DE60138263D1 - Ceriumoxidsol und Abrasiv - Google Patents

Ceriumoxidsol und Abrasiv

Info

Publication number
DE60138263D1
DE60138263D1 DE60138263T DE60138263T DE60138263D1 DE 60138263 D1 DE60138263 D1 DE 60138263D1 DE 60138263 T DE60138263 T DE 60138263T DE 60138263 T DE60138263 T DE 60138263T DE 60138263 D1 DE60138263 D1 DE 60138263D1
Authority
DE
Germany
Prior art keywords
abrasive
cerium oxide
oxide sol
sol
cerium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60138263T
Other languages
English (en)
Inventor
Isao Ota
Kenji Tanimoto
Tohru Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Application granted granted Critical
Publication of DE60138263D1 publication Critical patent/DE60138263D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C01F17/224—Oxides or hydroxides of lanthanides
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C01F17/224—Oxides or hydroxides of lanthanides
    • C01F17/229—Lanthanum oxides or hydroxides
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00—Compounds of rare earth metals
    • C01F17/20—Compounds containing only rare earth metals as the metal element
    • C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C01F17/224—Oxides or hydroxides of lanthanides
    • C01F17/235—Cerium oxides or hydroxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1472—Non-aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/01—Crystal-structural characteristics depicted by a TEM-image
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/72—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/10—Particle morphology extending in one dimension, e.g. needle-like
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
DE60138263T 2000-12-25 2001-12-20 Ceriumoxidsol und Abrasiv Expired - Lifetime DE60138263D1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000392593 2000-12-25
JP2000392592 2000-12-25
JP2001140015 2001-05-10
JP2001140014 2001-05-10

Publications (1)

Publication Number Publication Date
DE60138263D1 true DE60138263D1 (de) 2009-05-20

Family

ID=27481911

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60138263T Expired - Lifetime DE60138263D1 (de) 2000-12-25 2001-12-20 Ceriumoxidsol und Abrasiv

Country Status (4)

Country Link
US (2) US7887714B2 (de)
EP (1) EP1219568B1 (de)
CN (1) CN1248967C (de)
DE (1) DE60138263D1 (de)

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JP4236857B2 (ja) 2002-03-22 2009-03-11 三井金属鉱業株式会社 セリウム系研摩材およびその製造方法
CN100370587C (zh) * 2002-09-06 2008-02-20 旭硝子株式会社 绝缘膜研磨剂组合物及半导体集成电路的制造方法
JP4311247B2 (ja) * 2004-03-19 2009-08-12 日立電線株式会社 研磨用砥粒、研磨剤、研磨液の製造方法
EP1818312A4 (de) * 2004-11-08 2010-09-08 Asahi Glass Co Ltd Verfahren zur herstellung von feinen ceo2-teilchen und poliersuspension, die derartige feine teilchen enthält
DE102005017372A1 (de) * 2005-04-14 2006-10-19 Degussa Ag Wässrige Ceroxiddispersion
KR100812052B1 (ko) 2005-11-14 2008-03-10 주식회사 엘지화학 탄산세륨 분말, 산화세륨 분말, 그 제조방법, 및 이를포함하는 ｃｍｐ 슬러리
JP4836731B2 (ja) * 2006-07-18 2011-12-14 旭硝子株式会社 磁気ディスク用ガラス基板の製造方法
CN101386420B (zh) * 2007-09-12 2010-09-22 北京有色金属研究总院 一种复合纳米二氧化铈溶胶
MY155533A (en) 2008-06-11 2015-10-30 Shinetsu Chemical Co Polishing agent for synthetic quartz glass substrate
KR101376057B1 (ko) * 2009-04-15 2014-03-19 솔베이 (차이나) 컴퍼니, 리미티드 세륨 기반 입자 조성물 및 그의 제조
CN102504705B (zh) * 2011-10-17 2014-07-09 河南省化工研究所有限责任公司 光通讯Zr02陶瓷插芯精密加工用抛光液及其制备方法
US8916061B2 (en) * 2012-03-14 2014-12-23 Cabot Microelectronics Corporation CMP compositions selective for oxide and nitride with high removal rate and low defectivity
KR102198376B1 (ko) * 2012-11-02 2021-01-04 로렌스 리버모어 내쇼날 시큐리티, 엘엘시 표면 활성의 손실없이 대전된 콜로이드의 응집을 방지하는 방법
US20160068711A1 (en) * 2013-04-17 2016-03-10 Samsung Sdi Co., Ltd. Organic Film CMP Slurry Composition and Polishing Method Using Same
KR102032758B1 (ko) * 2013-08-05 2019-10-17 삼성전기주식회사 희토류 산화물의 제조방법
CN103923569B (zh) * 2014-05-06 2015-07-08 济南大学 一种玉石翡翠抛光粉的制备方法
JP6691061B2 (ja) * 2014-06-24 2020-04-28 ローディア オペレーションズ 金属ドープ酸化セリウム組成物
KR101773543B1 (ko) * 2015-06-30 2017-09-01 유비머트리얼즈주식회사 연마 입자, 연마 슬러리 및 연마 입자의 제조 방법
CN105176492A (zh) * 2015-09-02 2015-12-23 上海大学 镧元素掺杂氧化硅溶胶复合磨粒、抛光液组合物及其制备方法
KR101900543B1 (ko) * 2015-10-02 2018-09-20 삼성에스디아이 주식회사 유기막 ｃｍｐ 슬러리 조성물 및 이를 이용한 연마방법
WO2018088088A1 (ja) * 2016-11-14 2018-05-17 日揮触媒化成株式会社 セリア系複合微粒子分散液、その製造方法及びセリア系複合微粒子分散液を含む研磨用砥粒分散液
KR102539028B1 (ko) * 2017-06-15 2023-06-02 로디아 오퍼레이션스 세륨 기반 입자
EP3710549A4 (de) 2017-11-15 2021-08-18 Saint-Gobain Ceramics&Plastics, Inc. Zusammensetzung zur durchführung von materialentfernungsoperationen und verfahren zu ihrer herstellung
CN108081117A (zh) * 2017-11-29 2018-05-29 浙江工业大学 一种基于软质磨料固着磨具的钽酸锂抛光方法
US20210115300A1 (en) * 2019-10-22 2021-04-22 Cmc Materials, Inc. Composition and method for silicon oxide and carbon doped silicon oxide cmp
KR20220085803A (ko) * 2019-10-22 2022-06-22 씨엠씨 머티리얼즈, 인코포레이티드 자가-정지 연마 조성물 및 방법
TWI777279B (zh) * 2019-10-22 2022-09-11 美商Ｃｍｃ材料股份有限公司 用於介電質化學機械拋光之組合物及方法
US20220332977A1 (en) * 2021-04-16 2022-10-20 Entegris, Inc. Cmp compositions for polishing dielectric materials
CN116410666A (zh) * 2021-12-30 2023-07-11 安集微电子科技（上海）股份有限公司 一种合成氧化铈的方法及一种化学机械抛光液
CN115960540A (zh) * 2022-12-23 2023-04-14 昂士特科技(深圳)有限公司 具有改进颗粒的化学机械抛光组合物

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Also Published As

Publication number Publication date
CN1248967C (zh) 2006-04-05
EP1219568B1 (de) 2009-04-08
US20040223898A1 (en) 2004-11-11
CN1361064A (zh) 2002-07-31
EP1219568A3 (de) 2003-12-03
US6887289B2 (en) 2005-05-03
US7887714B2 (en) 2011-02-15
EP1219568A2 (de) 2002-07-03
US20020086618A1 (en) 2002-07-04

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