal of the electrode part of location semiconductor device DV; Bolt lock mechanism (with reference to Fig. 2 and Fig. 5), it comprises pressing member 16A, 16B, this pressing member 16A, 16B push each electrode part that is housed in the semiconductor device DV in the align member 14 to a plurality of contact terminals, and keep semiconductor device DV.
Being applied to this semiconductor device for example is the roughly foursquare semiconductor device that one side of BGA type is about 50mm with the semiconductor device DV of slot.Semiconductor device DV has electrode surface, on this electrode surface, is formed with in length and breadth greater than about 2200 a plurality of spherical electrode part DVa (with reference to Fig. 8 A).
The contact resettlement section is as shown in Figure 1, constitutes by being connected and being respectively applied for a plurality of cells of accommodating each contact terminal 20ai towards the recess of the surface opening of printed substrate 18 with this recess.Each cell forms with the interval of regulation in length and breadth.Adjacent cell in the same row is separated by partition wall 10Pai (i=1～n, n are positive integer) to each other.Be formed with the portion that is pressed into of the fixed part 20B that utilizes internal face supporting contact terminal 20ai in the inside of cell.Form the upper surface part of the contact resettlement section of opening at the openend of this cell, be formed with so that as after the contact action stated dispose the tabular surface of this sliding component 22 with the sliding component 22 mobile modes of member.
Contact terminal 20ai utilizes the laminal metal material of rubber-like through punch process and integrally formed, as shown in Figure 1, and extend on the surface of contact terminal 20ai edge and the printed substrate 18 roughly direction of quadrature.Contact terminal 20ai comprises: become a pair of movable side joint contact 20m of portion and the fixation side contact chip 20f of portion, it is used for the spherical electrode part DVa (with reference to Fig. 8 B) of the above-mentioned semiconductor device DV of optionally clamping; Fixation side terminal 20C, the plated-through-hole of printed substrate 18 is fixed in its soldering; Fixed part 20B, it links the movable side joint contact 20m of portion, the fixation side contact chip 20f of portion and fixation side terminal 20C.
The movable side joint contact 20m of portion has elasticity, with can with the fixation side contact chip 20f of portion near or separate.In the upper end of movable side joint contact 20m of portion and the fixation side contact chip 20f of portion, be formed with the contact portion that is used for the spherical electrode part DVa butt of semiconductor device DV respectively.As amplifying expression among Fig. 3 B, each contact portion projects to the pore position nearby of align member 14 through each slot 22b of sliding component 22.
In addition, in Fig. 4 A, under the situation that sliding component 22 is moved along the direction shown in the arrow F, the contact portion of the movable side joint contact 20m of portion is pushed and away from the contact portion of the fixation side contact chip 20f of portion by the press section 22a of sliding component 22 shown in dotted line.On the other hand, sliding component 22 is moved and the position that separated from this turns back under the situation of initial position along the direction shown in the arrow R, the contact portion of the movable side joint contact 20m of portion is near the contact portion of the fixation side contact chip 20f of portion.
The down maneuver of sliding component 22 and lid member 12 accordingly, the direction shown in the arrow F in Fig. 4 A of the effect lower edge of cam mechanism (not shown) moves.This cam mechanism for example comprises the also leverage component and the helical spring of that kind shown in TOHKEMY 2003-17207 communique.
In addition, shown in Fig. 3 A, sliding component 22 has the slot 22b that a pair of movable side joint contact 20m of portion of the one-tenth that supplies among the contact terminal 20ai and the fixation side contact chip 20f of portion pass through in length and breadth.The inner press section 22a that is formed on to each other of adjacent slot 22b in the same row separates.The wall that is separated each other of the slot 22b to each other of adjacent different lines is separated.In addition; As shown in Figure 5; On the corresponding each other upper surface of the slot 22b each other of substantial middle portion and the adjacent different lines of sliding component 22, be formed with the length with regulation and the rib 22rai (i=1～n, n are positive integer) of the reinforcement usefulness of height.
As shown in Figure 5; The periphery of the slot 22b group on the limit parallel of sliding component 22 in orthogonal coordinate system with reference axis X; Have the hole 22R of two places along reference axis X with the interval of stipulating, the shank (not shown) of the 1st guide pillar of the align member that this hole 22R states after supplying inserts.Between the hole 22R and hole 22R that extend along reference axis X, be formed with the hole 22H of two places with the interval of stipulating, this hole 22H supplies the hook portion (not shown) of the 2nd guide pillar of align member to pass through.In addition, sliding component 22 can be supported on the upper surface part of contact resettlement section along reference axis X with coming and going action.
As shown in Figure 6; On sliding component 22; Adjacent with each hole 22R and open with slot 22b component and be formed with groove 22GA, 22GB, 22GC, 22GD near the position of peripheral part respectively, this groove 22GA, 22GB, 22GC, 22GD are used to be provided with the leverage component 26,26 ' that can swing.
Elongated groove 22GA is as shown in Figure 6, comprising: inclined plane part 22BS, and it becomes along the reference axis X-shaped; Par 22Bf, it links to each other with the end of inclined plane part 22BS; Depressed part 22Bd, the end of its 22Bf from the par forms along reference axis Y agley.
Inclined plane part 22BS among the elongated groove 22GA has the gradient of the regulation that tilts to the lower right shown in Fig. 3 A.Boundary member at inclined plane part 22BS and par 22Bf is formed with recess 22Bp, the jut 26BP as rotating fulcrum in the leverage component of stating after this recess 22Bp catches 26.
As shown in Figure 6, along reference axis X and groove 22GA relatively be formed on the shared straight line of groove 22GA on groove 22GB comprise: inclined plane part 22BS, it becomes along the reference axis X-shaped; Par 22Bf, it links to each other with the end of inclined plane part 22BS; Depressed part 22Bd, the end of its 22Bf from the par along reference axis Y to form agley with the identical direction of bending direction of the depressed part 22Bd of groove 22GA.
Inclined plane part 22BS among the groove 22GB has the gradient of the regulation that tilts to the lower left as amplifying expression among Fig. 3 B.Boundary member at inclined plane part 22BS and par 22Bf is formed with recess 22Bp, the jut 26BP as rotating fulcrum in the leverage component of stating after this recess 22Bp catches 26 '.
As shown in Figure 6, the groove 22GC that relatively forms along reference axis Y and groove 22GB comprises: inclined plane part 22BS, and it becomes along the reference axis X-shaped; Par 22Bf, it links to each other with the end of inclined plane part 22BS; Depressed part 22Bd, the end of its 22Bf from the par forms with the opposite direction of bending direction with the depressed part 22Bd of groove 22GA and groove 22GB along reference axis Y agley.
Inclined plane part 22BS among the groove 22GC has the gradient of the regulation that tilts to the lower left shown in Fig. 3 A.Boundary member at inclined plane part 22BS and par 22Bf is formed with recess 22Bp, the jut 26BP as rotating fulcrum in the leverage component of stating after this recess 22Bp catches 26.
As shown in Figure 6, along reference axis X and groove 22GC relatively be formed on the shared straight line of groove 22GC on groove 22GD comprise: inclined plane part 22BS, it becomes along the reference axis X-shaped; Par 22Bf, it links to each other with the end of inclined plane part 22BS; Depressed part 22Bd, the end of its 22Bf from the par forms with the opposite direction of bending direction with the depressed part 22Bd of groove 22GA and groove 22GB along reference axis Y agley.
Inclined plane part 22BS among the groove 22GD has the gradient of the regulation that tilts to the lower right shown in Fig. 3 A.Boundary member at inclined plane part 22BS and par 22Bf is formed with recess 22Bp, the jut 26BP as rotating fulcrum in the leverage component of stating after this recess 22Bp catches 26 '.
In Fig. 7 A, the central axis of lid member abutting part 26UR and arm 26B is quadrature roughly, and forms highlightedly to lid member 12 (that is, to the top).Thus, cover under the situation that member 12 descends making, as amplifying expression among Fig. 4 A, the top of lid member abutting part 26UR as dynamic action point and with the inner peripheral surface butt that covers member 12.
In Fig. 7 A, guide portion 26C with the shared plane of the central axis of arm 26B on, roughly form on quadrature ground towards a side and this central axis.The end of guide portion 26C outstanding towards the below shown in Fig. 7 B (that is, the top of lid member abutting part 26UR towards opposite direction).In guide portion 26C with the shared plane of arm 26B on, be formed with as drag effect point with after the abutting part 26t of lower surface butt of the align member 14 stated.
In addition, the guide portion 26C in the leverage component 26 ' is as shown in Figure 5, and is different with the guide portion 26C of leverage component 26, in Fig. 7 A, this guide portion 26C with the shared plane of the central axis of arm 26B on roughly form on quadrature ground towards the opposing party and this central axis.
Carry the align member 14 put on the upper surface of above-mentioned sliding component 22 shown in Fig. 3 A by leverage component 26 and leverage component 26 '; Has semiconductor device resettlement section 14A; This semiconductor device resettlement section 14A is used to accommodate semiconductor device DV; And have guide portion, this guide portion is used to carry out the location with respect to each contact portion of contact terminal 20ai of the electrode part of semiconductor device DV.The semiconductor device that semiconductor device resettlement section 14A has a part that forms the bottom carries puts face 14as.
Shown in Fig. 3 A, opened in 10 minutes with socket body and be positioned under the situation of position topmost at lid member 12, the movable side joint contact 20m of portion of above-mentioned contact terminal 20ai and the contact portion of the fixation side contact chip 20f of portion give prominence in the 14A of this semiconductor device resettlement section.On the other hand; Shown in Fig. 4 A; Lid member 12 and socket body 10 near and be positioned under the situation of lowest positions; Align member 14 under the effect of the abutting part 26t of leverage component 26,26 ' guide portion 26C with sliding component 22 spaced manner by on push away predetermined distance, in the 14A of this semiconductor device resettlement section, form the movable side joint contact 20m of portion of above-mentioned contact terminal 20ai and the outstanding state of contact portion of the fixation side contact chip 20f of portion.
In the wall portion that faces mutually that forms semiconductor device resettlement section 14A, be formed with the pressing member 16A that states after the confession, the peristome that 16B passes through respectively respectively.
A plurality of shanks (not shown) of lid member 12 be formed on respectively socket body 10 peripheral part the guiding of each groove and be supported to and can carry out lifting action.In addition, as shown in Figure 1, between spring-loaded portion and the socket body 10 of lid member 12, be provided with a plurality of helical springs 17, this helical spring 17 is to the top, promptly cover direction that member 12 and socket body opened in 10 minutes to covering member 12 application of forces along making.When the time comes, the claw of being located at the top of the shank that covers member 12 engages with the end of groove.Thus, lid member 12 is maintained at position topmost.In addition, Fig. 1 and Fig. 3 A all represent to cover the state that member 12 is maintained at position, the top.
Pressing member 16A, 16B are as shown in Figure 5, can be supported on each limit parallel with reference axis X in the sliding component 22 respectively rotationally.
In addition, the base end part of pressing member 16A, 16B respectively under the effect of helical spring (not shown), by the direction of the semiconductor device DV that is installed in the align member 14 being pushed along the top ends of utilizing this pressing member 16A, 16B by the application of force.Thus, the top ends of pressing member 16A, 16B is configured in the position of align member 14 tops.On the other hand, utilize the arm cover member 12 make the base end part of pressing member 16A, 16B overcome helical spring 17 active force under the situation about being pressed, the self-align member 14 of the top ends of pressing member 16A, 16B leaves and is configured in the position of readiness of regulation.
In this structure; When carrying out the test of semiconductor device DV; At first be located at the upper surface butt facial and lid member 12 of pushing of the pressing member that omits on the illustrated portable transfer robot, and the active force ground that overcomes above-mentioned helical spring 17 is pressed into the lowest positions of regulation with prescribed stroke towards the below.When the time comes, shown in Fig. 4 A, depress lever member 26,26 ' lid member abutting part 26UR, thus align member 14 is pushed away predetermined distance on the abutting part 26t.
Thus, pressing member 16A, 16B are separated from each other and are positioned at position of readiness.In addition, for example utilize to omit the conveying arm of illustrated portable transfer robot, attract to keep semiconductor device DV as checked property, with semiconductor device DV be delivered to the peristome 12a that covers member 12 and align member 14 directly over the position.
Then, make and utilize conveying arm to attract the semiconductor device DV that keeps to descend through covering the peristome 12a of member 12, location and installation is in the 14A of the semiconductor device resettlement section of align member 14.
When the time comes; Shown in Fig. 8 A; Even the posture of the semiconductor device DV that falls at the height of regulation has certainly been installed under the situation of semiconductor device DV obliquely by mistake; Because predetermined distance leaves in the contact portion of the electrode part DVa of semiconductor device DV in movable side joint contact 20m of portion and the fixation side contact chip 20f of portion, the contact portion among therefore movable side joint contact 20m of portion and the fixation side contact chip 20f of portion can be not impaired.
In addition; Shown in Fig. 9 A; Even be partial to the mode of a contact portion in the contact portion of the movable side joint contact 20m of portion and the fixation side contact chip 20f of portion of contact terminal 20ai has installed under the situation of semiconductor device DV in the electrode part DVa mistake of the semiconductor device DV that falls with the height of regulation certainly; Because predetermined distance leaves in the contact portion of the electrode part DVa of semiconductor device DV in movable side joint contact 20m of portion and the fixation side contact chip 20f of portion, the contact portion among therefore movable side joint contact 20m of portion and the fixation side contact chip 20f of portion can be not impaired.
Then, when the state of the upper surface butt of and lid member 12 facial pushing of above-mentioned pressing member when lid member 12 rises down, make by the active force of above-mentioned helical spring 17 etc. and to cover member 12 and rise to position, the top.When the time comes, the abutting part on the top of pressing member 16A, 16B rotates respectively at synchronization roughly, pushes semiconductor device DV to contact terminal 20ai side.In addition, at lid when member 12 begins to rise, leverage component 26,26 ' lid member abutting part 26UR are pushing away on the quilt down in the effect of deadweight, thereby align member 14 is carried out pressing down of predetermined distance.Subsequently, the moment of regulation begin to carry out sliding component 22 to the moving of initial position, therefore with the electrode part DVa of semiconductor device DV be clamped among movable side joint contact 20m of portion and the fixation side contact chip 20f of portion contact portion each other.
Then; To cover on the basis that member 12 maintains position topmost; When the input and output portion of printed substrate 18 supplies with the inspection signal; Should check through contact terminal 20ai that signal supplied among the semiconductor device DV, and check out under the unusual situation of this circuit, will supply in the outside trouble-shooter through input and output portion from the anomaly detection signal of semiconductor device DV.
In above-mentioned example; An example of the present invention be applied in have following structure semiconductor device with in the slot; That is, when enabling under the situation that the sliding component that slides on the tabular surface of contact resettlement section upper surface part 22 moves along the direction of regulation, the contact portion of the movable side joint contact 20m of portion is pushed by the press section 22a of sliding component 22 and the structure opened with the contact part of the fixation side contact chip 20f of portion; But the present invention is not limited to this example; An example of the present invention certainly also can be applied in have following structure semiconductor device with in the slot, that is, for example also shown in patent documentation 1; Movable plate with the partition wall each other that is configured in a pair of contact chip portion is moved along the above-below direction of socket body, thus the structure that a pair of contact chip portion is all moved with the mode that is separated from each other.
Though describe the present invention with reference to specific embodiment, the present invention is not limited to above-mentioned specific embodiment.The appended claim book is consistent with maximum magnitude, thereby comprises all modified examples and be equal to example.
Claims (4)
1. a semiconductor device is used slot, and this semiconductor device comprises with slot:
Socket body, it has contact terminal, and this contact terminal has the terminal that is used for clamping semiconductor device optionally and a pair of contact chip portion that is electrically connected;
Member is used in the contact action; It can be disposed at above-mentioned socket body movably; This contact action has the press section with member; This press section is used for making at least one contact chip portion of a pair of contact chip portion of above-mentioned contact terminal to move, thus make in a pair of contact chip portion of above-mentioned contact terminal contact chip portion and another contact chip portion relatively near or separate;
Align member; Its with can with the action of above-mentioned contact with a pair of contact chip portion of member and above-mentioned contact terminal near or spaced manner be disposed at this contact action and use member; This align member has the semiconductor device resettlement section; This semiconductor device resettlement section is used for accommodating this semiconductor device with the mode that can load and unload, and is used to carry out the location with respect to a pair of contact chip portion of this contact terminal of the electrode part of this semiconductor device;
Leverage component, it is configured in the action of above-mentioned contact with between member and the above-mentioned align member with the mode that can swing, be used to make this align member and this contact move with member near or separate;
The lid member; It can be supported on above-mentioned socket body movably; The loading and unloading with respect to above-mentioned semiconductor device resettlement section of this lid member and above-mentioned semiconductor device make above-mentioned contact action move with the press section of member accordingly; Thereby the terminal butt of a pair of contact chip portion that makes above-mentioned contact terminal and this semiconductor device or separate; And when above-mentioned semiconductor device is installed in above-mentioned semiconductor device resettlement section; This lid member makes above-mentioned align member near the action of above-mentioned contact action with a pair of contact chip portion of member and above-mentioned contact terminal after the action that the above-mentioned align member that above-mentioned leverage component is let contain above-mentioned semiconductor device and above-mentioned contact action temporarily separate with a pair of contact chip portion of member and above-mentioned contact terminal.
2. semiconductor device according to claim 1 is used slot, it is characterized in that,
Above-mentioned lid member has peristome, and the above-mentioned semiconductor device that this peristome confession is loaded and unloaded on the semiconductor device resettlement section of above-mentioned align member passes through, and this lid member can be supported on above-mentioned socket body lifting action.
3. semiconductor device according to claim 2 is used slot, it is characterized in that,
Above-mentioned leverage component comprises: lid member abutting part, and itself and above-mentioned lid member butt become the dynamic action point; Guide portion, itself and above-mentioned align member butt become the drag effect point; Jut, the member butt is used in itself and the action of above-mentioned contact, becomes fulcrum.
4. semiconductor device according to claim 3 is used slot, it is characterized in that,
Above-mentioned contact action has groove with member, and above-mentioned leverage component is configured in this groove with the mode that can swing, and this groove comprises: inclined plane part; The par, it links to each other with an end of this inclined plane part; Recess, the intersection that it is formed on this inclined plane part and this par is used to dispose the jut of above-mentioned leverage component.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010255971A JP2012109081A (en) | 2010-11-16 | 2010-11-16 | Socket for semiconductor device |
| JP2010-255971 | 2010-11-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102468552A true CN102468552A (en) | 2012-05-23 |
Family
ID=46071860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102721773A Pending CN102468552A (en) | 2010-11-16 | 2011-09-09 | Slot used for semiconductor device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2012109081A (en) |
| CN (1) | CN102468552A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5518410A (en) * | 1993-05-24 | 1996-05-21 | Enplas Corporation | Contact pin device for IC sockets |
| US20030003789A1 (en) * | 2001-06-27 | 2003-01-02 | Yamaichi Electronics Co., Ltd. | Semiconductor device-socket |
| CN1495888A (en) * | 2002-09-19 | 2004-05-12 | 富士通株式会社 | Electronic component mounting method and tool |
| CN1529817A (en) * | 2001-06-19 | 2004-09-15 | 莫列斯公司 | Socket for semiconductor package |
| US20060040540A1 (en) * | 2003-11-28 | 2006-02-23 | Kenji Hayakawa | Socket for electric component |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3257994B2 (en) * | 1999-08-30 | 2002-02-18 | 日本テキサス・インスツルメンツ株式会社 | socket |
-
2010
- 2010-11-16 JP JP2010255971A patent/JP2012109081A/en active Pending
-
2011
- 2011-09-09 CN CN2011102721773A patent/CN102468552A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5518410A (en) * | 1993-05-24 | 1996-05-21 | Enplas Corporation | Contact pin device for IC sockets |
| CN1529817A (en) * | 2001-06-19 | 2004-09-15 | 莫列斯公司 | Socket for semiconductor package |
| US20030003789A1 (en) * | 2001-06-27 | 2003-01-02 | Yamaichi Electronics Co., Ltd. | Semiconductor device-socket |
| CN1495888A (en) * | 2002-09-19 | 2004-05-12 | 富士通株式会社 | Electronic component mounting method and tool |
| US20060040540A1 (en) * | 2003-11-28 | 2006-02-23 | Kenji Hayakawa | Socket for electric component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012109081A (en) | 2012-06-07 |
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Application publication date: 20120523 |