CN1173414C - 可表面装配的光电子组件及其制造方法 - Google Patents
可表面装配的光电子组件及其制造方法 Download PDFInfo
- Publication number
- CN1173414C CN1173414C CNB988136422A CN98813642A CN1173414C CN 1173414 C CN1173414 C CN 1173414C CN B988136422 A CNB988136422 A CN B988136422A CN 98813642 A CN98813642 A CN 98813642A CN 1173414 C CN1173414 C CN 1173414C
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Links
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
Description
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19755734.1 | 1997-12-15 | ||
DE19755734A DE19755734A1 (de) | 1997-12-15 | 1997-12-15 | Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1285082A CN1285082A (zh) | 2001-02-21 |
CN1173414C true CN1173414C (zh) | 2004-10-27 |
Family
ID=7851993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB988136422A Expired - Lifetime CN1173414C (zh) | 1997-12-15 | 1998-12-15 | 可表面装配的光电子组件及其制造方法 |
Country Status (7)
Country | Link |
---|---|
US (3) | US6610563B1 (zh) |
EP (1) | EP1042819B1 (zh) |
JP (2) | JP2002509362A (zh) |
CN (1) | CN1173414C (zh) |
DE (1) | DE19755734A1 (zh) |
TW (1) | TW418546B (zh) |
WO (1) | WO1999031737A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108352356A (zh) * | 2015-10-07 | 2018-07-31 | 赫普塔冈微光有限公司 | 模制电路基底 |
Families Citing this family (207)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19755734A1 (de) * | 1997-12-15 | 1999-06-24 | Siemens Ag | Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes |
US7208725B2 (en) * | 1998-11-25 | 2007-04-24 | Rohm And Haas Electronic Materials Llc | Optoelectronic component with encapsulant |
DE19918370B4 (de) | 1999-04-22 | 2006-06-08 | Osram Opto Semiconductors Gmbh | LED-Weißlichtquelle mit Linse |
DE19940319B4 (de) * | 1999-08-25 | 2004-10-14 | Osram Opto Semiconductors Gmbh | Verfahren zum spannungsarmen Aufsetzen einer Linse auf ein oberflächenmontierbares optoelektronisches Bauelement |
DE19952712A1 (de) * | 1999-11-02 | 2001-05-10 | Osram Opto Semiconductors Gmbh | Laserdiodenvorrichtung |
DE19963264B4 (de) * | 1999-12-17 | 2007-05-31 | Optotransmitter-Umweltschutz-Technologie E.V. | Trägermaterial für elektronische Hochleistungs-Bauelemente in SMD-Bauform und ein damit hergestelltes elektronisches Hochleistungs-Bauelement |
DE10002521A1 (de) * | 2000-01-21 | 2001-08-09 | Infineon Technologies Ag | Elektrooptisches Datenübertragungsmodul |
DE10023353A1 (de) | 2000-05-12 | 2001-11-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung |
DE10034865B4 (de) * | 2000-07-18 | 2006-06-01 | Infineon Technologies Ag | Optoelektronisches oberflächenmontierbares Modul |
DE10041328B4 (de) * | 2000-08-23 | 2018-04-05 | Osram Opto Semiconductors Gmbh | Verpackungseinheit für Halbleiterchips |
DE10058622A1 (de) | 2000-11-15 | 2002-05-29 | Vishay Semiconductor Gmbh | Gemouldetes elektronisches Bauelement |
DE10058608A1 (de) | 2000-11-25 | 2002-05-29 | Vishay Semiconductor Gmbh | Leiterstreifenanordnung für ein gemouldetes elektronisches Bauelement und Verfahren zum Moulden |
MY131962A (en) * | 2001-01-24 | 2007-09-28 | Nichia Corp | Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
DE10118231A1 (de) * | 2001-04-11 | 2002-10-17 | Heidenhain Gmbh Dr Johannes | Optoelektronische Baulelmentanordnung und Verfahren zur Herstellun einer oploelektronischen Bauelementanordnung |
DE10127550B4 (de) * | 2001-06-01 | 2005-05-12 | Infineon Technologies Ag | Optische Vorrichtung |
DE10129785B4 (de) * | 2001-06-20 | 2010-03-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
DE20110274U1 (de) * | 2001-06-21 | 2002-08-01 | Siemens Ag | Gehäuse und Abdeckung mit einer abgedichteten Öffnung zur Durchleitung von Licht |
JP3948650B2 (ja) * | 2001-10-09 | 2007-07-25 | アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド | 発光ダイオード及びその製造方法 |
DE10153259A1 (de) | 2001-10-31 | 2003-05-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
DE10158395B4 (de) * | 2001-11-28 | 2011-07-07 | OSRAM Opto Semiconductors GmbH, 93055 | LED-Beleuchtungssystem |
DE10241989A1 (de) * | 2001-11-30 | 2003-06-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
DE10163117C5 (de) * | 2001-12-24 | 2005-12-01 | G.L.I. Global Light Industries Gmbh | Verfahren zum Herstellen von lichtleitenden LED-Körpern in zwei zeitlich getrennten Stufen |
DE10206464A1 (de) * | 2002-02-16 | 2003-08-28 | Micronas Gmbh | Verfahren zur Herstellung einer Sensor- oder Aktuatoranordnung sowie Sensor- oder Aktuatoranordnung |
GB0209016D0 (en) * | 2002-04-19 | 2002-05-29 | Zarlink Semiconductor Ab | Optical transducer with farfield modifier |
US7429757B2 (en) * | 2002-06-19 | 2008-09-30 | Sanken Electric Co., Ltd. | Semiconductor light emitting device capable of increasing its brightness |
DE10229067B4 (de) | 2002-06-28 | 2007-08-16 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
US7800121B2 (en) | 2002-08-30 | 2010-09-21 | Lumination Llc | Light emitting diode component |
US7224000B2 (en) * | 2002-08-30 | 2007-05-29 | Lumination, Llc | Light emitting diode component |
US7264378B2 (en) * | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
US7244965B2 (en) * | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
US7775685B2 (en) * | 2003-05-27 | 2010-08-17 | Cree, Inc. | Power surface mount light emitting die package |
TWI292961B (en) * | 2002-09-05 | 2008-01-21 | Nichia Corp | Semiconductor device and an optical device using the semiconductor device |
DE10250383B4 (de) * | 2002-10-29 | 2007-05-10 | Diemount Gmbh | Leuchtdiodenanordnung mit Reflektor |
US7692206B2 (en) * | 2002-12-06 | 2010-04-06 | Cree, Inc. | Composite leadframe LED package and method of making the same |
TWI237546B (en) * | 2003-01-30 | 2005-08-01 | Osram Opto Semiconductors Gmbh | Semiconductor-component sending and/or receiving electromagnetic radiation and housing-basebody for such a component |
JP4599857B2 (ja) * | 2003-04-24 | 2010-12-15 | 日亜化学工業株式会社 | 半導体装置及びその製造方法 |
JP4600404B2 (ja) * | 2003-04-24 | 2010-12-15 | 日亜化学工業株式会社 | 半導体装置及びその製造方法 |
DE10319782B4 (de) * | 2003-04-30 | 2009-01-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement mit einem Chipträgerelement |
JP4120813B2 (ja) * | 2003-06-12 | 2008-07-16 | セイコーエプソン株式会社 | 光学部品およびその製造方法 |
US7157744B2 (en) * | 2003-10-29 | 2007-01-02 | M/A-Com, Inc. | Surface mount package for a high power light emitting diode |
US7087465B2 (en) * | 2003-12-15 | 2006-08-08 | Philips Lumileds Lighting Company, Llc | Method of packaging a semiconductor light emitting device |
DE102004004779B4 (de) * | 2004-01-30 | 2015-09-03 | Osram Opto Semiconductors Gmbh | Leuchtdioden-Beleuchtungsmodul mit optischer Einrichtung zur Strahlformung |
JP2005217337A (ja) * | 2004-02-02 | 2005-08-11 | Matsushita Electric Ind Co Ltd | 光学デバイス |
JP4170968B2 (ja) * | 2004-02-02 | 2008-10-22 | 松下電器産業株式会社 | 光学デバイス |
US20050179041A1 (en) * | 2004-02-18 | 2005-08-18 | Lumileds Lighting U.S., Llc | Illumination system with LEDs |
JP2005233776A (ja) * | 2004-02-19 | 2005-09-02 | Denso Corp | 距離検出装置およびその製造方法 |
TWI257184B (en) * | 2004-03-24 | 2006-06-21 | Toshiba Lighting & Technology | Lighting apparatus |
US7279346B2 (en) * | 2004-03-31 | 2007-10-09 | Cree, Inc. | Method for packaging a light emitting device by one dispense then cure step followed by another |
US7517728B2 (en) * | 2004-03-31 | 2009-04-14 | Cree, Inc. | Semiconductor light emitting devices including a luminescent conversion element |
US7326583B2 (en) * | 2004-03-31 | 2008-02-05 | Cree, Inc. | Methods for packaging of a semiconductor light emitting device |
US20050242708A1 (en) * | 2004-04-30 | 2005-11-03 | Keong Chong C | LED device with a vertical leadframe that is configured for surface mounting |
EP1751806B1 (de) * | 2004-05-31 | 2019-09-11 | OSRAM Opto Semiconductors GmbH | Optoelektronisches halbleiterbauelement und gehäuse-grundkörper für ein derartiges bauelement |
US7456499B2 (en) * | 2004-06-04 | 2008-11-25 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
US7280288B2 (en) * | 2004-06-04 | 2007-10-09 | Cree, Inc. | Composite optical lens with an integrated reflector |
JP4544619B2 (ja) * | 2004-06-08 | 2010-09-15 | ローム株式会社 | 発光ダイオードランプ |
DE102004051379A1 (de) * | 2004-08-23 | 2006-03-23 | Osram Opto Semiconductors Gmbh | Vorrichtung für ein optoelektronisches Bauteil und Bauelement mit einem optoelektronischen Bauteil und einer Vorrichtung |
JP2006086176A (ja) * | 2004-09-14 | 2006-03-30 | Hitachi Kyowa Engineering Co Ltd | Led用サブマウント及びその製造方法 |
DE102004045950A1 (de) | 2004-09-22 | 2006-03-30 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
US8324641B2 (en) * | 2007-06-29 | 2012-12-04 | Ledengin, Inc. | Matrix material including an embedded dispersion of beads for a light-emitting device |
US9929326B2 (en) | 2004-10-29 | 2018-03-27 | Ledengin, Inc. | LED package having mushroom-shaped lens with volume diffuser |
US8816369B2 (en) * | 2004-10-29 | 2014-08-26 | Led Engin, Inc. | LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices |
US8134292B2 (en) * | 2004-10-29 | 2012-03-13 | Ledengin, Inc. | Light emitting device with a thermal insulating and refractive index matching material |
US7262493B2 (en) * | 2005-01-06 | 2007-08-28 | Avago Technologies General Ip (Singapore) Pte. Ltd. | System and method for mounting electrical devices |
US7821023B2 (en) | 2005-01-10 | 2010-10-26 | Cree, Inc. | Solid state lighting component |
US9793247B2 (en) * | 2005-01-10 | 2017-10-17 | Cree, Inc. | Solid state lighting component |
US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
JP2006196529A (ja) * | 2005-01-11 | 2006-07-27 | Nichia Chem Ind Ltd | 発光装置 |
US7939842B2 (en) * | 2005-01-27 | 2011-05-10 | Cree, Inc. | Light emitting device packages, light emitting diode (LED) packages and related methods |
DE102005061431B4 (de) * | 2005-02-03 | 2020-01-02 | Samsung Electronics Co., Ltd. | LED-Einheit der Art Seitenausstrahlung |
EP1861876A1 (en) * | 2005-03-24 | 2007-12-05 | Tir Systems Ltd. | Solid-state lighting device package |
US7364945B2 (en) | 2005-03-31 | 2008-04-29 | Stats Chippac Ltd. | Method of mounting an integrated circuit package in an encapsulant cavity |
EP1872401B1 (en) * | 2005-04-05 | 2018-09-19 | Philips Lighting Holding B.V. | Electronic device package with an integrated evaporator |
US7354800B2 (en) * | 2005-04-29 | 2008-04-08 | Stats Chippac Ltd. | Method of fabricating a stacked integrated circuit package system |
KR100665178B1 (ko) * | 2005-05-26 | 2007-01-09 | 삼성전기주식회사 | 발광다이오드 패키지 제조방법 |
KR100616684B1 (ko) * | 2005-06-03 | 2006-08-28 | 삼성전기주식회사 | 고출력 led 패키지 및 그 제조방법 |
US8669572B2 (en) * | 2005-06-10 | 2014-03-11 | Cree, Inc. | Power lamp package |
US7980743B2 (en) * | 2005-06-14 | 2011-07-19 | Cree, Inc. | LED backlighting for displays |
US20060292747A1 (en) * | 2005-06-27 | 2006-12-28 | Loh Ban P | Top-surface-mount power light emitter with integral heat sink |
KR101161383B1 (ko) * | 2005-07-04 | 2012-07-02 | 서울반도체 주식회사 | 발광 다이오드 및 이를 제조하기 위한 방법 |
KR100665222B1 (ko) * | 2005-07-26 | 2007-01-09 | 삼성전기주식회사 | 확산재료를 이용한 엘이디 패키지 및 그 제조 방법 |
US7646035B2 (en) * | 2006-05-31 | 2010-01-12 | Cree, Inc. | Packaged light emitting devices including multiple index lenses and multiple index lenses for packaged light emitting devices |
US8835952B2 (en) | 2005-08-04 | 2014-09-16 | Cree, Inc. | Submounts for semiconductor light emitting devices and methods of forming packaged light emitting devices including dispensed encapsulants |
US7365371B2 (en) * | 2005-08-04 | 2008-04-29 | Cree, Inc. | Packages for semiconductor light emitting devices utilizing dispensed encapsulants |
US20070040182A1 (en) * | 2005-08-16 | 2007-02-22 | Julian Lee | Light emitting diode packaging structure |
MY152857A (en) * | 2005-09-01 | 2014-11-28 | Dominant Opto Tech Sdn Bhd | Surface mount optoelectronic component with lens |
US20070063213A1 (en) * | 2005-09-21 | 2007-03-22 | Lighthouse Technology Co., Ltd. | LED package |
DE102006032416A1 (de) * | 2005-09-29 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement |
DE102006032428A1 (de) * | 2005-09-30 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines strahlungsemittierenden Bauelements |
KR100665262B1 (ko) * | 2005-10-20 | 2007-01-09 | 삼성전기주식회사 | 발광다이오드 패키지 |
US7768125B2 (en) | 2006-01-04 | 2010-08-03 | Stats Chippac Ltd. | Multi-chip package system |
US7723146B2 (en) * | 2006-01-04 | 2010-05-25 | Stats Chippac Ltd. | Integrated circuit package system with image sensor system |
US7456088B2 (en) | 2006-01-04 | 2008-11-25 | Stats Chippac Ltd. | Integrated circuit package system including stacked die |
US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
US7750482B2 (en) | 2006-02-09 | 2010-07-06 | Stats Chippac Ltd. | Integrated circuit package system including zero fillet resin |
US8704349B2 (en) | 2006-02-14 | 2014-04-22 | Stats Chippac Ltd. | Integrated circuit package system with exposed interconnects |
JP5268082B2 (ja) * | 2006-02-22 | 2013-08-21 | シチズン電子株式会社 | 光半導体装置 |
US7675145B2 (en) * | 2006-03-28 | 2010-03-09 | Cree Hong Kong Limited | Apparatus, system and method for use in mounting electronic elements |
US8969908B2 (en) * | 2006-04-04 | 2015-03-03 | Cree, Inc. | Uniform emission LED package |
US8748915B2 (en) * | 2006-04-24 | 2014-06-10 | Cree Hong Kong Limited | Emitter package with angled or vertical LED |
US7635915B2 (en) * | 2006-04-26 | 2009-12-22 | Cree Hong Kong Limited | Apparatus and method for use in mounting electronic elements |
JP2007311445A (ja) * | 2006-05-17 | 2007-11-29 | Stanley Electric Co Ltd | 半導体発光装置及びその製造方法 |
EP2033235B1 (en) | 2006-05-26 | 2017-06-21 | Cree, Inc. | Solid state light emitting device |
WO2007141827A1 (ja) * | 2006-05-30 | 2007-12-13 | Fujikura Ltd. | 発光素子実装用基板、光源、照明装置、表示装置、交通信号機、及び発光素子実装用基板の製造方法 |
US7795632B2 (en) * | 2006-06-26 | 2010-09-14 | Osram Sylvania Inc. | Light emitting diode with direct view optic |
US7906794B2 (en) | 2006-07-05 | 2011-03-15 | Koninklijke Philips Electronics N.V. | Light emitting device package with frame and optically transmissive element |
US8735920B2 (en) * | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
JP5205724B2 (ja) * | 2006-08-04 | 2013-06-05 | 日亜化学工業株式会社 | 発光装置 |
US8367945B2 (en) * | 2006-08-16 | 2013-02-05 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
US7808013B2 (en) * | 2006-10-31 | 2010-10-05 | Cree, Inc. | Integrated heat spreaders for light emitting devices (LEDs) and related assemblies |
EP2080223B8 (en) * | 2006-10-31 | 2018-08-22 | Lumileds Holding B.V. | Lighting device package |
DE102007001706A1 (de) | 2007-01-11 | 2008-07-17 | Osram Opto Semiconductors Gmbh | Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse |
US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
DE102007021904A1 (de) * | 2007-02-28 | 2008-09-04 | Osram Opto Semiconductors Gmbh | Optoelektronische Vorrichtung mit Gehäusekörper |
US7993038B2 (en) * | 2007-03-06 | 2011-08-09 | Toyoda Gosei Co., Ltd. | Light-emitting device |
WO2008157342A1 (en) * | 2007-06-13 | 2008-12-24 | Videntity Systems, Inc. | Identity verification and information management |
US20090008662A1 (en) * | 2007-07-05 | 2009-01-08 | Ian Ashdown | Lighting device package |
KR100880638B1 (ko) * | 2007-07-06 | 2009-01-30 | 엘지전자 주식회사 | 발광 소자 패키지 |
US9401461B2 (en) * | 2007-07-11 | 2016-07-26 | Cree, Inc. | LED chip design for white conversion |
US10505083B2 (en) * | 2007-07-11 | 2019-12-10 | Cree, Inc. | Coating method utilizing phosphor containment structure and devices fabricated using same |
CN101388161A (zh) * | 2007-09-14 | 2009-03-18 | 科锐香港有限公司 | Led表面安装装置和并入有此装置的led显示器 |
JP2009099680A (ja) * | 2007-10-15 | 2009-05-07 | Panasonic Corp | 光学デバイスおよびその製造方法 |
US9086213B2 (en) * | 2007-10-17 | 2015-07-21 | Xicato, Inc. | Illumination device with light emitting diodes |
US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
USD615504S1 (en) | 2007-10-31 | 2010-05-11 | Cree, Inc. | Emitter package |
US8866169B2 (en) | 2007-10-31 | 2014-10-21 | Cree, Inc. | LED package with increased feature sizes |
USD633631S1 (en) | 2007-12-14 | 2011-03-01 | Cree Hong Kong Limited | Light source of light emitting diode |
US8217482B2 (en) * | 2007-12-21 | 2012-07-10 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared proximity sensor package with reduced crosstalk |
USD634863S1 (en) | 2008-01-10 | 2011-03-22 | Cree Hong Kong Limited | Light source of light emitting diode |
JP2009239106A (ja) * | 2008-03-27 | 2009-10-15 | Sony Corp | 半導体装置及び同半導体装置の製造方法 |
US8877524B2 (en) * | 2008-03-31 | 2014-11-04 | Cree, Inc. | Emission tuning methods and devices fabricated utilizing methods |
KR101526567B1 (ko) | 2008-05-07 | 2015-06-10 | 엘지이노텍 주식회사 | 발광 다이오드 패키지 |
US8049230B2 (en) * | 2008-05-16 | 2011-11-01 | Cree Huizhou Opto Limited | Apparatus and system for miniature surface mount devices |
JP5173647B2 (ja) * | 2008-07-29 | 2013-04-03 | 京セラ株式会社 | 受光素子用サブキャリアおよび光半導体装置 |
JP2010034370A (ja) * | 2008-07-30 | 2010-02-12 | Kyocera Corp | 太陽電池ユニット |
JP2010034371A (ja) * | 2008-07-30 | 2010-02-12 | Kyocera Corp | 太陽電池装置および太陽電池装置用パッケージ |
JP2010034369A (ja) * | 2008-07-30 | 2010-02-12 | Kyocera Corp | 太陽電池ユニットおよび太陽電池ユニット用パッケージ |
CN102177768A (zh) * | 2008-10-10 | 2011-09-07 | 高通Mems科技公司 | 分布式照明控制 |
EP2350526B1 (en) * | 2008-10-10 | 2014-12-31 | Qualcomm Mems Technologies, Inc | Distributed illumination system |
US8075165B2 (en) * | 2008-10-14 | 2011-12-13 | Ledengin, Inc. | Total internal reflection lens and mechanical retention and locating device |
US9425172B2 (en) | 2008-10-24 | 2016-08-23 | Cree, Inc. | Light emitter array |
US8791471B2 (en) | 2008-11-07 | 2014-07-29 | Cree Hong Kong Limited | Multi-chip light emitting diode modules |
CN101740680A (zh) * | 2008-11-21 | 2010-06-16 | 富准精密工业(深圳)有限公司 | 发光二极管 |
US8507300B2 (en) * | 2008-12-24 | 2013-08-13 | Ledengin, Inc. | Light-emitting diode with light-conversion layer |
JP2010171379A (ja) * | 2008-12-25 | 2010-08-05 | Seiko Instruments Inc | 発光デバイス |
US7923739B2 (en) * | 2009-06-05 | 2011-04-12 | Cree, Inc. | Solid state lighting device |
US8598602B2 (en) | 2009-01-12 | 2013-12-03 | Cree, Inc. | Light emitting device packages with improved heat transfer |
US8368112B2 (en) | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
US20110037083A1 (en) * | 2009-01-14 | 2011-02-17 | Alex Chi Keung Chan | Led package with contrasting face |
DE102009000597B4 (de) * | 2009-02-04 | 2020-10-15 | Robert Bosch Gmbh | Haltekörper zur spielfreien Montage von Sensoren |
JP5689223B2 (ja) * | 2009-03-05 | 2015-03-25 | 日亜化学工業株式会社 | 発光装置 |
US8610156B2 (en) * | 2009-03-10 | 2013-12-17 | Lg Innotek Co., Ltd. | Light emitting device package |
KR101047603B1 (ko) * | 2009-03-10 | 2011-07-07 | 엘지이노텍 주식회사 | 발광 소자 패키지 및 그 제조방법 |
US8420999B2 (en) * | 2009-05-08 | 2013-04-16 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Metal shield and housing for optical proximity sensor with increased resistance to mechanical deformation |
US8686445B1 (en) | 2009-06-05 | 2014-04-01 | Cree, Inc. | Solid state lighting devices and methods |
US8860043B2 (en) * | 2009-06-05 | 2014-10-14 | Cree, Inc. | Light emitting device packages, systems and methods |
DE102009031008A1 (de) | 2009-06-29 | 2010-12-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil |
US8957380B2 (en) * | 2009-06-30 | 2015-02-17 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared attenuating or blocking layer in optical proximity sensor |
US8779361B2 (en) * | 2009-06-30 | 2014-07-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optical proximity sensor package with molded infrared light rejection barrier and infrared pass components |
US9525093B2 (en) | 2009-06-30 | 2016-12-20 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared attenuating or blocking layer in optical proximity sensor |
US8796706B2 (en) * | 2009-07-03 | 2014-08-05 | Seoul Semiconductor Co., Ltd. | Light emitting diode package |
US8415692B2 (en) * | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
US8598809B2 (en) * | 2009-08-19 | 2013-12-03 | Cree, Inc. | White light color changing solid state lighting and methods |
US8350216B2 (en) * | 2009-09-10 | 2013-01-08 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Miniaturized optical proximity sensor |
US8716665B2 (en) * | 2009-09-10 | 2014-05-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Compact optical proximity sensor with ball grid array and windowed substrate |
US8143608B2 (en) * | 2009-09-10 | 2012-03-27 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Package-on-package (POP) optical proximity sensor |
JP5936810B2 (ja) * | 2009-09-11 | 2016-06-22 | ローム株式会社 | 発光装置 |
US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
US20110101062A1 (en) * | 2009-11-04 | 2011-05-05 | Benjamin Franklin Roberts | Pouch and pouches to carry personal items and lights on a belt |
KR100986468B1 (ko) | 2009-11-19 | 2010-10-08 | 엘지이노텍 주식회사 | 렌즈 및 렌즈를 갖는 발광 장치 |
KR100986380B1 (ko) | 2009-11-20 | 2010-10-08 | 엘지이노텍 주식회사 | 발광 장치 |
US9733357B2 (en) * | 2009-11-23 | 2017-08-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared proximity sensor package with improved crosstalk isolation |
US8568012B2 (en) * | 2010-01-18 | 2013-10-29 | Lg Innotek Co., Ltd. | Lighting unit and display device having the same |
US9468070B2 (en) | 2010-02-16 | 2016-10-11 | Cree Inc. | Color control of light emitting devices and applications thereof |
US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
DE102010028407B4 (de) * | 2010-04-30 | 2021-01-14 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
US8648359B2 (en) | 2010-06-28 | 2014-02-11 | Cree, Inc. | Light emitting devices and methods |
US8269244B2 (en) | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
USD643819S1 (en) | 2010-07-16 | 2011-08-23 | Cree, Inc. | Package for light emitting diode (LED) lighting |
JP5488310B2 (ja) * | 2010-07-30 | 2014-05-14 | 市光工業株式会社 | 車両用灯具の半導体型光源の光源ユニット、車両用灯具 |
US8610140B2 (en) | 2010-12-15 | 2013-12-17 | Cree, Inc. | Light emitting diode (LED) packages, systems, devices and related methods |
USD679842S1 (en) | 2011-01-03 | 2013-04-09 | Cree, Inc. | High brightness LED package |
US8841597B2 (en) | 2010-12-27 | 2014-09-23 | Avago Technologies Ip (Singapore) Pte. Ltd. | Housing for optical proximity sensor |
TW201251140A (en) | 2011-01-31 | 2012-12-16 | Cree Inc | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
WO2012109225A1 (en) | 2011-02-07 | 2012-08-16 | Cree, Inc. | Components and methods for light emitting diode (led) lighting |
US8373183B2 (en) | 2011-02-22 | 2013-02-12 | Hong Kong Applied Science and Technology Research Institute Company Limited | LED package for uniform color emission |
TWI403678B (zh) * | 2011-05-09 | 2013-08-01 | 泰金寶電通股份有限公司 | 光機模組及發光二極體燈具 |
DE102011105010A1 (de) * | 2011-06-20 | 2012-12-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung |
JP5808973B2 (ja) * | 2011-07-25 | 2015-11-10 | スタンレー電気株式会社 | 発光装置 |
US8816512B2 (en) * | 2011-07-28 | 2014-08-26 | Lg Innotek Co., Ltd. | Light emitting device module |
US8564004B2 (en) | 2011-11-29 | 2013-10-22 | Cree, Inc. | Complex primary optics with intermediate elements |
US9897284B2 (en) | 2012-03-28 | 2018-02-20 | Ledengin, Inc. | LED-based MR16 replacement lamp |
US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
CN102935532B (zh) * | 2012-10-26 | 2015-05-20 | 秦皇岛博硕光电设备股份有限公司 | 用于太阳能电池红外焊接的下压保持装置 |
DE102013106948A1 (de) * | 2013-07-02 | 2015-01-08 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
EP3038173B1 (en) * | 2014-12-23 | 2019-05-22 | LG Innotek Co., Ltd. | Light emitting device |
JP2016122731A (ja) * | 2014-12-25 | 2016-07-07 | ローム株式会社 | 光半導体装置およびその製造方法 |
CN106469772B (zh) * | 2015-08-18 | 2018-01-05 | 江苏诚睿达光电有限公司 | 一种基于滚压式的热塑性树脂光转换体贴合封装led的工艺方法 |
EP3300126B1 (en) * | 2015-08-18 | 2019-05-22 | Jiangsu Cherrity Optronics Co., Ltd | Process method for refining photoconverter to bond-package led and refinement equipment system |
CN106546327B (zh) * | 2015-09-17 | 2021-04-20 | 日月光半导体制造股份有限公司 | 光学装置、电装置及无源光学组件 |
DE102016104659A1 (de) * | 2016-03-14 | 2017-09-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauteil |
DE102016116298A1 (de) | 2016-09-01 | 2018-03-01 | Osram Opto Semiconductors Gmbh | Anordnung mit Träger und optoelektronischem Bauelement |
DE102016223516A1 (de) * | 2016-11-28 | 2018-05-30 | Osram Gmbh | Herstellen eines Lichtdurchtrittkörpers für eine Leuchte |
JP7082280B2 (ja) * | 2018-03-30 | 2022-06-08 | 日亜化学工業株式会社 | 発光装置 |
DE102020201493A1 (de) * | 2020-02-07 | 2021-08-12 | Robert Bosch Gesellschaft mit beschränkter Haftung | Gehäuse und Verfahren zum Vergießen eines offenen Aufnahmeraums eines Gehäuses |
JP7357595B2 (ja) | 2020-09-17 | 2023-10-06 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5785273A (en) * | 1980-11-17 | 1982-05-27 | Toshiba Corp | Photo-semiconductor device |
JPS58500921A (ja) * | 1981-06-12 | 1983-06-02 | モトロ−ラ・インコ−ポレ−テツド | セルフアライン・レンズを備えたリ−ド |
DE3128187A1 (de) * | 1981-07-16 | 1983-02-03 | Joachim 8068 Pfaffenhofen Sieg | Opto-elektronisches bauelement |
JPS6020587A (ja) | 1983-07-14 | 1985-02-01 | Sanyo Electric Co Ltd | 光結合器の製造方法 |
FR2593930B1 (fr) * | 1986-01-24 | 1989-11-24 | Radiotechnique Compelec | Dispositif opto-electronique pour montage en surface |
JPH01172889A (ja) * | 1987-12-26 | 1989-07-07 | Takiron Co Ltd | ドットマトリックス発光表示体とその製造方法 |
US4843280A (en) | 1988-01-15 | 1989-06-27 | Siemens Corporate Research & Support, Inc. | A modular surface mount component for an electrical device or led's |
US5043716A (en) * | 1988-07-14 | 1991-08-27 | Adaptive Micro Systems, Inc. | Electronic display with lens matrix |
EP0374121A3 (de) * | 1988-12-16 | 1991-01-16 | RSF-Elektronik Gesellschaft m.b.H. | Leuchtdiode |
EP1187227A3 (de) * | 1989-05-31 | 2002-08-28 | Osram Opto Semiconductors GmbH & Co. OHG | Oberflächenmontierbares Opto-Bauelement und Verfahren zum Herstellen desselben |
JPH04109556A (ja) | 1990-08-29 | 1992-04-10 | Hitachi Chem Co Ltd | 密閉型二次電池 |
JPH04109556U (ja) * | 1991-03-08 | 1992-09-22 | シヤープ株式会社 | 反射ケース型ledランプ |
SE468150B (sv) * | 1991-05-06 | 1992-11-09 | Asea Brown Boveri | Optoelektronisk komponent |
JPH05119707A (ja) * | 1991-10-25 | 1993-05-18 | Takiron Co Ltd | ドツトマトリクス発光表示体及びその製造方法 |
US5331512A (en) * | 1992-04-16 | 1994-07-19 | Orton Kevin R | Surface-mount LED |
JPH0832120A (ja) * | 1994-07-19 | 1996-02-02 | Rohm Co Ltd | 面発光表示器 |
US5545359A (en) * | 1994-08-11 | 1996-08-13 | Motorola | Method of making a plastic molded optoelectronic interface |
US5686172A (en) * | 1994-11-30 | 1997-11-11 | Mitsubishi Gas Chemical Company, Inc. | Metal-foil-clad composite ceramic board and process for the production thereof |
US5614131A (en) * | 1995-05-01 | 1997-03-25 | Motorola, Inc. | Method of making an optoelectronic device |
JPH0927643A (ja) * | 1995-07-13 | 1997-01-28 | Stanley Electric Co Ltd | 受光/発光素子 |
JPH0983018A (ja) * | 1995-09-11 | 1997-03-28 | Nippon Denyo Kk | 発光ダイオードユニット |
DE19535777A1 (de) * | 1995-09-26 | 1997-03-27 | Siemens Ag | Optoelektronisches Halbleiter-Bauelement und Verfahren zur Herstellung |
DE59711671D1 (de) * | 1996-06-26 | 2004-07-01 | Osram Opto Semiconductors Gmbh | Lichtabstrahlendes halbleiterbauelement mit lumineszenzkonversionselement |
US6097521A (en) * | 1997-09-26 | 2000-08-01 | Siemens Aktiengesellschaft | Optoelectronic module for bidirectional optical data transmission |
JPH10160961A (ja) * | 1996-12-03 | 1998-06-19 | Mitsubishi Gas Chem Co Inc | 光学素子 |
JPH10210606A (ja) * | 1997-01-22 | 1998-08-07 | Toshiba Corp | 電気車制御装置 |
US6103398A (en) * | 1997-05-22 | 2000-08-15 | Motorola, Inc. | Optoelectronic device having an overfill material and method of assembly |
DE19746893B4 (de) * | 1997-10-23 | 2005-09-01 | Siemens Ag | Optoelektronisches Bauelement mit Wärmesenke im Sockelteil und Verfahren zur Herstellung |
DE19755734A1 (de) * | 1997-12-15 | 1999-06-24 | Siemens Ag | Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes |
DE19829197C2 (de) * | 1998-06-30 | 2002-06-20 | Siemens Ag | Strahlungsaussendendes und/oder -empfangendes Bauelement |
TW512543B (en) * | 1999-06-28 | 2002-12-01 | Semiconductor Energy Lab | Method of manufacturing an electro-optical device |
US6455398B1 (en) | 1999-07-16 | 2002-09-24 | Massachusetts Institute Of Technology | Silicon on III-V semiconductor bonding for monolithic optoelectronic integration |
DE10058622A1 (de) * | 2000-11-15 | 2002-05-29 | Vishay Semiconductor Gmbh | Gemouldetes elektronisches Bauelement |
DE10058608A1 (de) * | 2000-11-25 | 2002-05-29 | Vishay Semiconductor Gmbh | Leiterstreifenanordnung für ein gemouldetes elektronisches Bauelement und Verfahren zum Moulden |
WO2004077558A1 (de) * | 2003-02-28 | 2004-09-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches bauteil mit strukturiert metallisiertem gehäusekörper, verfahren zur herstellung eines derartigen bauteils und verfahren zur strukturierten metallisierung eines kunststoff enthaltenden körpers |
US7718451B2 (en) * | 2003-02-28 | 2010-05-18 | Osram Opto Semiconductor Gmbh | Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body |
DE102004045950A1 (de) * | 2004-09-22 | 2006-03-30 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
DE102005020908A1 (de) * | 2005-02-28 | 2006-08-31 | Osram Opto Semiconductors Gmbh | Beleuchtungsvorrichtung |
-
1997
- 1997-12-15 DE DE19755734A patent/DE19755734A1/de not_active Ceased
-
1998
- 1998-12-11 TW TW087120679A patent/TW418546B/zh not_active IP Right Cessation
- 1998-12-15 EP EP98965124.5A patent/EP1042819B1/de not_active Expired - Lifetime
- 1998-12-15 WO PCT/DE1998/003676 patent/WO1999031737A1/de active Application Filing
- 1998-12-15 US US09/581,585 patent/US6610563B1/en not_active Expired - Lifetime
- 1998-12-15 CN CNB988136422A patent/CN1173414C/zh not_active Expired - Lifetime
- 1998-12-15 JP JP2000539534A patent/JP2002509362A/ja active Pending
-
2003
- 2003-05-16 US US10/439,695 patent/US6946714B2/en not_active Expired - Lifetime
-
2005
- 2005-08-11 US US11/202,424 patent/US7675132B2/en not_active Expired - Fee Related
-
2010
- 2010-11-05 JP JP2010248992A patent/JP5193265B2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108352356A (zh) * | 2015-10-07 | 2018-07-31 | 赫普塔冈微光有限公司 | 模制电路基底 |
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US6946714B2 (en) | 2005-09-20 |
EP1042819A1 (de) | 2000-10-11 |
US6610563B1 (en) | 2003-08-26 |
US20060022212A1 (en) | 2006-02-02 |
JP2002509362A (ja) | 2002-03-26 |
US7675132B2 (en) | 2010-03-09 |
JP2011023770A (ja) | 2011-02-03 |
JP5193265B2 (ja) | 2013-05-08 |
US20040201028A1 (en) | 2004-10-14 |
DE19755734A1 (de) | 1999-06-24 |
EP1042819B1 (de) | 2018-01-24 |
CN1285082A (zh) | 2001-02-21 |
TW418546B (en) | 2001-01-11 |
WO1999031737A1 (de) | 1999-06-24 |
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