DE102009008845A1 - Light module and method for producing a light module - Google Patents

Abstract

Luminous module (40), in particular a flexible light module, comprising at least one profile (41) and a light strip (43) arranged in the profile (41), the light strip (43) having a printed circuit board (44) fitted with semiconductor light sources (46), in particular light emitting diodes ), wherein the printed circuit board (44) with a potting compound (47) is cast opaque and wherein a luminous surface of the semiconductor light sources (46) of eienr transparent cover layer (49) is covered.

Description

The The invention relates to a light module with a light strip and a Method for producing such a light module.

So far LED modules are known in which an LED strip is in a longitudinal direction band-shaped U-profile inserted and then completely shed with a transparent potting compound becomes. An LED strip typically has several on its top Light emitting diodes (LEDs) and can at certain intervals (z. B. every 20 cm) are separated for confectioning. In these known LED modules are also the luminous surfaces of the LEDs with the Covering compound covered. Such a potted LED module has the advantage on that, due to the consistent surface from potting compound at a bend of the light module no cracks arise between the LEDs and the potting compound, which could lead to the ingress of dirt or moisture. adversely It is that the LED tape is visible and can also be damaged by UV radiation.

Further LED modules are known in which an LED strip in a band-shaped C-profile is inserted and then completely shed with a transparent potting compound becomes. As a result, the light strip is optically protected from UV radiation, however is an introduction costly and for size lengths little suitable.

Further LED modules are known in which an LED tape is cast, which mainly radial having radiating LEDs. To the absorption of the LED radiation In a potting compound to prevent the LEDs protrude with their luminous surface of the Casting compound out. However, you can now at a bend comparatively easy cracks between the LEDs and the potting compound arise.

It the object of the present invention is a particularly colorfast, reliable and provide optically responsive LED module.

These Task is by means of a light module and by means of a method solved for producing a light module. Preferred embodiments are in particular the dependent ones claims removable.

The Light module has at least one band-shaped profile or a rail and a light band arranged in the profile, wherein the light band has a band-shaped printed circuit board equipped with semiconductor light sources. The circuit board is potted with a translucent potting compound. A light area the semiconductor light sources is covered by a transparent cover layer. This light module has the advantage that by the potting compound the printed circuit board with its electronic components fitted thereon protected against UV radiation is and is no longer visible. The translucency can also cover small bubbles, which are perceived artistically as "unpleasant". Through the transparent cover layer can also protect against Cracking on bending of the light module at the same time largely lossless Light transmission and even an increase the decoupling efficiency can be achieved. Also can be another protection achieve UV radiation. Advantageously, the circuit board by means of the translucent potting compound essentially shed opaque so that details of the circuit board such as electronic components or Tracks are no longer clearly visible. May like the circuit board only be recognizable in their dimensions. The circuit board but by the translucent potting compound but also completely opaque to be shed.

Generally that applies the opacity the material of the potting compound higher is that of the material of the topcoat. The property the cover layer as transparent also includes a property as essentially transparent, in which case a weakening of a intensity a passing through the cover layer light beam negligible is, especially in comparison to a weakening when passing through the potting compound. An opacity level For example, by adding at least one filler and / or a type and / or density of the filler. there a base material of the potting compound and the topcoat may be the same be, z. Silicone. This base material can also be used for manufacturing the profile rails are used.

The Potting compound may advantageously be white. This allows a neutral color reflection of scattered light. This can be special in optical systems (eg for the backlighting of diffuse display panels) be beneficial. Also, a black potting compound may be preferred especially when a light output is strictly applied to the semiconductor light sources limited shall be. However, other colors are possible, for. B. from the RGB color space.

advantageously, may increase the topcoat the coupling-out efficiency is a function of an optical element, e.g. As a lens, take over. For this purpose, for example, it can be concave on its free surface or convex. The cover layer can be replaced by any be applied suitable method, advantageously as a dispersion, z. B. by means of a Vergusses.

advantageously, For example, the cover layer can be designed to be color-selective, in particular have at least one color-selective filler, in particular a phosphor, z. B. as so-called. "Remote Phosphor". A color-selective topcoat may be used in particular as a color-selective absorbent or phosphorescent or fluorescent cover layer designed be. As a result, the cover layer can be targeted to produce a specific Tints are used, in particular by a passing therethrough Light regarding the corresponding color (s) at least partially absorbed or converted becomes. In other words, 'color selective' can be at least for some wavelength regarded as 'color changing' be, by at least partial absorption certain Wavelengths and / or through reinforcement certain wavelengths. The color-selective absorption can be particularly advantageous in combination with multicolor and / or white LEDs are used. The color-selective fluorescence can in particular can be advantageously used in combination with blue LEDs or UV LEDs, in particular for achieving a conversion effect.

The Light module can be used for easy installation advantageously as be configured flexible light module. These are the profile, the Potting compound, the circuit board and the cover layer made flexible. The Profile, the potting compound and the cover layer can advantageously to be made of silicone. The circuit board can advantageously with her unembellished Bottom or back be glued to the profile, z. B. by means of - in particular opaque - adhesive tape, z. B. double adhesive tapes.

The at least one semiconductor light source may comprise at least one diode laser but advantageously at least one light-emitting diode. The LED can be monochrome or multicolored, z. B. white, radiate. In the presence of several LEDs, these z. B. same color (monochrome or multicolored) and / or different colors shine. For example, an LED module may have several LED chips ('LED clusters'), which together a white Can give mixed light, z. B. in 'cold white' or 'warm white'. to Generation of a white one Mixed light, the LED cluster preferably includes LED chips in the Basic colors red (R), green (G) and blue (B) light up. As can be single or multiple Colors can also be generated by several LEDs at the same time; so are Combinations RGB, RRGB, RGGB, RGBB, RGGBB etc. possible. however the color combination is not limited to R, G and B. to Generation of a warm white Shades can for example, one or more amber amber LEDs (A) and / or white LEDs (W) be present. For LEDs with different colors, these can Also be controlled so that the LED module in a tunable RGB color range radiates. To produce a white light a mixture of blue light with yellow light can also with phosphor provided LED chips are used, for. In surface mount technology, z. B. in so-called. Chip-level conversion technique. It can too Other methods are used, such as a red / green combination using the conversion technique. Of course, also a "classic" volume conversion possible. One LED module can also be several white Single-chip, resulting in easy scalability reach the luminous flux. The single LEDs and / or the modules can be fitted with suitable optics for beam guidance equipped be, z. B. Fresnel lenses, collimators, and so on. Instead or additionally to inorganic light emitting diodes, z. Based on InGaN or AlInGaP, In general, organic LEDs (O-LEDs) can be used.

The Semiconductor light sources can to minimize the path lengths be advantageously arranged in the cover layer so that their Main emission direction upwards (out of the profile) points. The LEDs can In this case, so-called top LEDs whose emission direction with respect to a underside bearing surface directed upward, in which case the top LEDs with their bearing surface in particular can rest on a floor of the profile. But the LEDs can for example, so-called side LEDs, whose emission direction in terms of a lower side bearing surface is directed to one side, with the side LEDs then with their bearing surface in particular can rest on a side wall of the profile. The So Side LEDs can in terms of its horizontal orientation rotated by 90 ° attached to the profile, z. B. glued to it, and then shed analogous to the top LEDs be.

advantageously, the semiconductor light source with the potting compound substantially opaque to a surface having the respective luminous surface to be shed. Thereby, the body of the semiconductor light source (s) opaque, and the semiconductor light source (s) can also be hidden be highlighted in a designed state, while their environment recedes.

For heat dissipation from the light strip, in particular the light sources, and the following heat spreading, the potting compound and / or the cover layer may comprise a thermally conductive filler, for. AlN or Al ₂ O ₃ . To avoid damage due to an electrostatic discharge, the potting compound and / or the cover layer may have an electrically conductive filler. For fire prevention, the potting compound and / or the cover layer may advantageously comprise a flame-retardant filler. To avoid or at least least suppression of material aging, the potting compound and / or the cover layer may advantageously have a sulfur and / or air-binding filler. A filler may have one or more of the stated properties.

It may be advantageous if the potting compound and / or the cover layer Silicone as a base material, since silicone comparatively resistant to aging, simple manageable, flexible or elastic ausgestaltbar and inexpensive is. Also, the profile may have silicone as a base material, and indeed transparent or colored or opaque.

advantageously, the light module can at least one separation point for separation of the lighting module, wherein the light strip or its printed circuit board at least one separation point in each case at least one electrical Having connecting element, which by separating at the separation point prepared for electrical connection or is prepared. The Light module is advantageously at the separation points of the light strip separable; the separation points or dividing lines of light module and Luminous band thus coincide.

At the contact points (such as the separation points), the circuit board with suitable sleeves, Cables and / or jumpers, etc., to be contacted to facilitate after a separation.

The PCB can alternatively or additionally with plugs and / or Bushings fitted are, which by the separation, z. B. cutting, the light module be exposed and contacted. This has the advantage on that the PCB does not need to be exposed and a tightness of the light module is given undiminished.

to Facilitating the separation process, the light module at a separation point advantageously have one or more predetermined breaking points, for. B. a perforated breaking point.

advantageously, For example, the lighting module can have at least one potted power supply line laid in the profile (For example, at least one wire, at least one cable, in particular a cable with an average of about AWG24, etc.), preferably two power supply lines. Because of the much higher Conductor cross-section compared to applied on the circuit board Leaves yourself for the a maximum tape length relevant ampacity increase greatly or the voltage drop greatly reduce and so the tape length to a Multiply many times.

to Particularly simple contacting, it may be advantageous if the at least one power supply line can be contacted by the profile, z. B. by use of insulation displacement terminals or piercing contacts. Through this kind of contacting can a tightness of the light module due to a circuit the contacts maintained by the profile and / or the potting stay.

to simple contact on an end face, z. B. a separation point, the potting compound can at least in the region of the separation point of the light strip solvable be. It does not like between the light strip and the potting compound or a low liability. This allows the potting compound be easily removed, and connection points or connection elements on the illuminated strip are easily accessible. To realize the Bad or missing adhesion can attach the PCB to the desired one Make selective pretreatment, z. B. by means of documents a poorly adhering to the potting compound or a plasma treatment.

• a) Die Vergussmasse (und ggf. der darauf aufgebrachte Abschnitt der Deckschicht) wird von der Leiterplatte abisoliert, und auf den abisolierten Teil der Leiterplatte wird ein Stecker aufgesteckt. Diese Methode weist den Vorteil eines sicheren Sitzes des Steckers auf. Durch den Aufsatz des Steckers können die freigelegten Kontakte und die Leiterplatte geschützt werden.
• b) Ein Stecker wird unter Materialverdrängung der Vergussmasse (und ggf. des darauf aufgebrachten Abschnitts der Deckschicht) aufgesteckt. Diese Methode weist den Vorteil einer Abdichtung des Steckers durch die daran unter Druck anliegende Vergussmasse auf.
• c) Auch kann ein Stecker mittels Kontaktierens in einem ”Hohlraum” aufgesetzt werden.

In general, but advantageously using the low or absent adhesion of the potting compound to a separation area, the following connection possibilities can result, for example:

• a) The potting compound (and possibly the applied thereto portion of the cover layer) is stripped from the circuit board, and on the stripped part of the circuit board, a plug is plugged. This method has the advantage of a secure fit of the plug. Through the attachment of the connector, the exposed contacts and the circuit board can be protected.
• b) A plug is plugged under material displacement of the potting compound (and possibly the applied thereon section of the cover layer). This method has the advantage of sealing the plug by the pressure applied thereto potting compound.
• c) Also, a plug can be placed by means of contacting in a "cavity".

• – Aufdruck oder Lasermarkierung an der Trennstelle;
• – Vorsehen eines transparenten Profils und einer farbigen Vergussmasse, wodurch eine Trennstelle auf der Rückseite einer nicht vergossenen, sondern auf dem Profil aufliegenden Leiterplatte sichtbar gemacht werden kann;
• – Vorsehen erhabener (sich nach außen wölbender usw.) und/oder durchscheinender Komponenten;
• – Erstellen einer Nut an der Außenseite des Leuchtmoduls, z. B. durch Fräßen, Ritzen, Schmelzen usw.;
• – Einbringen einer Öffnung, z. B. eines Lochs, in die Leiterplatte, wobei die Öffnung im Gegenlicht sichtbar ist und die Schneidstelle markiert.

Since the separation mark of the light band between unit sections is covered by the encapsulation, it may be advantageous to ensure easy separability, if the light module has at least one mark for marking a separation point. The marking can be realized, for example, in the following ways:

• - imprint or laser marking at the separation point;
• - Providing a transparent profile and a colored potting compound, whereby a separation point can be made visible on the back of a non-potted, but resting on the profile circuit board;
• Providing raised (outwardly arching etc.) and / or translucent components;
• - Creating a groove on the outside of the light module, z. B. by milling, scratches, melting, etc .;
• - introducing an opening, z. As a hole in the circuit board, wherein the opening is visible in the backlight and marks the cutting point.

To stick particles, e.g. As dust particles, on the light module, in particular on a possibly sticky top layer, to prevent the light module can be advantageously surface-treated, in particular plasma-treated or UV-irradiated, be. A plasma treatment can, for. B. by O ₂ , silicate or parylene be performed.

The Method is used to produce such a light module, wherein the potting compound is poured in at least the following two steps: recast of on-board electronic components (transistors, Resistors, etc.) by means of the potting compound; and final casting by means of the potting compound. The first step will be the education from blurring critical sharp-edged or leaping electrically encapsulated electronic components. A possible blistering is thereby prevented. The following potting is on by abandoned the first potting step already straightened surface, with no significant blistering occurring. The of the Covered in the second Vergussschritt potting compound covered Bubbles are then for hiding a viewer.

Blow can also further suppressed be that the electronic components glued to the circuit board be under cavities to avoid the components.

alternative Bubble formation can also be prevented by a vacuum casting be, which results in a simpler potting at higher equipment cost.

• 1) Herstellen des Leuchtbands in der richtigen Länge.
• a) Dazu kann das Leuchtband entsprechend zugeschnitten werden, und an den Endbereichen werden geeignete Bauelemente zur Vorbereitung einer Kontaktierung befestigt (z. B. Hülsen, Kabel, Jumper usw., die beispielsweise durch Schneidklemmen oder Piercingkontakte kontaktiert werden können).
• b) Die Leiterplatte kann an einer möglichen Trennstelle mit z. B. Steckern und/oder Buchsen bestückt werden, die durch einen Trennvorgang freigelegt und kontaktiert werden können.
• 2) Bereitstellen eines Profils bzw. einer Profilschiene
• 3) Zusammenführen von Leuchtband und Profil. Dies kann besonders vorteilhaft durch eine Rolle-zu-Rolle-Fügung durchgeführt werden.
• a) Vorteilhafterweise können auch Stromführungsleitungen in die Profilschiene eingelegt werden.
• b) Die Platine kann zur reduzierten Haftung der Vergussmasse an einem Trennbereich vorbereitet werden.
• 4) Vergießen des Profils und dadurch Vergießen des Leuchtbands bis zu einer Oberkante bzw. Oberfläche der Halbleiterlichtquellen mittels einer farbigen (einschließlich weißen oder schwarzen) Vergussmasse. Dieses Vergießen kann beispielsweise in zwei Schritten wie oben beschrieben oder als Vakuumvergießen durchgeführt werden.
• 5) Dispensieren bzw. Vergießen einer transparenten Deckschicht
• 6) Markieren der Trennstellen
• 7) Oberflächenbehandeln, z. B. mittels einer Plasmabehandlung

The LED module can be produced by way of example by means of the following steps:

• 1) Make the luminous band in the correct length.
• a) For this purpose, the light strip can be cut to size, and at the end regions suitable components for preparing a contact are attached (eg, sleeves, cables, jumpers, etc., which can be contacted, for example, by insulation displacement or Piercingkontakte).
• b) The circuit board can be connected to a possible separation point with z. B. plugs and / or sockets are fitted, which can be exposed and contacted by a separation process.
• 2) Providing a profile or a profile rail
• 3) Merging of light strip and profile. This can be carried out particularly advantageously by a roll-to-roll joining.
• a) Advantageously, power supply lines can be inserted into the rail.
• b) The board can be prepared for reduced adhesion of the potting compound at a separation area.
• 4) potting the profile and thereby potting the fluorescent strip up to an upper edge or surface of the semiconductor light sources by means of a colored (including white or black) potting compound. This potting may for example be carried out in two steps as described above or as a vacuum casting.
• 5) Dispensing or potting a transparent cover layer
• 6) Marking the separation points
• 7) Surface treatment, e.g. B. by means of a plasma treatment

In The following figures illustrate the invention with reference to exemplary embodiments described in more detail schematically. It can for better clarity identical or equivalent elements with the same reference numerals be provided.

1 shows a cross-sectional view in front view of a conventional LED module;

2 shows a cross-sectional view in front view of another conventional LED module;

3 shows a cross-sectional view in front view of yet another conventional LED module;

4 shows a cross-sectional view in front view of an inventive LED module according to a first embodiment;

5 shows a cross-sectional view in front view of an inventive LED module according to a second embodiment;

6 shows a cross-sectional view in front view of an inventive LED module according to a third embodiment;

7 shows a cross-sectional view in front view of an inventive LED module with contact elements of a first embodiment;

8th shows a cross-sectional view in front view of an inventive LED module with contact elements of a second embodiment in the unseparated state;

9 shows a cross-sectional view in front view of an inventive LED module with contact elements of the second embodiment in the separated state;

10 shows in plan view of an inventive LED module, which is contacted by means of a plug according to a first method;

11 shows in plan view of an inventive LED module, which is contacted by means of a plug according to a second method.

1 shows a cross-sectional view in front view of a conventional LED module 1 , The conventional LED module 1 has a U-shaped profile or a rail 2 with an open side up. In the profile 2 is an LED band 3 arranged, which a flexible, band-shaped printed circuit board ("Flexband") 4 which is on a top or front 5 with light-emitting diodes 6 is equipped, of which here only a light emitting diode 6 is shown. The profile 2 is complete with a transparent potting compound 7 shed. This means that even the LED band 3 completely in the potting compound 7 is embedded. This is also a top 8th the LED 6 with the potting compound 7 covered, with the top 8th the illuminated area of the LED 6 having. Such a light-emitting diode 6 which radiates in the opposite direction with respect to its underside bearing surface, here: along the z-axis, is also called top LED 6 designated. This embodiment of the LED module 1 has the advantage that it is due to the potting compound 7 has a protective sheath, z. B. to achieve certain IP protection classes, which also under a bend of the LED band 1 shows no surface cracks. However, it is disadvantageous here that radiation reflected back from the surface of the potting compound or from the outside into the LED strip 1 incident radiation through the transparent potting compound 7 can run and color distorted can be radiated back to the outside. Also, so is the entire top surface of the LED tape 3 visible, which causes a disadvantageous appearance. Furthermore, a transparent potting compound is relatively permeable to UV radiation, which on the circuit board 4 located electronic components (not shown). The LED band 3 is typically called a quasi-endless LED band 3 offered and can at predetermined intervals, z. B. 200 mm, to be separated. This corresponds to a composition of the LED band 3 of connected, separable light sections of 200 mm in length.

2 shows in one too 1 analog representation of another embodiment of a conventional LED module 10 in which the LED band 3 in a C-shaped profile 11 is housed. The LED band 3 is now comparatively narrow, but still with sufficient distance to introduce the potting compound 7 in the profile 11 arranged. The LED band 3 can not be used from above, but must be in the profile 11 be inserted. This is comparatively expensive. Here, too, the potting compound 7 beyond the top surface provided with the luminous surface 8th the top LED 6 ,

3 shows in one too 1 and 2 analog representation of another conventional LED module 20 , Instead of in 1 and 2 used top LED 6 is now on the circuit board 4 a so-called radial LED 21 which emits their light mainly radially, that is, at an angle to the upwardly directed z-axis. More specifically, the radiation occurs mainly radially from a hemispherical area 22 the LED 21 out. The LED 21 is now no longer potted with its light radiating outward surface, but looks from a potting compound 23 so clear that a radial light emission is not or only slightly hindered. This LED module 20 has the disadvantage that in a bend due to the surface tensions occurring cracks between the LED 21 and the potting compound 23 can occur, which can reduce or nullify protection, in particular IP protection.

4 shows a flexible LED module according to the invention 40 which has a C-shaped, flexible silicone profile (or rail) 41 has, at the bottom 42 a flexible LED strip 43 by means of a double-sided adhesive tape (not shown) is attached. The LED band 43 has a flexible, band-shaped circuit board 44 and on top or on the front 45 attached white top LEDs 46 on. A potting compound 47 made of silicone, the LED band sheds 43 up to its top 48 , which of the potting compound 47 not covered. Among other things, cracking between the light emitting diode 46 and the potting compound 47 at bending of the LED module 40 to prevent, is on the light emitting diode (s) 46 and the surface of the potting compound 47 a cover layer 49 made of transparent silicone. The cover layer 49 is arched at its top, leaving it out of the light emitting diode 46 can lead outgoing light and serves to increase the light extraction efficiency as a lens-like primary optics. While the potting compound 47 colored, here: white, and thus even at low thickness opaque, is the top layer 49 transparent. The profile 41 can be opaque or transparent. By a white potting compound 47 Firstly, it can be from the topcoat 49 on the potting compound 47 reflected light are scattered back diffusely, which suppresses unwanted light reflections and / or color shifts of the reflected light. Also, the colored potting compound 47 be highly UV-tight. Furthermore, by the white potting compound 47 achieved that the side walls of the light emitting diode 46 and the upper surface 45 the circuit board 44 are not visible, resulting in a more pleasant appearance. For the underside of the PCB 44 like the profile 41 be opaque, or the profile 41 may be transparent or transparent, with the circuit board 44 then against insight from below by a opaque tape can be protected, which is the LED strip 43 with the ground 42 of the profile 41 firmly connects. The potting compound 47 and / or the cover layer 49 can be equipped with a filler which increases thermal conductivity, thereby heat removal from the light emitting diodes 46 and thus their life can be improved. In order to avoid electrostatic discharge, it is also possible to use a filler which improves the electrical conductivity. To suppress aging, an air and / or sulfur-binding filler can also be used. To reduce the risk of fire, a flame retardant filler can also be used. A filler may also have several of these properties.

5 shows a cross-sectional view of an LED module 50 , which in contrast to the LED module 40 out 4 in a profile 51 an LED band 52 picks up which side LEDs 53 used. So the side LEDs 53 can continue to radiate upward from the profile opening, the bottom of the circuit board 44 now on a side wall 54 of the profile arranged and thus by 90 ° compared to the embodiment of 4 twisted. In the embodiment shown, the side LED is 53 up to an upper edge with the potting compound 47 shed. The rest of the room in profile 51 above the side LED 53 is with the transparent topcoat 49 been filled, the free surface of the cover layer 49 now has no curvature and thus no or only a small ability to focus.

6 shows another exemplary LED module 60 , Unlike the in 4 shown LED module 40 are now in the potting compound 47 two cables 61 with a cross section according to AWG24 been introduced, namely on both sides of the LED 46 , These cables 61 serve the power supply of the LEDs 46 , With a separable LED band 43 , which is divided into successive unit sections, these unit sections are electrically connected in parallel, and in each case between the two cables 61 connected. For electrical connection of two LED modules 60 or two separate sections of such an LED module 60 just need the cables 61 the two LED modules 60 or the sections to be electrically connected to each other. This can advantageously be done so that contacts (o. Fig.) From the outside through the profile 41 through to the cables 61 be directed, as indicated by the arrow P, z. B. piercing contacts or insulation displacement terminals. If the profile 41 is made of a silicone or a similar material, lies the profile 41 after the contacts have been made, due to the displacement of the material and the resulting springback sealing against the contacts, so that an IP protection class can be maintained.

7 shows an LED module 70 with a further type of electrical contacting after a separation along a separation point or dividing line T. In a separation along the dividing line T is a socket 71 completely or exposed to a thin volume of material. Such a volume of material can be easily removed by hand. An exposed socket 71 can then easily by plugging a plug (o. Fig.) into an associated connector receptacle 72 the socket 71 be contacted. So that the plug receptacle 72 during potting not with potting compound 47 fills, it is by means of a cover element 73 previously covered, for. B. with a membrane such as a wax or a film. This cover 73 can also be easily removed. Such a contacting has the advantage that a comparatively complex connection structure can be imaged and the plug / socket system can be operated without difficulty. Furthermore, the severed part of the luminous band remains with the socket 71 from the potting compound 47 or the cover layer 49 obscured without deterioration of the protective function. In the same way, for example, a light strip 43 at each end of a unit section with such a socket 71 be equipped, wherein after a separation, the two opposite sockets 71 can be exposed and connected by means of a two-sided connector.

8th shows a further inventive LED module 80 , in which now on each side of a dividing line T one on the circuit board 44 attached contact pin 81 so attached that it passes through the potting compound 47 and through the cover layer 49 runs and off the top coat 49 protrudes. After disconnecting an LED module 80 along the dividing line T thus protrude on both sides of the dividing line T contact pins 81 from the respective module parts and can be connected accordingly. To protect the protruding part of the contact pin 81 this can be done by means of a protective cap 82 be covered, which is easy from the contact pin 81 is solvable. 9 shows such in two parts 80a . 80b separated LED module 80 in which the two opposite with respect to the separation point T contact pins 81 via an electrical line 82 are connected.

10 shows in supervision another contacting possibility of an LED module 100 or part of it. In this case, the potting compound 47 at least in the area of the dividing line T slightly from the LED strip 43 detachable, namely here from an unpopulated part of the circuit board 44 , After a separation can thus the potting compound 47 (possibly also the profile and the cover layer) by placing a plug 101 be displaced. Here is the circuit board 44 at a separation point T correspondingly occupied with contacts which to the selected connector 101 fit. Such contacting has in contrast to a - in principle also possible - stripping of the LED strip 43 in the separation area the advantage that the potting compound 47 still light on the plug 101 pushes and thus seals him better.

11 shows in side view another contacting possibility of an LED module 110 in which now a plug 111 in a recess (or "cavity") 112 is introduced in the potting compound. The recess 112 For example, by means of a bending of the potting compound of the circuit board 44 be generated.

Of course it is the present invention is not limited to the embodiments shown.

1

conventional LED module

2

profile

3

LED tape

4

circuit board

5

front the circuit board

6

led

7

potting compound

8th

top the LED

10

conventional LED module

11

profile

20

conventional LED module

21

led

22

Hemispherical area the LED

23

potting compound

40

LED module

41

profile

42

ground

43

LED tape

44

circuit board

45

front the circuit board

46

led

47

potting compound

48

top the LED

49

topcoat

50

LED module

51

profile

52

LED tape

53

led

60

LED module

61

electric wire

70

LED module

71

Rifle

72

plug receptacle

73

cover

80

LED module

80a

part of the LED module

80b

part of the LED module

81

pin

82

protective cap

100

LED module

101

plug

110

LED module

111

plug

112

recess

T

parting line

Claims (13)

Light module ( 40 ; 50 ; 60 ; 70 ; 80 ; 90 ; 100 ; 110 ), in particular flexible light module, comprising at least one profile ( 41 ; 51 ) and one in the profile ( 41 ; 51 ) arranged light strip ( 43 ; 52 ), - whereby the light strip ( 43 ; 52 ) one with semiconductor light sources ( 46 ; 53 ), in particular light-emitting diodes, populated printed circuit board ( 44 ), - wherein the printed circuit board ( 44 ) with a translucent potting compound ( 47 ), wherein a luminous area of the semiconductor light sources ( 46 ; 53 ) of a transparent cover layer ( 49 ) is covered. Light module ( 40 ; 50 ; 60 ; 70 ; 80 ; 90 ; 100 ; 110 ) according to claim 1, in which the semiconductor light sources are potted with the potting compound substantially up to a surface having the respective luminous surface opaque. Light module ( 40 ; 50 ; 60 ; 70 ; 80 ; 90 ; 100 ; 110 ) according to one of claims 1 or 2, wherein the potting compound and / or the cover layer comprises a thermally conductive filler, an electrically conductive filler, a flame retardant filler and / or a sulfur and / or air-binding filler. Light module ( 40 ; 50 ; 60 ; 70 ; 80 ; 90 ; 100 ; 110 ) according to one of the preceding claims, in which the potting compound and / or the cover layer are color-selective. Light module ( 40 ; 50 ; 60 ; 70 ; 80 ; 90 ; 100 ; 110 ) according to one of claims 1 or 2, wherein the potting compound ( 47 ) and / or the cover layer ( 49 ) Silicone as a base material. Light module ( 40 ; 50 ; 60 ; 70 ; 80 ; 90 ; 100 ; 110 ) according to one of the preceding claims, comprising at least one separation point (T) for application of the light module ( 40 ; 50 ; 60 ; 70 ; 80 ; 90 ; 100 ; 110 ), wherein the light module ( 40 ; 50 ; 60 ; 70 ; 80 ; 90 ; 100 ; 110 ) at the at least one separation point (T) in each case at least one electrical connection element ( 61 ; 71 ; 81 ), which is prepared by a separation at the separation point (T) for electrical connection or preparable. Light module ( 40 ; 50 ; 60 ; 70 ; 80 ; 90 ; 100 ; 110 ) according to claim 6, wherein the potting compound ( 47 ) at least in the region of the separation point (T) of the light strip ( 43 ; 52 ) is solvable. Light module ( 40 ; 50 ; 60 ; 70 ; 80 ; 90 ; 100 ; 110 ) according to one of claims 6 or 7, comprising at least one marking for marking the separation point (T). Light module ( 40 ; 50 ; 60 ; 70 ; 80 ; 90 ; 100 ; 110 ) according to one of the preceding claims, comprising at least one in the profile ( 41 ; 51 ) laid, potted power line ( 61 ) Light module ( 40 ; 50 ; 60 ; 70 ; 80 ; 90 ; 100 ; 110 ) according to claim 9, wherein the at least one current-carrying line ( 61 ) through the profile ( 41 ; 51 ) is contactable through. Light module ( 40 ; 50 ; 60 ; 70 ; 80 ; 90 ; 100 ; 110 ) according to one of the preceding claims, which has been surface-treated, in particular plasma-treated. Light module ( 40 ; 50 ; 60 ; 70 ; 80 ; 90 ; 100 ; 110 ) according to one of the preceding claims, in which the semiconductor light sources ( 46 ; 53 ) Are light emitting diodes which have a main emission direction upwards out of the profile ( 41 ; 51 ) exhibit. Method for producing a light module ( 40 ; 50 ; 60 ; 70 ; 80 ; 90 ; 100 ; 110 ) according to one of the preceding claims, in which the potting compound ( 47 ) is cast in at least the following two steps: At least on the circuit board 44 ) electronic components by means of the potting compound ( 47 ); - Final casting by means of the potting compound ( 47 ).