CN103384454A - Method for manufacturing composite circuit board - Google Patents
Method for manufacturing composite circuit board Download PDFInfo
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- CN103384454A CN103384454A CN2012101476853A CN201210147685A CN103384454A CN 103384454 A CN103384454 A CN 103384454A CN 2012101476853 A CN2012101476853 A CN 2012101476853A CN 201210147685 A CN201210147685 A CN 201210147685A CN 103384454 A CN103384454 A CN 103384454A
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Abstract
The invention discloses a method for manufacturing a composite circuit board. The method for manufacturing the composite circuit board comprises the following steps that firstly, a rigid base material is provided and the rigid base material comprises a rigid dielectric layer; then, penetration portions arranged in a preset format is arranged on the rigid dielectric layer, so that the rigid base material is divided into preset removing zones and preset remaining zones according to the arrangement of the penetration portions; then, an electric conductive joint layer is provided and the electric conductive joint layer comprises an electric conductive layer and a dielectric joint layer arranged on the electric conductive layer; then, the electric conductive layer and the rigid base material are pressed and combined, so that the penetration layer is filled with a part of the dielectric joint layer; then, a soft circuit board and the rigid base material are pressed and combined; then, the electric conductive layer is patterned so that a circuit layer can be formed; then, the rigid base material, the soft circuit board and the electric conductive joint layer are bent with the penetration portions serving as a standard, so that each preset remaining zone is bent in one penetration portion relative to one preset removing zone; finally, one part, in each preset removing zone, of the rigid base material and one part, corresponding to each preset removing zone, of the electric conductive joint layer are removed so that a recessed portion can be formed and a part of the soft circuit board can be exposed.
Description
Technical field
The present invention relates to a kind of manufacture method of circuit board, and particularly relate to a kind of manufacture method of combined type circuit board.
Background technology
Generally speaking, existing in order to carrying and the circuit board that is electrically connected to a plurality of electronic components be mainly by a plurality of line layers (circuit layer) and a plurality of dielectric layer (dielectric layer) be superimposed consist of.These line layers are defined through the patterning manufacture craft by conductive layer (conductive layer) to form.These dielectric layers are to be disposed at respectively between adjacent these line layers, in order to isolate these line layers.In addition, can be electrically connected to each other by conduction duct (conductive via) between these overlapped line layers.In addition, configurable various electronic component (for example active element or passive component) also on the surface of circuit board, and reach the purpose of electrical signals transmission (electrical signal propagation) by the circuit board internal wiring.
Along with the miniaturization of electronic product, the range of application of circuit board is more and more wider, for example is applied in cover-lifting type mobile phone and notebook computer.Therefore, the combined type circuit board that flexible circuit board (flexible circuit board) is formed in conjunction with hard circuit board (rigid circuit board) is the direction that is worth development.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method of combined type circuit board, the yield of the combined type circuit board that it is produced is higher.
For reaching above-mentioned purpose, the present invention proposes a kind of manufacture method of combined type circuit board, and it comprises the following steps.At first, provide a rigid base material (rigid substrate), it comprises a rigid dielectric layer (rigid dielectric layer).Then, form a plurality of sections (through portion) of running through in rigid dielectric layer.These run through section arranges with a predetermined format and runs through rigid dielectric layer, makes rigid base material run through the arrangement of section according to these and divides at least one predetermined district (predetermined removed region) and at least one predetermined reserved area (predetermined reserved region) of removing.Then, provide a conductive bond layer (conductive bonding layer), it comprises a conductive layer (conductive layer) and a dielectric knitting layer (dielectric bonding layer).The dielectric knitting layer is disposed on conductive layer.
Then, with conductive bond layer and rigid base material pressing, make part dielectric knitting layer between conductive layer and rigid base material, and another part dielectric knitting layer is filled these and is run through section.Then, with a flexible circuit board and rigid base material pressing, make flexible circuit board and conductive layer be positioned at the relative both sides of rigid base material.Then, patterned conductive layer is to form a line layer.
Then, run through section as benchmark bending rigid base material, flexible circuit board and conductive bond layer take these, make predetermined reserved area with respect to being scheduled to remove the district in these sections' of running through place's bendings.At last, remove the predetermined part that removes the district of being positioned at of rigid base material and conductive bond floor corresponding to a predetermined part that removes the district, cave in (indentation) and the expose portion flexible circuit board to form one.
In one embodiment of this invention, before bending rigid base material, flexible circuit board and conductive bond layer, the manufacture method of above-mentioned combined type circuit board more comprises at least part of being covered on line layer of formation one welding resisting layer (solder mask layer).
In one embodiment of this invention, above-mentioned mode with flexible circuit board and rigid base material pressing for by a joint fastener (bonding sheet) with flexible circuit board and rigid base material pressing, make joint fastener be engaged between flexible circuit board and rigid base material.Joint fastener has at least one district (through region) of running through, and runs through the district corresponding to the predetermined district that removes.
In one embodiment of this invention, above-mentioned these sections of running through are that mode by laser processing forms.
In one embodiment of this invention, above-mentioned these sections of running through are by other physics or (for example stamp (punching), the boring (drilling) of chemical process mode ... Deng) form.
In one embodiment of this invention, above-mentioned conductive bond layer is a gum Copper Foil (resin coated copper).
In one embodiment of this invention, the material of above-mentioned rigid dielectric layer comprises glass fibre and resin.
To be the section of running through of being filled by the dielectric knitting layer take these bend rigid base material, flexible circuit board and conductive bond layer as benchmark in the present invention, and then remove the predetermined part that removes the district of being positioned at of rigid base material and conductive bond floor corresponding to a predetermined part that removes the district, cave in to form.Therefore, the manufacture method of combined type circuit board of the present invention can't cause any unexpected destruction for flexible circuit board in the process that forms depression, make the yield of the produced combined type circuit board of the manufacture method of utilizing combined type circuit board of the present invention higher.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and coordinate appended accompanying drawing, be described in detail below.
Description of drawings
Figure 1A to Fig. 1 I is the schematic diagram of manufacture method of a kind of combined type circuit board of one embodiment of the invention;
Fig. 2 is the schematic top plan view of the rigid base material of another embodiment of the present invention.
The main element symbol description
100 combined type circuit boards
110,210 rigid base materials
112 rigid dielectric layers
114 line layers
116,216 run through section
The predetermined district that removes of 118a
118b is scheduled to the reserved area
120 conductive bond layers
122 conductive layers
The 122a line layer
124 dielectric knitting layers
130 flexible circuit boards
132 soft dielectric layer
133 line layers
133a golden finger contact
134 soft protective layer
140 joint fasteners
142 run through the district
150 welding resisting layers
160 depressions
A1, A2, A3, A4, A5, A6, A7, A8 dotted arrow
Embodiment
Figure 1A to Fig. 1 I, it illustrates the manufacture method of a kind of combined type circuit board of one embodiment of the invention.The manufacture method of the combined type circuit board of the present embodiment comprises the following steps.At first, please refer to Figure 1A, at least one rigid base material 110 is provided.In the present embodiment, for example provide two rigid base materials 110.Should be noted that at this, for convenience of description for the purpose of, Figure 1A illustrates one of them vertical view and generalized section along line K-K of these rigid base material 110 simultaneously, and these rigid base materials 110 another generalized section wherein.
Each rigid base material 110 comprises a rigid dielectric layer 112 and a line layer 114.Each rigid dielectric layer 112 for example comprises glass fibre and resin, be for example bismaleimide resin (bismaleimide-triazine resin, BT resin) with the composite material of glass fibre, it is for example perhaps the composite material (FR-4, FR-5) of epoxy (epoxy resin) and glass fibre.What deserves to be explained is, the rigidity (rigidity) of the rigid dielectric layer 112 that is made of glass fibre and resin is stronger.
In the present embodiment, each rigid base material 110 can be via processing for a copper clad laminate (copper clad laminate) (not illustrating).Copper clad laminate for example has two copper foil layers (copper foil layer), lays respectively at the relative both sides of the rigid dielectric layer of copper clad laminate.One of them of these copper foil layers removed fully, and for these copper foil layers wherein another carries out the patterning manufacture craft to form line layer 114, therefore can obtain the rigid base material 110 of the present embodiment.In another embodiment, one of them of these rigid base materials 110 can only have rigid dielectric layer 112 and the configuration of omitting line layer 114, looks closely producer's demand and decides.
Then, for each rigid base material 110, for example by physics or (for example laser, stamp, the boring of chemical process mode ... Deng) form a plurality of sections 116 of running through in the rigid dielectric layer 112 of correspondence.In the present embodiment, each to run through section 116 be for example an elliptoid through hole.These of each rigid base material 110 run through section 116 to be arranged with a predetermined format and runs through corresponding rigid dielectric layer 112, makes each rigid base material 110 run through the arrangement of section 116 and divide at least one predetermined district 118a and at least one predetermined reserved area 118b of removing according to corresponding these.In the present embodiment, with regard to the vertical view of Figure 1A, each rigid base material 110 comprises two predetermined district 118a and three predetermined reserved area 118b of removing.In the present embodiment, in each rigid base material 110, each is predetermined removes district 118a predetermined removing between these adjacent predetermined reserved area 118b of district 118a therewith.In the present embodiment, the position of section 116 is run through corresponding to these of the rigid base material 110 of below in fact in these of the rigid base material 110 of the top position of running through section 116.
Should be noted that at this, these external forms that run through section 116 can be done different variations.Fig. 2 illustrates the schematic top plan view of the rigid base material of another embodiment of the present invention.Please refer to Fig. 2, in this embodiment, the external form that each of rigid base material 210 runs through section 216 is comparatively long and narrow rectangle.Therefore, the section of running through 116 of above-described embodiment, 216 external form are in order to for example and non-limiting the present invention.
Then, please refer to Figure 1B, at least one conductive bond layer 120 is provided.In the present embodiment, for example provide two conductive bond layers 120.Each conductive bond layer 120 comprises a conductive layer 122 and a dielectric knitting layer 124, and dielectric knitting layer 124 is disposed on conductive layer 122.In the present embodiment, each conductive bond layer 120 is for example a gum Copper Foil, that is the conductive layer 122 of each conductive bond layer 120 is for example the copper foil layer of gum Copper Foil, and the dielectric knitting layer 124 of each conductive bond layer 120 is for example the resin bed of gum Copper Foil.
Then, please refer to Fig. 1 C, with each conductive bond layer 120 and corresponding rigid base material 110 pressings, the part dielectric knitting layer 124 that makes each conductive bond layer 120 between the conductive layer 122 of correspondence and corresponding rigid base material 110, and another part dielectric knitting layer 124 of each conductive bond layer 120 fill corresponding rigid base material 110 these run through section 116.
Then, please refer to Fig. 1 D, a flexible circuit board 130 and at least one joint fastener 140 is provided.In the present embodiment, for example provide two joint fasteners 140.Each joint fastener 140 with characteristic for example for not Flowing Film (non-flowing prepreg) or low Flowing Film (low-flow prepreg), take material such as resin film (resin prepreg) etc.Each joint fastener 140 has at least one district 142 (Fig. 1 D signal illustrate two) of running through, and each size that runs through district 142 is rough identical with the corresponding predetermined area that removes district 118a.
In addition, in the present embodiment, the material of these soft dielectric layer 132 is for example polyimide resin (polyimide, PI) or epoxy resin, and the material of these soft protective layer 134 is such as being polyimide resin collocation epoxy resin or other materials etc.
Then, please refer to Fig. 1 E, for example by these joint fasteners 140 and with flexible circuit board 130 and these rigid base material 110 pressings, make each joint fastener 140 be engaged between flexible circuit board 130 and corresponding rigid base material 110.Flexible circuit board 130 is the relative both sides that are positioned at the rigid base material 110 of top with the conductive layer 122 of the conductive bond layer 120 of top, and flexible circuit board 130 is the relative both sides that are positioned at the rigid base material 110 of below with the conductive layer 122 of the conductive bond layer 120 of below.In addition, these of the joint fastener 140 of top run through these predetermined district 118a that remove that district 142 corresponds respectively to the rigid base material 110 of top, and these of the joint fastener 140 of below run through these predetermined district 118a that remove that district 142 corresponds respectively to the rigid base material 110 of below.
Then, please refer to Fig. 1 F, come these conductive layers 122 of these conductive bond layers 120 of patterning to form a plurality of line layer 122a by photoetching and etching process.Then, form a welding resisting layer 150 on the dielectric knitting layer 124 of each conductive bond layer 120, be covered on corresponding line layer 122a with at least part of.
Then, please refer to Fig. 1 G, run through section 116 take these and bend these rigid base materials 110, flexible circuit board 130 and these conductive bond layers 120 as benchmark.In detail, the predetermined reserved area 118b in the left side of top rigid base material 110 with respect to be adjacent predetermined remove district 118a and between these run through section 116 places (that is dotted arrow A 1 indication part) bending.The predetermined reserved area 118b in the left side of below rigid base material 110 with respect to be adjacent predetermined remove district 118a and between these run through section 116 places (that is dotted arrow A 2 indication parts) bending.Combine speech, the predetermined reserved area 118b in these left sides runs through section 116 take these of dotted arrow A 1 and A2 indication and bends up and down with respect to these predetermined district's 118a works that remove that are adjacent for benchmark.
The predetermined reserved area 118b of the centre of top rigid base material 110 removes district 118a with respect to the left side that is adjacent predetermined and these of between run through section 116 places (that is dotted arrow A 3 indication parts) bending.The predetermined reserved area 118b of the centre of below rigid base material 110 removes district 118a with respect to the left side that is adjacent predetermined and these of between run through section 116 places (that is dotted arrow A 4 indication parts) bending.Combine speech, the predetermined reserved area 118b in the middle of these run through section 116 take these of dotted arrow A 3 and A4 indication and bend up and down for the predetermined district's 118a work that removes of benchmark with respect to these left sides that are adjacent.
The predetermined reserved area 118b of the centre of top rigid base material 110 removes district 118a with respect to the right side that is adjacent predetermined and these of between run through section 116 places (that is dotted arrow A 5 indication parts) bending.The predetermined reserved area 118b of the centre of below rigid base material 110 removes district 118a with respect to the right side that is adjacent predetermined and these of between run through section 116 places (that is dotted arrow A 6 indication parts) bending.Combine speech, the predetermined reserved area 118b in the middle of these run through section 116 take these of dotted arrow A 5 and A6 indication and bend up and down for the predetermined district's 118a work that removes of benchmark with respect to these right sides that are adjacent.
The predetermined reserved area 118b on the right side of top rigid base material 110 with respect to be adjacent predetermined remove district 118a and between these run through section 116 places (that is dotted arrow A 7 indication parts) bending.The predetermined reserved area 118b on the right side of below rigid base material 110 with respect to be adjacent predetermined remove district 118a and between these run through section 116 places (that is dotted arrow A 8 indication parts) bending.Combine speech, the predetermined reserved area 118b on these right sides runs through section 116 take these of dotted arrow A 7 and A8 indication and bends up and down with respect to these predetermined district's 118a works that remove that are adjacent for benchmark.
These materials that run through the dielectric knitting layer 124 in section 116 are more crisp compared to the material of rigid base material 110 owing to filling, so the crack that produces after above-mentioned these bendings can form and extend through these outside dielectric knitting layers 124 in the section of running through 116 inside of correspondence respectively.
Then, please refer to Fig. 1 H, remove these rigid base materials 110 be positioned at these predetermined parts that remove district 118a (visible Fig. 1 G) and these conductive bond floor 120 corresponding to these predetermined parts that removes district 118a (as seen Fig. 1 G), the expose portion flexible circuit board 130 to form a plurality of depressions 160.In the present embodiment, the golden finger contact 133a of these flexible circuit boards 130 can by these cave in 150 be exposed to outside.
At last, please refer to Fig. 1 I, carry out the singulation manufacture craft, to form a plurality of combined type circuit boards 100.Should be noted that at this, so-called singulation manufacture craft is to carry out necessary cutting for the formed structure of Fig. 1 H, to form a plurality of combined type circuit boards 100 of required size.
One of them that the manufacture method of combined type circuit board of the present invention has the following advantages at least or other advantages:
(1) to be the section of running through of being filled by the dielectric knitting layer take these bend rigid base material, flexible circuit board and conductive bond layer as benchmark in the present invention, and then remove the predetermined part that removes the district of being positioned at of rigid base material and conductive bond floor corresponding to a predetermined part that removes the district, cave in to form.Therefore, the manufacture method of combined type circuit board of the present invention can't cause any unexpected destruction for flexible circuit board in the process that forms depression, make the yield of the produced combined type circuit board of the manufacture method of utilizing combined type circuit board of the present invention higher.
The welding resisting layer that (two) can first the conductive layer pattern on the conductive bond layer be turned to line layer and form this line layer of protection before form depression due to the manufacture method by combined type circuit board of the present invention is so follow-up formed depression can't affect the formation of above-mentioned patterning manufacture craft and welding resisting layer.
In the situation that do not break away from the present invention's spirit or necessary characteristic, can other particular forms embody the present invention.Described specific embodiment each side only should be considered as illustrative and non-limiting.Therefore, category of the present invention is as enclosing as shown in claim but not as shown in above stated specification.All drop on the equivalent meaning of claim and the change in scope should be considered as dropping in the category of claim.
Claims (7)
1. the manufacture method of a combined type circuit board comprises:
One rigid base material is provided, comprises rigid dielectric layer;
Form a plurality of sections of running through in this rigid dielectric layer, wherein those sections of running through arrange with a predetermined format and run through this rigid dielectric layer, make this rigid base material run through the arrangement of section according to those and divide at least one predetermined district and at least one predetermined reserved area of removing;
One conductive bond layer is provided, comprises conductive layer and dielectric knitting layer, wherein this dielectric knitting layer is disposed on this conductive layer;
With this conductive bond layer and this rigid base material pressing, make this dielectric knitting layer of part between this conductive layer and this rigid base material, and this dielectric knitting layer of another part is filled those and is run through section;
With a flexible circuit board and this rigid base material pressing, make this flexible circuit board and this conductive layer be positioned at the relative both sides of this rigid base material;
This conductive layer of patterning is to form a line layer; And
Run through section as benchmark bends this rigid base material, this flexible circuit board and this conductive bond layer take those, make this predetermined reserved area predeterminedly remove the district and in the place's bending of those sections of running through with respect to this; And
Remove this rigid base material be positioned at this predetermined part that removes the district and this conductive bond floor corresponding to this predetermined part that removes the district, cave in and this flexible circuit board of expose portion to form one.
2. the manufacture method of combined type circuit board as claimed in claim 1 before bending this rigid base material, this flexible circuit board and this conductive bond layer, also comprises formation one welding resisting layer is at least part of being covered on this line layer.
3. the manufacture method of combined type circuit board as claimed in claim 1, with the mode of this flexible circuit board and this rigid base material pressing for by a joint fastener with this flexible circuit board and this rigid base material pressing, make this joint fastener be engaged between this flexible circuit board and this rigid base material, wherein this joint fastener has at least one district of running through, and this runs through the district corresponding to this predetermined district that removes.
4. the manufacture method of combined type circuit board as claimed in claim 1, wherein those sections of running through are that mode by laser processing forms.
5. the manufacture method of combined type circuit board as claimed in claim 1, wherein those sections of running through are that mode by stamp or boring forms.
6. the manufacture method of combined type circuit board as claimed in claim 1, wherein this conductive bond layer is a gum Copper Foil.
7. the manufacture method of combined type circuit board as claimed in claim 1, wherein the material of this rigid dielectric layer comprises glass fibre and resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210147685.3A CN103384454B (en) | 2012-05-04 | 2012-05-04 | The making method of combined type circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210147685.3A CN103384454B (en) | 2012-05-04 | 2012-05-04 | The making method of combined type circuit board |
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| CN103384454A true CN103384454A (en) | 2013-11-06 |
| CN103384454B CN103384454B (en) | 2016-06-01 |
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| CN201210147685.3A Active CN103384454B (en) | 2012-05-04 | 2012-05-04 | The making method of combined type circuit board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783795A (en) * | 2015-11-20 | 2017-05-31 | 恒劲科技股份有限公司 | Package substrate |
| CN107278064A (en) * | 2017-08-09 | 2017-10-20 | 常熟东南相互电子有限公司 | The preparation method of flexible-rigid compound circuit board |
| CN110944449A (en) * | 2019-12-26 | 2020-03-31 | 上海创功通讯技术有限公司 | Bendable multi-layer hard circuit board and manufacturing method thereof |
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| US5004639A (en) * | 1990-01-23 | 1991-04-02 | Sheldahl, Inc. | Rigid flex printed circuit configuration |
| US5206463A (en) * | 1990-07-24 | 1993-04-27 | Miraco, Inc. | Combined rigid and flexible printed circuits and method of manufacture |
| CN1816258A (en) * | 2005-02-06 | 2006-08-09 | 华通电脑股份有限公司 | Method for making hard-soft composite circuit board |
| CN201528472U (en) * | 2008-09-22 | 2010-07-14 | 博罗县精汇电子科技有限公司 | Rigid-flexible circuit board with bent area protected by copper foil |
| CN101896037A (en) * | 2004-06-11 | 2010-11-24 | 揖斐电株式会社 | Rigid-flex wiring board and method for producing same |
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2012
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5004639A (en) * | 1990-01-23 | 1991-04-02 | Sheldahl, Inc. | Rigid flex printed circuit configuration |
| US5206463A (en) * | 1990-07-24 | 1993-04-27 | Miraco, Inc. | Combined rigid and flexible printed circuits and method of manufacture |
| CN101896037A (en) * | 2004-06-11 | 2010-11-24 | 揖斐电株式会社 | Rigid-flex wiring board and method for producing same |
| CN1816258A (en) * | 2005-02-06 | 2006-08-09 | 华通电脑股份有限公司 | Method for making hard-soft composite circuit board |
| CN201528472U (en) * | 2008-09-22 | 2010-07-14 | 博罗县精汇电子科技有限公司 | Rigid-flexible circuit board with bent area protected by copper foil |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106783795A (en) * | 2015-11-20 | 2017-05-31 | 恒劲科技股份有限公司 | Package substrate |
| CN107278064A (en) * | 2017-08-09 | 2017-10-20 | 常熟东南相互电子有限公司 | The preparation method of flexible-rigid compound circuit board |
| CN107278064B (en) * | 2017-08-09 | 2019-07-09 | 常熟东南相互电子有限公司 | The production method of flexible-rigid compound circuit board |
| CN110944449A (en) * | 2019-12-26 | 2020-03-31 | 上海创功通讯技术有限公司 | Bendable multi-layer hard circuit board and manufacturing method thereof |
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|---|---|
| CN103384454B (en) | 2016-06-01 |
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