CN1314541C - 内含多个喷嘴排列的喷墨打印头芯片及喷墨打印机 - Google Patents

内含多个喷嘴排列的喷墨打印头芯片及喷墨打印机 Download PDF

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CN1314541C
CN1314541C CNB028287444A CN02828744A CN1314541C CN 1314541 C CN1314541 C CN 1314541C CN B028287444 A CNB028287444 A CN B028287444A CN 02828744 A CN02828744 A CN 02828744A CN 1314541 C CN1314541 C CN 1314541C
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ink
actuator
nozzle
substrate
print head
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CN1625480A (zh
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卡·西尔弗布鲁克
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Silverbrook Research Pty Ltd
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Abstract

一种用于喷墨打印头的打印头芯片，所述的打印头芯片包含一个衬底。多个喷嘴排列设置在所述衬底之上。每个喷嘴排列包含：一个喷嘴腔结构，所述喷嘴腔结构界定一个其中容纳墨的喷嘴腔；一个喷墨口，墨从所述喷嘴腔中通过所述喷墨口喷出。一个喷墨构件置于所述喷嘴腔中，并且可以在喷嘴腔中移动以从所述喷嘴腔喷墨。至少一个致动器置于所述衬底之上，所述致动器具有一个当致动器接收一个驱动信号时可相对于所述衬底移动的工作部分。一个密封结构置于所述衬底上，并且插入在致动器与所述喷墨构件之间以阻止墨在喷墨构件和致动器之间通过。一个运动传递结构桥接密封结构，并把致动器的工作部分与喷墨构件相互连接。

Description

内含多个喷嘴排列的喷墨打印头芯片及喷墨打印机
技术领域
本发明涉及一种打印头。更具体地，本发明涉及一种内含多个喷嘴排列的打印头芯片，所述多个喷嘴排列各包括一个运动传递结构。
背景技术
如以上引述的申请/专利中指出，本发明人花费了相当的时间和精力研发内含以微电-机械系统(MEMS)为基础的部件的打印头，以实现打印所需要的喷墨。
作为本申请人研究和开发的结果，本申请人已经能够研发具有配合在一起体现达84000个喷嘴排列的一或多个打印头芯片的打印头。本申请人还研发了能够控制这样的打印头工作的适用的处理器技术。特别地，所述处理器技术和打印头能够配合产生1600dpi的分辨率以及某些情况下更高的分辨率。适用的处理器技术的示例在以上引述的专利申请/专利中给出。
本申请人研发的多数打印头芯片共同的是一种相对一个衬底移动以从喷嘴腔喷墨的部件。这种部件可以是一种能够在一个喷嘴腔中移动以从喷嘴腔喷墨的喷墨构件的形式。
实现致动器形式的原动装置与移动部件之间的适当界面是本发明人所面临过一个特殊困难。需要所述界面能够把所述移动部件在喷嘴腔内移动并且防止油墨从喷嘴腔泄露。
如以上引述的专利/专利申请中所指出，打印头芯片用集成电路制造技术制造。这是用之制造以MEMS为基础的装置的通常方式。这种制造形式因为它们涉及相继的沉积和蚀刻技术而受到限制。因此，以MEMS为基础的装置通常分层形成，并且具有相对复杂的形状的部件，所以制造困难而且昂贵。
在图1中，标号10总体上指代一个打印头芯片的一个喷嘴排列的部分。所示部分10示出一个致动器12和一个喷墨构件14。致动器12包括一个从一个固定件18伸出的长形的致动器臂。所述致动器臂16构成：当它接收一个驱动信号时，致动器臂16如箭头22所示向一个衬底20弯曲。一个连接结构24插入在致动器臂16和喷墨构件14之间。从而，当致动器臂16向衬底20弯曲时，把喷墨构件14沿箭头26的方向移动以从喷嘴腔喷墨。
从直觉上简单地与一个适当的密封结构一起使用上述排列10以实现有效的喷墨和密封。其原因是表面上致动器臂16、连接结构24和喷墨构件14可以是一种整体结构的形式。然而，本申请人发现不可能通过使用以MEMS为基础的制造技术获得图示的工作结构。特别是，本申请人发现这样的整体结构本身不适于这种制造技术。
因此引起本申请人构想出本发明。
发明内容
本发明的目的是提供一种用于喷墨打印头的打印头芯片，其具有便于喷嘴排列的制造的结构形式，同时可有效地传递运动和密封。
根据本发明，提供一种用于喷墨打印头的打印头芯片，所述的打印头芯片包含：
一个衬底；和
多个置于所述衬底之上的喷嘴排列，每个喷嘴排列包含
一个喷嘴腔结构，所述喷嘴腔结构界定一个其中容纳墨的喷嘴腔；
一个喷墨口，墨从所述喷嘴腔中通过所述喷墨口喷出；
一个喷墨构件，所述喷墨构件置于所述喷嘴腔中，并且可以在喷嘴腔中移动以从所述喷嘴腔喷墨；
至少一个置于所述衬底之上的致动器，所述致动器具有一个当致动器接收一个驱动信号时可相对于所述衬底移动的工作部分；
一个密封结构，所述的密封结构置于所述衬底上，并且插入在致动器与所述喷墨构件之间以阻止墨在喷墨构件和致动器之间通过；和
一个桥接所述密封结构的运动传递结构，该运动传递结构包括一个连接到致动器的工作部分的施力结构、一个连接到喷墨构件的负载结构和一个把施力结构和负载结构相互连接的杠杆臂结构，所述杠杆臂结构相对于喷嘴腔结构枢转，从而致动器的工作部分的往复运动由杠杆结构的枢转运动提供，使得喷墨构件朝向和离开喷墨口往复移动。
附图说明
下文参照附图，以举例的方式说明本发明。下文的说明不是旨在限制上述的发明内容部分的广泛范畴。在附图中：
图1以概略示意的方式示出一个喷墨打印头的一个打印头芯片的喷嘴排列部分的示意性侧剖视图；
图2示出根据本发明的一个喷嘴打印头的一个打印头芯片第一实施方式的喷嘴排列的示意性侧剖视图；
图3示出根据本发明的一个喷嘴打印头的一个打印头芯片的第二实施方式的喷嘴排列的三维侧剖视图；
图4示出图3的喷嘴排列的三维图示。
具体实施方式
在图2中，标号30总体上示出根据本发明的一个喷嘴打印头的一个打印头芯片第一实施方式的喷嘴排列。
喷嘴排列30是形成在硅晶片衬底32上的多个这种喷嘴排列之一，用于确定本发明的打印头芯片。如在本说明书的背景技术部分所指出，单个打印头可以含有高达84000个这种喷嘴排列。为了说明清楚和方便的目的，只说明一个喷嘴排列。可以理解本领域普通技术人员通过在晶片衬底32上简单地复制所述喷嘴排列30就可方便地得到所述打印头芯片。
所述打印头芯片是集成电路制造技术的产品。特别是每个喷嘴排列30都是以MEMS为基础的制造技术的产品。众所周知，这样的制造技术涉及沉积集成电路材料的功能层和牺牲层。蚀刻功能层以确定各种运动部件，蚀刻掉牺牲层以露出上述部件。众所周知，这种制造技术一般涉及在单个晶片上制造大数量的相似部件，接着切割所述单个晶片把各个部件相互分开。这加深了本领域普通技术人员可以通过复制喷嘴排列30方便地得到本发明的打印头芯片的看法。
一个电驱动电路层34置于硅晶片衬底32之上。所述电驱动电路层包括CMOS驱动电路。CMOS驱动电路的具体结构对本说明书不重要，并且因此示意地在附图中示出。说明它连接到一个适当的微处理器并且在从所述适当的微处理器接收一个赋能信号时向喷嘴排列30提供电流就够了。一个适当的微处理器的例子在以上引述的专利/专利申请中说明。因此在本说明书中不作这种程度的详细说明。
一个墨钝化层36置于驱动电路层34之上。所述墨钝化层36可以由诸如氮化硅的任何材料组成。
喷嘴排列30包括一个喷嘴腔结构38。喷嘴腔结构38确定一个喷嘴腔40并具有一个确定一个喷墨口44的顶部42。
喷嘴腔结构38包括一对对置的侧壁46、一个远端壁48和一个近端壁50，从而使得喷嘴腔40在平面上总体上是矩形的。
多个墨输入通路52通过硅晶片衬底32、驱动电路层34和墨钝化层36界定。一个墨输入通路52与每个相应的喷嘴腔40液体连通。而且，每个墨输入通路52都与每个相应的喷墨口44对齐。
喷嘴排列30包括一个叶片54形式的喷墨构件。叶片54的尺寸做得大体上与喷嘴腔40对应。而且，叶片54具有一个插入在墨输入通路52的一个开口58与喷墨口之间的远端部分56。叶片54可以在喷嘴腔40内部角位移，从而使远端部56可以朝向和离开喷墨口44移动。从而当喷墨腔40充有油墨60时，这种叶片移动造成喷嘴腔40内油墨压力起伏，使墨滴62从喷墨口44喷出。墨滴喷射的机制在前文引述的申请和专利中指出。因此其细节不在本说明书中叙述。
喷嘴排列30包括一个以热弯致动器64形式的致动器。这种形式的致动器也在前文引述的申请和专利中说明了，因此在本发明书中不进一步详细说明。然而，简而言之，热弯致动器64包括一个致动器臂66，所述致动器臂66具有一个固定到一个固定件70上的固定端68和一个工作端72，所述工作端72可以在接收驱动电路层34发出的电流脉冲形式的驱动信号后朝向和离开衬底32位移。
喷嘴排列30包括一个插入在致动器臂66的工作端72与叶片54的近端76之间的密封结构78。致动器臂66、密封结构78和叶片54是用单种材料进行沉积和蚀刻工艺的产品。然而臂66、密封结构78和叶片54是分离的部件。这方便了制造喷嘴排列30。
上述材料可以是用于集成电路制造工艺中的任何型号的材料。然而要求所述材料的热膨胀系数应当是使得当加热并且接着冷却时能够膨胀和收缩到足以在MEMS的规模上做功。而且，最好该材料是弹性的。本申请人发现氮化钛铝(TiAlN)特别适合于所述任务。
喷嘴排列30包括一个运动传递结构74，所述运动传递结构74把致动器臂66的工作端72与叶片54的近端部分76相互连接。该运动传递结构桥接密封结构78，使得密封结构78插入在运动传递结构74的至少一部分与密封结构78之间。
运动传递结构74包括一个从致动器臂66的工作端72伸出的施力结构80。运动传递结构74还包括一个从叶片54的近端部分76伸出的负载结构82。一个杠杆臂结构84把施力结构80和负载结构82相互连接。杠杆结构84的杠杆臂用对置的挠性连接器85形式的连接器枢转地连接在侧壁46之间。挠性连接器85构成得在杠杆臂结构84的枢转运动时经受扭转形变。因此应当理解，在致动器臂66的工作端72往复运动时，杠杆臂结构84枢转。如前所述，这种枢转运动通过负载结构82导致叶片54的角位移。
运动传递结构74和顶部42界定一个槽隙开口86，所述槽隙开口86提供结构74和顶部分42的相对运动。槽隙开口86置于从结构74和顶部42伸出的隆起88之间。隆起88的尺寸做得使在用油墨60灌充喷墨腔40时在隆起88之间确定一个流体密封90。类似地密封结构78和叶片54的近端76构成得使近端部分76与密封结构78之间确定一个流体密封92。
在图3和4中，标号100总体上指代一个根据本发明的打印头芯片的喷嘴排列，用于喷墨打印头。参见图2，除了另有说明之外，相同的标号指代相同的部分。
喷嘴排列100包括置于墨钝化层36上的喷嘴腔壁102。一个顶部104置于喷嘴腔壁102上使得顶部104和喷嘴腔壁102界定一个喷嘴腔106。喷嘴腔壁102包括一个远端壁108、一个近端壁110和一对对置的侧壁112。一个喷墨口114界定在顶部104中，以与喷嘴腔106流体连通。顶部104界定一个喷嘴边缘116和一个置于边缘116上方防止墨扩散的凹陷118。
壁102和顶部104构成得使喷嘴腔在平面上是矩形的。
多个墨输入通道120通过衬底32、驱动电路层34和墨钝化层36界定，墨输入通道120之一示于附图中。墨输入通道120与喷嘴腔106流体连通，从而可以向喷嘴腔106供应墨。
喷嘴排列100包括一个运动传递结构122。运动传递结构122包括一个施力结构124、一个杠杆臂结构126和一个负载结构128。杠杆臂结构126插入在施力结构124与负载结构128之间。
喷嘴排列100包括一个密封结构130，所述密封结构130固着在墨钝化层36上。特别地，密封结构130用初级层132和次级层134复合成。层132、134构成得使密封结构130可以弹性地形变，以使杠杆臂结构126能够相对衬底32枢转运动。层132、134可以由适合于集成电路制造工艺中的任何型号的材料制造。本申请人发现氮化钛铝(TiAlN)特别适合于层132，而钛适合于层134。
负载结构128确定近端壁110的部分。负载结构128用初级层136和次级层138复合成。如同密封结构130的情况那样，层136、138可以由适合于集成电路制造工艺中的任何型号的材料制造。然而，如上所述，用相继的沉积和蚀刻步骤制造喷嘴排列100。因此层136、136与层132、134用相同的材料是方便的。因此，层136、138可以分别由TiAlN和钛材料制造。
喷嘴排列100包括一个长形的矩形叶片140形式的喷墨构件。叶片140固定到负载结构128上并且伸向远端壁108。而且，叶片140的尺寸做得总体上对应喷嘴腔106。因此，叶片140以足够的能量趋向喷墨器114和离开喷墨口114的位移引起墨滴从喷墨口喷出。实现喷射墨滴的方式在前文引述的专利/申请中说明，因此不在此详细地说明。
为了方便制造，叶片140由TiAlN制造。特别地，叶片140是运动传递结构122的负载结构128的层136的延伸。
叶片140具有皱折142，用于在工作期间强化叶片140对抗挠曲。
施力结构124也用初级层144和次级层146复合。层144、146可以由用于集成电路制造工艺中的任何信号材料制造。然而，如上所述，用相继的沉积和蚀刻步骤制造喷嘴排列100。因此层144、146与层132、134用相同的材料是方便的。因此，层144、146可以分别由TiAlN和钛材料制造。
喷嘴排列100包括一个热弯致动器148形式的致动器。热弯致动器148由能够电阻性加热的导电材料制造。所述导电材料的热膨胀系数是，当加热并且接着冷却时，材料能够膨胀和收缩到足以在MEMS规模上做功的程度。
热弯致动器148可以是任何型号的前文引述的专利/专利申请中说明的热弯致动器。在一个示例中，热弯致动器148包括一个致动器臂150，所述致动器臂150具有一个主动部分152和一个被动部分。主动部分152具有一对内支腿154，而被动部分由置于所述一对内支腿154的每侧上的一个支腿确定。一个过桥部分156相互连接主动内支腿154与所述被动支腿。每个支腿154固定到从墨钝化层36伸出的主动固定件158形式的一对固定件结构之一上。每个主动固定件158构成得使支腿154电气地连接到驱动电路层34上。
每个被支腿固定到与驱动电路层34电绝缘的被动固定件160形式的一对固定件结构之一上。
从而支腿154和过桥部分156构成得使当从驱动电路层34中流出的电流建立在支腿154中时，致动器臂150受到差动加热。特别地，致动器臂150的形状做得使被动支腿插入在支腿154的至少一部分与衬底32之间。可以理解，这引起致动器臂150弯向衬底32。
因此桥接部分156确定一个致动器148的工作端。特别地，过桥部分156确定施力结构124的初级层144。从而，致动器148由TiAlN制造。本申请人发现这种材料完全适用于致动器148。
杠杆臂结构126布置在、并且固着于密封结构130、负载结构128和施力结构124各自的次级层134、138、136上。从而致动器148朝向和离开衬底32的往复运动通过运动传递结构122转换成叶片140的往复的角位移，以从喷墨口144喷墨。
每个主动固定件158和被动固定件也用初级层160和次级层162复合。层160、162可以由用于集成电路制造工艺中的任何信号的材料制造。然而，为了方便制造，层166由TiAlN制造，而层162由钛材料制造。
一个罩盖结构164置于固定件上以在致动器148上延伸并且盖住致动器148。气腔臂166在墨钝化层36与罩盖结构164之间延伸，从而使罩盖结构164和气腔壁166界定一个气腔168。从而致动器148和固定件置于气腔168中。
罩盖结构164、杠杆结构126和顶部104是整体的保护结构170的形式，以防止损坏喷嘴排列100。
保护结构170可以由用于集成电路制造工艺中的任何型号的材料制造。然而，本申请人发现二氧化硅特别适用于此任务。
应当理解，需要杠杆结构126能够相对罩盖结构164和顶部104移动。因此，这使得罩盖结构164和杠杆臂结构126能够通过与气腔169流体连通的槽隙开口172划分开。顶部104与杠杆臂结构126由一个与喷嘴腔106流体连通的槽隙开口174划分开。
杠杆臂结构126和顶部104一起界定联接槽隙开口174的隆起176。从而，当用油墨灌充喷嘴腔106时，所述隆起176在喷墨期间确定一个流体密封。隆起176通过为由墨形成的弯液面提供适当的粘附表面而起防止墨扩散的作用。
槽隙开口172、174划分出一对由保护结构170确定的对置挠性连接器形式的可弹性挠曲的连接器。所述挠性连接器178构成得可经受扭转形变，以提供在喷嘴排列100工作过程中的杠杆臂结构126的枢转运动。保护结构170的二氧化硅可以在MEMS规模上弹性地挠曲，并且从而适用于这样的往复形变。
应当理解叶片140、密封结构130和致动器臂150是分离的部件。这方便了制造喷嘴排列100同时还保留了有效地运动传递和密封的优点。

Claims (8)

1.一种用于喷墨打印头的打印头芯片，所述的打印头芯片包含：
一个衬底；和
多个置于所述衬底之上的喷嘴排列，每个喷嘴排列包含：
一个喷嘴腔结构，所述喷嘴腔结构界定一个其中容纳墨的喷嘴腔；
一个喷墨口，墨从所述喷嘴腔中通过所述喷墨口喷出；
一个喷墨构件，所述喷墨构件置于所述喷嘴腔中，并且可以在喷嘴腔中移动以从所述喷嘴腔喷墨；
至少一个置于所述衬底之上的致动器，所述致动器具有一个当该致动器接收一个驱动信号时可相对于所述衬底移动的工作部分；
一个密封结构，所述密封结构置于所述衬底上，并且插入在致动器与所述喷墨构件之间以阻止墨在喷墨构件和致动器之间通过；和
一个桥接所述密封结构的运动传递结构，该运动传递结构包括一个连接到致动器的工作部分的施力结构、一个连接到喷墨构件的负载结构和一个把施力结构和负载结构相互连接的杠杆臂结构，所述杠杆臂结构相对于喷嘴腔结构枢转，从而致动器的工作部分的往复运动由杠杆结构的枢转运动提供，使得喷墨构件朝向和离开喷墨口往复移动。
2.如权利要求1所述的打印头芯片，其中，所述衬底包括一个硅晶片衬底和一个置于所述晶片衬底上的CMOS驱动电路层。
3.如权利要求2所述的打印头芯片，其中，喷嘴腔结构包括从所述衬底伸出的喷嘴腔壁和一个跨所述喷嘴腔壁的项部，所述喷墨口形成在所述顶部。
4.如权利要求3所述的打印头芯片，其中，所述喷嘴腔壁和顶部构成为使喷嘴腔基本上在平面上是矩形的，同时所述喷嘴腔确定一个远端壁、一个近端壁和一对对置的侧壁。
5.如权利要求4所述的打印头芯片，其中，每个喷嘴排列的密封结构和运动传递结构确定至少一部分的近端壁。
6.如权利要求1所述的打印头芯片，其中，每个喷嘴排列包括一个热弯致动器，所述热弯致动器包括一个长形的致动器臂，所述长形的致动器臂具有一个相对于衬底固定的固定端和一个工作端，所述工作端由可以相对于衬底移动的工作部分确定，所述的热弯致动器构成为：在致动器接收从驱动电路层发出的一个驱动信号时，所述长形的致动器层向衬底弯曲，所述工作端固定在运动传递结构的施力结构上，使得在致动器臂向衬底移动时，杠杆臂枢转并且负载结构作用在喷墨构件上以向喷墨口驱动喷墨构件。
7.如权利要求1所述的打印头芯片，其中，所述杠杆结构用一对对置的可弹性地挠曲的连接器安装在喷嘴腔层上。
8.一种包括至少一个如权利要求1所述的打印头芯片的喷墨打印机。
CNB028287444A 2002-04-12 2002-06-13 内含多个喷嘴排列的喷墨打印头芯片及喷墨打印机 Expired - Fee Related CN1314541C (zh)

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