US6829131B1
(en)
*
|
1999-09-13 |
2004-12-07 |
Carnegie Mellon University |
MEMS digital-to-acoustic transducer with error cancellation
|
US6674383B2
(en)
*
|
2000-11-01 |
2004-01-06 |
Onix Microsystems, Inc. |
PWM-based measurement interface for a micro-machined electrostatic actuator
|
US8623709B1
(en)
|
2000-11-28 |
2014-01-07 |
Knowles Electronics, Llc |
Methods of manufacture of top port surface mount silicon condenser microphone packages
|
US7434305B2
(en)
|
2000-11-28 |
2008-10-14 |
Knowles Electronics, Llc. |
Method of manufacturing a microphone
|
US6859542B2
(en)
|
2001-05-31 |
2005-02-22 |
Sonion Lyngby A/S |
Method of providing a hydrophobic layer and a condenser microphone having such a layer
|
AU2002331624A1
(en)
*
|
2001-08-17 |
2003-03-03 |
Carnegie Mellon University |
Method and apparatus for reconstruction of soundwaves from digital signals
|
US20030108098A1
(en)
*
|
2001-08-24 |
2003-06-12 |
Geddes Earl Russell |
Pulse width modulated controller
|
US7298856B2
(en)
*
|
2001-09-05 |
2007-11-20 |
Nippon Hoso Kyokai |
Chip microphone and method of making same
|
ATE370633T1
(de)
*
|
2001-09-10 |
2007-09-15 |
Sonion As |
Miniaturlautsprecher mit integrierter signalverarbeitungselektronik
|
US20030210799A1
(en)
*
|
2002-05-10 |
2003-11-13 |
Gabriel Kaigham J. |
Multiple membrane structure and method of manufacture
|
US20040017921A1
(en)
*
|
2002-07-26 |
2004-01-29 |
Mantovani Jose Ricardo Baddini |
Electrical impedance based audio compensation in audio devices and methods therefor
|
DE10238523B4
(de)
*
|
2002-08-22 |
2014-10-02 |
Epcos Ag |
Verkapseltes elektronisches Bauelement und Verfahren zur Herstellung
|
SG143934A1
(en)
|
2002-11-08 |
2008-07-29 |
Semiconductor Energy Lab |
Display appliance
|
US7142682B2
(en)
|
2002-12-20 |
2006-11-28 |
Sonion Mems A/S |
Silicon-based transducer for use in hearing instruments and listening devices
|
US6943448B2
(en)
|
2003-01-23 |
2005-09-13 |
Akustica, Inc. |
Multi-metal layer MEMS structure and process for making the same
|
US7049051B2
(en)
|
2003-01-23 |
2006-05-23 |
Akustica, Inc. |
Process for forming and acoustically connecting structures on a substrate
|
DE602004023497D1
(de)
|
2003-05-06 |
2009-11-19 |
Enecsys Ltd |
Stromversorgungsschaltungen
|
DE10327053A1
(de)
*
|
2003-06-16 |
2005-01-05 |
Volkswagen Ag |
Audiosystem zum parallelen Hören unterschiedlicher Audioquellen
|
DE10340367B4
(de)
*
|
2003-09-02 |
2007-11-29 |
Robert Bosch Gmbh |
Verfahren und Vorrichtung zur Verbesserung des Schalldruckpegels eines Schallgebers
|
US20050069153A1
(en)
*
|
2003-09-26 |
2005-03-31 |
Hall David S. |
Adjustable speaker systems and methods
|
KR20060113925A
(ko)
*
|
2003-10-14 |
2006-11-03 |
아우디오아시스 에이/에스 |
마이크로폰 전치 증폭기
|
US20050095814A1
(en)
*
|
2003-11-05 |
2005-05-05 |
Xu Zhu |
Ultrathin form factor MEMS microphones and microspeakers
|
US6936524B2
(en)
|
2003-11-05 |
2005-08-30 |
Akustica, Inc. |
Ultrathin form factor MEMS microphones and microspeakers
|
KR200355341Y1
(ko)
*
|
2004-04-02 |
2004-07-06 |
주식회사 솔리토닉스 |
초음파 스피커 시스템을 구비하는 이동통신 단말기용 보드
|
DE102004020204A1
(de)
*
|
2004-04-22 |
2005-11-10 |
Epcos Ag |
Verkapseltes elektrisches Bauelement und Verfahren zur Herstellung
|
US7929714B2
(en)
*
|
2004-08-11 |
2011-04-19 |
Qualcomm Incorporated |
Integrated audio codec with silicon audio transducer
|
US7608789B2
(en)
|
2004-08-12 |
2009-10-27 |
Epcos Ag |
Component arrangement provided with a carrier substrate
|
US7329933B2
(en)
|
2004-10-29 |
2008-02-12 |
Silicon Matrix Pte. Ltd. |
Silicon microphone with softly constrained diaphragm
|
US7346178B2
(en)
|
2004-10-29 |
2008-03-18 |
Silicon Matrix Pte. Ltd. |
Backplateless silicon microphone
|
US20060158737A1
(en)
*
|
2005-01-19 |
2006-07-20 |
Chenming Hu |
Tamper-Proof Content-Playback System Offering Excellent Copyright Protection
|
US7795695B2
(en)
|
2005-01-27 |
2010-09-14 |
Analog Devices, Inc. |
Integrated microphone
|
DE102005008511B4
(de)
|
2005-02-24 |
2019-09-12 |
Tdk Corporation |
MEMS-Mikrofon
|
DE102005008512B4
(de)
|
2005-02-24 |
2016-06-23 |
Epcos Ag |
Elektrisches Modul mit einem MEMS-Mikrofon
|
JP4450751B2
(ja)
*
|
2005-03-17 |
2010-04-14 |
富士通株式会社 |
メッシュモデル作成方法、シミュレーション装置及びプログラム
|
US20070071268A1
(en)
*
|
2005-08-16 |
2007-03-29 |
Analog Devices, Inc. |
Packaged microphone with electrically coupled lid
|
US7885423B2
(en)
|
2005-04-25 |
2011-02-08 |
Analog Devices, Inc. |
Support apparatus for microphone diaphragm
|
US7825484B2
(en)
*
|
2005-04-25 |
2010-11-02 |
Analog Devices, Inc. |
Micromachined microphone and multisensor and method for producing same
|
US7449356B2
(en)
*
|
2005-04-25 |
2008-11-11 |
Analog Devices, Inc. |
Process of forming a microphone using support member
|
US7449355B2
(en)
*
|
2005-04-27 |
2008-11-11 |
Robert Bosch Gmbh |
Anti-stiction technique for electromechanical systems and electromechanical device employing same
|
US7589456B2
(en)
*
|
2005-06-14 |
2009-09-15 |
Siemens Medical Solutions Usa, Inc. |
Digital capacitive membrane transducer
|
JP4706578B2
(ja)
*
|
2005-09-27 |
2011-06-22 |
セイコーエプソン株式会社 |
静電型超音波トランスデューサ、静電型超音波トランスデューサの設計方法、静電型超音波トランスデューサの設計装置、静電型超音波トランスデューサの設計プログラム、製造方法及び表示装置
|
US20070040231A1
(en)
*
|
2005-08-16 |
2007-02-22 |
Harney Kieran P |
Partially etched leadframe packages having different top and bottom topologies
|
US8477983B2
(en)
*
|
2005-08-23 |
2013-07-02 |
Analog Devices, Inc. |
Multi-microphone system
|
US7961897B2
(en)
*
|
2005-08-23 |
2011-06-14 |
Analog Devices, Inc. |
Microphone with irregular diaphragm
|
US8351632B2
(en)
*
|
2005-08-23 |
2013-01-08 |
Analog Devices, Inc. |
Noise mitigating microphone system and method
|
US8130979B2
(en)
*
|
2005-08-23 |
2012-03-06 |
Analog Devices, Inc. |
Noise mitigating microphone system and method
|
DE602005006419T2
(de)
*
|
2005-09-14 |
2008-09-25 |
Esaote S.P.A. |
Elektroakustischer Wandler für Hochfrequenzanwendungen
|
JP2008042869A
(ja)
*
|
2005-10-05 |
2008-02-21 |
Seiko Epson Corp |
静電型超音波トランスデューサ、超音波スピーカ、音声信号再生方法、超指向性音響システム及び表示装置
|
US7420472B2
(en)
*
|
2005-10-16 |
2008-09-02 |
Bao Tran |
Patient monitoring apparatus
|
DE102005050398A1
(de)
*
|
2005-10-20 |
2007-04-26 |
Epcos Ag |
Gehäuse mit Hohlraum für ein mechanisch empfindliches elektronisches Bauelement und Verfahren zur Herstellung
|
DE102005053767B4
(de)
|
2005-11-10 |
2014-10-30 |
Epcos Ag |
MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
|
DE102005053765B4
(de)
|
2005-11-10 |
2016-04-14 |
Epcos Ag |
MEMS-Package und Verfahren zur Herstellung
|
DE102006001886A1
(de)
*
|
2006-01-13 |
2007-07-19 |
Siemens Audiologische Technik Gmbh |
Mikrofonvorrichtung mit mehreren Siliziummikrofonen für eine Hörvorrichtung
|
GB2435544B
(en)
*
|
2006-02-24 |
2008-11-19 |
Oligon Ltd |
Mems device
|
JP2007229825A
(ja)
*
|
2006-02-27 |
2007-09-13 |
Hirosaki Univ |
微小電気機械構造、その製造方法および微小電気機械素子
|
ATE471635T1
(de)
*
|
2006-03-30 |
2010-07-15 |
Sonion Mems As |
Akustischer einchip-mems-wandler und herstellungsverfahren
|
US20070268209A1
(en)
*
|
2006-05-16 |
2007-11-22 |
Kenneth Wargon |
Imaging Panels Including Arrays Of Audio And Video Input And Output Elements
|
JP4689542B2
(ja)
*
|
2006-06-08 |
2011-05-25 |
パナソニック株式会社 |
膜スチフネス測定装置及び測定方法
|
WO2008003051A2
(en)
|
2006-06-29 |
2008-01-03 |
Analog Devices, Inc. |
Stress mitigation in packaged microchips
|
US20080013747A1
(en)
*
|
2006-06-30 |
2008-01-17 |
Bao Tran |
Digital stethoscope and monitoring instrument
|
US8270634B2
(en)
*
|
2006-07-25 |
2012-09-18 |
Analog Devices, Inc. |
Multiple microphone system
|
EP1906704B1
(de)
*
|
2006-09-26 |
2012-03-21 |
Epcos Pte Ltd |
Kalibriertes mikroelektromechanisches Mikrofon
|
US8165323B2
(en)
*
|
2006-11-28 |
2012-04-24 |
Zhou Tiansheng |
Monolithic capacitive transducer
|
WO2008067431A2
(en)
*
|
2006-11-30 |
2008-06-05 |
Analog Devices, Inc. |
Microphone system with silicon microphone secured to package lid
|
US20080139893A1
(en)
*
|
2006-12-08 |
2008-06-12 |
Warren Lee |
Apparatus And System For Sensing and Analyzing Body Sounds
|
US7970148B1
(en)
*
|
2007-05-31 |
2011-06-28 |
Raytheon Company |
Simultaneous enhancement of transmission loss and absorption coefficient using activated cavities
|
WO2009017718A2
(en)
*
|
2007-07-27 |
2009-02-05 |
Kenneth Wargon |
Flexible sheet audio-video device
|
US7829366B2
(en)
*
|
2008-02-29 |
2010-11-09 |
Freescale Semiconductor, Inc. |
Microelectromechanical systems component and method of making same
|
US8345895B2
(en)
*
|
2008-07-25 |
2013-01-01 |
United Microelectronics Corp. |
Diaphragm of MEMS electroacoustic transducer
|
US8280097B2
(en)
*
|
2008-08-21 |
2012-10-02 |
United Microelectronics Corp. |
Microelectromechanical system diaphragm and fabricating method thereof
|
FR2938918B1
(fr)
*
|
2008-11-21 |
2011-02-11 |
Commissariat Energie Atomique |
Procede et dispositif d'analyse acoustique de microporosites dans un materiau tel que le beton a l'aide d'une pluralite de transducteurs cmuts incorpores dans le materiau
|
GB2467776A
(en)
|
2009-02-13 |
2010-08-18 |
Wolfson Microelectronics Plc |
Integrated MEMS transducer and circuitry
|
DE102009026502B4
(de)
|
2009-05-27 |
2017-03-16 |
Robert Bosch Gmbh |
Mikromechanisches Bauelement
|
WO2010139050A1
(en)
|
2009-06-01 |
2010-12-09 |
Tiansheng Zhou |
Mems micromirror and micromirror array
|
US10551613B2
(en)
|
2010-10-20 |
2020-02-04 |
Tiansheng ZHOU |
Micro-electro-mechanical systems micromirrors and micromirror arrays
|
US9036231B2
(en)
|
2010-10-20 |
2015-05-19 |
Tiansheng ZHOU |
Micro-electro-mechanical systems micromirrors and micromirror arrays
|
US9148712B2
(en)
*
|
2010-12-10 |
2015-09-29 |
Infineon Technologies Ag |
Micromechanical digital loudspeaker
|
DE102011003168A1
(de)
|
2011-01-26 |
2012-07-26 |
Robert Bosch Gmbh |
Lautsprechersystem
|
US8643140B2
(en)
|
2011-07-11 |
2014-02-04 |
United Microelectronics Corp. |
Suspended beam for use in MEMS device
|
US8525354B2
(en)
|
2011-10-13 |
2013-09-03 |
United Microelectronics Corporation |
Bond pad structure and fabricating method thereof
|
CN103999484B
(zh)
|
2011-11-04 |
2017-06-30 |
美商楼氏电子有限公司 |
作为声学设备中的屏障的嵌入式电介质和制造方法
|
US9385634B2
(en)
|
2012-01-26 |
2016-07-05 |
Tiansheng ZHOU |
Rotational type of MEMS electrostatic actuator
|
DE102012202921A1
(de)
|
2012-02-27 |
2013-08-29 |
Robert Bosch Gmbh |
Schallwandler, integrierter Schaltkreis, Verfahren zum Wandeln von digitalen Audiodaten in Schall
|
US9078063B2
(en)
|
2012-08-10 |
2015-07-07 |
Knowles Electronics, Llc |
Microphone assembly with barrier to prevent contaminant infiltration
|
DE102012216996A1
(de)
|
2012-09-21 |
2014-03-27 |
Robert Bosch Gmbh |
MEMS-Schallwandler, MEMS-Schallwandleranordnung und Verfahren zum Herstellen eines MEMS-Schallwandlers
|
US9183829B2
(en)
|
2012-12-21 |
2015-11-10 |
Intel Corporation |
Integrated accoustic phase array
|
US9173024B2
(en)
*
|
2013-01-31 |
2015-10-27 |
Invensense, Inc. |
Noise mitigating microphone system
|
US9676614B2
(en)
|
2013-02-01 |
2017-06-13 |
Analog Devices, Inc. |
MEMS device with stress relief structures
|
US8680894B1
(en)
*
|
2013-03-06 |
2014-03-25 |
Calient Technologies, Inc. |
Precision driver circuits for micro-electro-mechanical system
|
US8981501B2
(en)
|
2013-04-25 |
2015-03-17 |
United Microelectronics Corp. |
Semiconductor device and method of forming the same
|
DE102013106353B4
(de)
*
|
2013-06-18 |
2018-06-28 |
Tdk Corporation |
Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement
|
US10659889B2
(en)
*
|
2013-11-08 |
2020-05-19 |
Infineon Technologies Ag |
Microphone package and method for generating a microphone signal
|
CN106105259A
(zh)
*
|
2014-01-21 |
2016-11-09 |
美商楼氏电子有限公司 |
提供极高声学过载点的麦克风设备和方法
|
US10167189B2
(en)
|
2014-09-30 |
2019-01-01 |
Analog Devices, Inc. |
Stress isolation platform for MEMS devices
|
JP6213679B2
(ja)
*
|
2015-05-20 |
2017-10-18 |
第一精工株式会社 |
デジタルスピーカ、スピーカシステム及びイヤホン
|
EP3099047A1
(de)
*
|
2015-05-28 |
2016-11-30 |
Nxp B.V. |
Echoregler
|
US9794661B2
(en)
|
2015-08-07 |
2017-10-17 |
Knowles Electronics, Llc |
Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
|
US10131538B2
(en)
|
2015-09-14 |
2018-11-20 |
Analog Devices, Inc. |
Mechanically isolated MEMS device
|
JP6429759B2
(ja)
*
|
2015-10-24 |
2018-11-28 |
キヤノン株式会社 |
静電容量型トランスデューサ及びそれを備える情報取得装置
|
CN105744449A
(zh)
*
|
2016-01-06 |
2016-07-06 |
吴泓均 |
一种薄膜扬声器及其制造方法
|
US9716955B1
(en)
*
|
2016-03-24 |
2017-07-25 |
Revx Technologies |
Device for monitoring a sound pressure level
|
US9918173B1
(en)
|
2016-03-24 |
2018-03-13 |
Revx Technologies |
Adaptable sound quality device
|
DE102016113347A1
(de)
*
|
2016-07-20 |
2018-01-25 |
Infineon Technologies Ag |
Verfahren zum produzieren eines halbleitermoduls
|
US11203183B2
(en)
*
|
2016-09-27 |
2021-12-21 |
Vaon, Llc |
Single and multi-layer, flat glass-sensor structures
|
US11243192B2
(en)
|
2016-09-27 |
2022-02-08 |
Vaon, Llc |
3-D glass printable hand-held gas chromatograph for biomedical and environmental applications
|
US10015658B1
(en)
|
2017-05-18 |
2018-07-03 |
Motorola Solutions, Inc. |
Method and apparatus for maintaining mission critical functionality in a portable communication system
|
DE102018104561A1
(de)
*
|
2018-02-28 |
2019-08-29 |
USound GmbH |
Verfahren zum Betreiben eines piezoelektrischen Lautsprechers
|
US10899605B2
(en)
|
2018-03-05 |
2021-01-26 |
Sharp Kabushiki Kaisha |
MEMS device and manipulation method for micro-objects
|
US10636936B2
(en)
|
2018-03-05 |
2020-04-28 |
Sharp Kabushiki Kaisha |
MEMS array system and method of manipulating objects
|
US10681488B1
(en)
*
|
2019-03-03 |
2020-06-09 |
xMEMS Labs, Inc. |
Sound producing apparatus and sound producing system
|
JP7433870B2
(ja)
|
2019-12-04 |
2024-02-20 |
エルジー ディスプレイ カンパニー リミテッド |
表示装置及び情報処理装置
|
US11417611B2
(en)
|
2020-02-25 |
2022-08-16 |
Analog Devices International Unlimited Company |
Devices and methods for reducing stress on circuit components
|