DE50112868D1 - Halbleiter-chip - Google Patents

Halbleiter-chip

Info

Publication number
DE50112868D1
DE50112868D1 DE50112868T DE50112868T DE50112868D1 DE 50112868 D1 DE50112868 D1 DE 50112868D1 DE 50112868 T DE50112868 T DE 50112868T DE 50112868 T DE50112868 T DE 50112868T DE 50112868 D1 DE50112868 D1 DE 50112868D1
Authority
DE
Germany
Prior art keywords
semiconductor chip
chip
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE50112868T
Other languages
English (en)
Inventor
Albrecht Mayer
Andreas Wenzel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Application granted granted Critical
Publication of DE50112868D1 publication Critical patent/DE50112868D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0657Stacked arrangements of devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503Stacked arrangements of devices
    • H01L2225/06513Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503Stacked arrangements of devices
    • H01L2225/06527Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE50112868T 2000-06-30 2001-06-12 Halbleiter-chip Expired - Lifetime DE50112868D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10030994A DE10030994A1 (de) 2000-06-30 2000-06-30 Halbleiter-Chip
PCT/DE2001/002174 WO2002003464A2 (de) 2000-06-30 2001-06-12 Halbleiter-chip

Publications (1)

Publication Number Publication Date
DE50112868D1 true DE50112868D1 (de) 2007-09-27

Family

ID=7646784

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10030994A Withdrawn DE10030994A1 (de) 2000-06-30 2000-06-30 Halbleiter-Chip
DE50112868T Expired - Lifetime DE50112868D1 (de) 2000-06-30 2001-06-12 Halbleiter-chip

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10030994A Withdrawn DE10030994A1 (de) 2000-06-30 2000-06-30 Halbleiter-Chip

Country Status (4)

Country Link
US (1) US6845027B2 (de)
EP (1) EP1295340B1 (de)
DE (2) DE10030994A1 (de)
WO (1) WO2002003464A2 (de)

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JP2003099414A (ja) * 2001-09-21 2003-04-04 Mitsubishi Electric Corp 半導体集積回路
US9171585B2 (en) 2005-06-24 2015-10-27 Google Inc. Configurable memory circuit system and method
US20080028136A1 (en) * 2006-07-31 2008-01-31 Schakel Keith R Method and apparatus for refresh management of memory modules
US20080082763A1 (en) 2006-10-02 2008-04-03 Metaram, Inc. Apparatus and method for power management of memory circuits by a system or component thereof
US9542352B2 (en) 2006-02-09 2017-01-10 Google Inc. System and method for reducing command scheduling constraints of memory circuits
US8335894B1 (en) 2008-07-25 2012-12-18 Google Inc. Configurable memory system with interface circuit
US8060774B2 (en) 2005-06-24 2011-11-15 Google Inc. Memory systems and memory modules
US8796830B1 (en) 2006-09-01 2014-08-05 Google Inc. Stackable low-profile lead frame package
US8130560B1 (en) 2006-11-13 2012-03-06 Google Inc. Multi-rank partial width memory modules
US8244971B2 (en) * 2006-07-31 2012-08-14 Google Inc. Memory circuit system and method
US8077535B2 (en) 2006-07-31 2011-12-13 Google Inc. Memory refresh apparatus and method
US8089795B2 (en) * 2006-02-09 2012-01-03 Google Inc. Memory module with memory stack and interface with enhanced capabilities
US8359187B2 (en) 2005-06-24 2013-01-22 Google Inc. Simulating a different number of memory circuit devices
US8090897B2 (en) 2006-07-31 2012-01-03 Google Inc. System and method for simulating an aspect of a memory circuit
US8397013B1 (en) 2006-10-05 2013-03-12 Google Inc. Hybrid memory module
US8111566B1 (en) 2007-11-16 2012-02-07 Google, Inc. Optimal channel design for memory devices for providing a high-speed memory interface
US8081474B1 (en) 2007-12-18 2011-12-20 Google Inc. Embossed heat spreader
US7386656B2 (en) 2006-07-31 2008-06-10 Metaram, Inc. Interface circuit system and method for performing power management operations in conjunction with only a portion of a memory circuit
US8327104B2 (en) 2006-07-31 2012-12-04 Google Inc. Adjusting the timing of signals associated with a memory system
US10013371B2 (en) 2005-06-24 2018-07-03 Google Llc Configurable memory circuit system and method
US8386722B1 (en) 2008-06-23 2013-02-26 Google Inc. Stacked DIMM memory interface
US8041881B2 (en) 2006-07-31 2011-10-18 Google Inc. Memory device with emulated characteristics
US8438328B2 (en) 2008-02-21 2013-05-07 Google Inc. Emulation of abstracted DIMMs using abstracted DRAMs
US20080126690A1 (en) * 2006-02-09 2008-05-29 Rajan Suresh N Memory module with memory stack
US9507739B2 (en) 2005-06-24 2016-11-29 Google Inc. Configurable memory circuit system and method
US7609567B2 (en) * 2005-06-24 2009-10-27 Metaram, Inc. System and method for simulating an aspect of a memory circuit
US8055833B2 (en) 2006-10-05 2011-11-08 Google Inc. System and method for increasing capacity, performance, and flexibility of flash storage
KR101318116B1 (ko) * 2005-06-24 2013-11-14 구글 인코포레이티드 집적 메모리 코어 및 메모리 인터페이스 회로
US7379316B2 (en) 2005-09-02 2008-05-27 Metaram, Inc. Methods and apparatus of stacking DRAMs
US9632929B2 (en) 2006-02-09 2017-04-25 Google Inc. Translating an address associated with a command communicated between a system and memory circuits
US20080025136A1 (en) * 2006-07-31 2008-01-31 Metaram, Inc. System and method for storing at least a portion of information received in association with a first operation for use in performing a second operation
US20080028137A1 (en) * 2006-07-31 2008-01-31 Schakel Keith R Method and Apparatus For Refresh Management of Memory Modules
US7724589B2 (en) * 2006-07-31 2010-05-25 Google Inc. System and method for delaying a signal communicated from a system to at least one of a plurality of memory circuits
US8209479B2 (en) * 2007-07-18 2012-06-26 Google Inc. Memory circuit system and method
US8080874B1 (en) 2007-09-14 2011-12-20 Google Inc. Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween
US20100117242A1 (en) * 2008-11-10 2010-05-13 Miller Gary L Technique for packaging multiple integrated circuits
US7827336B2 (en) * 2008-11-10 2010-11-02 Freescale Semiconductor, Inc. Technique for interconnecting integrated circuits
EP2441007A1 (de) * 2009-06-09 2012-04-18 Google, Inc. Programmierung von dimm-abschlusswiderstandswerten
US9170974B2 (en) 2013-02-25 2015-10-27 Freescale Semiconductor, Inc. Methods and systems for interconnecting host and expansion devices within system-in-package (SiP) solutions
US9176916B2 (en) 2013-02-25 2015-11-03 Freescale Semiconductor, Inc. Methods and systems for address mapping between host and expansion devices within system-in-package (SiP) solutions

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH025455A (ja) * 1988-06-24 1990-01-10 Hitachi Ltd チップオンチップの半導体装置
US5285107A (en) * 1989-04-20 1994-02-08 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
EP0486829B1 (de) * 1990-10-22 1997-04-23 Seiko Epson Corporation Halbleiteranordnung und Verpackungssystem für Halbleiteranordnung
JP2876773B2 (ja) * 1990-10-22 1999-03-31 セイコーエプソン株式会社 プログラム命令語長可変型計算装置及びデータ処理装置
TW520816U (en) * 1995-04-24 2003-02-11 Matsushita Electric Ind Co Ltd Semiconductor device
JPH09152979A (ja) * 1995-09-28 1997-06-10 Matsushita Electric Ind Co Ltd 半導体装置
DE19743264C2 (de) * 1997-09-30 2002-01-17 Infineon Technologies Ag Verfahren zur Herstellung einer Emulationsschaltkreisanordnung sowie Emulationsschaltkreisanordnung mit zwei integrierten Schaltkreisen
US5994774A (en) * 1997-10-30 1999-11-30 Stmicroelectronics, Inc. Surface mountable integrated circuit package with detachable module and interposer

Also Published As

Publication number Publication date
EP1295340B1 (de) 2007-08-15
WO2002003464A2 (de) 2002-01-10
EP1295340A2 (de) 2003-03-26
WO2002003464A3 (de) 2002-06-06
US6845027B2 (en) 2005-01-18
US20030117828A1 (en) 2003-06-26
DE10030994A1 (de) 2002-01-17

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Legal Events

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