CN103325756A - Multi-device SMT flat packaging piece based on frame and manufacturing process of multi-device SMT flat packaging piece - Google Patents
Multi-device SMT flat packaging piece based on frame and manufacturing process of multi-device SMT flat packaging piece Download PDFInfo
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- CN103325756A CN103325756A CN2013101815999A CN201310181599A CN103325756A CN 103325756 A CN103325756 A CN 103325756A CN 2013101815999 A CN2013101815999 A CN 2013101815999A CN 201310181599 A CN201310181599 A CN 201310181599A CN 103325756 A CN103325756 A CN 103325756A
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- lead frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The invention discloses a multi-device SMT flat packaging piece based on a frame and a manufacturing process of the multi-device SMT flat packaging piece. The packaging piece is mainly composed of a lead frame, insulation paste, a chip, a bonding wire, an inducer, a resistor, a capacitor, a packaged finished product and a plastic packaging body. The lead frame is connected with the chip through the insulation paste, and the lead frame is connected with the inducer, the resistor, the capacitor and the packaged finished product through a pin of the inducer, a pin of the resistor, a pin of the capacitor and a pin of the packaged finished product. The bonding wire is connected with the chip and lead frame directly. The plastic packaging body surrounds the lead frame, the insulation paste, the chip, the bonding wire, the inducer, the resistor, the capacitor and the packaged finished product so as to form a whole of a circuit. The procedures of the manufacturing process are pin tin pack-up, wafer thinning, scribing, chip installing (chip pasting), bonding, plastic packaging, post curing, tinning, printing, product separating, checking, packing and storing. According to the multi-device SMT flat packaging piece based on the frame and the manufacturing process of the multi-device SMT flat packaging piece, the size can be reduced effectively, the weight can be reduced, the reliability of the packaging piece can be improved, shock resistance is strong, and defect rates of welding points are low.
Description
Technical field
The invention belongs to the integrated antenna package technical field, specifically a kind of many devices SMT flat packaging part and manufacture craft thereof based on framework.
Background technology
Electronic circuit surface installation technique (Surface Mount Technology, SMT) is called surface mount or surface mounting technology.It is a kind ofly will (be called for short SMC/SMD without pin or short leg surface-assembled components and parts, Chinese title sheet components and parts) be installed in printed circuit board (Printed Circuit Board, PCB) on the surface or the surface of other substrate, by the methods such as Reflow Soldering or the immersed solder circuit load technology of welding assembly in addition.
Packaging density is high, the electronic product volume is little, lightweight, and the volume and weight of surface mount elements only has about 1/10 of traditional inserting element, generally adopts after the SMT electronic product volume-diminished 40% ~ 60%, weight saving 60% ~ 80%; Reliability is high, shock resistance is strong; The welding point defect rate is low; High frequency characteristics is good; Electromagnetism and radio frequency interference have been reduced; Easily be automated, enhance productivity; Reduce cost and reach 30% ~ 50%, save material, the energy, equipment, manpower, time etc.
The QFN(flat-four-side is without pin package) and the dual flat non-leaded encapsulation of DFN() encapsulation grows up, is applicable to high frequency, broadband, low noise, high heat conduction, small size in the in recent years generation (digital camera, mobile phone, PC, MP3) along with communication and portable small-sized digital electronic goods, the high-speed encapsulation that waits the middle small scale integrated circuit that electrically requires.We know that the QFN/DFN encapsulation has effectively utilized the encapsulated space of terminal pin, thereby have improved significantly packaging efficiency.
And along with the electronic product function is increasingly more complete, the integrated circuit that adopts (IC)
Without punctured element, particularly extensive, high integrated IC has to adopt the surface patch element.And along with the product mass, the production automation, manufacturer will with low-cost high yield, produce quality product to cater to customer demand and to strengthen the market competitiveness.Because technical limitations, the SMT technology only is used for substrate class encapsulating products at present, is difficult to namely connect the devices such as inductance, resistance, electric capacity and encapsulation finished product at framework so that shell frame products is realized the SMT technology.
Summary of the invention
Problem with regard to above-mentioned prior art existence, the invention provides a kind of many devices SMT flat packaging part and manufacture craft thereof based on framework, have effectively reduced volume, weight reduction also improves the packaging part reliability, shock resistance is strong, the advantage that the welding point defect rate is low.
A kind of many devices SMT flat packaging part based on framework is mainly by lead frame, insulating cement, and chip, bonding line, inductance, resistance, electric capacity and encapsulation finished product, plastic-sealed body forms.Described lead frame is connected with chip by insulating cement; lead frame and inductance; resistance; electric capacity and encapsulation finished product pass through inductance; resistance; electric capacity connects with the pin that is connected finished product; described bonding line directly connects chip and lead frame; plastic-sealed body has surrounded lead frame; insulating cement; chip; bonding line; inductance; inductance; resistance; electric capacity and encapsulation finished product have also consisted of the integral body of circuit; plastic-sealed body has played support and protective effect, chip to chip and bonding line; bonding line; inductance; resistance; electric capacity and encapsulation finished product; lead frame has consisted of power supply and the signalling channel of circuit.
A kind of flow process of manufacture craft of the many devices SMT flat packaging part based on framework: the pin tin sticky of inductance, resistance, electric capacity and encapsulation finished product → wafer attenuate → scribing → upper core (bonding die) → pressure welding → plastic packaging → rear curing → tin → printing → separation of products → check → packing → warehouse-in.
Description of drawings
Fig. 1 lead frame profile;
Product profile behind the bonding inductance of Fig. 2, resistance, electric capacity and the encapsulation finished product;
Product profile behind the core on Fig. 3;
Product profile after Fig. 4 pressure welding;
Fig. 5 plastic packaged products profile;
Fig. 6 finished product profile.
Among the figure, 1 is lead frame, and 2 is insulating cement, and 3 is chip, and 4 is bonding line, and 5 is inductance, resistance, electric capacity and encapsulation finished product, and 6 is plastic-sealed body.
Embodiment
The present invention is described further below in conjunction with accompanying drawing.
As shown in Figure 6, a kind of many devices SMT flat packaging part based on framework is mainly by lead frame 1, insulating cement 2, and chip 3, bonding line 4, inductance, resistance, electric capacity and encapsulation finished product 5, plastic-sealed body 6 forms.Described lead frame 1 is connected with chip 3 by insulating cement 2; lead frame 1 and inductance; resistance; electric capacity and encapsulation finished product 5 pass through inductance; resistance; electric capacity connects with the pin that is connected finished product 5; described bonding line 4 directly connects chip 3 and lead frame 1; plastic-sealed body 6 has surrounded lead frame 1; insulating cement 2; chip 3; bonding line 4; inductance; inductance; resistance; electric capacity and encapsulation finished product 5 have also consisted of the integral body of circuit; 6 pairs of chips 3 of plastic-sealed body and bonding line 4 have played support and protective effect, chip 3; bonding line 4; inductance; resistance; electric capacity and encapsulation finished product 5; lead frame 1 has consisted of power supply and the signalling channel of circuit.
A kind of flow process of manufacture craft of the many devices SMT flat packaging part based on framework: the pin tin sticky of inductance, resistance, electric capacity and encapsulation finished product → wafer attenuate → scribing → upper core (bonding die) → pressure welding → plastic packaging → rear curing → tin → printing → separation of products → check → packing → warehouse-in.
To shown in Figure 6, a kind of key step of manufacture craft of the many devices SMT flat packaging part based on framework is as follows such as Fig. 1:
1, inductance, resistance, electric capacity and the 5 pin tin sticky of encapsulation finished product link to each other with lead frame 1;
2, attenuate, scribing: thickness thinning 50 μ m～200 μ m, the above wafer of 150 μ m are with common Q FN scribing process, but thickness uses double-pole scribing machine and technique thereof at the following wafer of 150 μ m;
3, upper core (bonding die): adopt insulating cement 2 that chip 3 is linked to each other with lead frame 1;
4, pressure welding: pressure welding is identical with conventional QFN/DFN technique;
5, plastic packaging, rear curing, mill glue, tin, printing, separation of products, check, packing etc. are all identical with conventional QFN/DFN technique.
Claims (2)
1. many devices SMT flat packaging part based on framework is characterized in that: mainly by lead frame (1), and insulating cement (2), chip (3), bonding line (4), inductance, resistance, electric capacity and encapsulation finished product (5), plastic-sealed body (6) forms; Described lead frame (1) is connected with chip (3) by insulating cement (2), lead frame (1) and inductance, resistance, electric capacity and encapsulation finished product (5) pass through inductance, resistance, electric capacity connects with the pin that is connected finished product (5), described bonding line (4) directly connects chip (3) and lead frame (1), plastic-sealed body (6) has surrounded lead frame (1), insulating cement (2), chip (3), bonding line (4), inductance, inductance, resistance, electric capacity and encapsulation finished product (5) have also consisted of the integral body of circuit, chip (3), bonding line (4), inductance, resistance, electric capacity and encapsulation finished product (5), lead frame (1) has consisted of power supply and the signalling channel of circuit.
2. manufacture craft based on many devices SMT flat packaging part of framework, it is characterized in that: it carries out according to following key step:
(1), inductance, resistance, electric capacity and encapsulation finished product (5) pin tin sticky, link to each other with lead frame (1);
(2), attenuate, scribing: thickness thinning 50 μ m～200 μ m, the above wafer of 150 μ m are with common Q FN scribing process, but thickness uses double-pole scribing machine and technique thereof at the following wafer of 150 μ m;
(3), upper core (bonding die): adopt insulating cement (2) that chip (3) is linked to each other with lead frame (1);
(4), pressure welding: pressure welding is identical with conventional QFN/DFN technique;
(5), plastic packaging, rear curing, mill glue, tin, printing, separation of products, check, packing etc. are all identical with conventional QFN/DFN technique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101815999A CN103325756A (en) | 2013-05-16 | 2013-05-16 | Multi-device SMT flat packaging piece based on frame and manufacturing process of multi-device SMT flat packaging piece |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101815999A CN103325756A (en) | 2013-05-16 | 2013-05-16 | Multi-device SMT flat packaging piece based on frame and manufacturing process of multi-device SMT flat packaging piece |
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| Publication Number | Publication Date |
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| CN103325756A true CN103325756A (en) | 2013-09-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2013101815999A Pending CN103325756A (en) | 2013-05-16 | 2013-05-16 | Multi-device SMT flat packaging piece based on frame and manufacturing process of multi-device SMT flat packaging piece |
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| Country | Link |
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| CN (1) | CN103325756A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103606540A (en) * | 2013-10-31 | 2014-02-26 | 华天科技（西安）有限公司 | Frame-based small-distance multi-device SMT package and manufacturing process thereof |
| CN107958880A (en) * | 2017-11-02 | 2018-04-24 | 杰群电子科技（东莞）有限公司 | A kind of semiconductor package and its method for packing and electronic product |
| CN112599425A (en) * | 2020-12-14 | 2021-04-02 | 苏州华太电子技术有限公司 | Hybrid packaging method and hybrid packaging structure applied to electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050142694A1 (en) * | 2003-12-24 | 2005-06-30 | Super Talent Electronics Inc. | Stacking memory chips using flat lead-frame with breakaway insertion pins and pin-to-pin bridges |
| CN102231372A (en) * | 2011-06-30 | 2011-11-02 | 天水华天科技股份有限公司 | Multi-turn arranged carrier-free IC (Integrated Circuit) chip packaging component and manufacturing method thereof |
| CN103021995A (en) * | 2012-12-28 | 2013-04-03 | 华天科技（西安）有限公司 | Single chip packaging piece capable of realizing SMT (surface mount technology) on basis of cylindrical inductor and manufacturing technology of single chip packaging piece |
| CN203589007U (en) * | 2013-05-16 | 2014-05-07 | 华天科技（西安）有限公司 | Multi-device SMT flat packaging piece based on frame |
-
2013
- 2013-05-16 CN CN2013101815999A patent/CN103325756A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050142694A1 (en) * | 2003-12-24 | 2005-06-30 | Super Talent Electronics Inc. | Stacking memory chips using flat lead-frame with breakaway insertion pins and pin-to-pin bridges |
| CN102231372A (en) * | 2011-06-30 | 2011-11-02 | 天水华天科技股份有限公司 | Multi-turn arranged carrier-free IC (Integrated Circuit) chip packaging component and manufacturing method thereof |
| CN103021995A (en) * | 2012-12-28 | 2013-04-03 | 华天科技（西安）有限公司 | Single chip packaging piece capable of realizing SMT (surface mount technology) on basis of cylindrical inductor and manufacturing technology of single chip packaging piece |
| CN203589007U (en) * | 2013-05-16 | 2014-05-07 | 华天科技（西安）有限公司 | Multi-device SMT flat packaging piece based on frame |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103606540A (en) * | 2013-10-31 | 2014-02-26 | 华天科技（西安）有限公司 | Frame-based small-distance multi-device SMT package and manufacturing process thereof |
| CN107958880A (en) * | 2017-11-02 | 2018-04-24 | 杰群电子科技（东莞）有限公司 | A kind of semiconductor package and its method for packing and electronic product |
| CN112599425A (en) * | 2020-12-14 | 2021-04-02 | 苏州华太电子技术有限公司 | Hybrid packaging method and hybrid packaging structure applied to electronic device |
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Application publication date: 20130925 |