DE3367460D1 - Evaluating the thickness of a layer or determining change in thermal characteristics with depth by thermal wave detection - Google Patents

Evaluating the thickness of a layer or determining change in thermal characteristics with depth by thermal wave detection

Info

Publication number
DE3367460D1
DE3367460D1 DE8383303411T DE3367460T DE3367460D1 DE 3367460 D1 DE3367460 D1 DE 3367460D1 DE 8383303411 T DE8383303411 T DE 8383303411T DE 3367460 T DE3367460 T DE 3367460T DE 3367460 D1 DE3367460 D1 DE 3367460D1
Authority
DE
Germany
Prior art keywords
thermal
evaluating
depth
thickness
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383303411T
Other languages
English (en)
Inventor
Allan Rosencwaig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Therma Wave Inc
Original Assignee
Therma Wave Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Therma Wave Inc filed Critical Therma Wave Inc
Application granted granted Critical
Publication of DE3367460D1 publication Critical patent/DE3367460D1/de
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G01B11/0633—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection using one or more discrete wavelengths
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1702—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
DE8383303411T 1982-06-18 1983-06-13 Evaluating the thickness of a layer or determining change in thermal characteristics with depth by thermal wave detection Expired DE3367460D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/389,623 US4513384A (en) 1982-06-18 1982-06-18 Thin film thickness measurements and depth profiling utilizing a thermal wave detection system

Publications (1)

Publication Number Publication Date
DE3367460D1 true DE3367460D1 (en) 1986-12-11

Family

ID=23539021

Family Applications (2)

Application Number Title Priority Date Filing Date
DE198383303411T Pending DE97473T1 (de) 1982-06-18 1983-06-13 Bestimmung der dicke einer schicht oder bestimmung der aenderung thermischer charakteristiken in der tiefe durch empfang thermischer wellen.
DE8383303411T Expired DE3367460D1 (en) 1982-06-18 1983-06-13 Evaluating the thickness of a layer or determining change in thermal characteristics with depth by thermal wave detection

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE198383303411T Pending DE97473T1 (de) 1982-06-18 1983-06-13 Bestimmung der dicke einer schicht oder bestimmung der aenderung thermischer charakteristiken in der tiefe durch empfang thermischer wellen.

Country Status (4)

Country Link
US (1) US4513384A (de)
EP (1) EP0097473B1 (de)
JP (1) JPS5985908A (de)
DE (2) DE97473T1 (de)

Families Citing this family (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI64465C (fi) * 1982-03-15 1983-11-10 Mauri Luukkala Foerfarande och apparat foer att maeta ytornas egenskaper av fasta tillstaondets materialer
US4522510A (en) * 1982-07-26 1985-06-11 Therma-Wave, Inc. Thin film thickness measurement with thermal waves
US4752140A (en) * 1983-12-02 1988-06-21 Canadian Patents And Development Limited/Societe Canadienne Des Brevets Et D'exploitation Limitee Pulsed dilatometric method and device for the detection of delaminations
US4679174A (en) * 1984-04-26 1987-07-07 Western Geophysical Company Of America Method for seismic lithologic modeling
US4579463A (en) * 1984-05-21 1986-04-01 Therma-Wave Partners Detecting thermal waves to evaluate thermal parameters
US4679946A (en) * 1984-05-21 1987-07-14 Therma-Wave, Inc. Evaluating both thickness and compositional variables in a thin film sample
JPS6138503A (ja) * 1984-07-31 1986-02-24 Ketsuto Kagaku Kenkyusho:Kk 膜厚計
JPS61102541A (ja) * 1984-10-25 1986-05-21 Hitachi Ltd 液体中の不純物分析方法および装置
US4818118A (en) * 1984-11-26 1989-04-04 General Electric Company Coating thickness measurement
US4634291A (en) * 1984-11-26 1987-01-06 General Electric Company Coating thickness measurement
EP0200301A1 (de) * 1985-03-01 1986-11-05 Therma-Wave Inc. Verfahren und Vorrichtung zum Auswerten von Eigenschaften der Oberfläche und des Inneren eines Halbleiters
US4632561A (en) * 1985-04-30 1986-12-30 Therma-Wave, Inc. Evaluation of surface and subsurface characteristics of a sample
GB8601176D0 (en) * 1986-01-17 1986-02-19 Infrared Eng Ltd Sensing
US4744084A (en) * 1986-02-27 1988-05-10 Mentor Graphics Corporation Hardware modeling system and method for simulating portions of electrical circuits
US4890245A (en) * 1986-09-22 1989-12-26 Nikon Corporation Method for measuring temperature of semiconductor substrate and apparatus therefor
JPH0827264B2 (ja) * 1988-09-21 1996-03-21 工業技術院長 マルチ変調周波数による光音響撮像方法
US4950897A (en) * 1989-01-04 1990-08-21 University Of Toronto Innovations Foundation Thermal wave sub-surface defect imaging and tomography apparatus
US4950990A (en) * 1989-07-21 1990-08-21 Iowa State University Research Foundation, Inc. Method and apparatus for photoinductive imaging
DD291157A5 (de) * 1989-12-28 1991-06-20 ����@�����@�����@����k�� Anordnung zur thermowellenanalyse von schichtsystemen
US5769540A (en) * 1990-04-10 1998-06-23 Luxtron Corporation Non-contact optical techniques for measuring surface conditions
US5154512A (en) * 1990-04-10 1992-10-13 Luxtron Corporation Non-contact techniques for measuring temperature or radiation-heated objects
JPH05500416A (ja) * 1990-04-17 1993-01-28 アイオワ　ステイト　ユニヴァーシティ　リサーチ　ファンデイション，インコーポレイテッド 光誘導画像生成装置及び方法
US5131758A (en) * 1990-05-16 1992-07-21 Administrator Of The National Aeronautics And Space Administration Method of remotely characterizing thermal properties of a sample
US5170666A (en) * 1991-03-29 1992-12-15 Larsen Lawrence E Nondestructive evaluation of composite materials using acoustic emissions stimulated by absorbed microwave/radiofrequency energy
DE4114672A1 (de) * 1991-05-06 1992-11-12 Hoechst Ag Verfahren und messanordnung zur beruehrungslosen on-line messung
US5497657A (en) * 1991-11-11 1996-03-12 Nippondenso Co., Ltd. Tire air pressure detecting device
US5553491A (en) * 1991-11-11 1996-09-10 Nippondenso Co., Ltd. Tire air pressure detecting device
US5344236A (en) * 1992-01-23 1994-09-06 Fishman Iiya M Method for evaluation of quality of the interface between layer and substrate
US5201841A (en) * 1992-02-20 1993-04-13 Motorola, Inc. Thermal delay non-destructive bond integrity inspection
US5527110A (en) * 1993-04-30 1996-06-18 International Business Machines Corporation Method and apparatus for detecting asperities on magnetic disks using thermal proximity imaging
US5810477A (en) * 1993-04-30 1998-09-22 International Business Machines Corporation System for identifying surface conditions of a moving medium
US5376793A (en) * 1993-09-15 1994-12-27 Stress Photonics, Inc. Forced-diffusion thermal imaging apparatus and method
US5745385A (en) * 1994-04-25 1998-04-28 International Business Machines Corproation Method for stochastic and deterministic timebase control in stochastic simulations
US5625579A (en) * 1994-05-10 1997-04-29 International Business Machines Corporation Stochastic simulation method for processes containing equilibrium steps
US6019684A (en) 1994-10-12 2000-02-01 Hoyt, Iii; Raymond E. Compact flexible couplings with improved lock-on features
US5657754A (en) * 1995-07-10 1997-08-19 Rosencwaig; Allan Apparatus for non-invasive analyses of biological compounds
US5826065A (en) * 1997-01-13 1998-10-20 International Business Machines Corporation Software architecture for stochastic simulation of non-homogeneous systems
US6000844A (en) * 1997-03-04 1999-12-14 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method and apparatus for the portable identification of material thickness and defects using spatially controlled heat application
US5996415A (en) * 1997-04-30 1999-12-07 Sensys Instruments Corporation Apparatus and method for characterizing semiconductor wafers during processing
US5978074A (en) 1997-07-03 1999-11-02 Therma-Wave, Inc. Apparatus for evaluating metalized layers on semiconductors
US5882947A (en) * 1997-08-05 1999-03-16 United Microelectronics Corp. Method for probing the error of energy and dosage in the high-energy ion implantation
ES2171797T3 (es) * 1997-09-09 2002-09-16 Boschung Mecatronic Ag Procedimiento y dispositivo para generar una señal en dependencia de una pelicula de un fluido sobre una superficie.
US5890805A (en) * 1997-09-26 1999-04-06 Usx Corporation Method for monitoring the wear and extending the life of blast furnace refractory lining
US6019000A (en) * 1997-11-20 2000-02-01 Sensys Instruments Corporation In-situ measurement of deposition on reactor chamber members
DE19837889C1 (de) 1998-08-20 2000-12-21 Siemens Ag Thermowellen-Meßverfahren
US6595685B2 (en) * 1998-10-13 2003-07-22 National Research Laboratory Of Metrology Method and apparatus for measuring thermophysical properties
US6323951B1 (en) * 1999-03-22 2001-11-27 Boxer Cross Incorporated Apparatus and method for determining the active dopant profile in a semiconductor wafer
US6394646B1 (en) 1999-04-16 2002-05-28 General Electric Company Method and apparatus for quantitative nondestructive evaluation of metal airfoils using high resolution transient thermography
US6369888B1 (en) * 1999-11-17 2002-04-09 Applied Materials, Inc. Method and apparatus for article inspection including speckle reduction
DE10013173C2 (de) * 2000-03-17 2002-02-28 Wagner Internat Ag Altstaetten Verfahren und Vorrichtung zur photothermischen Analyse einer Materialschicht, insbesondere zur Schichtdickenmessung
DE10013172C2 (de) * 2000-03-17 2002-05-16 Wagner Internat Ag Altstaetten Verfahren und Vorrichtung zur photothermischen Analyse einer Materialschicht, insbesondere zur Schichtdickenmessung
JP3430258B2 (ja) * 2000-10-17 2003-07-28 独立行政法人産業技術総合研究所 熱拡散率と界面熱抵抗の測定方法
US6711954B2 (en) 2001-01-19 2004-03-30 Lockheed Martin Corporation Method and apparatus for improving the dynamic range of laser detected ultrasound in attenuative materials
US6911349B2 (en) * 2001-02-16 2005-06-28 Boxer Cross Inc. Evaluating sidewall coverage in a semiconductor wafer
US6812717B2 (en) * 2001-03-05 2004-11-02 Boxer Cross, Inc Use of a coefficient of a power curve to evaluate a semiconductor wafer
US6668654B2 (en) 2001-08-15 2003-12-30 Lockheed Martin Corporation Method and apparatus for generating specific frequency response for ultrasound testing
US6940592B2 (en) * 2001-10-09 2005-09-06 Applied Materials, Inc. Calibration as well as measurement on the same workpiece during fabrication
US7031894B2 (en) * 2002-01-16 2006-04-18 Timbre Technologies, Inc. Generating a library of simulated-diffraction signals and hypothetical profiles of periodic gratings
US6958814B2 (en) * 2002-03-01 2005-10-25 Applied Materials, Inc. Apparatus and method for measuring a property of a layer in a multilayered structure
JP2003342728A (ja) * 2002-05-24 2003-12-03 Alps Electric Co Ltd 光学薄膜の成膜装置及び成膜方法
US6825933B2 (en) 2002-06-07 2004-11-30 N&K Technology, Inc. Computer-implemented reflectance system and method for non-destructive low dose ion implantation monitoring
GB2393246A (en) * 2002-09-21 2004-03-24 Sonoptix Ltd Transducer sensor
US6878559B2 (en) * 2002-09-23 2005-04-12 Applied Materials, Inc. Measurement of lateral diffusion of diffused layers
US6963393B2 (en) * 2002-09-23 2005-11-08 Applied Materials, Inc. Measurement of lateral diffusion of diffused layers
US6756591B1 (en) * 2003-03-14 2004-06-29 Centre National De La Recherche Method and device for photothermal imaging tiny particles immersed in a given medium
US7204639B1 (en) * 2003-09-26 2007-04-17 Lam Research Corporation Method and apparatus for thin metal film thickness measurement
US7379185B2 (en) 2004-11-01 2008-05-27 Applied Materials, Inc. Evaluation of openings in a dielectric layer
US7407324B2 (en) * 2005-08-10 2008-08-05 Tokyo Electron, Ltd. Method and apparatus for monitoring the thickness of a conductive coating
FR2895688B1 (fr) * 2005-12-30 2010-08-27 Pellenc Selective Technologies Procede et machine automatiques d'inspection et de tri d'objets non metalliques
US7716987B2 (en) 2006-07-31 2010-05-18 University Of Dayton Non-contact thermo-elastic property measurement and imaging system for quantitative nondestructive evaluation of materials
US20090000382A1 (en) * 2006-07-31 2009-01-01 University Of Dayton Non-contact acousto-thermal method and apparatus for detecting incipient damage in materials
US7993698B2 (en) * 2006-09-23 2011-08-09 Varian Semiconductor Equipment Associates, Inc. Techniques for temperature controlled ion implantation
US8794072B2 (en) * 2007-10-10 2014-08-05 Sonoscan, Inc. Scanning acoustic microscope with profilometer function
US7973547B2 (en) * 2008-08-13 2011-07-05 Infineon Technologies Ag Method and apparatus for detecting a crack in a semiconductor wafer, and a wafer chuck
CN102667442B (zh) * 2009-10-13 2015-07-29 派克米瑞斯有限责任公司 用于检测和测量单层和多层物体中的界面性质的系统和方法
GB0919059D0 (en) * 2009-10-30 2009-12-16 Sencon Europ Ltd Application and inspection system
CN102466467B (zh) * 2010-11-19 2014-03-12 中芯国际集成电路制造(北京)有限公司 薄膜厚度的监控方法
CN102810455A (zh) * 2011-05-31 2012-12-05 无锡华润上华半导体有限公司 产品植入实时监测系统
KR101974580B1 (ko) * 2012-05-03 2019-05-02 삼성전자주식회사 레이저 유도 초음파 장치 및 이를 이용한 영상 생성 방법
KR101989155B1 (ko) * 2012-08-01 2019-06-17 삼성전자주식회사 초음파 변환기, 이를 포함하는 초음파 발생 장치 및 시스템
FR3007831B1 (fr) 2013-07-01 2015-06-19 Enovasense Procede de mesure de l'epaisseur d'une couche d'un materiau, procede de galvanisation et dispositif de mesure associes
US10054495B2 (en) 2013-07-02 2018-08-21 Exergen Corporation Infrared contrasting color temperature measurement system
WO2016056110A1 (ja) * 2014-10-09 2016-04-14 浜松ホトニクス株式会社 解析装置及び解析方法
WO2016142864A1 (en) 2015-03-09 2016-09-15 Alliance For Sustainable Energy, Llc Batch and continuous methods for evaluating the physical and thermal properties of films
CN108355861A (zh) * 2018-05-21 2018-08-03 广州泽亨实业有限公司 一种基于热波的粉末厚度检测喷涂控制方法及装置
CN110489718B (zh) * 2019-07-26 2023-01-03 浙江锋锂新能源科技有限公司 铝塑膜冲壳深度的检测方法
US11578971B2 (en) * 2021-02-12 2023-02-14 Holloway Ndt & Engineering Inc. Ultrasonic testing using a phased array
DE102021127596A1 (de) 2021-10-22 2023-04-27 Linseis Messgeräte Gesellschaft mit beschränkter Haftung Temperaturleitfähigkeitsmessgerät

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3803414A (en) * 1972-07-26 1974-04-09 Infra Systems Inc Standardization of infrared measuring system
US3804532A (en) * 1972-08-03 1974-04-16 Us Navy Transparent film uniformity gauge
JPS508554A (de) * 1973-05-19 1975-01-29
US3978713A (en) * 1975-05-27 1976-09-07 General Electric Company Laser generation of ultrasonic waves for nondestructive testing
FR2443113B1 (fr) * 1978-06-30 1985-12-06 Deutsch Pruef Messgeraete Procede et dispositif d'emission d'impulsions acoustiques, particulierement dans le domaine des ultra-sons, et application de ces impulsions notamment au controle non destructif de materiaux
US4255971A (en) * 1978-11-01 1981-03-17 Allan Rosencwaig Thermoacoustic microscopy
JPS55153054A (en) * 1979-05-15 1980-11-28 Hitachi Ltd Logic circuit simulation system
US4274288A (en) * 1979-07-23 1981-06-23 Rockwell International Corporation Method for measuring the depth of surface flaws
US4305294A (en) * 1980-01-10 1981-12-15 Rockwell International Corporation Ultrasonic apparatus and method for measuring wall thickness
DE3034944C2 (de) * 1980-09-01 1985-01-17 Gerhard Dr. 8029 Sauerlach Busse Verfahren und Einrichtung zur photothermischen Struktur-Untersuchung fester Körper
US4430897A (en) * 1981-05-14 1984-02-14 The Board Of Trustees Of The Leland Stanford University Acoustic microscope and method

Also Published As

Publication number Publication date
JPS5985908A (ja) 1984-05-18
EP0097473B1 (de) 1986-11-05
JPH0358443B2 (de) 1991-09-05
DE97473T1 (de) 1984-09-27
US4513384A (en) 1985-04-23
EP0097473A1 (de) 1984-01-04

Similar Documents

Publication Publication Date Title
DE3367460D1 (en) Evaluating the thickness of a layer or determining change in thermal characteristics with depth by thermal wave detection
DE3579502D1 (de) Sonde mit mehrfach gekruemmter anordnung.
GB2042737B (en) Detecting the presence of water in oil
NO814033L (no) Florstoff med vekevirkning
DK457883D0 (da) Vandfortykkelsesmidler samt tryksvaerte med indhold heraf
GB2089039B (en) Thickness measurement with ultrasonic pulses
IT1147501B (it) Apparecchio misuratore di resistenza superficiale
JPS57198811A (en) Measuring sensor with piezo-electric detecting element
DK161294C (da) Elektromekanisk transducer med justerbart ankerlaag
AT381593B (de) Messanordnung mit zumindest einem sensor
AU3842478A (en) Making surface layers with improved corrosion properties
DE3577351D1 (de) Spektralanalysator mit akustischen oberflaechenwellen.
DE3571692D1 (en) Method for the continuous and contactless measurement of film thickness as well as an arrangement for the realization of the method
JPS5664629A (en) Surface soundwave sensor
GB2070245B (en) Measuring surface roughness
GB2093185B (en) Thickness measurement with ultrasonic pulses
GB2087085B (en) Force transducer with multiple measuring sections
GB2074312B (en) Measuring surface distances
AU540648B2 (en) Temperature probe with oscillator
DE3576089D1 (de) Elektronischer zeitgeber mit tiefenlehre.
AT382963B (de) Messverfahren zur bestimmung der dicke duenner schichten
DE3576258D1 (de) Verbessertes filter mit akustischen oberflaechenwellen.
GB2082780B (en) Electro-physical measuring with variable resistance transducers
GB2073425B (en) Magnetic layer thickness gauge
GB2145822B (en) Non-destructive testing with guided waves

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: DERZEIT KEIN VERTRETER BESTELLT

8328 Change in the person/name/address of the agent

Free format text: BLUMBACH, P., DIPL.-ING., 6200 WIESBADEN WESER, W., DIPL.-PHYS. DR.RER.NAT., PAT.-ANWAELTE, 8000 MUENCHEN BERGEN, P., DIPL.-ING. DR.JUR., PAT.-ASS., 6200 WIESBADEN KRAMER, R., DIPL.-ING., 8000 MUENCHEN ZWIRNER, G., DIPL.-ING. DIPL.-WIRTSCH.-ING., 6200 WIESBADEN HOFFMANN, E., DIPL.-ING., PAT.-ANWAELTE, 8032 GRAEFELFING

8327 Change in the person/name/address of the patent owner

Owner name: THERMA-WAVE, INC. (N.D.GES.D. STAATES DELAWARE), F

8328 Change in the person/name/address of the agent

Free format text: BLUMBACH, P., DIPL.-ING., 65193 WIESBADEN WESER, W., DIPL.-PHYS. DR.RER.NAT. KRAMER, R., DIPL.-ING., 81245 MUENCHEN ZWIRNER, G., DIPL.-ING. DIPL.-WIRTSCH.-ING., 65193 WIESBADEN HOFFMANN, E., DIPL.-ING., PAT.-ANWAELTE, 82166 GRAEFELFING

8339 Ceased/non-payment of the annual fee