DE3483594D1 - Verfahren zum anordnen einer mehrzahl von leitersegmenten in einer "bai" zusammengesetzt aus leiterkanaelen. - Google Patents

Verfahren zum anordnen einer mehrzahl von leitersegmenten in einer "bai" zusammengesetzt aus leiterkanaelen.

Info

Publication number
DE3483594D1
DE3483594D1 DE8484104622T DE3483594T DE3483594D1 DE 3483594 D1 DE3483594 D1 DE 3483594D1 DE 8484104622 T DE8484104622 T DE 8484104622T DE 3483594 T DE3483594 T DE 3483594T DE 3483594 D1 DE3483594 D1 DE 3483594D1
Authority
DE
Germany
Prior art keywords
ladder
bai
arranging
channels
segments
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8484104622T
Other languages
English (en)
Inventor
Paul Henry Bergeron
Kurt Douglas Carpenter
Jerome Bissell Hickson
Roger Kent Jackson
Keith Wesley Lallier
Elba K Malone
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3483594D1 publication Critical patent/DE3483594D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/394—Routing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE8484104622T 1983-05-16 1984-04-25 Verfahren zum anordnen einer mehrzahl von leitersegmenten in einer "bai" zusammengesetzt aus leiterkanaelen. Expired - Fee Related DE3483594D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/495,021 US4593362A (en) 1983-05-16 1983-05-16 Bay packing method and integrated circuit employing same

Publications (1)

Publication Number Publication Date
DE3483594D1 true DE3483594D1 (de) 1990-12-20

Family

ID=23966932

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8484104622T Expired - Fee Related DE3483594D1 (de) 1983-05-16 1984-04-25 Verfahren zum anordnen einer mehrzahl von leitersegmenten in einer "bai" zusammengesetzt aus leiterkanaelen.

Country Status (5)

Country Link
US (1) US4593362A (de)
EP (1) EP0125537B1 (de)
JP (1) JPH0669067B2 (de)
CA (1) CA1199428A (de)
DE (1) DE3483594D1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63237436A (ja) * 1987-03-26 1988-10-03 Toshiba Corp 半導体集積回路装置の配線方法
US4965739A (en) * 1987-03-26 1990-10-23 Vlsi Technology, Inc. Machine process for routing interconnections from one module to another module and for positioning said two modules after said modules are interconnected
JPH01274277A (ja) * 1988-04-26 1989-11-02 Hitachi Ltd 負荷分配方式
US5008831A (en) * 1989-01-12 1991-04-16 The United States Of America As Represented By The Department Of Health And Human Services Method for producing high quality chemical structure diagrams
US5255156A (en) * 1989-02-22 1993-10-19 The Boeing Company Bonding pad interconnection on a multiple chip module having minimum channel width
US5309371A (en) * 1989-06-28 1994-05-03 Kawasaki Steel Corporation Method of and apparatus for designing circuit block layout in integrated circuit
JP2759573B2 (ja) * 1992-01-23 1998-05-28 株式会社日立製作所 回路基板の配線パターン決定方法
US5629859A (en) * 1992-10-21 1997-05-13 Texas Instruments Incorporated Method for timing-directed circuit optimizations
US5493510A (en) * 1992-11-10 1996-02-20 Kawasaki Steel Corporation Method of and apparatus for placing blocks in semiconductor integrated circuit
US5440497A (en) * 1993-06-29 1995-08-08 Mitsubishi Semiconductor America, Inc. Method of and system for laying out bus cells on an integrated circuit chip
US5548747A (en) * 1995-02-10 1996-08-20 International Business Machines Corporation Bit stack wiring channel optimization with fixed macro placement and variable pin placement
US5631842A (en) * 1995-03-07 1997-05-20 International Business Machines Corporation Parallel approach to chip wiring
US5987241A (en) * 1997-01-09 1999-11-16 Hewlett-Packard Company Routing techniques to assure electrical integrity in datapath blocks
US6240542B1 (en) * 1998-07-14 2001-05-29 Lsi Logic Corporation Poly routing for chip interconnects with minimal impact on chip performance
JP2000164723A (ja) * 1998-11-30 2000-06-16 Matsushita Electric Ind Co Ltd Ｌｓｉ動作保証設計システム
TW200601909A (en) * 2004-06-18 2006-01-01 Hon Hai Prec Ind Co Ltd System and method for calculating net-length of the mainboard layout
US20070174803A1 (en) * 2006-01-20 2007-07-26 Lizotech, Inc. Method for concurrent search and select of routing patterns for a routing system
US8914551B2 (en) 2013-04-09 2014-12-16 Analog Devices, Inc. Sensor polling unit for microprocessor integration

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US940013A (en) * 1908-08-17 1909-11-16 David J Havenstrite Apparatus for harvesting and cutting plate-ice.
US940020A (en) * 1909-04-14 1909-11-16 Thomas G Plant Lip-turning machine.
US3567914A (en) * 1964-12-31 1971-03-02 Sperry Rand Corp Automated manufacturing system
US3702004A (en) * 1970-01-08 1972-10-31 Texas Instruments Inc Process and system for routing interconnections between logic system elements
GB1405508A (en) * 1971-12-29 1975-09-10 Ibm Circuit design apparatus
US3908118A (en) * 1973-09-27 1975-09-23 California Inst Of Techn Cross correlation anomaly detection system
UST940020I4 (en) 1974-04-17 1975-11-04 Automatic circuit generation process and apparatus
US3999214A (en) * 1974-06-26 1976-12-21 Ibm Corporation Wireable planar integrated circuit chip structure
UST940013I4 (en) 1974-09-17 1975-11-04 Network design process using multiple performance functions
US4263651A (en) * 1979-05-21 1981-04-21 International Business Machines Corporation Method for determining the characteristics of a logic block graph diagram to provide an indication of path delays between the blocks
US4495559A (en) * 1981-11-02 1985-01-22 International Business Machines Corporation Optimization of an organization of many discrete elements

Also Published As

Publication number Publication date
EP0125537B1 (de) 1990-11-14
JPH0669067B2 (ja) 1994-08-31
EP0125537A2 (de) 1984-11-21
US4593362A (en) 1986-06-03
CA1199428A (en) 1986-01-14
EP0125537A3 (en) 1987-01-21
JPS59213143A (ja) 1984-12-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee