DE4305793A1 - Power module - Google Patents

Power module

Info

Publication number
DE4305793A1
DE4305793A1 DE4305793A DE4305793A DE4305793A1 DE 4305793 A1 DE4305793 A1 DE 4305793A1 DE 4305793 A DE4305793 A DE 4305793A DE 4305793 A DE4305793 A DE 4305793A DE 4305793 A1 DE4305793 A1 DE 4305793A1
Authority
DE
Germany
Prior art keywords
power
power module
carrier body
section
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4305793A
Other languages
German (de)
Inventor
Guenter Dipl Ing Leicht
Reinhard Dipl Ing Rueckert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Temic Telefunken Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Temic Telefunken Microelectronic GmbH filed Critical Temic Telefunken Microelectronic GmbH
Priority to DE4305793A priority Critical patent/DE4305793A1/en
Publication of DE4305793A1 publication Critical patent/DE4305793A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/105—Mechanically attached to another device

Abstract

In the case of a power module having a power section and a control section, the semiconductor components of the power section and of the control section are accommodated on separate supporting bodies which are arranged one above the other. The power section has exclusively encased semiconductor components whose casing lower side is arranged on a first supporting body on one side; the control section has components arranged on one side or both sides, on a second supporting body. The two supporting bodies are connected to one another via the connecting pins of the encased semiconductor components of the power section.

Description

Leistungsmodule werden beispielsweise für Motorsteue­ rungen, Frequenzumrichter oder in Schaltnetzteilen eingesetzt. Die Schaltung derartiger Leistungsmodule umfaßt einen Leistungsteil und einen Steuerelektronikteil, deren Bauelemente in sogenannter "chip-on-board"-Technik als ungehäuste Halbleiterchips auf einen Wärmespreizer gelötet und gebondet werden; die gesamte Schaltung wird zur Wärmeabfuhr auf einen Kühlkörper montiert (geklebt).Power modules are used, for example, for engine control rungs, frequency converter or in switching power supplies used. The switching of such power modules includes a power section and one Control electronics part, the components in so-called "chip-on-board" technology as un-packaged semiconductor chips soldered to a heat spreader and bonded; the entire circuit is used for heat dissipation Heatsink installed (glued).

Nachteilig hierbei ist jedoch zum einen die kosten­ intensive Herstellungsweise (es sind viele Arbeitsgänge notwendig), zum anderen ist die Handhabung ungehäuster Halbleiterbauelemente mit Problemen verbunden (Gefahr der Beschädigung, Erfordernis von Reinräumen, schwierige Testbarkeit etc.).However, the disadvantage here is the cost intensive production method (there are many operations necessary), on the other hand, handling is unhoused Semiconductor components associated with problems (danger the damage, the need for clean rooms, difficult testability etc.).

Der Erfindung liegt die Aufgabe zugrunde ein Leistungs­ modul anzugeben, das die vorgenannten Nachteile ver­ meidet und demgegenüber vorteilhafte Eigenschaften auf­ weist.The invention has for its object a performance To specify module that ver the disadvantages mentioned avoids and in contrast advantageous properties points.

Diese Aufgabe wird erfindungsgemäß durch die Merkmale im Kennzeichen des Patentanspruches 1 gelöst. Vorteilhafte Weiterbildungen des Leistungsmoduls er­ geben sich aus den Unteransprüchen. This object is achieved by the features solved in the characterizing part of claim 1. Advantageous further developments of the power module give themselves from the subclaims.  

Beim vorgestellten Leistungsmodul werden Steuerteil und Leistungsteil in zwei getrennten Ebenen und separaten Prozessen gefertigt: beim Leistungsteil werden aus­ schließlich gehäuste Halbleiterbauelemente einseitig auf einen gut wärmeleitenden, elektrisch isolierenden Trägerkörper aufgebrächt (aufgelötet oder aufgeklebt) und vorzugsweise der Trägerkörper zur Wärmeabfuhr auf einen Kühlkörper aufgebracht (beispielsweise geklebt); beim Steuerteil werden u. a. SMD-Bauelemente einseitig oder beidseitig auf einen zweiten Trägerkörper (beispielsweise eine Leiterplatte) aufgebracht. Die beiden Trägerkörper und damit die Schaltungsteile werden auf einfache Weise über die Anschlußpins der gehäusten Leistungs-Halbleiterbauelemente miteinander verbunden, indem diese gebogen, durch Öffnungen der Leiterplatte des Steuerteils gesteckt und mit dieser fest verbunden (beispielsweise verlötet) werden.The control module and Power section in two separate levels and separate Processes manufactured: in the power section are out finally, single-sided semiconductor devices on a good heat-conducting, electrically insulating Carrier body applied (soldered or glued) and preferably the carrier body for heat dissipation applied a heat sink (for example glued); in the control section u. a. SMD components on one side or on both sides on a second carrier body (for example a printed circuit board). The two carrier bodies and thus the circuit parts are easily connected via the connecting pins packaged power semiconductor devices together connected by these bent through openings of the Printed circuit board of the control section and with this firmly connected (for example soldered).

Das Leistungsmodul vereinigt mehrere Vorteile in sich:The power module combines several advantages:

  • - Leistungsteil und Steuerteil können in getrennten Prozessen unabhängig voneinander bestückt werden,- Power section and control section can be in separate Processes are equipped independently of each other,
  • - durch die Verwendung von gehäusten Leistungs-Halb­ leiterbauelementen sind keine Maßnahmen zur Isolierung oder Versiegelung dieser Bauelemente erforderlich,- through the use of housed power half conductor components are not measures for Insulation or sealing of these components required,
  • - das einfache Herstellungsverfahren benötigt nur eine geringe Zahl an Arbeitsgängen und ist somit kostengünstig, - The simple manufacturing process only needs a small number of operations and is therefore inexpensive,  
  • - trotz der Verwendung von gehäusten Leistungs- Halbleiterbauelementen und von zwei separaten Trägerkörpern kann durch deren kurze Verbindung (gebogene Anschlußpins, direktes Aufsetzen) eine geringe Bauhöhe erreicht werden,- despite the use of housed power Semiconductor devices and two separate ones Carrier bodies can by their short connection (curved connection pins, direct attachment) one low overall height can be achieved,
  • - da nur der Leistungsteil auf einen Keramik-Träger­ körper oder eine Metallkern-Leiterplatte aufge­ bracht wird, ist der Bedarf an (teurem) Keramikma­ terial oder Metallkern-Leiterplattenmaterial ge­ ring,- since only the power section on a ceramic support body or a metal core circuit board is brought, the need for (expensive) ceramics material or metal core circuit board material ring,
  • - wird der Keramik-Trägerkörper beidseitig gelötet (Leistungs-Halbleiterbauelemente auf Trägerkörper, Trägerkörper auf Kühlkörper), ist ein guter Wärme­ übergang und damit eine gute Wärmeabfuhr gegeben.- The ceramic carrier body is soldered on both sides (Power semiconductor components on carrier bodies, Support body on heat sink), is a good heat transition and thus good heat dissipation.

Anhand der Fig. 1 und 2 soll das vorgestellte Leistungsmodul, wie es beispielsweise für Motorsteue­ rungen eingesetzt wird, näher erläutert werden. In der Fig. 1 sind dabei die getrennten Komponenten des Leistungsmoduls dargestellt, die Fig. 2 zeigt das zusammengebaute Leistungsmodul.To the presented power module, as is for example used for stanchions Motorsteue reference to FIGS. 1 and 2, will be explained in more detail. In FIG. 1, the separate components of the power module are illustrated, Fig. 2 shows the assembled power module.

Die gehäusten Halbleiterbauelemente 7 des Leistungs­ teils 1 werden mit ihrer Gehäuse-Unterseite mittels der Lotpaste 11 einseitig auf den ersten Trägerkörper 5 aufgebracht; der Trägerkörper 5 besteht beispielsweise aus einer Al2O3-Keramik mit den Abmessungen 50 × 60 mm und einer Dicke von 0,65 mm. Die SMD-Bauelemente 9 des Steuerteils 2 werden beidseitig auf den zweiten Träger­ körper 6 aufgebracht; der Trägerkörper 6 ist beispiels­ weise als gedruckte Schaltungsplatine ("PCB-Board") mit einer Dicke von 1 mm und den Abmessungen 55 × 65 mm ausgebildet. Der erste Trägerkörper 5 wird mittels einer gut wärmeleitenden Schicht 12 (beispielsweise eine Kleberschicht oder eine Lotpaste mit einer Schichtdicke von 20 um) auf eine Substrat-Trägerplatte 3 aufgebracht (beispielsweise aufgeklebt oder aufgelö­ tet); die Trägerplatte 3 besteht beispielsweise aus Aluminium und besitzt eine Dicke von beispielsweise 2 mm. Die beiden Trägerkörper 5, 6 werden miteinander verbunden, indem die Anschlußpins 8 der gehäusten Leistungs-Halbleiterbauelemente 7 nach oben umgebogen werden, der zweite Trägerkörper 6 mittels der Öffnungen 10 über die hochstehenden Anschlußpins 8 der Halblei­ terbauelemente 7 gefädelt wird und die Anschlußpins 8 mit dem zweiten Trägerkörper 6 (beispielsweise durch Verlöten mittels eines Schwall-Lötverfahrens) verbunden werden. Anschließend wird die gesamte Baugruppe aus Leistungsteil 1, Steuerteil 2 und Substrat-Trägerplatte 3 durch eine Abdeckhaube 4 (beispielsweise eine Plastikhaube) gesteckt, die mit der Substrat-Träger­ platte 3 vernietet werden kann.The packaged semiconductor components 7 of the power part 1 are applied on one side to the first carrier body 5 by means of the solder paste 11 with their housing underside; the carrier body 5 consists for example of an Al 2 O 3 ceramic with the dimensions 50 × 60 mm and a thickness of 0.65 mm. The SMD components 9 of the control part 2 are applied to the second carrier body 6 on both sides; the carrier body 6 is, for example, as a printed circuit board ("PCB board") with a thickness of 1 mm and the dimensions 55 × 65 mm. The first carrier body 5 is applied by means of a highly heat-conducting layer 12 (for example an adhesive layer or a solder paste with a layer thickness of 20 μm) to a substrate carrier plate 3 (for example glued or dissolved); the carrier plate 3 consists, for example, of aluminum and has a thickness of, for example, 2 mm. The two carrier bodies 5 , 6 are connected to one another by the connection pins 8 of the housed power semiconductor components 7 being bent upward, the second carrier body 6 being threaded through the openings 10 via the upstanding connection pins 8 of the semiconductor component 7 and the connection pins 8 with the second carrier body 6 (for example by soldering using a wave soldering method). Then the entire assembly of power section 1 , control section 2 and substrate support plate 3 is inserted through a cover 4 (for example a plastic cover), which can be riveted to the substrate support plate 3 .

Claims (9)

1. Leistungsmodul mit einem Leistungsteil (1) und einem Steuerteil (2), dadurch gekennzeichnet, daß die Halb­ leiterbauelemente (7, 9) des Leistungsteils (1) und des Steuerteils (2) auf getrennten, übereinander angeordne­ ten Trägerkörpern (5, 6) aufgebracht sind, daß der Leistungsteil (1) ausschließlich gehäuste Halbleiter­ bauelemente (7) aufweist, die mit ihrer Gehäuse-Unter­ seite auf einem ersten Trägerkörper (5) einseitig ange­ ordnet sind, daß der Steuerteil (2) auf einem zweiten Trägerkörper (6) einseitig oder beidseitig angeordnete Bauelemente (9) aufweist, und daß die beiden Trägerkörper (5, 6) über die Anschlußpins (8) der gehäusten Halbleiterbauelemente (7) des Leistungsteils (1) miteinander verbunden sind.1. Power module with a power section ( 1 ) and a control section ( 2 ), characterized in that the semiconductor components ( 7 , 9 ) of the power section ( 1 ) and the control section ( 2 ) on separate, one above the other carrier bodies ( 5 , 6 ) are applied that the power section ( 1 ) has exclusively packaged semiconductor components ( 7 ) which are arranged on one side with their lower housing side on a first carrier body ( 5 ), that the control part ( 2 ) on a second carrier body ( 6 ) has components ( 9 ) arranged on one or both sides, and that the two carrier bodies ( 5 , 6 ) are connected to one another via the connection pins ( 8 ) of the packaged semiconductor components ( 7 ) of the power unit ( 1 ). 2. Leistungsmodul nach Anspruch 1 , dadurch gekennzeich­ net, daß die Anschlußpins (8) der gehäusten Halbleiter­ bauelemente (7) des Leistungsteils (1) umgebogen sind und vom ersten Trägerkörper (5) wegweisen, und daß der zweite Trägerkörper (6) Öffnungen (10) aufweist, durch die die Anschlußpins (8) durchgeführt und fest mit dem zweiten Trägerkörper (6) verbunden sind.2. Power module according to claim 1, characterized in that the connecting pins ( 8 ) of the semiconductor components ( 7 ) of the power section ( 1 ) are bent and point away from the first carrier body ( 5 ), and that the second carrier body ( 6 ) openings ( 10 ), through which the connection pins ( 8 ) are passed and are firmly connected to the second carrier body ( 6 ). 3. Leistungsmodul nach Anspruch 1 oder 2, dadurch ge­ kennzeichnet, daß der Trägerkörper (5) des Leistungs­ teils (1) aus einem elektrisch isolierenden und gut wärmeleitenden Material besteht.3. Power module according to claim 1 or 2, characterized in that the carrier body ( 5 ) of the power part ( 1 ) consists of an electrically insulating and good heat-conducting material. 4. Leistungsmodul nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß der Trägerkörper (6) des Steuerteils (2) als gedruckte Schaltungsplatine ausge­ bildet ist.4. Power module according to one of claims 1 to 3, characterized in that the carrier body ( 6 ) of the control part ( 2 ) is formed out as a printed circuit board. 5. Leistungsmodul nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß der Trägerkörper (5) des Leistungsteils (1) auf einer Trägerplatte (3) aufge­ bracht ist.5. Power module according to one of claims 1 to 4, characterized in that the carrier body ( 5 ) of the power section ( 1 ) on a carrier plate ( 3 ) is brought up. 6. Leistungsmodul nach Anspruch 5, dadurch gekennzeichnet, daß die Trägerplatte (3) aus einem gut wärmeleitenden Metall besteht.6. Power module according to claim 5, characterized in that the carrier plate ( 3 ) consists of a good heat-conducting metal. 7. Leistungsmodul nach Anspruch 6, dadurch gekennzeich­ net, daß die Trägerplatte (3) aus Aluminium besteht.7. Power module according to claim 6, characterized in that the carrier plate ( 3 ) consists of aluminum. 8. Leistungsmodul nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß der Trägerkörper (5) und die Trägerplatte (3) als Metallkern-Leiterplatte ausgebildet sind.8. Power module according to one of claims 1 to 5, characterized in that the carrier body ( 5 ) and the carrier plate ( 3 ) are designed as a metal core circuit board. 9. Leistungsmodul nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, daß der Leistungsteil (1), der Steuerteil (2) und die Trägerplatte (3) in eine Abdeck­ haube (4) eingebracht sind.9. Power module according to one of claims 1 to 8, characterized in that the power section ( 1 ), the control section ( 2 ) and the carrier plate ( 3 ) are introduced into a cover ( 4 ).
DE4305793A 1993-02-25 1993-02-25 Power module Withdrawn DE4305793A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4305793A DE4305793A1 (en) 1993-02-25 1993-02-25 Power module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4305793A DE4305793A1 (en) 1993-02-25 1993-02-25 Power module

Publications (1)

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DE4305793A1 true DE4305793A1 (en) 1994-09-01

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Cited By (26)

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Publication number Priority date Publication date Assignee Title
DE19505180A1 (en) * 1995-02-16 1996-08-22 Telefunken Microelectron Electronic control module
DE19519414A1 (en) * 1995-05-26 1996-11-28 Rexroth Mannesmann Gmbh Electrically operated servo-valve
DE19645636C1 (en) * 1996-11-06 1998-03-12 Telefunken Microelectron Power module for operating electric motor with speed and power control
DE19645635C1 (en) * 1996-11-06 1998-04-23 Telefunken Microelectron Control device for controlling the electric motor of motor vehicles
DE19646004A1 (en) * 1996-11-07 1998-05-14 Siemens Ag Electronic switching apparatus
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DE19734032C1 (en) * 1997-08-06 1998-12-17 Siemens Ag Electronic control device with manufacturing procedure e.g. for installing in oil-sump of automobile automatic transmission
DE19730865A1 (en) * 1997-07-18 1999-02-18 Ulrich Dipl Ing Grauvogel Heat sink for an electronic component especially a ceramic circuit board
DE19753060A1 (en) * 1997-11-29 1999-06-17 Telefunken Microelectron Electronic circuit board module
DE29819349U1 (en) * 1998-10-30 1999-12-09 Siemens Ag Semiconductor circuit arrangement, in particular high-current converters with a low intermediate circuit voltage
EP0997943A2 (en) * 1998-10-30 2000-05-03 Siemens Aktiengesellschaft Semiconductor circuit device, in particular high current converter
EP1006766A2 (en) † 1998-12-01 2000-06-07 Mannesmann VDO Aktiengesellschaft Electronic device
DE19951865A1 (en) * 1998-12-22 2000-08-03 Mannesmann Vdo Ag Circuit board e.g. for vehicle indicator instrument, has light source mounted on bearer in form of bridge attached to circuit board by fixing arrangement in form of clip fixing or hinge made in one piece with instrument housing
DE10055040C1 (en) * 2000-11-07 2002-06-06 Hella Kg Hueck & Co Ceramic circuit board mounting method uses adhesive structure applied to support surface or underside of ceramic circuit board
DE19924993C2 (en) * 1999-05-31 2002-10-10 Tyco Electronics Logistics Ag Intelligent power module in sandwich construction
US6502968B1 (en) 1998-12-22 2003-01-07 Mannesmann Vdo Ag Printed circuit board having a light source
DE10109584C2 (en) * 2000-03-08 2003-08-21 Yazaki Corp Electronic circuit device
DE4405578B4 (en) * 1994-02-22 2004-02-05 Siemens Ag Electronic assembly
DE10321852A1 (en) * 2003-05-15 2004-12-02 Leopold Kostal Gmbh & Co Kg connecting element
DE19734270B4 (en) * 1997-08-07 2006-02-23 Siemens Ag Air-cooled converter module
DE102005026233A1 (en) * 2005-06-07 2006-12-21 Tyco Electronics Ec Kft Electrical power module for use in e.g. frequency converter, has mechanical catch device fixed on printed circuit board, and isolation bar electrically isolating external component from board and pin
DE102007014713B3 (en) * 2007-03-23 2008-09-18 Sew-Eurodrive Gmbh & Co. Kg Cooling arrangement, inverter and electric drive system
WO2010130654A1 (en) * 2009-05-12 2010-11-18 Würth Elektronik Ics Gmbh & Co. Kg Pluggable varistor
DE102013215648A1 (en) * 2013-08-08 2015-02-12 Siemens Aktiengesellschaft Power electronics module with substrate, component and circuit board
FR3015177A1 (en) * 2013-12-18 2015-06-19 Zahnradfabrik Friedrichshafen PRINTED CIRCUIT, METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT DEVICE
DE102018202484A1 (en) * 2018-02-19 2019-08-22 Zf Friedrichshafen Ag Power electronics arrangement

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DE19645635C1 (en) * 1996-11-06 1998-04-23 Telefunken Microelectron Control device for controlling the electric motor of motor vehicles
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EP0857011A2 (en) * 1997-01-30 1998-08-05 Robert Bosch Gmbh Electrical device especially switchgear and control device for a motor vehicle
EP0857011A3 (en) * 1997-01-30 1999-04-28 Robert Bosch Gmbh Electrical device especially switchgear and control device for a motor vehicle
DE19730865A1 (en) * 1997-07-18 1999-02-18 Ulrich Dipl Ing Grauvogel Heat sink for an electronic component especially a ceramic circuit board
DE19730865C2 (en) * 1997-07-18 2001-12-13 Ulrich Grauvogel Arrangement with a heat sink made of an aluminum material and elements to be cooled
DE19734032C1 (en) * 1997-08-06 1998-12-17 Siemens Ag Electronic control device with manufacturing procedure e.g. for installing in oil-sump of automobile automatic transmission
DE19734270B4 (en) * 1997-08-07 2006-02-23 Siemens Ag Air-cooled converter module
DE19753060A1 (en) * 1997-11-29 1999-06-17 Telefunken Microelectron Electronic circuit board module
DE29819349U1 (en) * 1998-10-30 1999-12-09 Siemens Ag Semiconductor circuit arrangement, in particular high-current converters with a low intermediate circuit voltage
EP0997943A2 (en) * 1998-10-30 2000-05-03 Siemens Aktiengesellschaft Semiconductor circuit device, in particular high current converter
DE19850153A1 (en) * 1998-10-30 2000-05-18 Siemens Ag Semiconductor circuit arrangement, in particular high-current converters with a low intermediate circuit voltage
DE19850153B4 (en) * 1998-10-30 2005-07-21 Siemens Ag Semiconductor circuit arrangement, in particular high-current converter with low DC link voltage
EP0997943A3 (en) * 1998-10-30 2003-05-28 Siemens Aktiengesellschaft Semiconductor circuit device, in particular high current converter
DE19855389C2 (en) * 1998-12-01 2002-10-31 Siemens Ag Electronic device
EP1006766B2 (en) † 1998-12-01 2009-08-26 Continental Automotive GmbH Electronic device
EP1006766A2 (en) † 1998-12-01 2000-06-07 Mannesmann VDO Aktiengesellschaft Electronic device
DE19855389A1 (en) * 1998-12-01 2000-06-21 Mannesmann Vdo Ag Electronic device
DE19951865A1 (en) * 1998-12-22 2000-08-03 Mannesmann Vdo Ag Circuit board e.g. for vehicle indicator instrument, has light source mounted on bearer in form of bridge attached to circuit board by fixing arrangement in form of clip fixing or hinge made in one piece with instrument housing
US6502968B1 (en) 1998-12-22 2003-01-07 Mannesmann Vdo Ag Printed circuit board having a light source
DE19924993C2 (en) * 1999-05-31 2002-10-10 Tyco Electronics Logistics Ag Intelligent power module in sandwich construction
US6646884B1 (en) 1999-05-31 2003-11-11 Tyco Electronics Logistics Ag Sandwich-structured intelligent power module
DE10109584C2 (en) * 2000-03-08 2003-08-21 Yazaki Corp Electronic circuit device
DE10055040C1 (en) * 2000-11-07 2002-06-06 Hella Kg Hueck & Co Ceramic circuit board mounting method uses adhesive structure applied to support surface or underside of ceramic circuit board
DE10321852B4 (en) * 2003-05-15 2020-10-01 Kostal Automobil Elektrik Gmbh & Co. Kg Connecting device with a connecting element
DE10321852A1 (en) * 2003-05-15 2004-12-02 Leopold Kostal Gmbh & Co Kg connecting element
DE102005026233A1 (en) * 2005-06-07 2006-12-21 Tyco Electronics Ec Kft Electrical power module for use in e.g. frequency converter, has mechanical catch device fixed on printed circuit board, and isolation bar electrically isolating external component from board and pin
DE102005026233B4 (en) * 2005-06-07 2008-08-07 Tyco Electronics Ec Kft Electric power module
DE102007014713B3 (en) * 2007-03-23 2008-09-18 Sew-Eurodrive Gmbh & Co. Kg Cooling arrangement, inverter and electric drive system
WO2010130654A1 (en) * 2009-05-12 2010-11-18 Würth Elektronik Ics Gmbh & Co. Kg Pluggable varistor
DE102013215648A1 (en) * 2013-08-08 2015-02-12 Siemens Aktiengesellschaft Power electronics module with substrate, component and circuit board
FR3015177A1 (en) * 2013-12-18 2015-06-19 Zahnradfabrik Friedrichshafen PRINTED CIRCUIT, METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT DEVICE
DE102018202484A1 (en) * 2018-02-19 2019-08-22 Zf Friedrichshafen Ag Power electronics arrangement
US11246244B2 (en) 2018-02-19 2022-02-08 Zf Friedrichshafen Ag Power electronics assembly

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