DE4000372A1 - Conductive path prodn. on insulating plate - by selectively cutting away conductive coating on insulating base using scanning laser or sand jet - Google Patents

Conductive path prodn. on insulating plate - by selectively cutting away conductive coating on insulating base using scanning laser or sand jet

Info

Publication number
DE4000372A1
DE4000372A1 DE4000372A DE4000372A DE4000372A1 DE 4000372 A1 DE4000372 A1 DE 4000372A1 DE 4000372 A DE4000372 A DE 4000372A DE 4000372 A DE4000372 A DE 4000372A DE 4000372 A1 DE4000372 A1 DE 4000372A1
Authority
DE
Germany
Prior art keywords
tool
carrier
film
production
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4000372A
Other languages
German (de)
Inventor
Des Erfinders Auf Nennung Verzicht
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AEI GmbH
Original Assignee
AEI GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AEI GmbH filed Critical AEI GmbH
Priority to DE4000372A priority Critical patent/DE4000372A1/en
Publication of DE4000372A1 publication Critical patent/DE4000372A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Abstract

In a process for prodn. of a conductive path on an insulating plate or film carrier, the conductive coating is applied by an existing process, e.g. dipping and then through the use of a suitable tool, mateiral is removed from selected areas to leave the desired conductive paths which are then coated with a grease or silicone material. Methods of coating removal can involves the use of a scanning laser beam, fine sand jet or milling cutter. USE/ADVANTAGE - The process produces a conductive path on an insualting carrier for mfr. of printed circuits, foil conductor keyboard, liq.-crystal displays etc. and while producing a precision prod. is inexpensive.

Description

Die Erfindung richtet sich auf ein Verfahren zur Erstellung einer Leiter­ struktur auf einem platten- oder folienförmigen, isolierenden Träger.The invention is directed to a method for creating a ladder structure on a plate or foil-shaped, insulating support.

Derartige Leiterstrukturen werden für unterschiedliche Anwendungszwecke benötigt. Beispielsweise werden leitende Metallstrukturen auf als Träger fungierenden Glasplatten zur Erstellung sogenannter LCDs benötigt. Weiter­ hin werden Leiterstrukturen der in Betracht stehenden Art bei Folientas­ taturen eingesetzt, wo sie zur Ausbildung der Kontakte und Zuleitungen dienen, und wobei zwei mit derartigen Leiterstrukturen versehene Folien durch eine Abstandshalteeinrichtung so im Abstand voneinander gehalten werden, daß die Kontakte nur dann und nur dort geschlossen werden, wo auf die Folien ein mechanischer Druck ausgeübt wird.Such conductor structures are used for different purposes needed. For example, conductive metal structures are used as a carrier Acting glass plates needed to create so-called LCDs. Next towards lead structures of the type under consideration in film tapes tatures used where they are used to train the contacts and supply lines serve, and wherein two foils provided with such conductor structures held at a distance from each other by a spacer be that the contacts are closed only where and on the foils are subjected to mechanical pressure.

Herkömmlicherweise werden die Leiterstrukturen auf die jeweiligen Träger aufgedruckt. Derartige Herstellungsverfahren sind aufwendig und führen dazu, daß Folientastaturen beispielsweise relativ teuer sind.Conventionally, the conductor structures are on the respective carrier printed on. Such manufacturing processes are complex and lead that membrane keyboards, for example, are relatively expensive.

Zur Herstellung von gedruckten Schaltungen ist es an ich auch schon be­ kannt, eine isolierende Trägerplatte mit einer Kupferschicht zu versehen und die Kupferschicht an nicht von einem Schutzlack bedeckten Stellen in einem Säurebad abzutragen. Die aufgebrachte Schutzlackstruktur muß der später herzustellenden Leiterstruktur entsprechen. Dieses Verfahren ist aber auf solche Trägermaterialien beschränkt, welche von der Säure nicht angegriffen werden und es erfordert die Entsorgung der beim Prozeß an­ fallenden umweltfeindlichen Reste.For the production of printed circuits it is already on me knows to provide an insulating carrier plate with a copper layer and the copper layer in places not covered by a protective lacquer in to remove an acid bath. The protective lacquer structure applied must correspond to the conductor structure to be produced later. This procedure is but limited to those carrier materials which are not acidic be attacked and it requires the disposal of the process falling environmentally hostile remains.

Hiervon ausgehend liegt der Erfindung die Aufgabe zugrunde, ein Verfahren anzugeben, welches die präzise und gleichermaßen kostengünstige Herstel­ lung von Leiterstrukturen auf einem isolierenden Träger ermöglicht.Proceeding from this, the object of the invention is a method specify which is the most precise and equally inexpensive manufacturer development of conductor structures on an insulating support.

Diese Aufgabe wird dadurch gelöst, daß der Träger flächig mit einer lei­ tenden Beschichtung versehen wird, und daß mittels eines scannerartig verfahrenen Werkzeugs leitendes Material derart abgetragen wird, daß die gewünschte Leiterstruktur verbleibt.This object is achieved in that the carrier with a lei tenden coating is provided, and that by means of a scanner moved tool conductive material is removed so that the Desired conductor structure remains.

Durch die entsprechende Auswahl des Werkzeugs kann sichergestellt werden, daß zwar einerseits die leitende Schicht an den Stellen, die nicht als Leiterbahnen verbleiben sollen, zuverlässig abgetragen wird, daß anderer­ seits aber auch der Träger unbeschädigt bleibt. Bei diesem Verfahren ist es auch möglich, die Leiterbahnen relativ breit auszubilden, so daß eine gute Leitfähigkeit und eine zuverlässige Kontaktierung erreicht werden.The appropriate selection of the tool can ensure that on the one hand the conductive layer at the points that are not considered Conductors should remain, is reliably removed that others but also the carrier remains undamaged. In this procedure is it is also possible to form the conductor tracks relatively wide, so that a good conductivity and reliable contacting can be achieved.

Bei einer bevorzugten Ausführungsform des erfindungsgemäßen Verfahrens ist vorgesehen, daß als Werkzeug ein Laserstrahl verwendet wird, der mittels eines handelsüblichen Laserdruckers scannerartig verfahren und angesteuert wird. Dies bedeutet, daß der Laserstrahl z. B. mäanderförmig über die Trägerfläche gefahren wird und nur dort arbeitet und dementsprechend die leitende Beschichtung abträgt, wo keine Leiterstrukturen verbleiben sollen. In a preferred embodiment of the method according to the invention provided that a laser beam is used as a tool, which means of a commercially available laser printer is operated and controlled in a scanner-like manner becomes. This means that the laser beam z. B. meandering over the Carrier surface is driven and only works there and accordingly conductive coating removes where no conductor structures remain should.  

Es ist auf diese Weise mit besonderem Vorteil möglich, metallisch be­ schichtete Trägerfolien, z. B. Polyesterfolien mit Aluminiumbeschichtungen zu verwenden, die handelsüblich sind, weil sie auch für andere Einsatz­ zwecke Verwendung finden, und welche dementsprechend besonders kostengün­ stig verfügbar sind. Die Erfindung umfaßt also gerade auch das Bearbeiten handelsüblicher, bereits beschichteter Trägerfolien.It is particularly advantageous in this way to be metallic layered carrier films, e.g. B. polyester films with aluminum coatings to use that are commercially available because they are also used for other purposes find uses, and which accordingly are particularly inexpensive are always available. So the invention includes editing commercially available, already coated carrier films.

In weiterer Ausgestaltung der Erfindung kann vorgesehen sein, daß mittels des auf höhere Leistung geschalteten Lasers ein folienartiger Träger zu­ geschnitten wird. Dies bedeutet, daß mit Hilfe des Lasers auch die Außen­ konturen und eventuelle Ausnehmungen der Trägerfolie erstellt werden kön­ nen.In a further embodiment of the invention it can be provided that of the laser switched to higher power to a film-like carrier is cut. This means that with the help of the laser also the outside contours and possible recesses of the carrier film can be created nen.

Statt eines Lasers ist es auch denkbar, als Werkzeug ein Feinsandstrahl­ gebläse oder aber auch ein fräsend arbeitendes Werkzeug zu verwenden. Unter einem fräsend arbeitenden Werkzeug werden dabei Werkzeuge verstan­ den, welche eine rotierende oder eine hin- und hergehende Bewegung ausfüh­ ren und mittels eines entsprechenden Fräs- oder Radierelements die leiten­ de Beschichtung mechanisch abtragen. Dementsprechend ist es ebenso wie mit Hilfe eines Feinsandstrahlgebläses möglich, auch relativ komplizierte Strukturen sauber herauszuarbeiten. Zum Verfahren dieser Werkzeuge kann auf kommerziell verfügbare und erprobte Scanningeinrichtung zurückgegrif­ fen werden, wie sie z. B. von Plottern bekannt sind.Instead of a laser, it is also conceivable to use a fine sand jet as a tool blower or a milling tool. Tools are understood to mean a milling tool the one that performs a rotating or a reciprocating motion ren and lead with an appropriate milling or erasing element Remove the coating mechanically. Accordingly, it is the same as with Possible with the help of a fine sandblast blower, also relatively complicated Working out structures cleanly. To move these tools can access to commercially available and proven scanning equipment fen as z. B. are known from plotters.

Zur Erzielung einer Korrosionsfestigkeit kann vorgesehen sein, daß auf freiliegende Leiterabschnitte eine Kontaktfett-, Silikon-Schicht od. dgl. aufgetragen wird. Dies ist z. B. bei Folientastaturen bei solchen als An­ schlußbereich dienenden Leiterabschnitten von Bedeutung, welche nicht durch die jeweils andere Folie abgedeckt sind.To achieve corrosion resistance, it can be provided that exposed conductor sections a contact grease, silicone layer or the like. is applied. This is e.g. B. with membrane keyboards in such as An conductor sections serving in the final area, which are not are covered by the other film.

Neben der Verwendung handelsüblicher, bereits beschichteter Träger kann vorgesehen sein, daß die Herstellung der Beschichtung auf dem Träger durch Kalandrieren, Tauchen, Aufsprühen, Vakuum-Aufdampfen, Sputtern oder Ka­ schieren erfolgt.In addition to the use of commercially available, already coated supports be provided that the production of the coating on the carrier by Calendering, dipping, spraying, vacuum evaporation, sputtering or Ka sheer takes place.

Die Erfindung richtet sich auch auf die Verwendung des vorstehend be­ schriebenen Verfahrens speziell zur Herstellung von Leiterstrukturen auf Folien für Folientastaturen für Rechner, Schreibmaschinen und dgl.The invention is also directed to the use of the above described method specifically for the production of conductor structures Films for membrane keyboards for computers, typewriters and the like.

Claims (11)

1. Verfahren zur Erstellung einer Leiterstruktur auf einem platten- oder folienförmigen, isolierenden Träger, dadurch gekennzeichnet, daß der Träger flächig mit einer leitenden Beschichtung versehen wird, und daß dann mittels eines scannerartig verfahrbaren Werkzeugs leitendes Mate­ rial derart abgetragen wird, daß die gewünschte Leiterstruktur auf dem Träger verbleibt.1. A method for creating a conductor structure on a plate-shaped or film-shaped, insulating support, characterized in that the support is provided with a surface covering with a conductive coating, and that conductive material is then removed by means of a scanner-like tool so that the desired conductor structure remains on the carrier. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß als Werkzeug ein Laserstrahl verwendet wird, der mittels eines handelsüblichen Laser­ druckers und dessen Poligonspiegel scannerartig verfahren wird.2. The method according to claim 1, characterized in that as a tool Laser beam is used by means of a commercially available laser printer and its polygon mirror is moved like a scanner. 3. Verfahren nach Anspruch 2, dadurch gekennzeichnet, daß mittels des auf hohe Leistung geschalteten Lasers ein folienartiger Träger zugeschnit­ ten wird.3. The method according to claim 2, characterized in that by means of high power switched laser cut a film-like carrier will. 4. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß als Werkzeug ein Feinsandstrahlgebläse verwendet wird.4. The method according to claim 1, characterized in that as a tool Fine sandblasting is used. 5. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß als Werkzeug ein fräsend oder radierend arbeitendes Werkzeug verwendet wird.5. The method according to claim 1, characterized in that as a tool milling or erasing tool is used. 6. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß auf freiliegen­ de Leiterabschnitte eine Kontaktfett-, Silikon-Schicht od. dgl. aufge­ tragen wird.6. The method according to claim 1, characterized in that are exposed de conductor sections a contact grease, silicone layer or the like will wear. 7. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Beschichtung des Trägers durch Kalandrieren, Tauchen, Aufsprühen, Vakuum-Aufdampfen, Sputtern oder Kaschieren erfolgt.7. The method according to claim 1, characterized in that the coating the carrier by calendering, dipping, spraying, vacuum evaporation, Sputtering or laminating takes place. 8. Verwendung eines Verfahrens nach den Ansprüchen 1 bis 7 zur Herstellung einer Leiterstruktur auf einer metallisierten Folie für eine Folien­ tastatur.8. Use of a method according to claims 1 to 7 for the production a conductor structure on a metallized film for a film keyboard. 9. Verwendung eines Verfahrens nach den Ansprüchen 1 bis 7 zur Herstellung einer Leiterstruktur auf metallisiertem Glas oder Folie für die Ferti­ gung eines Liquid-Crystal-Display.9. Use of a method according to claims 1 to 7 for the production a ladder structure on metallized glass or foil for ferti a liquid crystal display. 10. Verwendung eines Verfahrens nach den Ansprüchen 1 bis 7 zur Herstellung einer Leiterstruktur auf einer metallisierten Folie für die Fertigung einer Multilayerschaltung.10. Use of a method according to claims 1 to 7 for the production a ladder structure on a metallized film for manufacturing a multilayer circuit. 11. Verwendung eines Verfahrens nach den Ansprüchen 1 bis 7 zur Herstellung einer Leiterstruktur auf einem kupferkaschierten Kunststoff für die Fer­ tigung einer gedruckten Schaltung.11. Use of a method according to claims 1 to 7 for the production a conductor structure on a copper-clad plastic for the Fer printed circuit board.
DE4000372A 1990-01-09 1990-01-09 Conductive path prodn. on insulating plate - by selectively cutting away conductive coating on insulating base using scanning laser or sand jet Withdrawn DE4000372A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4000372A DE4000372A1 (en) 1990-01-09 1990-01-09 Conductive path prodn. on insulating plate - by selectively cutting away conductive coating on insulating base using scanning laser or sand jet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4000372A DE4000372A1 (en) 1990-01-09 1990-01-09 Conductive path prodn. on insulating plate - by selectively cutting away conductive coating on insulating base using scanning laser or sand jet

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DE4000372A1 true DE4000372A1 (en) 1991-07-11

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19603971A1 (en) * 1996-01-26 1997-07-31 Emi Tec Elektronische Material Large, area data input device production, especially computer touch panel
EP0790123A2 (en) * 1996-02-14 1997-08-20 James River Corporation Of Virginia Patterned metal foil laminate and method for making same
DE19731969A1 (en) * 1997-07-24 1998-08-27 Siemens Ag Manufacturing method e.g. for electrical component having conductive structure on thermoplastic carrier substrate, such as chipcard-transponder
DE19737808A1 (en) * 1997-08-29 1999-03-18 Nwl Laser Tech Gmbh Structuring and manufacturing circuit boards
WO2002082875A2 (en) * 2001-04-03 2002-10-17 Siemens Aktiengesellschaft Circuit board with voltage-conducting electromechanical components and method for production of said circuit board
US7709766B2 (en) 2002-08-05 2010-05-04 Research Foundation Of The State University Of New York System and method for manufacturing embedded conformal electronics
US9079382B2 (en) 2008-03-26 2015-07-14 Tecnomar Oy Method for manufacturing laminated circuit board
US9876265B2 (en) 2010-06-14 2018-01-23 Avery Dennison Retail Information Services, Llc Foil laminate intermediate and method of manufacturing
US10186765B2 (en) 2006-01-24 2019-01-22 Avery Dennison Retail Information Services, Llc Radio frequency (RF) antenna containing element and methods of making the same

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DE2451299A1 (en) * 1974-10-29 1976-05-06 Juergen Dipl Ing Seebach Circuit board with machined out conducting paths - numerically controlled cutter used to simplify production
US4081653A (en) * 1976-12-27 1978-03-28 Western Electric Co., Inc. Removal of thin films from substrates by laser induced explosion
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EP0072658A1 (en) * 1981-08-18 1983-02-23 Itt Industries, Inc. Display device manufacture
US4670639A (en) * 1985-04-24 1987-06-02 Siemens Aktiengesellschaft Method for the formation of narrow, metal-free strips in a metal layer on plastic sheets
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Publication number Priority date Publication date Assignee Title
US3240624A (en) * 1962-03-07 1966-03-15 Corning Glass Works Method of forming a patterned electroconductive coating
DD146783A3 (en) * 1970-08-24 1981-03-04 Helmut Bollinger METHOD FOR PRODUCING PRINTED CIRCUITS
DE2451299A1 (en) * 1974-10-29 1976-05-06 Juergen Dipl Ing Seebach Circuit board with machined out conducting paths - numerically controlled cutter used to simplify production
US4081653A (en) * 1976-12-27 1978-03-28 Western Electric Co., Inc. Removal of thin films from substrates by laser induced explosion
GB1573699A (en) * 1977-03-31 1980-08-28 Citizen Watch Co Ltd Process for forming transparent electrode pattern on electro-optical display device
EP0072658A1 (en) * 1981-08-18 1983-02-23 Itt Industries, Inc. Display device manufacture
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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19603971A1 (en) * 1996-01-26 1997-07-31 Emi Tec Elektronische Material Large, area data input device production, especially computer touch panel
EP0790123A2 (en) * 1996-02-14 1997-08-20 James River Corporation Of Virginia Patterned metal foil laminate and method for making same
EP0790123A3 (en) * 1996-02-14 1998-12-23 Fort James Corporation Patterned metal foil laminate and method for making same
DE19731969A1 (en) * 1997-07-24 1998-08-27 Siemens Ag Manufacturing method e.g. for electrical component having conductive structure on thermoplastic carrier substrate, such as chipcard-transponder
DE19737808A1 (en) * 1997-08-29 1999-03-18 Nwl Laser Tech Gmbh Structuring and manufacturing circuit boards
WO2002082875A2 (en) * 2001-04-03 2002-10-17 Siemens Aktiengesellschaft Circuit board with voltage-conducting electromechanical components and method for production of said circuit board
WO2002082875A3 (en) * 2001-04-03 2003-01-23 Siemens Ag Circuit board with voltage-conducting electromechanical components and method for production of said circuit board
US7709766B2 (en) 2002-08-05 2010-05-04 Research Foundation Of The State University Of New York System and method for manufacturing embedded conformal electronics
US10186765B2 (en) 2006-01-24 2019-01-22 Avery Dennison Retail Information Services, Llc Radio frequency (RF) antenna containing element and methods of making the same
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