DE3380797D1 - Semiconductor chip assembly including a thermal radiator plate - Google Patents

Semiconductor chip assembly including a thermal radiator plate

Info

Publication number
DE3380797D1
DE3380797D1 DE8383301771T DE3380797T DE3380797D1 DE 3380797 D1 DE3380797 D1 DE 3380797D1 DE 8383301771 T DE8383301771 T DE 8383301771T DE 3380797 T DE3380797 T DE 3380797T DE 3380797 D1 DE3380797 D1 DE 3380797D1
Authority
DE
Germany
Prior art keywords
semiconductor chip
assembly including
chip assembly
radiator plate
thermal radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383301771T
Other languages
English (en)
Inventor
Shunji Kashiwagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3380797D1 publication Critical patent/DE3380797D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10157—Shape being other than a cuboid at the active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE8383301771T 1982-03-31 1983-03-29 Semiconductor chip assembly including a thermal radiator plate Expired DE3380797D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57053124A JPS58170044A (ja) 1982-03-31 1982-03-31 半導体素子

Publications (1)

Publication Number Publication Date
DE3380797D1 true DE3380797D1 (en) 1989-12-07

Family

ID=12934053

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383301771T Expired DE3380797D1 (en) 1982-03-31 1983-03-29 Semiconductor chip assembly including a thermal radiator plate

Country Status (4)

Country Link
US (1) US4571611A (de)
EP (1) EP0090651B1 (de)
JP (1) JPS58170044A (de)
DE (1) DE3380797D1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4807022A (en) * 1987-05-01 1989-02-21 Raytheon Company Simultaneous formation of via hole and tub structures for GaAs monolithic microwave integrated circuits
US4970578A (en) * 1987-05-01 1990-11-13 Raytheon Company Selective backside plating of GaAs monolithic microwave integrated circuits
JPH01257355A (ja) * 1987-12-14 1989-10-13 Mitsubishi Electric Corp マイクロ波モノリシックｉｃ
US5220487A (en) * 1992-01-27 1993-06-15 International Business Machines Corporation Electronic package with enhanced heat sinking
GB2371922B (en) * 2000-09-21 2004-12-15 Cambridge Semiconductor Ltd Semiconductor device and method of forming a semiconductor device
US7332819B2 (en) * 2002-01-09 2008-02-19 Micron Technology, Inc. Stacked die in die BGA package

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL242556A (de) * 1958-08-27
US3588632A (en) * 1968-11-12 1971-06-28 Josuke Nakata Structurally reinforced semiconductor device
US3723833A (en) * 1971-07-19 1973-03-27 Rca Corp Heat sinking of semiconductor integrated circuit devices
US3771028A (en) * 1972-05-26 1973-11-06 Westinghouse Electric Corp High gain, low saturation transistor
US3820153A (en) * 1972-08-28 1974-06-25 Zyrotron Ind Inc Plurality of semiconductor elements mounted on common base
DE2340128C3 (de) * 1973-08-08 1982-08-12 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterbauelement hoher Sperrfähigkeit
US4030943A (en) * 1976-05-21 1977-06-21 Hughes Aircraft Company Planar process for making high frequency ion implanted passivated semiconductor devices and microwave integrated circuits
JPS5315763A (en) * 1976-07-28 1978-02-14 Hitachi Ltd Resin sealed type semiconductor device
US4224734A (en) * 1979-01-12 1980-09-30 Hewlett-Packard Company Low electrical and thermal impedance semiconductor component and method of manufacture
FR2455785A1 (fr) * 1979-05-02 1980-11-28 Thomson Csf Support isolateur electrique, a faible resistance thermique, et embase ou boitier pour composant de puissance, comportant un tel support
JPS5796559A (en) * 1980-12-09 1982-06-15 Nec Corp Semiconductor device

Also Published As

Publication number Publication date
EP0090651A2 (de) 1983-10-05
EP0090651A3 (en) 1986-03-19
EP0090651B1 (de) 1989-11-02
JPS58170044A (ja) 1983-10-06
US4571611A (en) 1986-02-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee