DE3164377D1 - Die-stamped circuit board assembly having relief means and method of making - Google Patents

Die-stamped circuit board assembly having relief means and method of making

Info

Publication number
DE3164377D1
DE3164377D1 DE8181101954T DE3164377T DE3164377D1 DE 3164377 D1 DE3164377 D1 DE 3164377D1 DE 8181101954 T DE8181101954 T DE 8181101954T DE 3164377 T DE3164377 T DE 3164377T DE 3164377 D1 DE3164377 D1 DE 3164377D1
Authority
DE
Germany
Prior art keywords
die
making
circuit board
board assembly
relief means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8181101954T
Other languages
English (en)
Inventor
Boyd G Brower
John W Shaffer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram Sylvania Inc
Original Assignee
GTE Products Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GTE Products Corp filed Critical GTE Products Corp
Application granted granted Critical
Publication of DE3164377D1 publication Critical patent/DE3164377D1/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B15/00—Special procedures for taking photographs; Apparatus therefor
    • G03B15/02—Illuminating scene
    • G03B15/03—Combinations of cameras with lighting apparatus; Flash units
    • G03B15/04—Combinations of cameras with non-electronic flash apparatus; Non-electronic flash units
    • G03B15/0442—Constructional details of the flash apparatus; Arrangement of lamps, reflectors, or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1054—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing and simultaneously bonding [e.g., cut-seaming]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/107—Punching and bonding pressure application by punch
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49105—Switch making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
DE8181101954T 1980-03-19 1981-03-16 Die-stamped circuit board assembly having relief means and method of making Expired DE3164377D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/131,614 US4320572A (en) 1980-03-19 1980-03-19 Die-stamped circuit board assembly having relief means-method of making

Publications (1)

Publication Number Publication Date
DE3164377D1 true DE3164377D1 (en) 1984-08-02

Family

ID=22450228

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8181101954T Expired DE3164377D1 (en) 1980-03-19 1981-03-16 Die-stamped circuit board assembly having relief means and method of making

Country Status (5)

Country Link
US (1) US4320572A (de)
EP (1) EP0036607B1 (de)
JP (1) JPS56144423A (de)
CA (1) CA1153477A (de)
DE (1) DE3164377D1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0045052B1 (de) * 1980-07-25 1986-02-26 Nissan Motor Co., Ltd. Radiofrequenzinterferenz unterdrückender Rotor eines Zündverteilers
US4935090A (en) * 1981-09-03 1990-06-19 Gte Products Corporation Photoflash array quick-cure laminating process
DE3636587A1 (de) * 1986-10-28 1988-05-11 Pelz Ernst Erpe Vertrieb Verfahren zum herstellen eines furnierwerkstueckes mit ausschnitt sowie pressstanzwerkzeug zu seiner durchfuehrung
US5662760A (en) * 1991-11-11 1997-09-02 Tsuda; Sotaro Method of manufacturing laminated veneer lumber and decorative laminated sheet utilizing the same
US5277953A (en) * 1991-11-11 1994-01-11 Sotaro Tsuda Laminated veneer lumber and decorative laminated sheet utilizing the same
US5915752A (en) * 1992-07-24 1999-06-29 Tessera, Inc. Method of making connections to a semiconductor chip assembly
US5977618A (en) 1992-07-24 1999-11-02 Tessera, Inc. Semiconductor connection components and methods with releasable lead support
US6054756A (en) * 1992-07-24 2000-04-25 Tessera, Inc. Connection components with frangible leads and bus
US5283949A (en) * 1992-11-03 1994-02-08 Jurisich Peter L Method of producing a printed circuit board having a conductive pattern thereon
US5410799A (en) * 1993-03-17 1995-05-02 National Semiconductor Corporation Method of making electrostatic switches for integrated circuits
US20020151111A1 (en) * 1995-05-08 2002-10-17 Tessera, Inc. P-connection components with frangible leads and bus
US5761801A (en) * 1995-06-07 1998-06-09 The Dexter Corporation Method for making a conductive film composite
EP0956745A1 (de) 1995-09-18 1999-11-17 Tessera, Inc. Mikroeletronische anschlussstruktur mit dielektrischen lagen
JP2000332369A (ja) * 1999-05-25 2000-11-30 Mitsui Mining & Smelting Co Ltd プリント回路板及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3911716A (en) * 1971-05-21 1975-10-14 Jerobee Ind Inc Circuit board, method of making the circuit board and improved die for making said board
US3990142A (en) * 1973-10-02 1976-11-09 Jerobee Industries, Inc. Circuit board, method of making the circuit board and improved die for making said board
US3857667A (en) * 1973-10-23 1974-12-31 Gte Sylvania Inc Photoflash lamp array having support structure on base
US3988647A (en) * 1974-09-27 1976-10-26 General Electric Company Method for making a circuit board and article made thereby
US4017728A (en) * 1975-09-17 1977-04-12 Gte Sylvania Incorporated Multilamp photoflash unit having radiant-energy-activated quick-disconnect switch
US4113424A (en) * 1976-09-20 1978-09-12 Gte Sylvania Incorporated Multilamp photoflash unit with static grounding system
US4130857A (en) * 1977-04-08 1978-12-19 Gte Sylvania Incorporated Multilamp photoflash unit
US4164007A (en) * 1977-10-07 1979-08-07 Gte Sylvania Incorporated Multilamp photoflash unit
US4152751A (en) * 1977-12-19 1979-05-01 Gte Sylvania Incorporated Photoflash unit with secured insulator

Also Published As

Publication number Publication date
US4320572A (en) 1982-03-23
JPS56144423A (en) 1981-11-10
EP0036607A1 (de) 1981-09-30
CA1153477A (en) 1983-09-06
EP0036607B1 (de) 1984-06-27

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee