CN102808211A - Improved printed circuit board (PCB) electroplating production line - Google Patents

Improved printed circuit board (PCB) electroplating production line Download PDF

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Publication number
CN102808211A
CN102808211A CN201210073442XA CN201210073442A CN102808211A CN 102808211 A CN102808211 A CN 102808211A CN 201210073442X A CN201210073442X A CN 201210073442XA CN 201210073442 A CN201210073442 A CN 201210073442A CN 102808211 A CN102808211 A CN 102808211A
Authority
CN
China
Prior art keywords
titanium
copper
baskets
production line
copper spheres
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201210073442XA
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Chinese (zh)
Inventor
姜忠华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN YUANMAO ELECTRONIC TECHNOLOGY Co Ltd
Original Assignee
KUNSHAN YUANMAO ELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN YUANMAO ELECTRONIC TECHNOLOGY Co Ltd filed Critical KUNSHAN YUANMAO ELECTRONIC TECHNOLOGY Co Ltd
Priority to CN201210073442XA priority Critical patent/CN102808211A/en
Publication of CN102808211A publication Critical patent/CN102808211A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a printed circuit board (PCB) copper plating production line, in particular to a PCB electroplating production line with an improved copper sphere and titanium basket structure. The production line comprises titanium baskets and copper spheres put in the titanium baskets. The production line is characterized in that the titanium baskets are arranged on an electroplating bath, the copper spheres are microcrystal phosphorus copper spheres, and the microcrystal phosphorus copper spheres comprise two kinds of copper spheres with different diameters; 100 copper spheres with the diameters of 25 millimeters and 12 copper spheres with the diameters of 51 millimeters are put in each titanium basket; and a plurality of titanium basket zones are arranged in the length direction of the electroplating bath, a plurality of titanium baskets are arranged in each titanium basket zone, and the whole zone formed by a plurality of titanium basket zones is long in the middle and short at two ends. The improved PCB electroplating copper spheres (the microcrystal phosphorus copper spheres) are used in the production line, and the diameters of the copper spheres are increased from phi 25 millimeters to 51 millimeters, so that particles are fine, connector distribution is uniform, an anode dissolution solution is average, anode mud is reduced, and consumption of the copper spheres is reduced; and the long titanium baskets are arranged on the electroplating bath, and the quantity of the titanium baskets is increased, so that the density of the titanium baskets is improved, the anode area is enlarged and the electroplating efficiency is ensured.

Description

A kind of improved PCB electroplating assembly line
Technical field
The present invention relates to PCB copper facing production line, relate in particular to a kind of PCB electroplating assembly line that improves copper ball and titanium basket structure.
 
Background technology
In printed circuit board (PCB) production process, need to install plating line, the common copper facing of PCB plating line.In traditional P CB copper-plating technique; The general common copper ball of common phosphor-copper ball ﹐ that uses is bigger owing to particle interface potential difference; Atomic structure Bu Wen is Dinged ﹐ and is vulnerable to electroplate liquid Qin Shi ﹐ and in electroplating process, has produced a large amount of Yang Ji Ni ﹐ Chen Ji ﹐ in copper surface and anode to have produced the unusual Xiao Hao ﹐ electroplating efficiency of copper low; Power consumption Guo Da ﹐ has increased production cost, is unfavorable for energy-saving and emission-reduction.
 
Summary of the invention
The objective of the invention is to overcome the problems referred to above, provide a kind of through improving copper ball and titanium basket structure improved PCB electroplating assembly line to reduce the anode sludge, raising copper ball utilization ratio and electroplating efficiency, conservation of power resource and to reduce cost.
For solving the problems of the technologies described above; The technical scheme that the present invention adopted is: a kind of improved PCB electroplating assembly line; Comprise titanium basket and the copper ball that places the titanium basket; It is characterized in that: described titanium basket is installed on the plating tank, and described copper ball is the crystallite phosphorous copper balls, and the crystallite phosphorous copper balls comprises two kinds of copper balls that diameter is different.
Aforesaid a kind of improved PCB electroplating assembly line, the copper ball that it is 25mm that single titanium basket has 100 diameters and 12 copper balls that diameter is 51mm.
Aforesaid a kind of improved PCB electroplating assembly line, the length direction of described plating tank are provided with some titanium baskets zone, and each titanium basket zone is provided with some titanium baskets, and whole middle long two that some titanium baskets zone constitutes is short.
Common phosphorous copper balls is vulnerable to electroplate liquid and corrodes because particle interface potential difference is big, atomic structure is unstable, produces a large amount of anode sludge; The present invention uses a kind of improved PCB to electroplate copper ball (crystallite phosphorous copper balls), strengthens the copper ball diameter simultaneously, changes to φ 51mm by φ 25mm; Particle is more tiny, and interface is more evenly distributed, and anode dissolution liquid is average; The anode sludge produces and tails off, and practices thrift the copper ball usage quantity, reduces cost; Long titanium basket is also installed in the present invention additional on plating tank, through increasing titanium basket quantity, improving titanium basket density increase anode area , assurance electroplating efficiency.
 
Description of drawings
Fig. 1 is the titanium basket distributed architecture figure of the common copper ball of existing installing;
Fig. 2 is the titanium basket distributed architecture figure of installing crystallite copper ball of the present invention;
Fig. 3 is the 100* Photomicrograph of existing common phosphorous copper balls;
Fig. 4 is the 100* Photomicrograph of crystallite phosphorous copper balls of the present invention.
 
Embodiment
For technical scheme, technical characterictic that the present invention is realized, reach purpose and effect and be easy to understand and understand, below in conjunction with embodiment, further set forth the present invention.
As shown in Figure 2; A kind of improved PCB electroplating assembly line comprises titanium basket and the copper ball (lattice of Fig. 2 is represented copper ball) that places the titanium basket, and it is characterized in that: described titanium basket is installed on the plating tank; Described copper ball is the crystallite phosphorous copper balls, and the crystallite phosphorous copper balls comprises two kinds of copper balls that diameter is different; The copper ball that it is 25mm that single titanium basket has 100 diameters and 12 copper balls that diameter is 51mm; The length direction of plating tank is provided with some titanium baskets zone, and each titanium basket zone is spaced from each other in Fig. 2, and each titanium basket zone is provided with some titanium baskets, and whole middle long two that some titanium baskets zone constitutes is short.The improved PCB electroplating assembly line of the present invention is that 100 Zuo You ﹐ cause annode area to reduce increase titanium basket quantity, change the distribution of titanium basket to increase annode area so big copper ball quantity is the little copper ball of 12 Ge ﹐.Fig. 1 is the titanium basket distributed architecture figure of the common copper ball of existing installing,
Fig. 2 is the titanium basket distributed architecture figure of installing crystallite copper ball of the present invention, among Fig. 1 from left to right the titanium basket numbers in five titanium baskets zone be respectively 4,6,9,6,4, among Fig. 2 from left to right the titanium basket numbers in five titanium basket zones be respectively 4,7,10,7,4.
The above only is a preferred implementation of the present invention; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from know-why of the present invention; Can also make some improvement and retouching, these improvement and retouching also should be regarded as protection scope of the present invention.

Claims (3)

1. an improved PCB electroplating assembly line comprises titanium basket and the copper ball that places the titanium basket, and it is characterized in that: described titanium basket is installed on the plating tank, and described copper ball is the crystallite phosphorous copper balls, and the crystallite phosphorous copper balls comprises two kinds of copper balls that diameter is different.
2. a kind of improved PCB electroplating assembly line according to claim 1 is characterized in that: the copper ball that it is 25mm that single titanium basket has 100 diameters and 12 copper balls that diameter is 51mm.
3. a kind of improved PCB electroplating assembly line according to claim 1 is characterized in that: the length direction of described plating tank is provided with some titanium baskets zone, and each titanium basket zone is provided with some titanium baskets, and whole middle long two that some titanium baskets zone constitutes is short.
CN201210073442XA 2012-03-20 2012-03-20 Improved printed circuit board (PCB) electroplating production line Pending CN102808211A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210073442XA CN102808211A (en) 2012-03-20 2012-03-20 Improved printed circuit board (PCB) electroplating production line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210073442XA CN102808211A (en) 2012-03-20 2012-03-20 Improved printed circuit board (PCB) electroplating production line

Publications (1)

Publication Number Publication Date
CN102808211A true CN102808211A (en) 2012-12-05

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210073442XA Pending CN102808211A (en) 2012-03-20 2012-03-20 Improved printed circuit board (PCB) electroplating production line

Country Status (1)

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CN (1) CN102808211A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108265325A (en) * 2018-03-14 2018-07-10 电子科技大学 A kind of electroplating bath
CN114635172A (en) * 2022-02-18 2022-06-17 上海山崎电路板有限公司 PCB electroplating method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4331527A (en) * 1980-12-01 1982-05-25 Printing Machinery & Electronics, Inc. Rotogravure cylinder plating apparatus
CN1360089A (en) * 2000-12-20 2002-07-24 张简志贞 Electroplating device for circuit board
US6821407B1 (en) * 2000-05-10 2004-11-23 Novellus Systems, Inc. Anode and anode chamber for copper electroplating
CN101492831A (en) * 2008-01-23 2009-07-29 富葵精密组件(深圳)有限公司 Anode apparatus for electroplating and electroplating apparatus comprising the same
CN201924097U (en) * 2010-12-24 2011-08-10 北大方正集团有限公司 Electroplating device
CN202543370U (en) * 2012-03-20 2012-11-21 昆山元茂电子科技有限公司 Improved PCB (Printed Circuit Board) electroplating production line

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4331527A (en) * 1980-12-01 1982-05-25 Printing Machinery & Electronics, Inc. Rotogravure cylinder plating apparatus
US6821407B1 (en) * 2000-05-10 2004-11-23 Novellus Systems, Inc. Anode and anode chamber for copper electroplating
CN1360089A (en) * 2000-12-20 2002-07-24 张简志贞 Electroplating device for circuit board
CN101492831A (en) * 2008-01-23 2009-07-29 富葵精密组件(深圳)有限公司 Anode apparatus for electroplating and electroplating apparatus comprising the same
CN201924097U (en) * 2010-12-24 2011-08-10 北大方正集团有限公司 Electroplating device
CN202543370U (en) * 2012-03-20 2012-11-21 昆山元茂电子科技有限公司 Improved PCB (Printed Circuit Board) electroplating production line

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
张立伦: "酸性电镀铜用磷铜阳极探讨", 《印制电路信息》 *
王谨等: "微晶磷铜阳极对PCB电镀品质改善方面的应用研究", 《第四届全国青年印制电路学术年会》 *
蒋雄: "酸性镀铜中的磷铜阳极", 《电镀与涂饰》 *
高岩等: "集成电路用磷铜阳极及相关问题研究", 《中国集成电路》 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108265325A (en) * 2018-03-14 2018-07-10 电子科技大学 A kind of electroplating bath
CN108265325B (en) * 2018-03-14 2023-07-07 电子科技大学 Plating bath
CN114635172A (en) * 2022-02-18 2022-06-17 上海山崎电路板有限公司 PCB electroplating method

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Application publication date: 20121205