CN103593017A - Oil-cooling computer mainframe case - Google Patents
Oil-cooling computer mainframe case Download PDFInfo
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- CN103593017A CN103593017A CN201310521674.1A CN201310521674A CN103593017A CN 103593017 A CN103593017 A CN 103593017A CN 201310521674 A CN201310521674 A CN 201310521674A CN 103593017 A CN103593017 A CN 103593017A
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- oil
- heat
- mineral oil
- circulation line
- cooling computer
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Abstract
The invention discloses an oil-cooling computer mainframe case. The oil-cooling computer mainframe case is provided with a case body, a main board, a CPU (central processing unit) cooler, a display card and a memory. The case body is used for accommodating the mainframe case and on-board devices, the main board is fixed on one side of the case body, and the CPU cooler, the display card and the memory are fixed on the main board. The case body is internally filled with mineral oil which absorbs heat transmitted by the CPU cooler, the display card and the memory for cooling. An outer circulation pipeline is arranged at two ends of the case body and connected with an oil pump; under a running state, the mineral oil filled in the case body enters the outer circulation pipeline via the oil pump to circulate; a plurality of cooling fins are arranged on the outer surface of the outer circulation pipeline, and the heat flowing through the outer circulation pipeline is absorbed and cooled through the cooling fins. The problems that thermal damage is easy to cause to computer hardware which is large in heat generation is ingeniously solved by filling the mineral oil in the closed mainframe case to absorb the heat generated by the computer hardware; the oil-cooling computer mainframe case is mature in technology adopted, relatively low in cost and quite applicable to large-scale promotion and application.
Description
Technical field
The present invention relates to a kind of computer mainframe box, relate in particular to a kind of inner computer host box of filling cooling mineral oil.
Background technology
Computer hardware is observed Moore's Law, develop very rapidly, and update once every half a year, and hardware update has brought more powerful calculated performance, and the while has also brought more powerful heating property.Although wind-cooling heat dissipating technology and hardware processing procedure can solve the heat dissipation problem of considerable part now, still cannot tackle the thermal value of fever level hardware.
Common solution is to adopt water-filled radiator, but water-filled radiator is due to the chilled water conduction of inner loop, after leakage, can cause destructive strike to computer hardware, causes hardware large area to open circuit, and has very large potential safety hazard.
Mineral oil especially dimethyl silicon oil has good performance:
That thermotolerance, low temperature resistance, viscosity vary with temperature is little, water proofing property, surface tension are little, have thermal conductivity, and coefficient of heat conductivity is 0.134-0.159W/M*K
Methyl-silicone oil is No Poison, and light transmission is transmittance 100%
Methyl-silicone oil has good physical characteristics, can be directly used in damp proof insulation, damping, and damping, froth breaking, lubricated, the aspects such as polishing.
Methyl-silicone oil, except direct use, in order to make methyl-silicone oil scattered, is convenient to dipping, and spraying, raises the efficiency.Also can wiring solution-forming type, lipid, emulsion-type three types is used.
Dimethyl silicon oil is nonpoisonous and tasteless, has physiology inertia, good chemical stability, electrical insulating property and weatherability, hydrophobicity is good, and has very high anti-shear ability, can at-50 ℃～200 ℃, use for a long time.Be widely used as insulation lubricated, shockproof, grease proofing dirt, dielectric liquid and thermal barrier.And as froth breaking, release agent, paint and daily use chemicals product adjuvant.
Summary of the invention
The present invention is directed to the proposition of above problem, and a kind of oil cooling computer host box of development has: hold the casing that mainboard and plate carry equipment, be fixed on the mainboard of casing side plate, be fixed on cpu heat, video card and internal memory on mainboard;
Described box house is filled with mineral oil, and the heat that cpu heat, video card and internal memory distribute described in recovery by mineral oil dispels the heat.
The two ends of described casing are respectively equipped with external circulation line, and external circulation line is connected with oil pump; Under running status, the mineral oil that casing is filled enters external circulation line circulation through oil pump;
The outside surface of described external circulation line is provided with a plurality of heat radiator, and the heat of the mineral oil of the external circulation line of flowing through is absorbed and distributed by described a plurality of heat radiator.
Described external circulation line has water cold sleeve outward.
Described water cold sleeve has a plurality of interfaces.
Described casing one sidewall has the blind hole of holding mechanical hard disk, and the bottom of this blind hole has hard disk socket.
Described mineral oil is dimethyl silicon oil.
Owing to having adopted technique scheme, a kind of oil cooling computer host box provided by the invention, the heat sending by the mainframe box filling mineral oil calculation in absorption machine hardware airtight, solved cleverly computer hardware thermal value large, easily cause the problem of fire damage, the technology maturation adopting, cost is relatively cheap, is extremely suitable for promoting on a large scale and using.
Accompanying drawing explanation
Technical scheme for clearer explanation embodiments of the invention or prior art, by the accompanying drawing of required use in embodiment or description of the Prior Art being done to one, introduce simply below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is schematic diagram of the present invention
Fig. 2 is the vertical view of Fig. 1 of the present invention
Fig. 3 is inner structure vertical view of the present invention
Fig. 4 is vertical view of the present invention
Embodiment
For making object, technical scheme and the advantage of embodiments of the invention clearer, below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is known to complete description:
Mineral oil is full of whole airtight casing 6, and described each computer motherboard and assembly are immersed in mineral oil.The heat distributing is directly by recovery by mineral oil.
Further, in order to guarantee the uniform heat distribution of mineral oil inside, also there is external circulation line 4 and oil pump 3, drive mineral oil to circulate.Avoided because of mineral oil heat loss through convection characteristic poor, and the local oil overheating causing, thus affect the problem of hardware longevity.Meanwhile, also avoid mineral oil to be cited as long-time high-temperature heating and the slow rotten problem brought, extended the replacing serviceable life of mineral oil.
In order further to increase the heat dissipation effect of mineral oil, as an embodiment preferably, described external circulation line 4 is also provided with equally distributed heat radiator 41.The heat of mineral oil of external circulation line 4 of flowing through is absorbed and is distributed by described a plurality of heat radiator 41.The pipeline section that is provided with the external circulation line 4 of heat radiator 41 is metal section.
Further, in order to increase radiating effect, as an embodiment preferably, described external circulation line 4 also has water cold sleeve 5, the described heat radiator 41 of preferred water cold sleeve 5 parcel.
The two ends of described water cold sleeve 5 have joint 51, can external recirculated water sleeve pipes, strengthen cooling effect.
Consider, mechanical hard disk can not directly be immersed in oil, and solid state hard disc is now also universal, and pretending is a preferably embodiment, and the top board of described casing 6 has and holds 3.5 blind holes 15 of depositing hard disk, is provided with the socket of hard disk in the bottom of blind hole 15.
Preferably, the dimethyl silicon oil that the mineral oil that the present invention adopts is stable in properties.
The above; it is only preferably embodiment of the present invention; but protection scope of the present invention is not limited to this; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; according to technical scheme of the present invention and inventive concept thereof, be equal to replacement or changed, within all should being encompassed in protection scope of the present invention.
Claims (6)
1. an oil cooling computer host box, has: hold the airtight casing (6) that mainboard and plate carry equipment, be fixed on the mainboard (1) of casing side plate, be fixed on cpu heat (12), video card (13) and internal memory (11) on mainboard (1);
Described casing (6) inside is filled with mineral oil, and the heat that cpu heat (12), video card (13) and internal memory (11) distribute described in recovery by mineral oil dispels the heat.
2. a kind of oil cooling computer host box according to claim 1, is further characterized in that: the two ends of described casing (6) are respectively equipped with external circulation line (4), and external circulation line (4) is connected with oil pump (3); Under running status, the mineral oil that casing (6) is filled enters external circulation line (4) circulation through oil pump (3);
The outside surface of described external circulation line (4) is provided with a plurality of heat radiator (41), and the heat of the mineral oil of the external circulation line of flowing through (4) is absorbed and distributed by described a plurality of heat radiator (41).
3. a kind of oil cooling computer host box according to claim 2, is further characterized in that: outside described external circulation line (4), have water cold sleeve (5).
4. a kind of oil cooling computer host box according to claim 3, is further characterized in that: described water cold sleeve (5) has a plurality of interfaces (51).
5. a kind of oil cooling computer host box according to claim 1, is further characterized in that: described casing (6) one sidewalls have the blind hole (15) of holding mechanical hard disk, and the bottom of this blind hole has hard disk socket.
6. a kind of oil cooling computer host box according to claim 1, is further characterized in that: described mineral oil is dimethyl silicon oil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310521674.1A CN103593017A (en) | 2013-10-29 | 2013-10-29 | Oil-cooling computer mainframe case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310521674.1A CN103593017A (en) | 2013-10-29 | 2013-10-29 | Oil-cooling computer mainframe case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103593017A true CN103593017A (en) | 2014-02-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310521674.1A Pending CN103593017A (en) | 2013-10-29 | 2013-10-29 | Oil-cooling computer mainframe case |
Country Status (1)
| Country | Link |
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| CN (1) | CN103593017A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104216492A (en) * | 2014-09-29 | 2014-12-17 | 上海交通大学 | Liquid-state cooling immersion type structure heat dissipation system for computer chip |
| CN105116976A (en) * | 2015-09-13 | 2015-12-02 | 张雅男 | Noise-free oil cooling computer case |
| CN106445037A (en) * | 2016-11-29 | 2017-02-22 | 广东合新材料研究院有限公司 | Partial immersion type liquid cooling server cooling system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
| CN2914327Y (en) * | 2006-06-15 | 2007-06-20 | 讯凯国际股份有限公司 | North and south bridge chip water-cooling heat-dissipation structure |
| CN101018471A (en) * | 2007-03-05 | 2007-08-15 | 方志宏 | No-noise liquid cooling method |
-
2013
- 2013-10-29 CN CN201310521674.1A patent/CN103593017A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
| CN2914327Y (en) * | 2006-06-15 | 2007-06-20 | 讯凯国际股份有限公司 | North and south bridge chip water-cooling heat-dissipation structure |
| CN101018471A (en) * | 2007-03-05 | 2007-08-15 | 方志宏 | No-noise liquid cooling method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104216492A (en) * | 2014-09-29 | 2014-12-17 | 上海交通大学 | Liquid-state cooling immersion type structure heat dissipation system for computer chip |
| CN104216492B (en) * | 2014-09-29 | 2018-03-06 | 上海交通大学 | A kind of computer chip liquid cooled immersion structure cooling system |
| CN105116976A (en) * | 2015-09-13 | 2015-12-02 | 张雅男 | Noise-free oil cooling computer case |
| CN106445037A (en) * | 2016-11-29 | 2017-02-22 | 广东合新材料研究院有限公司 | Partial immersion type liquid cooling server cooling system |
| CN106445037B (en) * | 2016-11-29 | 2023-10-24 | 广东西江数据科技有限公司 | Partial immersion type liquid cooling server cooling system |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140219 |
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| RJ01 | Rejection of invention patent application after publication |