CN104518174A - OLED (organic light emitting diode) device - Google Patents

OLED (organic light emitting diode) device Download PDF

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Publication number
CN104518174A
CN104518174A CN201410745325.2A CN201410745325A CN104518174A CN 104518174 A CN104518174 A CN 104518174A CN 201410745325 A CN201410745325 A CN 201410745325A CN 104518174 A CN104518174 A CN 104518174A
Authority
CN
China
Prior art keywords
oled
film
substrate
guard cover
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410745325.2A
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Chinese (zh)
Inventor
刘亚伟
王宜凡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to CN201410745325.2A priority Critical patent/CN104518174A/en
Priority to PCT/CN2015/072467 priority patent/WO2016090746A1/en
Publication of CN104518174A publication Critical patent/CN104518174A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass

Abstract

The invention provides an OLED (organic light emitting diode) device. The OLED device comprises a substrate (1), an OLED thin-film device (2), an organic packaging thin film (3), an inorganic packaging thin film (4), a protection cover (5) and a rigid supporting plate (6). The OLED thin-film device (2) is arranged on the substrate (1), the organic packaging thin film (3) arranged on the substrate (1) completely covers the OLED thin-film device (2), the inorganic packaging thin film (4) arranged on the substrate (1) completely covers the organic packaging thin film (3), the protection cover (5) is hermetically connected to the peripheral edge of the substrate (1) and covers above the inorganic packaging thin film (4), and the rigid supporting plate (6) is arranged on one side, away from the substrate (1), of the protection cover (5). The OLED device has excellent mechanical performance and is less prone to damages under action of external force, and better airtightness protection can be provided for the OLED thin-film device.

Description

OLED
Technical field
The present invention relates to Display Technique field, particularly relate to a kind of OLED.
Background technology
Organic light emitting diode display (Organic Light Emitting Diode, OLED) be a kind of flat panel display having development prospect, it not only has very excellent display performance, also there is self-luminous, structure is simple, ultra-thin, fast response time, wide viewing angle, low-power consumption and can the characteristics such as Flexible Displays be realized, be described as " dreamlike display ", add its investment of production equipment much smaller than liquid crystal display (LiquidCrystal Display, LCD), obtain the favor of Ge great display producer, become the main force of third generation display device in Display Technique field.
OLED generally includes a glass substrate, be located at OLED thin-film device on glass substrate and for resisting external environment atmosphere, prevent steam, encapsulation cover plate that oxygen enters OLED inside, this encapsulation cover plate adopts another block glass plate usually.OLED thin-film device generally includes: be placed in the ITO transparent anode on glass substrate, the hole injection layer (HIL) be placed on ITO transparent anode, the hole transmission layer (HTL) be placed on hole injection layer, the luminescent layer (EML) be placed on hole transmission layer, the electron transfer layer (ETL) be placed on luminescent layer, the negative electrode that is placed in the electron injecting layer (EIL) on electron transfer layer and is placed on electron injecting layer.In order to raise the efficiency, luminescent layer adopts master/object doped system usually.
Because glass plate has sharp edge, it easily occurs protecting the problems such as improper during processing, and frangible when bearing mechanical load, and problems is more obvious when being applied to large scale OLED.Such as, and OLED is installed to the position of expectation by the common fixation methods such as glass plate (substrate or encapsulation cover plate) is difficult to apply as being threaded, clamping connection, boring, on wall.
Existing OLED is generally provided with common enclosure, and this common enclosure can provide the mechanical encapsulation around OLED outside, but directly can not contact with OLED on whole housing region.Because the mechanical robustness of OLED self does not improve, thus when there is mechanical collision, mechanical collision also acts in the OLED of enclosure, and finally damages OLED.A kind of shell is also had to be that OLED is embedded enclosure; to improve the mechanical performance of the OLED embedded in shell; under but this shell does not make OLED directly be in sealing state, better air-tightness cannot be provided to protect for OLED thin-film device.
Therefore, be necessary to provide a kind of novel OLED, to realize while significantly improving OLED mechanical performance, better air-tightness can be provided to protect for OLED thin-film device.
Summary of the invention
The object of the present invention is to provide a kind of OLED, it has good mechanical performance, not easily damages under external force, better air-tightness can be provided to protect for OLED thin-film device simultaneously.
For achieving the above object; the invention provides a kind of OLED, comprise substrate, the OLED thin-film device be located on described substrate, be located at described substrate covers completely described OLED thin-film device organic packages film, be located at the inorganic encapsulated film described substrate covering completely described organic packages film, the edge being sealedly attached to described substrate the guard cover covered at above described inorganic encapsulated film and be located at described guard cover away from the rigid support plate on described substrate side.
Described rigid support plate is provided with a cooling piece away from the side of described substrate.
Described OLED, also comprises adjacent with described substrate and is placed in driver controller in described guard cover, adjacent with described driver controller and be placed in electronic driver in described guard cover, and the electric contactor that be placed in described guard cover adjacent with described electronic driver; Described electric contactor part is exposed to the sidepiece of described guard cover.
Described guard cover is provided with the first holding part and second, third contrary with the opening direction of described first holding part and the 4th holding part; described substrate is placed in described first holding part, and described driver controller, electronic driver and electric contactor are placed in described second, third and the 4th holding part respectively.
Gap is left between described guard cover and described inorganic encapsulated film.
The upper and lower surface of described organic packages film all has adhesivity, and its material is Parylene, Parylene C or poly-dichloro-paraxylene.
The material of described inorganic encapsulated film is silicon nitride, silica, aluminium oxide or zirconia.
The material of described guard cover is plastics, is prepared by Shooting Technique.
Described rigid support plate is corrosion resistant plate.
The material of described cooling piece is aluminium or copper.
Beneficial effect of the present invention: a kind of OLED provided by the invention, by covering organic packaging film and inorganic encapsulated film on OLED thin-film device, the guard cover that cover establishes one to be sealedly attached to substrate edge above inorganic encapsulated film, and at this guard cover, rigid support plate is set away from the side of substrate, available protecting has been carried out to OLED, the mechanical performance of OLED is significantly improved, not easily damage under external force, simultaneously, better air-tightness can be provided to protect for OLED thin-film device, ensure the performance of OLED thin-film device, extend its useful life.In addition, due to the setting of guard cover, OLED is made to be installed to the position of any expectation more easily by traditional fixed form.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, by the specific embodiment of the present invention describe in detail, will make technical scheme of the present invention and other beneficial effect apparent.
In accompanying drawing,
Fig. 1 is the generalized section of OLED of the present invention.
Embodiment
For further setting forth the technological means and effect thereof that the present invention takes, be described in detail below in conjunction with the preferred embodiments of the present invention and accompanying drawing thereof.
Refer to Fig. 1; the invention provides a kind of OLED, comprise substrate 1, the OLED thin-film device 2 be located on described substrate 1, be located at described substrate 1 covers completely described OLED thin-film device 2 organic packages film 3, be located at the inorganic encapsulated film 4 described substrate 1 covering completely described organic packages film 3, the edge being sealedly attached to described substrate 1 guard cover 5 covered at above described inorganic encapsulated film 4 and be located at described guard cover 5 away from the rigid support plate 6 on described substrate 1 side.
Further; described OLED also comprises adjacent with described substrate 1 and is placed in driver controller 8 in described guard cover 5, adjacent with described driver controller 8 and be placed in electronic driver 9 in described guard cover 5, and the electric contactor 10 that be placed in described guard cover 5 adjacent with described electronic driver 9; described electric contactor 10 part is exposed to the sidepiece of described guard cover 5; for being electrically connected to external power source, thus OLED is driven.
Described rigid support plate 6 is provided with a cooling piece 7 away from the side of described substrate 1.
Particularly, described guard cover 5 is provided with the first holding part 51 and second, third contrary with the opening direction of described first holding part 51 and the 4th holding part 52,53,54.Described substrate 1 is placed in described first holding part 51, and described driver controller 8, electronic driver 9 and electric contactor 10 are placed in described second, third and the 4th holding part 52,53,54 respectively.
Described substrate 1 is transparency carrier, and for the light transmission that described OLED thin-film device 2 sends, preferably, described substrate 1 is glass substrate.
Described organic packages film 3 is similar to double faced adhesive tape, and its upper and lower surface all has adhesivity, can directly be attached on described OLED thin-film device 2.The material of described organic packages film 3 can be Parylene, Parylene C or poly-dichloro-paraxylene.
Because the structure of described organic packages film 3 is fine and close not, its performance intercepting steam and oxygen is unsatisfactory, so be also provided with the inorganic encapsulated film 4 that one deck covers organic packaging film 3 completely.The compact structure of described inorganic encapsulated film 4, its material can be silicon nitride, silica, aluminium oxide or zirconia.Described organic packages film 3 can be avoided in the preparation process of inorganic encapsulated film 4 damage that OLED thin-film device 2 may cause.
Described inorganic encapsulated film 4 and organic packages film 3 acting in conjunction; OLED thin-film device 2 is come by seal isolation completely, and for OLED thin-film device 2 provides good air-tightness protection, obstruct steam and oxygen enter; ensure the performance of OLED thin-film device 2, extend its useful life.
Described guard cover 5 can carry out available protecting to OLED, significantly improves the mechanical performance of OLED, and OLED is not easily damaged under external force.Described guard cover 5 is tightly connected with the edge of substrate 1, and does not contact with described inorganic encapsulated film 4, namely leaves gap between described guard cover 5 and described inorganic encapsulated film 4.OLED seals by described guard cover 5 completely, for described OLED thin-film device 2 provides the protection of better air-tightness.The electric components of described electronic driver 81, driver controller 82 and electric contactor 83 is covered by described guard cover 5 together.
The material of described guard cover 5 is plastics, by moulding process preparations such as injection mouldings.It is worth mentioning that, described guard cover 5 is set, OLED can also be made to be installed to the position of any expectation more easily by traditional fixed form.
Described rigid support plate 6 runs through the side of whole guard cover 5 away from described substrate 1, can increase the intensity of guard cover 5, better to protect OLED.Described rigid support plate 6 is made up of hard material, and preferably, described rigid support plate 6 is corrosion resistant plate.
The material of described cooling piece 7 is the good aluminium of thermal diffusivity or copper, distributes for the heat produced by OLED run duration, prevents the bad of the too high initiation of OLED Yin Wendu.
In sum, OLED of the present invention, by covering organic packaging film and inorganic encapsulated film on OLED thin-film device, the guard cover that cover establishes one to be sealedly attached to substrate edge above inorganic encapsulated film, and at this guard cover, rigid support plate is set away from the side of substrate, available protecting has been carried out to OLED, the mechanical performance of OLED is significantly improved, not easily damage under external force, simultaneously, better air-tightness can be provided to protect for OLED thin-film device, ensure the performance of OLED thin-film device, extend its useful life.In addition, due to the setting of guard cover, OLED is made to be installed to the position of any expectation more easily by traditional fixed form.
The above, for the person of ordinary skill of the art, can make other various corresponding change and distortion according to technical scheme of the present invention and technical conceive, and all these change and be out of shape the protection range that all should belong to the claims in the present invention.

Claims (10)

1. an OLED, it is characterized in that, comprise substrate (1), be located at the OLED thin-film device (2) on described substrate (1), be located at the organic packages film (3) described substrate (1) covering completely described OLED thin-film device (2), be located at the inorganic encapsulated film (4) described substrate (1) covering completely described organic packages film (3), be sealedly attached to described substrate (1) edge and cover at described inorganic encapsulated film (4) top guard cover (5), and be located at described guard cover (5) away from the rigid support plate (6) on described substrate (1) side.
2. OLED as claimed in claim 1, it is characterized in that, described rigid support plate (6) is provided with a cooling piece (7) away from the side of described substrate (1).
3. OLED as claimed in claim 1, it is characterized in that, also comprise adjacent with described substrate (1) and be placed in driver controller (8) in described guard cover (5), adjacent with described driver controller (8) and be placed in electronic driver (9) in described guard cover (5), and the electric contactor (10) that be placed in described guard cover (5) adjacent with described electronic driver (9); Described electric contactor (10) part is exposed to the sidepiece of described guard cover (5).
4. OLED as claimed in claim 3; it is characterized in that; described guard cover (5) is provided with the first holding part (51) and second, third contrary with the opening direction of described first holding part (51) and the 4th holding part (52,53,54); described substrate (1) is placed in described first holding part (51), and described driver controller (8), electronic driver (9) and electric contactor (10) are placed in described second, third and the 4th holding part (52,53,54) respectively.
5. OLED as claimed in claim 1, is characterized in that, leave gap between described guard cover (5) and described inorganic encapsulated film (4).
6. OLED as claimed in claim 1, it is characterized in that, the upper and lower surface of described organic packages film (3) all has adhesivity, and its material is Parylene, Parylene C or poly-dichloro-paraxylene.
7. OLED as claimed in claim 1, is characterized in that, the material (4) of described inorganic encapsulated film is silicon nitride, silica, aluminium oxide or zirconia.
8. OLED as claimed in claim 1, it is characterized in that, the material of described guard cover (5) is plastics, is prepared by Shooting Technique.
9. OLED as claimed in claim 1, it is characterized in that, described rigid support plate (6) is corrosion resistant plate.
10. OLED as claimed in claim 2, it is characterized in that, the material of described cooling piece (7) is aluminium or copper.
CN201410745325.2A 2014-12-08 2014-12-08 OLED (organic light emitting diode) device Pending CN104518174A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201410745325.2A CN104518174A (en) 2014-12-08 2014-12-08 OLED (organic light emitting diode) device
PCT/CN2015/072467 WO2016090746A1 (en) 2014-12-08 2015-02-08 Oled device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410745325.2A CN104518174A (en) 2014-12-08 2014-12-08 OLED (organic light emitting diode) device

Publications (1)

Publication Number Publication Date
CN104518174A true CN104518174A (en) 2015-04-15

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Country Status (2)

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CN (1) CN104518174A (en)
WO (1) WO2016090746A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6424092B1 (en) * 1999-01-29 2002-07-23 Sony Corporation Flat display device and wiring method thereof, and image display system
US20020101156A1 (en) * 2000-12-23 2002-08-01 Lg.Philips Lcd Co., Ltd. Electro-luminescence device
CN1780021A (en) * 2004-08-04 2006-05-31 三星电子株式会社 Display device, manufacturing method of the same, and manufacturing device for the same
CN102598345A (en) * 2009-09-11 2012-07-18 皇家飞利浦电子股份有限公司 OLED devices with protection cover
CN102610762A (en) * 2011-01-21 2012-07-25 彩虹显示器件股份有限公司 Film packaging method of organic light-emitting device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000040586A (en) * 1998-07-21 2000-02-08 Tdk Corp Organic el element module
WO2006046679A1 (en) * 2004-10-29 2006-05-04 Pioneer Corporation Organic electroluminescence display device and method for manufacturing the same
TWI420722B (en) * 2008-01-30 2013-12-21 Osram Opto Semiconductors Gmbh Device with encapsulation unit
CN103346268B (en) * 2013-06-24 2016-04-13 京东方科技集团股份有限公司 The method for packing of potted element, array base palte, display unit and OLED

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6424092B1 (en) * 1999-01-29 2002-07-23 Sony Corporation Flat display device and wiring method thereof, and image display system
US20020101156A1 (en) * 2000-12-23 2002-08-01 Lg.Philips Lcd Co., Ltd. Electro-luminescence device
CN1780021A (en) * 2004-08-04 2006-05-31 三星电子株式会社 Display device, manufacturing method of the same, and manufacturing device for the same
CN102598345A (en) * 2009-09-11 2012-07-18 皇家飞利浦电子股份有限公司 OLED devices with protection cover
CN102610762A (en) * 2011-01-21 2012-07-25 彩虹显示器件股份有限公司 Film packaging method of organic light-emitting device

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Application publication date: 20150415

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