CN103384454B - The making method of combined type circuit board - Google Patents
The making method of combined type circuit board Download PDFInfo
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- CN103384454B CN103384454B CN201210147685.3A CN201210147685A CN103384454B CN 103384454 B CN103384454 B CN 103384454B CN 201210147685 A CN201210147685 A CN 201210147685A CN 103384454 B CN103384454 B CN 103384454B
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Abstract
The present invention discloses the making method of a kind of combined type circuit board, and it comprises the following steps. , it is provided that rigid base material, first rigid dielectric layer is comprised. Then, form the through-Penetration portion arranged in a predetermined format in rigid dielectric layer, rigid base material is divided into according to the arrangement of through-Penetration portion and makes a reservation for remove district and predetermined reserved area. , it is provided that conductive bond layer, then it comprises conductive layer and configures dielectric knitting layer thereon. Then, by conductive bond layer and rigid base material pressing, part dielectric knitting layer is made to fill through-Penetration portion. Then, by flexible circuit board and rigid base material pressing. Then, patterned conductive layer is to form line layer. Then, it is that benchmark bends rigid base material, flexible circuit board and conductive bond layer taking through-Penetration portion, makes predetermined reserved area remove district and bend at through-Penetration portion place relative to predetermined. Finally, remove rigid base material be positioned at the predetermined part removing district and conductive bond floor corresponding to the predetermined part removing district, cave in and expose portion flexible circuit board to be formed.
Description
Technical field
The present invention relates to the making method of a kind of circuit card, and particularly relate to the making method of a kind of combined type circuit board.
Background technology
Generally speaking, the existing circuit card in order to carry and to be electrically connected multiple electronic component is mainly superimposed by multiple line layer (circuitlayer) and multiple dielectric layer (dielectriclayer) and is formed. These line layers are defined through patterning manufacture craft by conductive layer (conductivelayer) to be formed. These dielectric layers are configured between these line layers adjacent respectively, in order to isolate these line layers. In addition, it is electrically connected to each other by conduction duct (conductivevia) between these overlapped line layers. In addition, also configurable various electronic component (such as active component or passive element) on the surface of circuit card, and the object of electrical signals transmission (electricalsignalpropagation) is reached by the inner circuit of circuit card.
Along with the miniaturization of electronic product, the range of application of circuit card is more and more wider, such as, be applied in cover-lifting type mobile phone and notes type computer. Therefore, by the combined type circuit board that flexible circuit board (flexiblecircuitboard) becomes it is the direction being worth development in conjunction with hard circuit board (rigidcircuitboard).
Summary of the invention
It is an object of the invention to provide the making method of a kind of combined type circuit board, the good rate of the combined type circuit board produced by it is higher.
For reaching above-mentioned purpose, the present invention proposes the making method of a kind of combined type circuit board, and it comprises the following steps. , it is provided that a rigid base material (rigidsubstrate), first it comprises a rigid dielectric layer (rigiddielectriclayer). Then, multiple through-Penetration portion (throughportion) is formed in rigid dielectric layer. These through-Penetration portion are with a predetermined format permutation and run through rigid dielectric layer so that rigid base material is divided at least one making a reservation for and removed district (predeterminedremovedregion) and at least one predetermined reserved area (predeterminedreservedregion) according to the arrangement of these through-Penetration portion. , it is provided that a conductive bond layer (conductivebondinglayer), then it comprises a conductive layer (conductivelayer) and a dielectric knitting layer (dielectricbondinglayer). Dielectric knitting layer is configured on conductive layer.
Then, by conductive bond layer and rigid base material pressing so that part dielectric knitting layer is between conductive layer and rigid base material, and another part dielectric knitting layer fills these through-Penetration portion. Then, by a flexible circuit board and rigid base material pressing so that flexible circuit board is positioned at the relative both sides of rigid base material with conductive layer. Then, patterned conductive layer is to form a line layer.
Then, rigid base material, flexible circuit board and conductive bond layer taking these through-Penetration portion as benchmark bends so that predetermined reserved area removes district and bend at these through-Penetration portion places relative to predetermined. Finally, remove rigid base material be positioned at the predetermined part removing district and conductive bond floor corresponding to the part making a reservation for remove district, to form a depression (indentation) and expose portion flexible circuit board.
In one embodiment of this invention, before the rigid base material of bending, flexible circuit board and conductive bond layer, the making method of above-mentioned combined type circuit board more comprises formation one welding resisting layer (soldermasklayer) and is covered at least partly on line layer.
In one embodiment of this invention, above-mentioned by the mode of flexible circuit board and rigid base material pressing for engage sheet (bondingsheet) by one and by flexible circuit board and rigid base material pressing so that engage chip bonding between flexible circuit board and rigid base material. Engage sheet to have and at least one run through district (throughregion), run through district and remove district corresponding to predetermined.
In one embodiment of this invention, these through-Penetration portion above-mentioned are that the mode by laser processing is formed.
In one embodiment of this invention, these through-Penetration portion above-mentioned are by other physics or chemical process mode (such as stamp (punching), boring (drilling) ... Deng) formed.
In one embodiment of this invention, above-mentioned conductive bond layer is back of the body glue Copper Foil (resincoatedcopper).
In one embodiment of this invention, the material of above-mentioned rigid dielectric layer comprises glass fibre and resin.
The present invention is by benchmark of these through-Penetration portion filled by dielectric knitting layer to bend rigid base material, flexible circuit board and conductive bond layer, and then remove rigid base material be positioned at the predetermined part removing district and conductive bond floor corresponding to the part making a reservation for remove district, to form depression. Therefore, the making method of the combined type circuit board of the present invention can't cause any unexpected destruction for flexible circuit board in the process forming depression so that utilizes the good rate of the combined type circuit board produced by making method of the combined type circuit board of the present invention higher.
For the above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended accompanying drawing, it is described in detail below.
Accompanying drawing explanation
Figure 1A to Fig. 1 I is the schematic diagram of the making method of a kind of combined type circuit board of one embodiment of the invention;
Fig. 2 is the schematic top plan view of the rigid base material of another embodiment of the present invention.
Main element nomenclature
100 combined type circuit boards
110,210 rigid base material
112 rigid dielectric layers
114 line layers
116,216 through-Penetration portion
118a is predetermined removes district
The predetermined reserved area of 118b
120 conductive bond layers
122 conductive layers
122a line layer
124 dielectric knitting layers
130 flexible circuit boards
132 soft dielectric layer
133 line layers
133a golden finger contact
134 soft protective layer
140 joint sheets
142 run through district
150 welding resisting layers
160 depressions
A1, A2, A3, A4, A5, A6, A7, A8 dotted line arrow
Embodiment
Figure 1A to Fig. 1 I, it illustrates the making method of a kind of combined type circuit board of one embodiment of the invention. The making method of the combined type circuit board of the present embodiment comprises the following steps. First, please refer to Figure 1A, it is provided that at least one rigid base material 110. In the present embodiment, two rigid base materials 110 are such as provided. Should be noted that at this, for the purpose of for convenience of description, Figure 1A illustrate simultaneously these rigid base materials 110 one of them vertical view with along the diagrammatic cross-section of line K-K, and these rigid base materials 110 wherein another diagrammatic cross-section.
Each rigid base material 110 comprises rigid dielectric layer 112 and a line layer 114. Each rigid dielectric layer 112 such as comprises glass fibre and resin, it is such as bismaleimide resin (bismaleimide-triazineresin, BTresin) with the matrix material of glass fibre, or it is such as the matrix material (FR-4, FR-5) of ring oxygen (epoxyresin) with glass fibre. What deserves to be explained is, the rigidity (rigidity) of the rigid dielectric layer 112 being made up of glass fibre and resin is stronger.
In the present embodiment, each rigid base material 110 can process via for a copper clad laminate (coppercladlaminate) (not illustrating). Copper clad laminate such as has two copper foil layers (copperfoillayer), lays respectively at the relative both sides of the rigid dielectric layer of copper clad laminate. One of them of these copper foil layers is removed completely, and for these copper foil layers wherein another carries out patterning manufacture craft to form line layer 114, therefore can obtain the rigid base material 110 of the present embodiment. In another embodiment, one of them of these rigid base materials 110 can only have rigid dielectric layer 112 and omit the configuration of line layer 114, looks closely the demand of producer and determines.
Then, for each rigid base material 110, such as by physics or chemical process mode (such as laser, stamp, boring ... Deng) form multiple through-Penetration portion 116 in the rigid dielectric layer 112 of correspondence. In the present embodiment, each through-Penetration portion 116 be such as an oval shape run through hole. These through-Penetration portion 116 of each rigid base material 110 are with a predetermined format permutation and run through corresponding rigid dielectric layer 112 so that each rigid base material 110 is divided into according to the arrangement of these through-Penetration portion 116 of correspondence and at least one predetermined removed district 118a and at least one predetermined reserved area 118b. In the present embodiment, with regard to the vertical view of Figure 1A, each rigid base material 110 comprises two and makes a reservation for remove district 118a and three predetermined reserved area 118b. In the present embodiment, in each rigid base material 110, each predetermined district 118a that removes makes a reservation for remove between these adjacent predetermined reserved area 118b of district 118a at this. In the present embodiment, the position of these through-Penetration portion 116 of the rigid base material 110 of top substantially corresponds to the position of these through-Penetration portion 116 of the rigid base material 110 of lower section.
Should be noted that at this, the external form of these through-Penetration portion 116 can do different changes. Fig. 2 illustrates the schematic top plan view of the rigid base material of another embodiment of the present invention. Please refer to Fig. 2, in this embodiment, the external form of each through-Penetration portion 216 of rigid base material 210 is comparatively long and narrow rectangle. Therefore, the external form of the through-Penetration portion 116,216 of above-described embodiment is non-limiting the present invention in order to citing.
Then, please refer to Figure 1B, it is provided that at least one conductive bond layer 120. In the present embodiment, such as, provide two conductive bond layers 120. Each conductive bond layer 120 comprises conductive layer 122 and a dielectric knitting layer 124, and dielectric knitting layer 124 is configured on conductive layer 122. In the present embodiment, each conductive bond layer 120 is such as a back of the body glue Copper Foil, that is the conductive layer 122 of each conductive bond layer 120 is such as the copper foil layer of back of the body glue Copper Foil, and the dielectric knitting layer 124 of each conductive bond layer 120 is such as carrying on the back the resin layer of glue Copper Foil.
Then, please refer to Fig. 1 C, by each conductive bond layer 120 and corresponding rigid base material 110 pressing, make the part dielectric knitting layer 124 of each conductive bond layer 120 between the conductive layer 122 and corresponding rigid base material 110 of correspondence, and another part dielectric knitting layer 124 of each conductive bond layer 120 fills these through-Penetration portion 116 of corresponding rigid base material 110.
Then, please refer to Fig. 1 D, it is provided that a flexible circuit board 130 and at least one joint sheet 140. In the present embodiment, such as, provide two and engage sheet 140. Each engages sheet 140 taking characteristic such as no-flow underfill sheet (non-flowingprepreg) or low flowing film (low-flowprepreg), taking material such as resin film (resinprepreg) etc. Each engages sheet 140 has and at least one runs through district 142 (Fig. 1 D illustrate illustrate two), and each runs through the size in district 142 and to remove the area of district 118a rough identical the predetermined of correspondence.
Flexible circuit board 130 such as comprises soft dielectric layer 132, two line layer 133 and two soft protective layer (flexiblecoverlayer) 134. These line layers 133 are configured at the relative both sides of soft dielectric layer 132 respectively, and these soft protective layer 134 are configured at the relative both sides of soft dielectric layer 132 respectively and partly cover these line layers 133 respectively. Offer a piece of advice it; outside the part being positioned at the line layer 133 of the upside of soft dielectric layer 132 is exposed to the soft protective layer 134 of the upside being positioned at soft dielectric layer 132, and form so-called multiple golden finger contact (goldenfingercontact) 133a. Outside the part being positioned at the line layer 133 of the downside of soft dielectric layer 132 is exposed to the soft protective layer 134 of the downside being positioned at soft dielectric layer 132, and form so-called other multiple golden finger contact 133a. Should be noted that at this, in another embodiment, one of them of these soft protective layer 134 can cover corresponding line layer 133 completely, looks closely the demand of producer and determines.
In addition; in the present embodiment; the material of these soft dielectric layer 132 is such as polyimide resin (polyimide, PI) or epoxy resin, and the material of these soft protective layer 134 is such as polyimide resin collocation epoxy resin or other materials etc.
Then, please refer to Fig. 1 E, such as, by these joint sheets 140 by flexible circuit board 130 and these rigid base material 110 pressings so that each engages sheet 140 and is engaged between flexible circuit board 130 and corresponding rigid base material 110. Flexible circuit board 130 is the relative both sides of the rigid base material 110 being positioned at top with the conductive layer 122 of the conductive bond layer 120 of top, and flexible circuit board 130 is the relative both sides of the rigid base material 110 being positioned at lower section with the conductive layer 122 of the conductive bond layer 120 of lower section. In addition, these of joint sheet 140 of top run through district 142 and correspond respectively to that these of rigid base material 110 of top are predetermined removes district 118a, and these of the joint sheet 140 of lower section run through district 142 and correspond respectively to that these of rigid base material 110 of lower section are predetermined removes district 118a.
Then, please refer to Fig. 1 F, these conductive layers 122 being carried out these conductive bond layers 120 of patterning by photoetching and etching process are to form multiple line layer 122a. Then, the dielectric knitting layer 124 of each conductive bond layer 120 forms a welding resisting layer 150, to be covered at least partly on corresponding line layer 122a.
Then, please refer to Fig. 1 G, bend these rigid base materials 110, flexible circuit board 130 and these conductive bond layers 120 by benchmark of these through-Penetration portion 116. In detail, the predetermined reserved area 118b in the left side of the rigid base material in top 110 predetermined removes district 118a and bend at these through-Penetration portion 116 places (that is dotted arrow A 1 is referred to part) between the two relative to what be adjacent. The predetermined reserved area 118b in the left side of the rigid base material 110 in lower section relative to be adjacent predetermined remove district 118a and in these through-Penetration portion 116 places (that is dotted arrow A 2 is referred to part) bending between the two. Comprehensive speech, the predetermined reserved area 118b on the left of these makes a reservation for remove district 118a as benchmark relative to these being adjacent taking these through-Penetration portion 116 that dotted arrow A 1 and A2 refer to and bends up and down.
The predetermined reserved area 118b of the centre of the rigid base material 110 in top removes district 118a and bend at these through-Penetration portion 116 places (that is dotted arrow A 3 is referred to part) between the two relative to the predetermined of the left side being adjacent. The predetermined reserved area 118b of the centre of the rigid base material 110 in lower section removes district 118a and bend at these through-Penetration portion 116 places (that is dotted arrow A 4 is referred to part) between the two relative to the predetermined of the left side being adjacent. Combine speech, these through-Penetration portion 116 that the predetermined reserved area 118b in the middle of these refer to taking dotted arrow A 3 and A4 as benchmark relative to be adjacent these on the left of the predetermined district 118a that removes bend up and down.
The predetermined reserved area 118b of the centre of the rigid base material 110 in top removes district 118a and bend at these through-Penetration portion 116 places (that is dotted arrow A 5 is referred to part) between the two relative to the predetermined of the right side being adjacent. The predetermined reserved area 118b of the centre of the rigid base material 110 in lower section removes district 118a and bend at these through-Penetration portion 116 places (that is dotted arrow A 6 is referred to part) between the two relative to the predetermined of the right side being adjacent. Combine speech, these through-Penetration portion 116 that the predetermined reserved area 118b in the middle of these refer to taking dotted arrow A 5 and A6 as benchmark relative to be adjacent these on the right side of the predetermined district 118a that removes bend up and down.
The predetermined reserved area 118b on the right side of the rigid base material 110 in top relative to be adjacent predetermined remove district 118a and in these through-Penetration portion 116 places (that is dotted arrow A 7 is referred to part) bending between the two. The predetermined reserved area 118b on the right side of the rigid base material 110 in lower section relative to be adjacent predetermined remove district 118a and in these through-Penetration portion 116 places (that is dotted arrow A 8 is referred to part) bending between the two. Comprehensive speech, the predetermined reserved area 118b on the right side of these makes a reservation for remove district 118a as benchmark relative to these being adjacent taking these through-Penetration portion 116 that dotted arrow A 7 and A8 refer to and bends up and down.
Owing to the material of the dielectric knitting layer 124 filled in these through-Penetration portion 116 is more crisp compared to the material of rigid base material 110, so the crack produced after these bendings above-mentioned can be formed in through-Penetration portion 116 inside of correspondence respectively and extend through these outside dielectric knitting layers 124.
Then, please refer to Fig. 1 H, remove being positioned at these and predetermined removing parts of district 118a (visible Fig. 1 G) and the part making a reservation for remove district 118a (visible Fig. 1 G) corresponding to these of these conductive bond floor 120 of these rigid base materials 110, to form multiple depression 160 and expose portion flexible circuit board 130. In the present embodiment, the golden finger contact 133a of these flexible circuit boards 130 can be caved in by these and 150 is exposed to the outside.
Finally, please refer to Fig. 1 I, carry out singulation manufacture craft, to form multiple combined type circuit board 100. Should be noted that at this, so-called singulation manufacture craft, it is that the structure formed for Fig. 1 H carries out necessary sanction and cuts, to form multiple combined type circuit boards 100 of desired size.
One of them or other advantages that the making method of the combined type circuit board of the present invention at least has the following advantages:
(1) the present invention is by benchmark of these through-Penetration portion filled by dielectric knitting layer to bend rigid base material, flexible circuit board and conductive bond layer, and then remove rigid base material be positioned at the predetermined part removing district and conductive bond floor corresponding to the part making a reservation for remove district, to form depression. Therefore, the making method of the combined type circuit board of the present invention can't cause any unexpected destruction for flexible circuit board in the process forming depression so that utilizes the good rate of the combined type circuit board produced by making method of the combined type circuit board of the present invention higher.
(2) owing to first the conductive layer pattern on conductive bond layer can being turned to line layer before forming depression by the making method of the combined type circuit board of the present invention and forming the welding resisting layer of this line layer of protection, so follow-up formed depression can't affect the formation of above-mentioned patterning manufacture craft and welding resisting layer.
When not departing from the present invention's spirit or necessary characteristic, it is possible to other particular forms embody the present invention. Described specific embodiment each side only should be considered as illustrative and non-limiting. Therefore, the category of the present invention is as enclosed shown in claim but not shown in illustrating as previously. All drop on claim equivalent meaning and scope in change should be considered as dropping in the category of claim.
Claims (7)
1. a making method for combined type circuit board, comprising:
One rigid base material is provided, comprises rigid dielectric layer;
Forming multiple through-Penetration portion in this rigid dielectric layer, wherein those through-Penetration portion with a predetermined format permutation and run through this rigid dielectric layer so that this rigid base material is divided at least one making a reservation for and removed district and at least one predetermined reserved area according to the arrangement of those through-Penetration portion;
Thering is provided a conductive bond layer, comprise conductive layer and dielectric knitting layer, wherein this dielectric knitting layer is configured on this conductive layer;
By this conductive bond layer and this rigid base material pressing so that partly this dielectric knitting layer is between the rigid base material of this conductive layer and this, and this dielectric knitting layer of another part fills those through-Penetration portion;
By rigid to a flexible circuit board and this base material pressing so that this flexible circuit board is positioned at the relative both sides of this rigid base material with this conductive layer;
This conductive layer of patterning is to form a line layer;
This rigid base material, this flexible circuit board and this conductive bond layer is bent so that this predetermined reserved area is predetermined relative to this removes district and bend at those through-Penetration portion places by benchmark of those through-Penetration portion of filling by this dielectric knitting layer of another part; And
After the above step, remove being positioned at this and predetermined removing the part in district and the part making a reservation for remove district corresponding to this of this conductive bond floor of this rigid base material, to form a depression and this flexible circuit board of expose portion.
2. the making method of combined type circuit board as claimed in claim 1, before this rigid base material of bending, this flexible circuit board and this conductive bond layer, also comprises formation one welding resisting layer and is covered at least partly on this line layer.
3. the making method of combined type circuit board as claimed in claim 1, by the mode of rigid to this flexible circuit board and this base material pressing for by one engage sheet and by rigid to this flexible circuit board and this base material pressing, make this joint chip bonding between the rigid base material of this flexible circuit board and this, wherein this joint sheet has and at least one runs through district, and this runs through district and predetermined removes district corresponding to this.
4. the making method of combined type circuit board as claimed in claim 1, wherein those through-Penetration portion are that the mode by laser processing is formed.
5. the making method of combined type circuit board as claimed in claim 1, wherein those through-Penetration portion are formed by the mode of stamp or boring.
6. the making method of combined type circuit board as claimed in claim 1, wherein this conductive bond layer is a back of the body glue Copper Foil.
7. the making method of combined type circuit board as claimed in claim 1, wherein the material of this rigid dielectric layer comprises glass fibre and resin.
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CN201210147685.3A CN103384454B (en) | 2012-05-04 | 2012-05-04 | The making method of combined type circuit board |
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CN201210147685.3A CN103384454B (en) | 2012-05-04 | 2012-05-04 | The making method of combined type circuit board |
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CN103384454B true CN103384454B (en) | 2016-06-01 |
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Families Citing this family (3)
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CN106783795A (en) * | 2015-11-20 | 2017-05-31 | 恒劲科技股份有限公司 | Package substrate |
CN107278064B (en) * | 2017-08-09 | 2019-07-09 | 常熟东南相互电子有限公司 | The production method of flexible-rigid compound circuit board |
CN110944449A (en) * | 2019-12-26 | 2020-03-31 | 上海创功通讯技术有限公司 | Bendable multi-layer hard circuit board and manufacturing method thereof |
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CN1816258A (en) * | 2005-02-06 | 2006-08-09 | 华通电脑股份有限公司 | Method for making hard-soft composite circuit board |
CN201528472U (en) * | 2008-09-22 | 2010-07-14 | 博罗县精汇电子科技有限公司 | Rigid-flexible circuit board with bent area protected by copper foil |
CN101896037A (en) * | 2004-06-11 | 2010-11-24 | 揖斐电株式会社 | Rigid-flex wiring board and method for producing same |
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2012
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US5004639A (en) * | 1990-01-23 | 1991-04-02 | Sheldahl, Inc. | Rigid flex printed circuit configuration |
US5206463A (en) * | 1990-07-24 | 1993-04-27 | Miraco, Inc. | Combined rigid and flexible printed circuits and method of manufacture |
CN101896037A (en) * | 2004-06-11 | 2010-11-24 | 揖斐电株式会社 | Rigid-flex wiring board and method for producing same |
CN1816258A (en) * | 2005-02-06 | 2006-08-09 | 华通电脑股份有限公司 | Method for making hard-soft composite circuit board |
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