CN104044320B - A kind of organic transparency carrier and manufacture method thereof - Google Patents

A kind of organic transparency carrier and manufacture method thereof Download PDF

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Publication number
CN104044320B
CN104044320B CN201410293707.6A CN201410293707A CN104044320B CN 104044320 B CN104044320 B CN 104044320B CN 201410293707 A CN201410293707 A CN 201410293707A CN 104044320 B CN104044320 B CN 104044320B
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inorganic oxide
organic
transparency carrier
organic resin
resin layer
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CN104044320A (en
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黄键全
张晏玮
邱登甲
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Shenzhen Haoyi quantum R & D Co.,Ltd.
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黄键全
张晏玮
邱登甲
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Abstract

The present invention relates to a kind of organic transparency carrier and manufacture method thereof, belong to the technical field of transparent substrate, which solve that existing organic resin substrate exists poor to the barrier property of oxygen and steam, in hot and humid environment, easily occur that deformation, static content are strong, the problem of superficial film poor adhesive force and inorganic oxide and the difficult problem combined of organic resin substrate.This organic transparency carrier comprises organic resin layer, and the two sides of described organic resin layer is attached with inorganic oxide rete.The manufacture method of this organic transparency carrier comprises the following steps: (1) dip-coating; (2) solidify.The method obtaining organic transparency carrier in the present invention is simple to operate, in conjunction with effective, the organic transparency carrier obtained shape stability, case hardness, optical property, weather resistance, resistance to impact, heat resistance and energy saving in hot and humid environment are excellent, water absorption rate is low and easily do the transparent substrate of secondary surface treatment, can widely use.

Description

A kind of organic transparency carrier and manufacture method thereof
Technical field
The present invention relates to the technical field of transparent substrate, be specifically related to a kind of organic transparency carrier and manufacture method thereof.
Background technology
Organic resin laminated plate is excellent in the transparency, lightweight, processability and mechanical strength, be widely used in electronic unit, building materials parts, automobile component etc., but its case hardness is not enough easily to be scratched, and polycarbonate resin (PC) anti-ultraviolet weatherability is poor, when using out of doors, easily there is the deteriorations such as xanthochromia.So need to do relevant coating process on the surface of organic resin laminated plate, but the water absorption character of each layer resin and the heat resistance difference of glass transition temperature representative in organic resin laminated plate, very large warpage can be produced, and can with the splitting of the face coat of cure process, antireflection process, antifouling process, non-glare treated or conductive processing etc., form problem according to using method.
Organic resin substrate has three shortcomings: one is poor to the barrier property of oxygen, steam; Two is non-refractories; Three is that static content is too strong.So the adhesion of organic resin substrate surface and types of functionality rete is poor, in order to solve this problem, need to process organic resin substrate surface.Surface treatment method best at present adheres to inorganic oxide on organic resin substrate, can the adhesion of the case hardness of disposable raising organic resin substrate, light transmission rate, weatherability and other functional film layer.
On the other hand, if can by inorganic oxide (especially silica, titanium dioxide, the inorganic oxide such as zirconium dioxide and aluminium oxide) for organic resin laminated plate surface, its intensity can be improved, impact flexibility, wearability, light transmission, uvioresistant, anti-aging, heat resistance and the performance such as energy-conservation, and the oozing property of resistance of inorganic oxide is very excellent, coating is very thin, so surface band has, the organic resin laminated plate water absorption rate of inorganic oxide film layer is lower more easily does secondary surface treatment, such as antifouling process, conductive processing etc., but inorganic oxide differs very large with the fusing point of resin plate, very large in conjunction with difficulty, although can be bonded together with the glass substrate of inorganic oxide protective film and resin plate with bonding agent, but thickness and weight can increase further, cannot widely use.
Summary of the invention
In order to overcome the deficiencies in the prior art, one object of the present invention is to provide a kind of organic transparency carrier, which solve that prior art exists poor to the barrier property of oxygen and steam, in hot and humid environment, easily there is deformation, static content by force and the problem of superficial film poor adhesive force.
Another object of the present invention is the manufacture method providing a kind of organic transparency carrier, which solves inorganic oxide and the difficult problem combined of organic resin substrate of prior art existence.
For solving above-mentioned first problem, the technical solution adopted in the present invention is as follows:
A kind of organic transparency carrier, comprise organic resin layer, the positive and negative of described organic resin layer is all attached with inorganic oxide rete.
Preferably, described inorganic oxide rete mainly comprise inorganic oxide, described inorganic oxide is one or more in silica, titanium dioxide, zirconium dioxide and aluminium oxide.The Main Function of inorganic oxide is formed to intercept rete on organic resin substrate, promotes the case hardness of organic resin substrate, optical property, weatherability, heat resistance, reduction water absorption rate, energy-conservation and be easy to the performances such as secondary surface treatment.
Preferably, described organic resin layer is PMMA layer, PC layer, the laminated body of PMMA and PC or the laminated body at the equal composite joint PMMA of the positive and negative of PC.Wherein, PMMA and acrylics, PC and polycarbonate resin.
Preferably, when organic resin layer is the laminated body of PMMA and PC or when the laminated body of the equal composite joint PMMA of the positive and negative of PC, the thickness of described PC layer is 0.1mm-2.5mm; The thickness of described PMMA layer is 0.1mm-1.0mm; The thickness of described inorganic oxide protective film is 10nm-1000nm.If the thickness of PC layer is lower than 0.1mm, then can there is the situation of partially soft rigidity deficiency; If more than 2.5mm, then there is the situation that aetiolation difficulty controls and hardness declines.If the thickness of PMMA layer is lower than 0.1mm, there is the situation of case hardness, marresistance and weatherability deficiency; If more than 1.0mm, then there is the situation of resistance to impact deficiency.If the thickness of inorganic oxide protective film is lower than 10nm, the situation of barrier, case hardness, marresistance and weatherability deficiency can be there is; Its thickness is at below 1000nm, and not good or that outward appearance is the not good situation of shaping rear optical effect occurs less.
Preferably, the thickness of described organic transparency carrier is 0.3-3.0mm.The thickness of organic transparency carrier, at more than 0.3mm, can reduce the generation of the situation that transfer printing is not good or thickness and precision is not good, and in addition, its thickness at below 3.0mm, then decreases the generation of the situation that lightweight is not good or thickness and precision is not good.
For solving above-mentioned Second Problem, the technical solution adopted in the present invention is as follows:
Manufacture a method for organic transparency carrier as claimed in claim 1, it comprises the following steps:
(1) dip-coating (dip-coating); (2) solidify.
Described step (1) is all put in inorganic oxide solution by organic resin layer to soak, and described inorganic oxide solution comprises the composition of following mass percentage content:
Inorganic oxide: 0.1%-15%;
Adjusting agent: surplus;
Described inorganic oxide is one or more in silica, titanium dioxide, zirconium dioxide or aluminium oxide.Described adjusting agent is alcohols, ketone and lipoid substance, and the Main Function of adjusting agent is improve the surface uniformity of inorganic oxide on organic resin plate and the workability etc. of raising inorganic oxide protective film.The Main Function of this step, for form inorganic matter rete on organic resin substrate, promotes the case hardness of organic resin substrate, optical property, weatherability, heat resistance, reduction water absorption rate, energy-conservation and be easy to the performances such as secondary surface treatment.
Described step (2) is taken out from inorganic oxide solution by organic resin substrate, the inorganic oxide protective film on its surface is cured.
Preferably, the content of described inorganic oxide is 0.5%-10%; The soaking temperature of described step (1) is 10 DEG C-40 DEG C, and soak time is 1min-15min; The solidification temperature of described step (2) is 60 DEG C-100 DEG C, and hardening time is 15min-120min.
Preferably, described inorganic oxide solution also comprises interfacial agent, and its main component is organic compound, and especially have organic amphiprotic molecule that is hydrophilic and hydrophobic grouping, the content of described interfacial agent is 1%-10%.The Main Function of interfacial agent reduces the surface tension between liquid and solid, makes inorganic oxide composition can be attached to organic resin plate well first-class.
Preferably, the content of described interfacial agent is 1%-5%.
Preferably, the soaking temperature of described step (1) is 15 DEG C-35 DEG C, and soak time is 1min-10min; The solidification temperature of described step (2) is 70 DEG C-90 DEG C, and hardening time is 30min-100min.
Compared to existing technology, beneficial effect of the present invention is:
The present invention is by adhering to inorganic oxide on the two sides of organic resin layer; this organic transparency carrier has interlaminar adhesion; can be provided in that shape stability in hot and humid environment, case hardness, optical property, weather resistance, resistance to impact, heat resistance and energy saving are excellent, water absorption rate is low and easily do the transparent substrate of secondary surface treatment, this substrate can use as transparent substrate material, transparent protective material.Specifically, be applicable to portable telephone terminal, OA machine, Portable electronic game machine, portable data assistance, mobile PC etc. portable display, notebook type PC, Desktop PC LCD monitor, liquid crystal display etc. escope etc. is set.
In organic transparency carrier of the present invention, any one in antireflection process, antifouling process, antistatic treatment, weatherability treatment and non-glare treated can be implemented in one face or two faces.The method of antireflection process, antifouling process, antistatic treatment, weatherability treatment and non-glare treated is not particularly limited, and can use known method.Such as, coating reflection reduces method, the method for evaporation dielectric substance film, the method etc. of coating antistatic coating of coating.The method of most secondary surface treatment can be applicable to.
Organic transparency carrier is obtained by method of the present invention; without the need to inorganic oxide protective film and organic resin layer being bonded with adhesive; only organic resin layer need be placed in inorganic oxide solution and carry out dip-coating (dip-coating) and solidify again; simple to operate; the organic transparency carrier obtained by the method in conjunction with effective; the increase of its thickness and weight is less, meets widely used requirement.
The partial test of the organic transparency carrier obtained by method of the present invention is carried out as follows:
One, pencil scratch hardness test
Take JISK5600-5-4 as benchmark, be 45 degree relative to the angle on surface, load 750g to the surface of plexiglass layer increase gradually hardness pressing pencil, the hardest pencil hardness not producing scar is evaluated as pencil hardness.For having carried out the hard test film being coated with process, more than pencil hardness 3H has been qualified.
Two, total light transmittance measures
Use the total light transmittance of color, turbidity Simultaneously test device COH400 (Japanese electricity Se industrial group manufactures) determination test sheet.It is qualified to be designated as by the test film of total light transmittance more than 90%.
Detailed description of the invention
A kind of organic transparency carrier, comprises organic resin layer, is all attached with inorganic oxide rete at the positive and negative of organic resin layer.Inorganic oxide rete mainly comprise inorganic oxide, inorganic oxide is one or more in silica, titanium dioxide, zirconium dioxide and aluminium oxide.And organic resin layer is PMMA layer, PC layer, the laminated body of PMMA and PC or the laminated body at the equal composite joint PMMA of the positive and negative of PC.When organic resin layer is the laminated body of PMMA and PC or when the laminated body of the equal composite joint PMMA of the positive and negative of PC, the thickness of PC layer is the thickness of 0.1mm-2.5mm, PMMA layer is 0.1mm-1.0mm, and the thickness of inorganic oxide protective film is 10nm-1000nm.The thickness of organic transparency carrier is 0.3-3.0mm.
Manufacture a method for organic transparency carrier, it comprises the following steps: (1) dip-coating; (2) solidify.Step (1) is put in inorganic oxide solution by organic resin layer to soak, and inorganic oxide solution comprises the composition of following mass percentage content: the inorganic oxide of 0.1%-15%; Surplus is adjusting agent.Inorganic oxide is one or more in silica, titanium dioxide, zirconium dioxide or aluminium oxide.Adjusting agent is then alcohols, ketone and lipoid substance.In this step, the content of inorganic oxide is preferably 0.5%-10%.The soaking temperature of step (1) is 10 DEG C-40 DEG C, and soak time is 1min-15min.The soaking temperature of step (1) is preferably 15 DEG C-35 DEG C, and soak time is preferably 1min-10min.Step (2) is taken out from inorganic oxide solution by organic resin substrate, the inorganic oxide protective film on its surface is cured.The solidification temperature of this step is 60 DEG C-100 DEG C, and hardening time is 15min-120min.Solidification temperature is preferably 70 DEG C-90 DEG C, and hardening time is preferably 30min-100min.In addition, as preferred embodiment, inorganic oxide solution also comprises interfacial agent, its main component is organic compound, and especially have organic amphiprotic molecule that is hydrophilic and hydrophobic grouping, the content of interfacial agent is 1%-10%, preferably, the content of this interfacial agent is 1%-5%.
Below in conjunction with detailed description of the invention, the present invention is described in further detail.
Embodiment one
Step (1), PC organic resin layer is put in inorganic oxide solution and soaks, wherein, inorganic oxide solution comprises the silica of 0.1% mass percent, the interfacial agent of 1% mass percent and 98.9% mass percent adjusting agent, soaking temperature is 10 DEG C, and soak time is 15 minutes.
Step (2), takes out the organic resin layer soaked, solidifies 15 minutes, thus obtain organic transparency carrier of the inorganic oxide rete being attached with sclerosis on the two sides of PC organic resin layer under the environment of 100 DEG C.
Embodiment two
Step (1), PMMA organic resin layer is put in inorganic oxide solution and soaks, wherein, inorganic oxide solution comprises the silica of 0.5% mass percent and titanium dioxide, the interfacial agent of 2% mass percent and 97.5% mass percent adjusting agent, soaking temperature is 15 DEG C, and soak time is 13 minutes.
Step (2), takes out the organic resin layer soaked, solidifies 20 minutes, thus obtain organic transparency carrier of the inorganic oxide rete being attached with sclerosis on the two sides of PMMA organic resin layer under the environment of 95 DEG C.
Embodiment three
Step (1), soak being put in inorganic oxide solution in the organic resin laminated body of the equal composite joint PMMA of PC positive and negative, wherein, inorganic oxide solution comprises the silica of 1% mass percent, titanium dioxide and zirconium dioxide, the interfacial agent of 3% mass percent and 96% mass percent adjusting agent, soaking temperature is 20 DEG C, and soak time is 11 minutes.
Step (2), takes out the organic resin layer soaked, solidifies 40 minutes, thus obtain organic transparency carrier of the inorganic oxide rete being attached with sclerosis on the two sides of organic resin layer under the environment of 90 DEG C.
Embodiment four
Step (1), soak being put in inorganic oxide solution in the organic resin laminated body of PMMA and PC lamination, wherein, inorganic oxide solution comprises the silica of 5% mass percent, titanium dioxide, zirconium dioxide and aluminium oxide, the interfacial agent of 4% mass percent and 91% mass percent adjusting agent, soaking temperature is 25 DEG C, and soak time is 9 minutes.
Step (2), takes out the organic resin layer soaked, solidifies 50 minutes, thus obtain organic transparency carrier of the inorganic oxide rete being attached with sclerosis on the two sides of the organic resin layer of PMMA and PC lamination under the environment of 85 DEG C.
Embodiment five
Step (1), soak being put in inorganic oxide solution in the organic resin laminated body of the equal composite joint PMMA of PC positive and negative, wherein, inorganic oxide solution comprises the titanium dioxide of 8% mass percent and zirconium dioxide, the interfacial agent of 5% mass percent and 87% mass percent adjusting agent, soaking temperature is 27 DEG C, and soak time is 7 minutes.
Step (2), takes out the organic resin layer soaked, solidifies 60 minutes, thus obtain organic transparency carrier of the inorganic oxide rete being attached with sclerosis on the two sides of organic resin layer under the environment of 80 DEG C.
Embodiment six
Step (1), PMMA organic resin layer is put in inorganic oxide solution and soaks, wherein, inorganic oxide solution comprises the zirconium dioxide of 10% mass percent and aluminium oxide, the interfacial agent of 7% mass percent and 83% mass percent adjusting agent, soaking temperature is 30 DEG C, and soak time is 5 minutes.
Step (2), takes out the organic resin layer soaked, solidifies 80 minutes, thus obtain organic transparency carrier of the inorganic oxide rete being attached with sclerosis on the two sides of PMMA organic resin layer under the environment of 75 DEG C.
Embodiment seven
Step (1), PC organic resin layer is put in inorganic oxide solution and soaks, wherein, inorganic oxide solution comprises the titanium dioxide of 12% mass percent, zirconium dioxide and aluminium oxide, the interfacial agent of 9% mass percent and 79% mass percent adjusting agent, soaking temperature is 35 DEG C, and soak time is 3 minutes.
Step (2), takes out the organic resin layer soaked, solidifies 100 minutes, thus obtain organic transparency carrier of the inorganic oxide rete being attached with sclerosis on the two sides of PC organic resin layer under the environment of 70 DEG C.
Embodiment eight
Step (1), the organic resin layer of PMMA and PC lamination is put in inorganic oxide solution and soaks, wherein, inorganic oxide solution comprises the silica of 15% mass percent, zirconium dioxide and aluminium oxide, the interfacial agent of 10% mass percent and 75% mass percent adjusting agent, soaking temperature is 40 DEG C, and soak time is 1 minute.
Step (2), takes out the organic resin layer soaked, solidifies 120 minutes, thus obtain organic transparency carrier of the inorganic oxide rete being attached with sclerosis on the two sides of the organic resin layer of PMMA and PC lamination under the environment of 60 DEG C.
Above-mentioned embodiment is only the preferred embodiment of the present invention; can not limit the scope of protection of the invention with this, change and the replacement of any unsubstantiality that those skilled in the art does on basis of the present invention all belong to the present invention's scope required for protection.

Claims (5)

1. an organic transparency carrier, comprises organic resin layer, it is characterized in that: the positive and negative of described organic resin layer is all attached with inorganic oxide rete;
Wherein, organic resin layer is the laminated body of PMMA and PC or is the laminated body at the equal composite joint PMMA of the positive and negative of PC, and the thickness of described PC layer is 0.1mm-2.5mm; The thickness of described PMMA layer is 0.1mm-1.0mm; The thickness of described inorganic oxide rete is 10nm-1000nm;
Described inorganic oxide rete mainly comprise inorganic oxide, described inorganic oxide is one or more in silica, titanium dioxide, zirconium dioxide and aluminium oxide;
The preparation method of described organic transparency carrier, comprises the following steps:
(1) dip-coating; (2) solidify;
Described step (1) is all put in inorganic oxide solution by organic resin layer to soak; Described inorganic oxide solution comprises the composition of following mass percentage content:
Inorganic oxide: 0.1%-15%;
Adjusting agent: surplus;
Described inorganic oxide be preferably in silica, titanium dioxide, zirconium dioxide or aluminium oxide one or more; Described adjusting agent is alcohols, ketone and lipoid substance;
Described step (2) is taken out from inorganic oxide solution by organic resin substrate, is cured by the inorganic oxide rete on its surface;
Described inorganic oxide solution also comprises interfacial agent, and the content of described interfacial agent is 1%-10%, and its main component is organic compound.
2. a kind of organic transparency carrier as claimed in claim 1, is characterized in that: the thickness of described organic transparency carrier is 0.3-3.0mm.
3. a kind of organic transparency carrier as claimed in claim 1, is characterized in that: the content of described inorganic oxide is 0.5%-10%; The soaking temperature of described step (1) is 10 DEG C-40 DEG C, and soak time is 1min-15min; The solidification temperature of described step (2) is 60 DEG C-100 DEG C, and hardening time is 15min-120min.
4. a kind of organic transparency carrier as claimed in claim 1, is characterized in that: the content of described interfacial agent is 1%-5%.
5. a kind of organic transparency carrier as claimed in claim 1, is characterized in that: the soaking temperature of described step (1) is 15 DEG C-35 DEG C, and soak time is 1min-10min; The solidification temperature of described step (2) is 70 DEG C-90 DEG C, and hardening time is 30min-100min.
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CN105405902A (en) * 2015-12-15 2016-03-16 常熟市万隆电源技术研发有限公司 Polycrystalline silicon solar cell panel grid with high conversion efficiency
CN109445008A (en) * 2018-11-12 2019-03-08 江西兆九光电技术有限公司 A kind of depolarized Amici prism and its film plating process

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6420032B1 (en) * 1999-03-17 2002-07-16 General Electric Company Adhesion layer for metal oxide UV filters
CN102825873A (en) * 2012-08-23 2012-12-19 赵金生 Anti-UV colorized organic sheet and manufacturing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6420032B1 (en) * 1999-03-17 2002-07-16 General Electric Company Adhesion layer for metal oxide UV filters
CN102825873A (en) * 2012-08-23 2012-12-19 赵金生 Anti-UV colorized organic sheet and manufacturing method thereof

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Patentee after: Shenzhen Haoyi quantum R & D Co.,Ltd.

Address before: 515200 104, 143 dungaonanmen street, Huicheng Town, Huilai County, Huizhou City, Guangdong Province

Patentee before: Huang Jianquan

Patentee before: Zhang Yanwei

Patentee before: Qiu Dengjia