DE60126341D1 - Direktbefestigung eines wärmerohrs an ein chip durch mittelpunktladung - Google Patents

Direktbefestigung eines wärmerohrs an ein chip durch mittelpunktladung

Info

Publication number
DE60126341D1
DE60126341D1 DE60126341T DE60126341T DE60126341D1 DE 60126341 D1 DE60126341 D1 DE 60126341D1 DE 60126341 T DE60126341 T DE 60126341T DE 60126341 T DE60126341 T DE 60126341T DE 60126341 D1 DE60126341 D1 DE 60126341D1
Authority
DE
Germany
Prior art keywords
heater
chip
center pole
direct mounting
pole loading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60126341T
Other languages
English (en)
Other versions
DE60126341T2 (de
Inventor
Ajit Sathe
Kristopher Frutschy
Eric Distefano
Ravi Prasher
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of DE60126341D1 publication Critical patent/DE60126341D1/de
Application granted granted Critical
Publication of DE60126341T2 publication Critical patent/DE60126341T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4068—Heatconductors between device and heatsink, e.g. compliant heat-spreaders, heat-conducting bands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
DE60126341T 2000-09-29 2001-09-27 Direktbefestigung eines wärmerohrs an ein chip durch mittelpunktladung Expired - Lifetime DE60126341T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/675,314 US6469893B1 (en) 2000-09-29 2000-09-29 Direct heatpipe attachment to die using center point loading
US675314 2000-09-29
PCT/US2001/030367 WO2002027785A2 (en) 2000-09-29 2001-09-27 Direct heatpipe attachment to die using center point loading

Publications (2)

Publication Number Publication Date
DE60126341D1 true DE60126341D1 (de) 2007-03-15
DE60126341T2 DE60126341T2 (de) 2007-11-15

Family

ID=24709934

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60126341T Expired - Lifetime DE60126341T2 (de) 2000-09-29 2001-09-27 Direktbefestigung eines wärmerohrs an ein chip durch mittelpunktladung

Country Status (9)

Country Link
US (2) US6469893B1 (de)
EP (1) EP1356512B1 (de)
CN (1) CN1531754B (de)
AT (1) ATE352872T1 (de)
AU (1) AU2001293159A1 (de)
DE (1) DE60126341T2 (de)
HK (1) HK1058104A1 (de)
MY (1) MY122824A (de)
WO (1) WO2002027785A2 (de)

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US6469893B1 (en) 2000-09-29 2002-10-22 Intel Corporation Direct heatpipe attachment to die using center point loading
DE10225993A1 (de) * 2002-06-12 2003-12-24 Bosch Gmbh Robert Kühlkörper
JP3634825B2 (ja) * 2002-06-28 2005-03-30 株式会社東芝 電子機器
US6988535B2 (en) 2002-11-01 2006-01-24 Cooligy, Inc. Channeled flat plate fin heat exchange system, device and method
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7836597B2 (en) * 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
DE60209423T2 (de) * 2002-11-08 2006-08-10 Agilent Technologies Inc., A Delaware Corp., Palo Alto Mikrochip-Kühlung auf Leiterplatte
US6929057B1 (en) * 2002-12-19 2005-08-16 Beutler Corporation Building heating assembly
US6731505B1 (en) * 2002-12-20 2004-05-04 Tyco Electronics Corporation Integrated circuit mounting system with separate loading forces for socket and heat sink
US20040233639A1 (en) * 2003-01-31 2004-11-25 Cooligy, Inc. Removeable heat spreader support mechanism and method of manufacturing thereof
US7044196B2 (en) * 2003-01-31 2006-05-16 Cooligy,Inc Decoupled spring-loaded mounting apparatus and method of manufacturing thereof
JP4272169B2 (ja) * 2003-04-16 2009-06-03 富士通株式会社 電子部品パッケージ組立体およびプリント基板ユニット
JP2004348650A (ja) * 2003-05-26 2004-12-09 Toshiba Corp 電子機器
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ATE388487T1 (de) * 2003-08-07 2008-03-15 Harman Becker Automotive Sys Vorrichtung zur kühlung von halbleiterbauteilen auf leiterplatten
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US6976525B2 (en) * 2004-02-24 2005-12-20 Asia Vital Component Co., Ltd. Fastening device for a radiator
US7071552B2 (en) * 2004-03-29 2006-07-04 Intel Corporation IC die with directly bonded liquid cooling device
JP2005315156A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプおよびポンプを備える電子機器
JP4234635B2 (ja) * 2004-04-28 2009-03-04 株式会社東芝 電子機器
JP2005317796A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプ、冷却装置および電子機器
JP2005315158A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプ、冷却装置、および電子機器
JP2005317797A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプ、電子機器および冷却装置
US20050264998A1 (en) * 2004-05-25 2005-12-01 3M Innovative Properties Company Heat sink assembly
JP4343032B2 (ja) * 2004-05-31 2009-10-14 株式会社東芝 冷却構造および投射型画像表示装置
JP2005344562A (ja) * 2004-06-01 2005-12-15 Toshiba Corp ポンプ、冷却装置および冷却装置を有する電子機器
US7301773B2 (en) * 2004-06-04 2007-11-27 Cooligy Inc. Semi-compliant joining mechanism for semiconductor cooling applications
US7616444B2 (en) * 2004-06-04 2009-11-10 Cooligy Inc. Gimballed attachment for multiple heat exchangers
US20050269691A1 (en) * 2004-06-04 2005-12-08 Cooligy, Inc. Counter flow micro heat exchanger for optimal performance
JP4928749B2 (ja) * 2005-06-30 2012-05-09 株式会社東芝 冷却装置
DE102005033249B3 (de) * 2005-07-15 2006-10-05 Fujitsu Siemens Computers Gmbh Kühlanordnung für ein Computersystem
US20070114010A1 (en) * 2005-11-09 2007-05-24 Girish Upadhya Liquid cooling for backlit displays
US7913719B2 (en) 2006-01-30 2011-03-29 Cooligy Inc. Tape-wrapped multilayer tubing and methods for making the same
EP1989935A4 (de) * 2006-02-16 2012-07-04 Cooligy Inc Flüssigkeitskühlungsschleifen für serveranwendungen
US7450387B2 (en) * 2006-03-02 2008-11-11 Tdk Innoveta Technologies, Inc. System for cooling electronic components
WO2007120530A2 (en) 2006-03-30 2007-10-25 Cooligy, Inc. Integrated liquid to air conduction module
US20070227709A1 (en) * 2006-03-30 2007-10-04 Girish Upadhya Multi device cooling
US20070227698A1 (en) * 2006-03-30 2007-10-04 Conway Bruce R Integrated fluid pump and radiator reservoir
US7388747B2 (en) * 2006-04-07 2008-06-17 Inventec Corporation Heat plate fixing structure
TW200739327A (en) * 2006-04-14 2007-10-16 Compal Electronics Inc Heat dissipating module
US20070256815A1 (en) * 2006-05-04 2007-11-08 Cooligy, Inc. Scalable liquid cooling system with modular radiators
US20080013278A1 (en) * 2006-06-30 2008-01-17 Fredric Landry Reservoir for liquid cooling systems used to provide make-up fluid and trap gas bubbles
CN101102655A (zh) * 2006-07-07 2008-01-09 富准精密工业(深圳)有限公司 散热装置
US7782622B1 (en) * 2006-10-04 2010-08-24 Nvidia Corporation Attachment apparatus for electronic boards
CN200994225Y (zh) * 2006-12-29 2007-12-19 帛汉股份有限公司 电路基板结构
JP2008251687A (ja) * 2007-03-29 2008-10-16 Toshiba Corp プリント回路板、およびこれを備えた電子機器
CN101715536A (zh) * 2007-05-02 2010-05-26 固利吉股份有限公司 用于电子冷却应用的微管/多端口逆流散热器设计
TW200912621A (en) 2007-08-07 2009-03-16 Cooligy Inc Method and apparatus for providing a supplemental cooling to server racks
CN101377706B (zh) * 2007-08-31 2011-12-21 鸿富锦精密工业（深圳）有限公司 电脑散热器背板组合
US8520393B2 (en) * 2008-04-01 2013-08-27 Hewlett-Packard Development Company, L.P. Apparatuses and methods for dissipating heat from a computer component
US8302419B2 (en) * 2008-05-02 2012-11-06 Thermal Take Technology Co., Ltd. Computer cooling apparatus
US8159821B2 (en) * 2009-07-28 2012-04-17 Dsem Holdings Sdn. Bhd. Diffusion bonding circuit submount directly to vapor chamber
CN102845143B (zh) 2009-08-18 2015-05-20 惠普发展公司，有限责任合伙企业 装置安装系统和方法
US8908373B2 (en) * 2009-09-30 2014-12-09 Nec Corporation Cooling structure for an electronic component and electronic instrument
US20110232877A1 (en) * 2010-03-23 2011-09-29 Celsia Technologies Taiwan, Inc. Compact vapor chamber and heat-dissipating module having the same
DE202010014108U1 (de) * 2010-10-08 2010-12-02 Congatec Ag Wärmeverteiler mit mechanisch gesichertem Wärmekopplungselement
DE202010014106U1 (de) * 2010-10-08 2010-12-16 Congatec Ag Wärmeverteiler mit flexibel gelagertem Wärmerohr
CN102655730A (zh) * 2011-03-04 2012-09-05 鸿富锦精密工业（深圳）有限公司 散热装置
US20120267078A1 (en) * 2011-04-20 2012-10-25 Chun-Ming Wu Heat dissipation mechanism
CN103702544A (zh) * 2012-09-27 2014-04-02 英业达科技有限公司 电子装置及其导热件
US9379037B2 (en) * 2014-03-14 2016-06-28 Apple Inc. Thermal module accounting for increased board/die size in a portable computer
DE102015000254A1 (de) 2015-01-16 2016-07-21 Tom Bub Beleuchtungsvorrichtung
US10359818B2 (en) 2015-08-17 2019-07-23 Microsoft Technology Licensing, Llc Device faraday cage
US10772190B2 (en) * 2017-09-29 2020-09-08 Apple Inc. Heat-removal assemblies with opposing springs
TWI745774B (zh) * 2019-11-01 2021-11-11 宏碁股份有限公司 分離式熱交換模組與複合式薄層導熱結構
CN115702492A (zh) * 2020-03-04 2023-02-14 传输现象科技有限责任公司 顺应性热管理装置、系统及其制造方法

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Also Published As

Publication number Publication date
EP1356512A2 (de) 2003-10-29
EP1356512B1 (de) 2007-01-24
HK1058104A1 (en) 2004-04-30
WO2002027785A2 (en) 2002-04-04
MY122824A (en) 2006-05-31
CN1531754B (zh) 2010-05-26
ATE352872T1 (de) 2007-02-15
US6469893B1 (en) 2002-10-22
CN1531754A (zh) 2004-09-22
US20020051341A1 (en) 2002-05-02
US6625022B2 (en) 2003-09-23
DE60126341T2 (de) 2007-11-15
WO2002027785A3 (en) 2003-08-14
AU2001293159A1 (en) 2002-04-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: HEYER, V., DIPL.-PHYS. DR.RER.NAT., PAT.-ANW., 806