CN102937663B - The encapsulating structure of kernel module of intelligent electricity meter and method for packing - Google Patents
The encapsulating structure of kernel module of intelligent electricity meter and method for packing Download PDFInfo
- Publication number
- CN102937663B CN102937663B CN201110233805.7A CN201110233805A CN102937663B CN 102937663 B CN102937663 B CN 102937663B CN 201110233805 A CN201110233805 A CN 201110233805A CN 102937663 B CN102937663 B CN 102937663B
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- chip
- kernel module
- intelligent
- electricity meter
- substrate surface
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The invention discloses a kind of encapsulating structure of kernel module of intelligent electricity meter, comprise, for carrying the substrate of multiple chip; Be arranged at a plurality of intelligent electric meter functional chips in precalculated position on substrate surface; The bonding wire electrically connected between each functional chip and base on-board circuitry described in realizing; Cover the protective seam of described functional chip and bonding wire; Do you form the BGA (Ball with described substrate back? Grid? Array) welded ball array.Compact conformation of the present invention, makes the area of whole module and volume all greatly reduce.The present invention also provides a kind of method for packing of kernel module of intelligent electricity meter.
Description
Technical field
The present invention relates to chip encapsulation technology field, particularly a kind of encapsulating structure of kernel module of intelligent electricity meter and method for packing thereof.
Background technology
Along with people are to the development of the requirement of electronic product to directions such as miniaturization, multi-functional, environment-friendly types, people make great efforts to seek electronic system to do less and less, and integrated level is more and more higher, and function is done more and more, more and more by force.
Traditional intelligent ammeter module is coupled together finally by corresponding logic by each packaged function electronic circuit, and this needs external a large amount of placement-and-routing to complete this connection, thus can occupy areas a large amount of on circuit board, also increases cabling difficulty.Meanwhile, because the wire sizes on circuit board and via size are also excessive, the area of whole system and volume also can and then be strengthened.This not only makes the encapsulating structure of whole intelligent ammeter module oversize, also causes manufacturing cost to rise.
Traditional intelligent electric meter encapsulating structure more and more cannot meet the requirement of people to miniaturization of electronic products, high integration.
Summary of the invention
The invention provides a kind of encapsulating structure and method for packing of kernel module of intelligent electricity meter, to solve the problems referred to above of existing kernel module of intelligent electricity meter encapsulating structure.The present invention provides a kind of method for packing of kernel module of intelligent electricity meter in addition.
The invention provides a kind of encapsulating structure of kernel module of intelligent electricity meter, comprising:
For carrying the substrate of multiple chip;
Be arranged at a plurality of intelligent electric meter functional chips in precalculated position on substrate surface;
The bonding wire electrically connected between each functional chip and base on-board circuitry described in realizing;
Cover the protective seam of described functional chip and bonding wire;
Form BGA (BallGridArray) welded ball array with described substrate back.
Optionally, described substrate is single or multiple lift compound printed-wiring board (PWB), and the bonding position periphery reserving chip at described substrate surface is provided with spun gold bonding pads.
Optionally, the pad metal that BGA plants ball needs is provided with at the back side of described substrate.
Optionally, the one in the material copper of described spun gold bonding pads, nickel, gold or its alloy is formed; Form the material of pad metal that described BGA plants ball and need and comprise one in copper, nickel, gold or its alloy.
Optionally, intelligent electric meter functional chip comprises MCU chip, 485 chips, computation chip, ESAM, storer, logical circuit and clock chip and other are for realizing ammeter function discrete component.
Optionally, described protective seam is the plastic packaging glue that organic polymer material is formed, and its thickness and area are enough to the intelligent electric meter functional chip of coated substrate surface, bonding wire and bonding pads.
Optionally, form described bonding wire material and comprise gold, copper or described gold or aldary.
Optionally, described BGA welded ball array is braze metal.
The present invention also provides a kind of method for packing of kernel module of intelligent electricity meter, comprises the steps:
Be provided for substrate, the bonding position periphery of described substrate surface chip is provided with spun gold bonding pads, in described substrate, be provided with the connecting circuit connecting intelligent electric meter functional chip;
Described intelligent electric meter functional chip is mounted on the predetermined assigned address of described substrate surface;
By lead-in wire, spun gold bonding pads corresponding to described substrate surface for the lead pad of each functional chip described is connected;
The protective seam of the intelligent electric meter functional chip of coated described substrate surface, bonding wire and bonding pads is formed at described substrate surface;
BGA welded ball array is formed at described substrate back.
Optionally, following sub-step is also comprised in the step described intelligent electric meter functional chip being mounted on described substrate surface:
Preheating is carried out to substrate;
Substrate surface precalculated position gluing after preheat;
Intelligent electric meter chip and substrate surface glue sites are aligned;
By intelligent electric meter chip attachment in substrate surface glue sites.
Optionally, by intelligent electric meter chip attachment after substrate surface glue sites, also comprise described substrate pyroprocessing, the step of solidification intelligent electric meter chip.
Optionally, described protective seam is one or more layers of plastic packaging glue.
Optionally, the mode of some glue or coating is adopted to form described plastic packaging glue at upper surface of base plate, and heating cure.
Optionally, BGA welded ball array is formed at the back side of substrate by C4 process reflows.
Optionally, also comprise the steps: the whole module section to completing encapsulation, and do Performance Detection.
Compared with prior art, the present invention has the following advantages: the encapsulating structure of kernel module of intelligent electricity meter of the present invention is by the bare chip of each different size dimension model used in electric meter system, by becoming one, form a high density, low-loss, the panel type meter module of low cost, makes the area of whole module and volume all greatly reduce; Further, the cable run distance of each chip chamber in this structure in ammeter module shortens, and is more conducive to the speed improving signal transacting, improves the performance of ammeter module.
In addition, method cost of the present invention low and be easy to control, be convenient to scale of mass production.
Accompanying drawing explanation
Fig. 1 is the cut-open view of the embodiment of the encapsulating structure of kernel module of intelligent electricity meter of the present invention;
Fig. 2 is the vertical view that in the embodiment of the encapsulating structure of kernel module of intelligent electricity meter of the present invention, intelligent electric meter chip distributes in substrate surface;
Fig. 3 to Fig. 6 is the schematic diagram of the structure formed after each step of the method for packing of kernel module of intelligent electricity meter of the present invention.
Embodiment
Set forth a lot of detail in the following description so that fully understand the present invention.But the present invention can be much different from alternate manner described here to implement, those skilled in the art can when without prejudice to doing similar popularization when intension of the present invention, therefore the present invention is by the restriction of following public concrete enforcement.
Be described in detail below in conjunction with the embodiment of accompanying drawing to the encapsulating structure of kernel module of intelligent electricity meter of the present invention.
Fig. 1 is the cut-open view of the embodiment of the encapsulating structure of kernel module of intelligent electricity meter of the present invention.Please refer to Fig. 1, in embodiments of the invention, kernel module of intelligent electricity meter encapsulating structure comprises substrate 101, is arranged at a plurality of intelligent electric meter functional chips (the first functional chip 104 and the second functional chip 105 is only shown in Fig. 1) in substrate 101 precalculated position on the surface; The bonding wire 106 electrically connected between each functional chip and base on-board circuitry described in realizing; Cover the protective seam 107 of described functional chip and bonding wire; Form BGA (BallGridArray) welded ball array 108 with described substrate back.
Wherein, described substrate 101 connects for realizing logic between multi-chip and provides support chip.It can be single or multiple lift compound printed circuit board (PCB).Be provided with the metal wiring layer of more than one deck in described substrate 101 inside, form connecting circuit.It connects in order to realize corresponding electrical equipment according to the logical relation of chip chamber.Described substrate 101 material can plastics, pottery etc.
In the surperficial precalculated position of described substrate 101 for intelligent electric meter chip of fitting, the periphery remaining for mounting intelligent electric meter chip position is in advance provided with spun gold bonding pads 102, and spun gold bonding pads 102 can be made up of the one in the materials such as copper, nickel, gold or its alloy.This spun gold bonding pads is connected with the circuit of substrate inside, and as the lead pad of the bonding with intelligent electric meter chip.
Also be provided with the pad metal 103 formed required for BGA array at the back side of described substrate 101, pad metal 103 also can be made up of the one in the materials such as copper, nickel, gold or its alloy.This pad metal 103 is also connected with the circuit of substrate inside.
Fig. 2 shows above-mentioned intelligent electric meter functional chip in the distribution of substrate surface.As shown in Figure 2, each intelligent electric meter functional chip pastes the surface with substrate 101 by alite paste.Intelligent electric meter functional chip comprises MCU chip 206,485 chip 204, computation chip 208, ESAM chip 202, storer 210, logical circuit 104 and clock chip 105 (Fig. 1 is equivalent to arrange in Fig. 2 the cut-open view along XX ' direction after protective seam) respectively.Can certainly also comprise realize ammeter functions of modules other needed for chip and components and parts.Every a chip and components and parts are mounted on the relevant position on substrate 101 surface by above-mentioned functional chip by mounting technology.Said chip can be market circulation chip and components and parts product, also can manufacture and design by self-developing.It should be noted that, the mounting position of the various functional chips shown in Fig. 2 is only schematic.The functional chip forming ammeter module can arrange arbitrarily on substrate 101 surface by those skilled in the art as required, accordingly, the circuit of substrate 101 inside and the spun gold bonding pads on substrate 101 surface can design in advance according to the setting position of functional chip and manufacture, and no longer repeat here.
Please continue referring to Fig. 1,106 one end that go between are connected on the pad of chip, and the other end is connected to substrate 101 and is distributed on the surface on the pad of chip circumference, are connected by the circuit in chip with the circuit in substrate 101.All chips are all connected with the circuit on substrate 101 by lead-in wire, thus can realize the electrical connection between different chip, and realize the ammeter functions of modules of expection.106 materials that go between comprise gold, copper or described gold or aldary.
Described protective seam 107 is arranged at described substrate 101 on the surface, for the protection of the syndeton of the chip on substrate 101 surface and chip and substrate 101.In the present embodiment, the plastic packaging glue that described protective seam 107 is formed for organic polymer materials, its thickness and area are enough to the intelligent electric meter functional chip on coated substrate 101 surface, bonding wire and bonding pads.By protective seam 107, physical mechanical and heating power protection can be provided for chip and bonding wire structure, strengthen integrally-built reliability.Certainly, the material of protective seam 107 is not limited to described plastic packaging glue, and it can also be the material that other can realize defencive function and provide physical strength, will not enumerate here.
The pad metal 103 at the back side of described substrate 101 is formed with BGA soldered ball.A plurality of soldered ball forms welded ball array.Described welded ball array forms the port that this ammeter module encapsulation construction is connected with next stage motherboard.BGA soldered ball principal ingredient can be common braze metal.
The encapsulating structure of the kernel module of intelligent electricity meter of above-described embodiment is by the bare chip of each different size dimension model used in electric meter system, by becoming one, form a high density, low-loss, the panel type meter module of low cost, makes the area of whole module and volume all greatly reduce.Further, the cable run distance of each chip chamber in this structure in ammeter module shortens, and is more conducive to the speed improving signal transacting, improves the performance of ammeter module.
The present invention also provides a kind of method for packing of kernel module of intelligent electricity meter.Fig. 3 to Fig. 6 is the schematic diagram of the structure formed after each step in the enforcement of the method for packing of kernel module of intelligent electricity meter of the present invention.Below in conjunction with Fig. 3 to Fig. 6, method of the present invention is described.
First, as shown in Figure 3, substrate 101 is provided.Described substrate surface chip bonding position periphery is provided with spun gold bonding pads 102, and it is generally by copper, nickel, gold grade for metal composition; Being provided with the wiring layer of the connection connecting intelligent electric meter functional chip in described substrate inside, such as, can be two layers of wiring structure.Be provided with BGA at described substrate 101 back side and plant pad metal 103 needed for ball.Described substrate 101 can be formed with the printed circuit board manufacturing process of routine.Here repeat no more.
Then, described intelligent electric meter functional chip is mounted on the predetermined assigned address of described substrate surface.Fig. 3 show the first functional chip 104 and the second functional chip 105 be mounted on substrate attachment after schematic diagram.
Wherein, attachment can adopt surface stick-mounting machine, and concrete step can comprise carries out preheating to substrate; Substrate surface precalculated position gluing after preheat; Intelligent electric meter chip and substrate surface glue sites are aligned; By intelligent electric meter chip attachment in substrate surface glue sites and to substrate pyroprocessing, the step of solidification intelligent electric meter chip.By this step, intelligent electric meter functional chip can firmly mount with on the surface of substrate 101.
Then, as shown in Figure 5,106 spun gold bonding pads corresponding to described substrate surface for the lead pad of each functional chip described to be connected by going between.This lead-in wire 106 is generally metal wire or copper cash, or its alloy.
Again then, as shown in Figure 6, the protective seam 107 of the intelligent electric meter functional chip of coated described substrate surface, bonding wire and bonding pads is formed at described substrate surface.In the present embodiment, described protective seam 107 is one or more layers of plastic packaging glue, and the composition of plastic packaging glue is generally organic polymer, and height is to cover all bare chips and lead-in wire is as the criterion.The mode of some glue or coating is adopted to form described plastic packaging glue at upper surface of base plate, and heating cure.
Finally, as shown in Figure 1, BGA welded ball array 108 is formed at described substrate 101 back side.In the present embodiment, form BGA welded ball array 108. by C4 process reflows
After completing above-mentioned steps, also comprise the whole module section to completing encapsulation, and do the step of Performance Detection.
The method of above-described embodiment has broken away from the method for the multimode assembling of traditional electrical list structure, and bare chip is integrated, and area and the volume of whole module reduce all greatly; And the cable run distance of each chip chamber in ammeter module shortens by this method, be more conducive to the speed improving signal transacting, improve the performance of ammeter module; In addition, method cost of the present invention low and be easy to control, be convenient to scale of mass production.
Although the present invention with preferred embodiment openly as above; but it is not for limiting the present invention; any those skilled in the art without departing from the spirit and scope of the present invention; can make possible variation and amendment, the scope that therefore protection scope of the present invention should define with the claims in the present invention is as the criterion.
Claims (14)
1. an encapsulating structure for kernel module of intelligent electricity meter, is characterized in that comprising,
For carrying the substrate of multiple chip;
Be arranged at a plurality of intelligent electric meter functional chips in precalculated position on substrate surface;
The bonding wire electrically connected between each functional chip and base on-board circuitry described in realizing;
Cover the protective seam of described functional chip and bonding wire;
Be formed at BGA (BallGridArray) welded ball array of described substrate back;
Wherein, described intelligent electric meter functional chip comprises MCU chip, 485 chips, computation chip, ESAM, storer, logical circuit and clock chip and other are for realizing the discrete component of ammeter function; Described substrate inside is provided with the metal wiring layer of more than one deck, forms the connecting circuit connecting intelligent electric meter functional chip.
2. the encapsulating structure of kernel module of intelligent electricity meter according to claim 1, is characterized in that, described substrate is single or multiple lift stratification compound printed-wiring board (PWB), and the bonding position periphery reserving chip at described substrate surface is provided with spun gold bonding pads.
3. the encapsulating structure of kernel module of intelligent electricity meter according to claim 2, is characterized in that, is provided with the pad metal that BGA plants ball needs at the back side of described substrate.
4. the encapsulating structure of kernel module of intelligent electricity meter according to claim 3, is characterized in that, forms the one in the material copper of described spun gold bonding pads, nickel, gold or its alloy; Form the material of pad metal that described BGA plants ball and need and comprise one in copper, nickel, gold or its alloy.
5. the encapsulating structure of kernel module of intelligent electricity meter according to claim 2; it is characterized in that; described protective seam is the plastic packaging glue that organic polymer material is formed, and its thickness and area are enough to the intelligent electric meter functional chip of coated substrate surface, bonding wire and bonding pads.
6. the encapsulating structure of kernel module of intelligent electricity meter according to claim 1, is characterized in that, forms described bonding wire material and comprises gold, copper or described gold or aldary.
7. the encapsulating structure of kernel module of intelligent electricity meter according to claim 1, is characterized in that, described BGA welded ball array is braze metal.
8. a method for packing for kernel module of intelligent electricity meter, is characterized in that comprising the steps,
Be provided for substrate, the bonding position periphery of described substrate surface chip is provided with spun gold bonding pads, described substrate inside is provided with the metal wiring layer of more than one deck, forms the connecting circuit connecting intelligent electric meter functional chip;
Described intelligent electric meter functional chip is mounted on the predetermined assigned address of described substrate surface;
By lead-in wire, spun gold bonding pads corresponding to described substrate surface for the lead pad of each functional chip described is connected;
The protective seam of the intelligent electric meter functional chip of coated described substrate surface, bonding wire and bonding pads is formed at described substrate surface;
BGA welded ball array is formed at described substrate back.
9. the method for packing of kernel module of intelligent electricity meter according to claim 8, is characterized in that, also comprises following sub-step in the step described intelligent electric meter functional chip being mounted on described substrate surface,
Preheating is carried out to substrate;
Substrate surface precalculated position gluing after preheat;
Intelligent electric meter chip and substrate surface glue sites are aligned;
By intelligent electric meter chip attachment in substrate surface glue sites.
10. the method for packing of kernel module of intelligent electricity meter according to claim 9, is characterized in that, by intelligent electric meter chip attachment after substrate surface glue sites, also comprises described substrate pyroprocessing, the step of solidification intelligent electric meter chip.
The method for packing of 11. kernel module of intelligent electricity meter according to claim 8, is characterized in that, described protective seam is one or more layers of plastic packaging glue.
The method for packing of 12. kernel module of intelligent electricity meter according to claim 11, is characterized in that, adopts the mode of some glue or coating to form described plastic packaging glue at upper surface of base plate, and heating cure.
The method for packing of 13. kernel module of intelligent electricity meter according to claim 8, is characterized in that, forms BGA welded ball array at the back side of substrate by C4 process reflows.
The method for packing of 14. kernel module of intelligent electricity meter according to claim 8, is characterized in that, also comprises the steps: the whole module section to completing encapsulation, and does Performance Detection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201110233805.7A CN102937663B (en) | 2011-08-16 | 2011-08-16 | The encapsulating structure of kernel module of intelligent electricity meter and method for packing |
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| CN201110233805.7A CN102937663B (en) | 2011-08-16 | 2011-08-16 | The encapsulating structure of kernel module of intelligent electricity meter and method for packing |
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| CN102937663A CN102937663A (en) | 2013-02-20 |
| CN102937663B true CN102937663B (en) | 2016-04-27 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105525332B (en) * | 2014-10-24 | 2018-11-09 | 中国科学院苏州纳米技术与纳米仿生研究所 | A kind of method and encapsulation chip reducing solder bonding thermal stress |
| CN105374804A (en) * | 2015-12-08 | 2016-03-02 | 深圳佰维存储科技有限公司 | Intelligent wearable device |
| CN107731763A (en) * | 2017-11-14 | 2018-02-23 | 湖北三江航天红峰控制有限公司 | A kind of chip encapsulation module and integrated AD harvesters |
| CN111082920A (en) * | 2019-12-27 | 2020-04-28 | 西南石油大学 | Non-interactive verifiable multi-type encrypted data aggregation method facing smart power grid |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6521994B1 (en) * | 2001-03-22 | 2003-02-18 | Netlogic Microsystems, Inc. | Multi-chip module having content addressable memory |
| CN1490858A (en) * | 2002-10-14 | 2004-04-21 | 矽品精密工业股份有限公司 | Spheric grid array semiconductor chip package procedure |
| US6798054B1 (en) * | 2000-07-28 | 2004-09-28 | Siliconware Precision Industries Co., Ltd. | Method of packaging multi chip module |
| CN2935472Y (en) * | 2006-08-02 | 2007-08-15 | 力成科技股份有限公司 | Ball grid array packaging structure |
| CN101145549A (en) * | 2006-09-13 | 2008-03-19 | 力成科技股份有限公司 | Ball grating array package structure and package method |
| CN201063342Y (en) * | 2007-07-06 | 2008-05-21 | 威宇科技测试封装有限公司 | Multiple-chip packaging structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102103165A (en) * | 2009-12-17 | 2011-06-22 | 深圳先进技术研究院 | Electricity meter |
-
2011
- 2011-08-16 CN CN201110233805.7A patent/CN102937663B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6798054B1 (en) * | 2000-07-28 | 2004-09-28 | Siliconware Precision Industries Co., Ltd. | Method of packaging multi chip module |
| US6521994B1 (en) * | 2001-03-22 | 2003-02-18 | Netlogic Microsystems, Inc. | Multi-chip module having content addressable memory |
| CN1490858A (en) * | 2002-10-14 | 2004-04-21 | 矽品精密工业股份有限公司 | Spheric grid array semiconductor chip package procedure |
| CN2935472Y (en) * | 2006-08-02 | 2007-08-15 | 力成科技股份有限公司 | Ball grid array packaging structure |
| CN101145549A (en) * | 2006-09-13 | 2008-03-19 | 力成科技股份有限公司 | Ball grating array package structure and package method |
| CN201063342Y (en) * | 2007-07-06 | 2008-05-21 | 威宇科技测试封装有限公司 | Multiple-chip packaging structure |
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