DE102004003928B4 - A miniaturized SM-technology optoelectronic device and method of making this device - Google Patents
A miniaturized SM-technology optoelectronic device and method of making this device Download PDFInfo
- Publication number
- DE102004003928B4 DE102004003928B4 DE102004003928A DE102004003928A DE102004003928B4 DE 102004003928 B4 DE102004003928 B4 DE 102004003928B4 DE 102004003928 A DE102004003928 A DE 102004003928A DE 102004003928 A DE102004003928 A DE 102004003928A DE 102004003928 B4 DE102004003928 B4 DE 102004003928B4
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- Germany
- Prior art keywords
- frame
- electrically conductive
- optoelectronic
- resin composition
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005693 optoelectronics Effects 0.000 title claims abstract description 44
- 238000005516 engineering process Methods 0.000 title claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000011342 resin composition Substances 0.000 claims abstract description 12
- 239000004020 conductor Substances 0.000 claims abstract description 5
- 230000003014 reinforcing effect Effects 0.000 claims abstract 2
- 239000002184 metal Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 230000032798 delamination Effects 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000004873 anchoring Methods 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Ein auf SM-Technologie basierendes optoelektronisches Bauelement mit: einem elektrisch leitenden Rahmen (1), der als Grundmaterial für die Bestückung verwendet wird, mindestens ein optoelektronischer Chip (3), der auf das Grundmaterial aufgesetzt ist; und einer elektrischen Verbindung zwischen dem optoelektronischen Chip (3) und dem elektrisch leitenden Material (1) mittels Verdrahtungsmittel (6); Lötstützpunkten die Teil des elektrisch leitenden Rahmens sind und die am Boden und Seitenteilen des Bauelements zugänglich sind, eine Reihe von in den elektrisch leitenden Rahmen eingearbeiteter Rillen und Flügel zum Verstärken einer Verankerung ung, wobei sich zur Bildung eines Flügels eine umlaufende Fläche des Rahmens von einer unteren Basisfläche des Rahmens zu einer oberen Fläche des Rahmens nach außen erweitert, derart, dass sich eine Ausbuchtung zur Aufnahme einer Harzmasse bildet, wobei der elektrisch leitende Rahmen mit einer harten durchsichtigen oder Licht durchlässigen Harzmasse eingeschlossen ist, um das...An SM technology-based optoelectronic device comprising: an electrically conductive frame (1) used as a base material for mounting, at least one optoelectronic chip (3) mounted on the base material; and an electrical connection between the optoelectronic chip (3) and the electrically conductive material (1) by means of wiring means (6); Lötstützpunkten which are part of the electrically conductive frame and which are accessible at the bottom and side parts of the device, a series of incorporated in the electrically conductive frame grooves and wings for reinforcing an anchoring ung, wherein forming a wing, a circumferential surface of the frame of a lower base surface of the frame to an upper surface of the frame widens outwardly, so as to form a recess for receiving a resin composition, wherein the electrically conductive frame is enclosed with a hard transparent or light-permeable resin composition to the ...
Description
Gebiet der ErfindungField of the invention
Die vorliegende Erfindung bezieht sich auf ein mit Surface Mount Technologie bestückbares optoelektronisches Bauelement.The present invention relates to a mountable with surface mount technology optoelectronic device.
Technologischer HintergrundTechnological background
Heutzutage sind viele verschiedene Arten von mit SM-Technologie bestückbaren optoelektronischen Bauelementen erhältlich. Im allgemeinen können sie in zwei Hauptgruppen unterteilt werden. Die erste Hauptgruppe bezieht sich auf die auf PCBs montierten mit SM-Technologie bestückbaren optoelektronischen Bauelemente. Diese Arten von optoelektronischen Bauelementen werden häufig in weniger anspruchsvollen Anwendungen wie Unterhaltungselektronik eingesetzt. Als Beispiel dienen die 0603 Chip LED-Produkte, die heute erhältlich sind. Ein PCB wird als Grundmaterial verwendet. Metallisierte Bahnen und Lotflecken werden für Chip-Befestigung, Drahtanschluss und Verlöten der Lötstifte bereitgestellt. Dieses optoelektronische Bauelement stellt ein einfaches Mittel zur Verfügung, um kleine Baugrößen und niedrige Höhenprofile zu erzielen. Es hat jedoch seine eigenen Grenzen. Wärmeableitung ist aufgrund der schlechten thermischen Leitfähigkeit des PCB-Materials beschränkt. Außerdem sind die Produkte bei Feuchtigkeit und hohen Temperaturen störanfällig.There are many different types of optoelectronic devices available with SM technology available today. In general, they can be divided into two main groups. The first main group refers to PCB-mounted SM technology-mountable optoelectronic devices. These types of optoelectronic devices are often used in less demanding applications such as consumer electronics. For example, the 0603 Chip LED products available today. A PCB is used as the base material. Metallized traces and solder pads are provided for die attach, wire termination, and solder pin soldering. This optoelectronic device provides a simple means to achieve small sizes and low height profiles. However, it has its own limits. Heat dissipation is limited due to the poor thermal conductivity of the PCB material. In addition, the products are prone to failure in moisture and high temperatures.
Die zweite Gruppe bezieht sich auf mit SM-Technologie bestückbare optoelektronische Bauelemente, die auf Leiterrahmen aufsitzen. Dieser Typ optoelektronischer Bauelemente ist in anspruchsvolleren Anwendungen aus Industrie und Automobilbau weit verbreitet. Ein klassisches Beispiel sind die PLCC2 und PLCC4 Bauteile. Im
Zusammenfassung der ErfindungSummary of the invention
Entsprechend wird ein miniaturisiertes mit SM-Technologie bestückbares optoelektronisches Bauelement bereitgestellt. Das optoelektronische Bauelement beinhaltet ein elektrisch leitendes Material, das eingesetzte Material wird als Grundmaterial für die Bestückung verwendet, mindestens einen optoelektronischer Chip, der auf das Grundmaterial aufgesetzt ist, sowie eine elektrische Verbindung zwischen dem optoelektronischen Chip und dem elektrisch leitenden Material mittels Verdrahtungsmitteln (
Das Bauelement dient für hochintegrierte Anwendungen, bei denen Größe ein kritisches Merkmal darstellt. Die Erfindung ist auch hinsichtlich der Wärmeableitung leistungsfähiger, da ein dickes Grundmaterial als Wärmesenke beim vorliegenden Design verwendet wird.The device is used for highly integrated applications where size is a critical feature. The invention is also more efficient in terms of heat dissipation since a thick base material is used as the heat sink in the present design.
Die vorliegende Erfindung besteht aus gewissen neuen Eigenschaften und einer Verbindung von Bauteilen, die nachfolgend in den beiliegenden Zeichnungen vollständig beschrieben und veranschaulicht werden und die insbesondere in den beiliegenden Ansprüchen herausgestellt werden.The present invention consists of certain novel features and a combination of components which are fully described and illustrated hereinafter in the accompanying drawings and which are pointed out with particularity in the appended claims.
Kurze Beschreibung der ZeichnungenBrief description of the drawings
Zum Zwecke einer Vereinfachung des Verständnisses der Erfindung wird die bevorzugte Ausführung davon in den beiliegenden Zeichnungen veranschaulicht, aus deren Untersuchung im Zusammenhang mit der folgenden Beschreibung die Erfindung, ihr Aufbau und Betrieb und viele ihrer Vorteile unmittelbar zu verstehen und anzuerkennen sein werden.For the purpose of simplifying the understanding of the invention, the preferred embodiment thereof is illustrated in the accompanying drawings, the examination of which, taken in conjunction with the following description, will be readily understood and appreciated the benefit of the invention, its construction and operation, and many advantages thereof.
Detaillierte Beschreibung der bevorzugten AusführungenDetailed description of the preferred embodiments
Die vorliegende Erfindung bezieht sich auf ein mit SM-Technologie bestückbares optoelektronisches Bauelement. Ab hier beschreibt diese Spezifikation das optoelektronische Bauelement entsprechend den bevorzugten Ausführungen und mit Referenz auf die beiliegenden Zeichnungen. Bezugnehmend auf die Zeichnungen basiert das optoelektronische Bauelement auf der Surface Mount Technologie. Ein elektrisch leitendes Material (
Lötstützpunkte (
Der elektrisch leitende Rahmen (
Optional kann eine Eintiefung (
In einer anderen Ausführung kann eine Linsenstruktur (
In einer anderen Ausführung kann auch eine mehrfache Linsenstruktur integriert werden, um verschiedene funktionale Zwecke zu erzielen. Elektrische Verbindung(en) zwischen dem Chip und dem Grundmaterial wird (werden) durch einen metallischen Draht oder Drähte (
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004003928A DE102004003928B4 (en) | 2004-01-26 | 2004-01-26 | A miniaturized SM-technology optoelectronic device and method of making this device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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DE102004003928A DE102004003928B4 (en) | 2004-01-26 | 2004-01-26 | A miniaturized SM-technology optoelectronic device and method of making this device |
Publications (2)
Publication Number | Publication Date |
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DE102004003928A1 DE102004003928A1 (en) | 2005-08-25 |
DE102004003928B4 true DE102004003928B4 (en) | 2012-02-23 |
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DE102004003928A Expired - Lifetime DE102004003928B4 (en) | 2004-01-26 | 2004-01-26 | A miniaturized SM-technology optoelectronic device and method of making this device |
Country Status (1)
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DE (1) | DE102004003928B4 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006043404A1 (en) * | 2006-09-15 | 2008-03-27 | Osram Opto Semiconductors Gmbh | Surface mountable package for a semiconductor chip |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19615839A1 (en) * | 1996-04-20 | 1997-10-23 | Abb Patent Gmbh | SMD light emitting diode |
WO1997050132A1 (en) * | 1996-06-26 | 1997-12-31 | Siemens Aktiengesellschaft | Light-emitting semiconductor component with luminescence conversion element |
JPH1051034A (en) * | 1996-08-01 | 1998-02-20 | Rohm Co Ltd | Surface-mount electronic component, its manufacture, method for mounting the component on circuit board, and circuit board mounting the component |
JPH1146018A (en) * | 1997-07-28 | 1999-02-16 | Citizen Electron Co Ltd | Surface mounted type light-emitting diode |
JP2001077424A (en) * | 1999-09-06 | 2001-03-23 | Sharp Corp | Optical semiconductor device and manufacture thereof |
DE10117889A1 (en) * | 2001-04-10 | 2002-10-24 | Osram Opto Semiconductors Gmbh | Leadframe used for a light emitting diode component comprises a chip assembly region, a wire connecting region, external electrical connecting strips, and a support part coupled with a thermal connecting part |
JP2002314148A (en) * | 2001-04-13 | 2002-10-25 | Citizen Electronics Co Ltd | Surface mount type light emitting diode and manufacturing method thereof |
JP2002324917A (en) * | 2001-04-26 | 2002-11-08 | Citizen Electronics Co Ltd | Surface mount light emitting diode and method of manufacturing the same |
US20030089914A1 (en) * | 2001-11-14 | 2003-05-15 | Solidlite Corporation | Surface-mounted devices of light-emitting diodes with small lens |
US20030141563A1 (en) * | 2002-01-28 | 2003-07-31 | Bily Wang | Light emitting diode package with fluorescent cover |
-
2004
- 2004-01-26 DE DE102004003928A patent/DE102004003928B4/en not_active Expired - Lifetime
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19615839A1 (en) * | 1996-04-20 | 1997-10-23 | Abb Patent Gmbh | SMD light emitting diode |
WO1997050132A1 (en) * | 1996-06-26 | 1997-12-31 | Siemens Aktiengesellschaft | Light-emitting semiconductor component with luminescence conversion element |
JPH1051034A (en) * | 1996-08-01 | 1998-02-20 | Rohm Co Ltd | Surface-mount electronic component, its manufacture, method for mounting the component on circuit board, and circuit board mounting the component |
JPH1146018A (en) * | 1997-07-28 | 1999-02-16 | Citizen Electron Co Ltd | Surface mounted type light-emitting diode |
JP2001077424A (en) * | 1999-09-06 | 2001-03-23 | Sharp Corp | Optical semiconductor device and manufacture thereof |
DE10117889A1 (en) * | 2001-04-10 | 2002-10-24 | Osram Opto Semiconductors Gmbh | Leadframe used for a light emitting diode component comprises a chip assembly region, a wire connecting region, external electrical connecting strips, and a support part coupled with a thermal connecting part |
JP2002314148A (en) * | 2001-04-13 | 2002-10-25 | Citizen Electronics Co Ltd | Surface mount type light emitting diode and manufacturing method thereof |
JP2002324917A (en) * | 2001-04-26 | 2002-11-08 | Citizen Electronics Co Ltd | Surface mount light emitting diode and method of manufacturing the same |
US20030089914A1 (en) * | 2001-11-14 | 2003-05-15 | Solidlite Corporation | Surface-mounted devices of light-emitting diodes with small lens |
US20030141563A1 (en) * | 2002-01-28 | 2003-07-31 | Bily Wang | Light emitting diode package with fluorescent cover |
Also Published As
Publication number | Publication date |
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DE102004003928A1 (en) | 2005-08-25 |
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Owner name: DOMINANT OPTO TECHNOLOGIES SDN BHD, MY Free format text: FORMER OWNERS: CHIONG, TAY KHENG, MELAKA, MY; SHIN, LAI KHIN, MELAKA, MY; BENG, LOW TEK, MELAKA, MY Effective date: 20121017 Owner name: DOMINANT OPTO TECHNOLOGIES SDN BHD, MY Free format text: FORMER OWNER: TAY KHENG CHIONG,LAI KHIN SHIN,LOW TEK BENG, , MY Effective date: 20121017 |
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