CN103813656A - Circuit board capable of bearing large currents and processing method thereof - Google Patents
Circuit board capable of bearing large currents and processing method thereof Download PDFInfo
- Publication number
- CN103813656A CN103813656A CN201210460009.1A CN201210460009A CN103813656A CN 103813656 A CN103813656 A CN 103813656A CN 201210460009 A CN201210460009 A CN 201210460009A CN 103813656 A CN103813656 A CN 103813656A
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- core material
- groove
- circuit board
- prepreg
- copper billet
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Abstract
The invention discloses a method for manufacturing a circuit board capable of bearing large currents. The method comprises the following steps: manufacturing fine lines in a signal region of a core material, and manufacturing grooves in a current region of the core material; electroplating the grooves to form copper blocks for filling in the grooves, wherein the copper blocks are used for bearing the large currents; pressing and fitting a half curing lamella on the core material. The embodiment of the invention also provides the corresponding circuit board. Through the adoption of the technical scheme of the invention, the circuit board itself can bear the large currents and the signals at the same time, the design can reduce the occupation for assembly space, the circuit board is simple to assemble, the reliability of the circuit board is high, and the cost of the circuit board is also reduced; in addition, the copper blocks for bearing the large currents are directly formed by electroplating, bonding strength between the copper blocks and the core material is larger, the core material is not easy to crack or layer, and the reliability of the core material is high; the height of the copper blocks formed by electroplating can be controlled, and bearing the large currents of different specifications is realized.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of circuit board and processing method thereof that can bearing great current.
Background technology
Current circuit board can carry little electric current and signal simultaneously, still, just helpless for the large electric current that is greater than 5A, and this is because large electric current needs the copper face of larger sectional area.Need the product of while bearing great current and signal for high-power power amplifier plate, automotive electronics circuit board etc., in prior art, conventionally adopt the mode that large electric current and signal are separated to realize, for example, the pilot wire that adheres to certain diameter at circuit board surface carrys out bearing great current.This mode that large electric current and signal are separated can take larger assembly space, and assembling is complicated, and reliability is not high yet.
Summary of the invention
The embodiment of the present invention provides a kind of circuit board and processing side thereof that can bearing great current, can take larger assembly space to solve prior art, and assembling is complicated, also not high technical problem of reliability.
A manufacture method for circuit board that can bearing great current, comprising: make fine and closely woven circuit in the signaling zone of core material, make groove in the Current Zone of core material; Described groove is electroplated, formed and fill up the copper billet of described groove, this copper billet is used for bearing great current; Pressing layer of prepreg on institute's core material.
A kind of circuit board that can bearing great current, comprise: core material, be pressed together on the layer of prepreg on core material, the signaling zone of described core material is manufactured with fine and closely woven circuit, Current Zone is manufactured with groove, in described groove, have to electroplate and form, fill up the copper billet of described groove, this copper billet is used for bearing great current.
The embodiment of the present invention adopts in the Current Zone of core material and makes groove, groove is electroplated and formed the technical scheme of copper billet of filling up described groove, being used for bearing great current, make circuit board bearing great current and signal simultaneously itself, this kind of design can reduce taking assembly space, assembling is simple, reliability is high, and cost is low, and, the copper billet of bearing great current directly forms by electroplating, with core material bond strength larger, be difficult for splitting or layering, reliability is high; And can control the height of electroplating the copper billet forming, realize the carrying to the large electric current of different size.
Accompanying drawing explanation
Fig. 1 be the embodiment of the present invention can bearing great current the flow chart of manufacture method of circuit board;
Fig. 2-7th, the schematic diagram of the circuit board of each step in the employing embodiment of the present invention method course of processing.
Embodiment
The embodiment of the present invention provides a kind of manufacture method of circuit board that can bearing great current, can solve prior art and can take larger assembly space, and assembling is complicated, also not high technical problem of reliability.The embodiment of the present invention also provides corresponding circuit board.Below be elaborated respectively.
Embodiment mono-,
Please refer to Fig. 1, the embodiment of the present invention provides a kind of manufacture method of circuit board that can bearing great current, comprising:
110, make fine and closely woven circuit in the signaling zone of core material, make groove in the Current Zone of core material.
The core material that the embodiment of the present invention adopts can be double face copper, as shown in Figures 2 and 3, is designed with the Current Zone that exceedes the large electric current of 5 amperes (A) for carrying on this core material 200, beyond Current Zone, is the signaling zone for carrying signal.Described signaling zone is manufactured with fine and closely woven circuit 201, and described Current Zone is manufactured with groove 202.This groove 202 is for copper mold piece that can bearing great current in follow-up embedding.The copper mold piece to be embedded of the shape and size basis of groove 202 determines, optional, large 0.025 to 1 millimeter of the length of side corresponding to the side ratio copper mold piece of groove 202.
120, described groove is electroplated, formed and fill up the copper billet of described groove, this copper billet is used for bearing great current.
In this step, utilize electroplating technology to form to be used for the copper billet of bearing great current in groove.Please refer to Fig. 4, its detailed process can be as described below:
First the region printing one deck resin except groove 202 curing on core material 200 surfaces.The thickness of this layer of resin can be between 10-35um.
Then groove 202 is carried out to holeization and electroplate, form and cover the inwall of groove 202 and the coating of bottom.
Then described groove 202 is carried out to graphic plating to add thickness coating, until fill up described groove 202, form the copper billet 204 that fills up described groove.When graphic plating, can utilize dry film to cover groove 202 region in addition, only groove 202 be electroplated.
Finally, can carry out alkaline etching to remove one deck resin of printing.
Through above-mentioned steps, can produce the upper surface copper billet concordant with core material.
In other execution mode, after groove 202 is filled up in plating, can also continue to electroplate, make the height of the copper billet forming exceed the degree of depth of groove 202, protrude from core material 200 surfaces, to can carry larger electric current.
130, pressing layer of prepreg on institute's core material.
As shown in Figure 5, in this step on core material pressing layer of prepreg 205.In concrete application, before pressing, can also carry out brown processing to core material.This layer of prepreg 205 can comprise one deck or multilayer prepreg, and the concrete number of plies determines according to actual needs.
Protrude from core material 200 surfaces if electroplate the copper billet 204 forming, in layer of prepreg 205, accommodating groove need to be offered in the position corresponding to core material Current Zone, size, shape and the degree of depth and the copper mold piece 204 of this accommodating groove match, so that in the time of pressing, the upper end of copper mold piece 204 is received wherein.
In concrete application, after 130, can also comprise:
As shown in Figure 6, pressing outer copper foil 206 in described layer of prepreg 205 is drilled with the blind hole 207 that arrives at described copper billet 204 on layer of prepreg 205 and outer copper foil 206, and described blind hole 207 is electroplated.This blind hole 207 can be used as large electric current and imports and leading-out terminal.
As shown in 7, on outer copper foil 206, make outer-layer circuit.
And, other processing steps such as solder mask are set.
To sum up, the embodiment of the present invention provides a kind of manufacture method of circuit board that can bearing great current, and the method adopts in the Current Zone of core material and makes groove, and groove is electroplated and formed the technical scheme of copper billet of filling up described groove, being used for bearing great current.The circuit board that the present embodiment method is made is bearing great current and signal simultaneously, thereby can reduce the taking of assembly space, and the form, fit, and function that is conducive to other module discharges; And, the copper billet of bearing great current directly by electroplate form, with core material bond strength larger, be difficult for splitting or layering, reliability is high; And can control the height of electroplating the copper billet forming, realize the carrying to the large electric current of different size.It is simple that the circuit board that the present embodiment method is made also has assembling, and efficiency of assembling is high, the beneficial effect that cost is low.
Embodiment bis-,
Please refer to Fig. 5, the embodiment of the present invention also provides a kind of circuit board that can bearing great current, this circuit board comprises: core material 200, be pressed together on the layer of prepreg 205 on core material, the signaling zone of described core material 200 is manufactured with fine and closely woven circuit 201, and Current Zone is manufactured with groove 202, in described groove 202, have electroplate form, fill up the copper billet 204 of described groove, this copper billet 204 is used for bearing great current.
Optionally, the height of electroplating the described copper billet 204 forming exceedes the degree of depth of described groove 202, protrude from the surface of described core material 200, in described layer of prepreg 205, offer the accommodating groove of the upper end for holding described copper billet corresponding to the position of described Current Zone.
Optionally, as shown in Figure 6 and Figure 7, in described outer copper foil 206 and layer of prepreg 205, be drilled with the plating blind hole 207 that arrives at described copper mold piece.
To sum up, the embodiment of the present invention provides a kind of circuit board that can bearing great current, on the core material of this circuit board, is manufactured with groove, has and electroplate filling up described groove, being used for the copper billet of bearing great current of forming in groove.This circuit board is bearing great current and signal simultaneously, can reduce the taking of assembly space, and the form, fit, and function that is conducive to other module discharges; This circuit board reliability is high, and assembling is simple, and efficiency of assembling is high, and cost is low; In this circuit board the copper billet of bearing great current directly by electroplate form, with core material bond strength larger, be difficult for splitting or layering, reliability is high; And can control the height of electroplating the copper billet forming, realize the carrying to the large electric current of different size.
Above the embodiment of the present invention is provided can bearing great current circuit board and preparation method thereof be described in detail, but the explanation of above embodiment is just understood method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.In the technical scope that those skilled in the art disclose in the present invention, the variation that can expect easily or replacement, within all should being encompassed in protection scope of the present invention.
Claims (8)
1. a manufacture method for circuit board that can bearing great current, is characterized in that, comprising:
Make fine and closely woven circuit in the signaling zone of core material, make groove in the Current Zone of core material;
Described groove is electroplated, formed and fill up the copper billet of described groove, this copper billet is used for bearing great current;
Pressing layer of prepreg on institute's core material.
2. method according to claim 1, is characterized in that, described groove is electroplated, and the copper billet that described groove is filled up in formation comprises:
Region printing one deck resin on described core material surface except described groove also solidifies;
Described groove is carried out to holeization and electroplate, form the coating that covers described groove inwall and bottom;
Described groove is carried out to graphic plating to add thickness coating, until fill up described groove, form copper billet.
3. method according to claim 2, is characterized in that:
Described groove is carried out to graphic plating, to add thickness coating, until also comprise after filling up described groove:
Continue described groove to carry out graphic plating, make the height of copper billet forming exceed the degree of depth of groove, protrude from the surface of core material;
On institute's core material, pressing layer of prepreg comprises:
In described layer of prepreg, offer the accommodating groove of the upper end for holding described copper billet corresponding to the position of described Current Zone, the described layer of prepreg of having offered holding tank is pressed together on described core material.
4. method according to claim 1, is characterized in that, also comprises:
Pressing outer copper foil in described layer of prepreg is drilled with the blind hole that arrives at described copper mold piece in described outer copper foil and layer of prepreg, and described blind hole is electroplated.
5. method according to claim 1, is characterized in that, also comprises:
On described outer copper foil, make outer circuit.
One kind can bearing great current circuit board, it is characterized in that, comprise: core material, be pressed together on the layer of prepreg on core material, the signaling zone of described core material is manufactured with fine and closely woven circuit, and Current Zone is manufactured with groove, in described groove, have electroplate form, fill up the copper billet of described groove, this copper billet is used for bearing great current.
7. circuit board according to claim 6, is characterized in that:
The height of electroplating the described copper billet forming exceedes the degree of depth of described groove, protrudes from the surface of described core material, offers the accommodating groove of the upper end for holding described copper billet in described layer of prepreg corresponding to the position of described Current Zone.
8. circuit board according to claim 6, is characterized in that, also comprises: be pressed together on the Copper Foil in described layer of prepreg, be drilled with the plating blind hole that arrives at described copper billet in described outer copper foil and layer of prepreg.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210460009.1A CN103813656A (en) | 2012-11-15 | 2012-11-15 | Circuit board capable of bearing large currents and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210460009.1A CN103813656A (en) | 2012-11-15 | 2012-11-15 | Circuit board capable of bearing large currents and processing method thereof |
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| Publication Number | Publication Date |
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| CN103813656A true CN103813656A (en) | 2014-05-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210460009.1A Pending CN103813656A (en) | 2012-11-15 | 2012-11-15 | Circuit board capable of bearing large currents and processing method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517317A (en) * | 2014-09-22 | 2016-04-20 | 深南电路有限公司 | Circuit board manufacturing method and circuit board |
| CN107484360A (en) * | 2017-08-25 | 2017-12-15 | 维沃移动通信有限公司 | A kind of preparation method of printed circuit board (PCB), printed circuit board (PCB) and mobile terminal |
| CN107548238A (en) * | 2017-08-25 | 2018-01-05 | 维沃移动通信有限公司 | A kind of preparation method of printed circuit board (PCB), printed circuit board (PCB) and mobile terminal |
| CN111642070A (en) * | 2020-06-30 | 2020-09-08 | 新华三技术有限公司 | Circuit board and preparation process thereof |
| CN114928961A (en) * | 2022-05-20 | 2022-08-19 | 重庆方正高密电子有限公司 | Preparation method of PCB and PCB |
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| US20060057341A1 (en) * | 2004-09-16 | 2006-03-16 | Tdk Corporation | Multilayer substrate and manufacturing method thereof |
| CN102138368A (en) * | 2008-08-29 | 2011-07-27 | 住友电木株式会社 | Printed wiring board and method of manufacturing printed wiring board |
| TW201146113A (en) * | 2009-10-30 | 2011-12-16 | Panasonic Elec Works Co Ltd | Circuit board and manufacturing method thereof |
| CN102711377A (en) * | 2012-05-09 | 2012-10-03 | 敬鹏(常熟)电子有限公司 | Circuit board for transmitting high current |
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2012
- 2012-11-15 CN CN201210460009.1A patent/CN103813656A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060057341A1 (en) * | 2004-09-16 | 2006-03-16 | Tdk Corporation | Multilayer substrate and manufacturing method thereof |
| CN102138368A (en) * | 2008-08-29 | 2011-07-27 | 住友电木株式会社 | Printed wiring board and method of manufacturing printed wiring board |
| TW201146113A (en) * | 2009-10-30 | 2011-12-16 | Panasonic Elec Works Co Ltd | Circuit board and manufacturing method thereof |
| CN102711377A (en) * | 2012-05-09 | 2012-10-03 | 敬鹏(常熟)电子有限公司 | Circuit board for transmitting high current |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517317A (en) * | 2014-09-22 | 2016-04-20 | 深南电路有限公司 | Circuit board manufacturing method and circuit board |
| CN107484360A (en) * | 2017-08-25 | 2017-12-15 | 维沃移动通信有限公司 | A kind of preparation method of printed circuit board (PCB), printed circuit board (PCB) and mobile terminal |
| CN107548238A (en) * | 2017-08-25 | 2018-01-05 | 维沃移动通信有限公司 | A kind of preparation method of printed circuit board (PCB), printed circuit board (PCB) and mobile terminal |
| CN107484360B (en) * | 2017-08-25 | 2020-03-06 | 维沃移动通信有限公司 | Manufacturing method of printed circuit board, printed circuit board and mobile terminal |
| CN107548238B (en) * | 2017-08-25 | 2020-05-05 | 维沃移动通信有限公司 | Manufacturing method of printed circuit board, printed circuit board and mobile terminal |
| CN111642070A (en) * | 2020-06-30 | 2020-09-08 | 新华三技术有限公司 | Circuit board and preparation process thereof |
| CN111642070B (en) * | 2020-06-30 | 2023-12-26 | 新华三技术有限公司 | Circuit board and preparation process thereof |
| CN114928961A (en) * | 2022-05-20 | 2022-08-19 | 重庆方正高密电子有限公司 | Preparation method of PCB and PCB |
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Application publication date: 20140521 |
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