DE2966326D1 - Apparatus and method for encapsulating electronic components in hardenable plastics - Google Patents

Apparatus and method for encapsulating electronic components in hardenable plastics

Info

Publication number
DE2966326D1
DE2966326D1 DE7979301404T DE2966326T DE2966326D1 DE 2966326 D1 DE2966326 D1 DE 2966326D1 DE 7979301404 T DE7979301404 T DE 7979301404T DE 2966326 T DE2966326 T DE 2966326T DE 2966326 D1 DE2966326 D1 DE 2966326D1
Authority
DE
Germany
Prior art keywords
electronic components
encapsulating electronic
hardenable plastics
hardenable
plastics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE7979301404T
Other languages
English (en)
Inventor
Dusan Slepcevic
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ONG, SAY YAUN, PETALING JAYA, MY
Original Assignee
Dusan Slepcevic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dusan Slepcevic filed Critical Dusan Slepcevic
Application granted granted Critical
Publication of DE2966326D1 publication Critical patent/DE2966326D1/de
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565Moulds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
DE7979301404T 1978-07-17 1979-07-16 Apparatus and method for encapsulating electronic components in hardenable plastics Expired DE2966326D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/925,295 US4332537A (en) 1978-07-17 1978-07-17 Encapsulation mold with removable cavity plates

Publications (1)

Publication Number Publication Date
DE2966326D1 true DE2966326D1 (en) 1983-11-24

Family

ID=25451521

Family Applications (1)

Application Number Title Priority Date Filing Date
DE7979301404T Expired DE2966326D1 (en) 1978-07-17 1979-07-16 Apparatus and method for encapsulating electronic components in hardenable plastics

Country Status (8)

Country Link
US (1) US4332537A (de)
EP (1) EP0007762B1 (de)
JP (1) JPS5533089A (de)
CA (1) CA1145521A (de)
DE (1) DE2966326D1 (de)
HK (1) HK61584A (de)
PH (1) PH16917A (de)
SG (1) SG30984G (de)

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Also Published As

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CA1145521A (en) 1983-05-03
JPS5759666B2 (de) 1982-12-15
US4332537A (en) 1982-06-01
EP0007762B1 (de) 1983-10-19
JPS5533089A (en) 1980-03-08
SG30984G (en) 1985-06-07
EP0007762A1 (de) 1980-02-06
PH16917A (en) 1984-04-12
HK61584A (en) 1984-08-17

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