CN102650054B - Method for removing burrs of copper-clad plate - Google Patents
Method for removing burrs of copper-clad plate Download PDFInfo
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- CN102650054B CN102650054B CN201110047782.0A CN201110047782A CN102650054B CN 102650054 B CN102650054 B CN 102650054B CN 201110047782 A CN201110047782 A CN 201110047782A CN 102650054 B CN102650054 B CN 102650054B
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- clad plate
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Abstract
The invention is applicable to the field of printed circuit boards, and provides a method for removing burrs of copper-clad plates. The method mainly comprises the step that after a plurality of stacked copper-clad plates are cut, burrs at the periphery of copper-clad plates are sequentially etched and cleaned. Compared with a conventional mechanical edge planning method or an abrasive band edge burnishing method, the method provided by the invention can remove burrs of a copper-clap plate with arbitrary thickness, but the conventional mechanical edge planning method or the abrasive band edge burnishing method can only remove burrs of a thick copper-clad plate and cannot remove burrs of a thin copper-clad plate. Therefore, the method provided by the invention has the advantages of simple process flow, high efficiency, low cost and convenience in operation.
Description
Technical field
The invention belongs to printed circuit board field, relate in particular to a kind of removal method of copper-clad plate edges of boards burr.
Background technology
As shown in Figure 1a, in printed electronic circuit board industry, after copper-clad plate 91 sawing sheets, edges of boards generally all produce burr 92, and following process is produced to larger impact, as burr 92 drops, can produce short circuit, also can cause scuffing to egative film.
As shown in Fig. 1 a, 1b, for head it off, in industry, generally take the method for mechanical Pao Bianhuo abrasive band edging to remove the edges of boards burr 92 (as shown in Figure 1 b) of copper-clad plate 91.
As shown in Fig. 1 a, 1c, 1d, in industry, also have and adopt engraving method fin cutting 92, traditional engraving method is: first the plate face in copper-clad plate 91 pastes or apply a photosensory membrane 93 (as shown in Fig. 1 c); Then by exposure imaging, the periphery of photosensory membrane 93 is etched away, thereby the edges of boards surrounding of copper-clad plate 91 is revealed; Next the copper of the edges of boards of copper-clad plate 91 is etched away, thereby remove edges of boards burr 92; Finally take off photosensory membrane 93 (as shown in Figure 1 d).
But the defect that above-mentioned prior art exists is: take the method for mechanical Pao Bianhuo abrasive band edging to remove edges of boards burr, can only, for thick copper-clad plate, for thin copper-clad plate, cannot process.And adopt the engraving method of traditional subsides or painting photosensory membrane to remove edges of boards burr, and technical process is long, and cost is high.
Summary of the invention
The object of the present invention is to provide a kind of removal method of copper-clad plate edges of boards burr, the method can be removed the copper-clad plate edges of boards burr of any thickness, and technical process is short, and efficiency is high, and cost is low, easy to operate.
The present invention is achieved in that a kind of removal method of copper-clad plate edges of boards burr, comprises the steps:
(1) polylith copper-clad plate stacking is cut together;
(2) whole folded the putting on the platform of etching machine of the copper-clad plate of well cutting, by the clamping device being arranged on platform, copper-clad plate is pushed down fixing;
(3) in top and bottom and the both sides of copper-clad plate, one baffle plate with window is set respectively, copper-clad plate is moved right to the window of right side baffle plate, then four baffle plates move to copper-clad plate simultaneously, until the top and bottom of copper-clad plate and both sides are clamped;
(4) at least one nozzle of arranged outside of right side baffle plate, in the inner side of right side baffle plate, at least one blow-out nozzle is installed, by nozzle, etching solution is sprayed onto on copper-clad plate edges of boards, the Copper Foil of copper-clad plate edges of boards is etched away, nozzle blow-out nozzle in spray etching solution is blown, and by air-flow, etching solution is isolated in to the outside of right side baffle plate;
(5) etching completes shut-off nozzle, copper-clad plate is moved to another station together with four baffle plates, by the water nozzle outside the baffle plate of right side, water is sprayed on copper-clad plate edges of boards, in the time of water nozzle water spray, the blow-out nozzle of baffle plate inner side, right side continues to blow, and water is isolated in to the outside of right side baffle plate;
(6) cleaned shut-off nozzle, copper-clad plate has been moved to another station together with four baffle plates, by the hot gas mouth outside the baffle plate of right side, hot gas has been blown on copper-clad plate edges of boards; When hot gas mouth is blown, the blow-out nozzle of right side baffle plate inner side continues to blow, and prevents that hot gas from blowing to water on copper-clad plate plate face;
(7) after having dried up, remove right side baffle plate, the clamping device on platform unclamps copper-clad plate, rotation copper-clad plate, and repeating step (2)～(6), etch away the Copper Foil on its excess-three batten limit of copper-clad plate.
Particularly, in step (3), described baffle plate is made by corrosion resistant material.
Compare with the method for traditional mechanical Pao Bianhuo abrasive band edging, the present invention can remove the copper-clad plate edges of boards burr of any thickness, and the method for traditional mechanical Pao Bianhuo abrasive band edging can only, for removing thick copper-clad plate edges of boards burr, cannot be removed thin copper-clad plate edges of boards burr.Compare with traditional engraving method, technical process of the present invention is short, and efficiency is high, and cost is low, easy to operate.
Accompanying drawing explanation
Fig. 1 a is the schematic diagram of the jagged copper-clad plate of edges of boards band of the prior art;
Fig. 1 b is that prior art takes the method for mechanical Pao Bianhuo abrasive band edging to remove the schematic diagram of the copper-clad plate after edges of boards burr;
Fig. 1 c pastes or applies the schematic diagram of a sensitive layer at the plate face of copper-clad plate while adopting traditional engraving method;
Fig. 1 d is that traditional engraving method is removed the schematic diagram after copper-clad plate edges of boards burr;
Fig. 2 a is the schematic diagram that polylith copper-clad plate stacking that the embodiment of the present invention provides cuts together;
Fig. 2 b is the schematic diagram on the whole folded platform of putting etching machine of the copper-clad plate of the well cutting that provides of the embodiment of the present invention;
Fig. 2 c is that four baffle plates that the embodiment of the present invention provides clamp respectively the schematic diagram of copper-clad plate from the surrounding of copper-clad plate;
Fig. 2 d is the schematic diagram that the platform of the etching machine that provides of the embodiment of the present invention moves right to the window of right side baffle plate;
Fig. 2 e is that the nozzle in the right side baffle plate outside that provides of the embodiment of the present invention is to the schematic diagram of copper-clad plate edges of boards spray etching solution;
Fig. 2 f is that the water nozzle in the right side baffle plate outside that provides of the embodiment of the present invention is to the schematic diagram of copper-clad plate edges of boards water spray;
Fig. 2 g is the schematic diagram that the hot gas mouth in the right side baffle plate outside that provides of the embodiment of the present invention is blown to copper-clad plate edges of boards.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
The removal method of the copper-clad plate edges of boards burr that the embodiment of the present invention provides is as follows:
(1) as shown in Figure 2 a, when copper-clad plate 11 sawing sheet, generally adopt polylith copper-clad plate 11 to be stacked and cut, after sawing sheet, copper-clad plate 11 is still deposited with stack manner.
(2) as shown in Figure 2 b,, whole folded the putting on the platform 12 of etching machine of the copper-clad plate 11 of well cutting, the clamping device (not shown) on platform 12 is pushed down copper-clad plate 11.
(3) as shown in Fig. 2 c, 2d, in copper-clad plate 11 top and bottom and both sides, one baffle plate 13 with window 131 is set respectively, copper-clad plate 11 is moved right to the window 131 interior (as shown in Figure 2 d) of right side baffle plate 13, then four baffle plates 13 move to copper-clad plate 11 simultaneously, until copper-clad plate 11 top and bottom and both sides are clamped to (as shown in Figure 2 c).13 pairs of copper-clad plates 11 of four baffle plates need apply certain pressure, and four baffle plates 13 are made by corrosion resistant material.
(4) as shown in Figure 2 e, at least one nozzle 14 of arranged outside at right side baffle plate 13, at least one blow-out nozzle 15 is installed in the inner side of right side baffle plate 13, by nozzle 14, any etching solution that can etch copper is sprayed onto on copper-clad plate 11 edges of boards, the Copper Foil of copper-clad plate 11 edges of boards is etched away, and the size of Copper Foil etch quantity regulates according to the concentration of the length of spraying time and solution; Nozzle 14 is in spray etching solution, and blow-out nozzle 15 is blown, and by air-flow, etching solution is isolated in to the outside of right side baffle plate 13, to prevent that etching solution from flowing to the plate face of the copper-clad plate 11 of right side baffle plate 13 inner sides.
(5) as shown in Fig. 2 f, etching completes shut-off nozzle 14, and copper-clad plate 11 is moved to another station together with four baffle plates 13, with clear water, cleans, and purging method is sprayed at water on copper-clad plate 11 edges of boards for the water nozzle 16 by right side baffle plate 13 outsides; In the time of water nozzle 16 water spray, the blow-out nozzle 15 of right side baffle plate 13 inner sides continues to blow, and water is isolated in to the outside of right side baffle plate 13.
(6) as shown in Figure 2 g, cleaned and closed water nozzle 16, copper-clad plate 11 is moved to another station together with four baffle plates 13, with hot gas, dried up, drying method blows hot gas on copper-clad plate 11 edges of boards for the hot gas mouth 17 by right side baffle plate 13 outsides; When hot gas mouth 17 is blown, the blow-out nozzle 15 of right side baffle plate 13 inner sides continues to blow, and prevents that hot gas from blowing to water on copper-clad plate 11 plate faces.
(7) after having dried up, remove right side baffle plate 13, clamping device on platform 12 unclamps copper-clad plate 11, rotation copper-clad plate 11, repeating step (2)～(6), the Copper Foil on its excess-three batten limit of copper-clad plate 11 is etched away, finally take out copper-clad plate 11, completed the removal technique of copper-clad plate 11 edges of boards burrs.
Compare with the method for traditional mechanical Pao Bianhuo abrasive band edging, the present invention can remove the copper-clad plate edges of boards burr of any thickness, and the method for traditional mechanical Pao Bianhuo abrasive band edging can only, for removing thick copper-clad plate edges of boards burr, cannot be removed thin copper-clad plate edges of boards burr.Compare with traditional engraving method, technical process of the present invention is short, and efficiency is high, and cost is low, easy to operate.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (2)
1. a removal method for copper-clad plate edges of boards burr, is characterized in that comprising the steps:
(1) polylith copper-clad plate stacking is cut together;
(2) whole folded the putting on the platform of etching machine of the copper-clad plate of well cutting, by the clamping device being arranged on platform, copper-clad plate is pushed down fixing;
(3) at the top and bottom of an edge of copper-clad plate and the baffle plate that both sides arrange respectively a vertical placement with window, copper-clad plate is moved right to the window of right side baffle plate, then four baffle plates move to copper-clad plate simultaneously, and support edge top and bottom and the both sides clamping of described copper-clad plate;
(4) at least one nozzle of arranged outside of right side baffle plate, in the inner side of right side baffle plate, at least one blow-out nozzle is installed, by nozzle, etching solution is sprayed onto on copper-clad plate edges of boards, the Copper Foil of copper-clad plate edges of boards is etched away, nozzle blow-out nozzle in spray etching solution is blown, and by air-flow, etching solution is isolated in to the outside of right side baffle plate;
(5) etching completes shut-off nozzle, copper-clad plate is moved to another station together with four baffle plates, by the water nozzle outside the baffle plate of right side, water is sprayed on copper-clad plate edges of boards, in the time of water nozzle water spray, the blow-out nozzle of baffle plate inner side, right side continues to blow, and water is isolated in to the outside of right side baffle plate;
(6) cleaned shut-off nozzle, copper-clad plate has been moved to another station together with four baffle plates, by the hot gas mouth outside the baffle plate of right side, hot gas has been blown on copper-clad plate edges of boards; When hot gas mouth is blown, the blow-out nozzle of right side baffle plate inner side continues to blow, and prevents that hot gas from blowing to water on copper-clad plate plate face;
(7) after having dried up, remove right side baffle plate, the clamping device on platform unclamps copper-clad plate, rotation copper-clad plate, and repeating step (2)～(6), etch away the Copper Foil on its excess-three batten limit of copper-clad plate.
2. the removal method of a kind of copper-clad plate edges of boards burr as claimed in claim 1, is characterized in that: in step (3), described baffle plate is made by corrosion resistant material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110047782.0A CN102650054B (en) | 2011-02-28 | 2011-02-28 | Method for removing burrs of copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110047782.0A CN102650054B (en) | 2011-02-28 | 2011-02-28 | Method for removing burrs of copper-clad plate |
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| Publication Number | Publication Date |
|---|---|
| CN102650054A CN102650054A (en) | 2012-08-29 |
| CN102650054B true CN102650054B (en) | 2014-01-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110047782.0A Expired - Fee Related CN102650054B (en) | 2011-02-28 | 2011-02-28 | Method for removing burrs of copper-clad plate |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102922559B (en) * | 2012-11-12 | 2016-02-24 | 大连新回路电子有限公司 | A kind of limit method of wiring board cutting machine saw blade |
| CN110774008B (en) * | 2019-11-02 | 2020-09-18 | 绍兴市上虞区成达机械科技有限公司 | Automatic production line of crystal growth furnace frame |
| CN113561618B (en) * | 2021-07-07 | 2023-01-31 | 安徽鸿海新材料股份有限公司 | Preparation method of high-CTI high-temperature-resistant copper-clad plate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6494221B1 (en) * | 1998-11-27 | 2002-12-17 | Sez Ag | Device for wet etching an edge of a semiconductor disk |
| CN101015049A (en) * | 2004-09-16 | 2007-08-08 | S.E.S.株式会社 | Substrate treatment apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101563162B1 (en) * | 2009-03-12 | 2015-10-26 | 해성디에스 주식회사 | Method for manufacturing flexible circuit board |
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- 2011-02-28 CN CN201110047782.0A patent/CN102650054B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6494221B1 (en) * | 1998-11-27 | 2002-12-17 | Sez Ag | Device for wet etching an edge of a semiconductor disk |
| CN101015049A (en) * | 2004-09-16 | 2007-08-08 | S.E.S.株式会社 | Substrate treatment apparatus |
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| CN102650054A (en) | 2012-08-29 |
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| C14 | Grant of patent or utility model | ||
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| C56 | Change in the name or address of the patentee |
Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140115 Termination date: 20160228 |
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| CF01 | Termination of patent right due to non-payment of annual fee |