DE602005008096D1 - Vorrichtung zur verkapselung von elektronischen bauteilen - Google Patents
Vorrichtung zur verkapselung von elektronischen bauteilenInfo
- Publication number
- DE602005008096D1 DE602005008096D1 DE602005008096T DE602005008096T DE602005008096D1 DE 602005008096 D1 DE602005008096 D1 DE 602005008096D1 DE 602005008096 T DE602005008096 T DE 602005008096T DE 602005008096 T DE602005008096 T DE 602005008096T DE 602005008096 D1 DE602005008096 D1 DE 602005008096D1
- Authority
- DE
- Germany
- Prior art keywords
- electronic components
- plastering
- packing reel
- secured
- integrated circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/996,916 US7335422B2 (en) | 2002-04-25 | 2004-11-24 | Absorbent polymeric material |
| US11/005,289 US7389877B2 (en) | 2000-08-28 | 2004-12-06 | Apparatus for packaging electronic components including a reel entrained with desiccating material |
| PCT/US2005/039427 WO2006057776A2 (en) | 2004-11-24 | 2005-11-01 | Apparatus for packaging electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE602005008096D1 true DE602005008096D1 (de) | 2008-08-21 |
Family
ID=36498403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE602005008096T Active DE602005008096D1 (de) | 2004-11-24 | 2005-11-01 | Vorrichtung zur verkapselung von elektronischen bauteilen |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7389877B2 (de) |
| EP (1) | EP1815729B1 (de) |
| AT (1) | ATE400990T1 (de) |
| DE (1) | DE602005008096D1 (de) |
| TW (1) | TW200626445A (de) |
| WO (1) | WO2006057776A2 (de) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002096974A (ja) * | 2000-09-22 | 2002-04-02 | Oki Electric Ind Co Ltd | 搬送用リールとそれを用いた搬送方法、及び電子装置の製造方法 |
| JP2008502551A (ja) * | 2004-06-14 | 2008-01-31 | スポーツ メディア インコーポレイテッド | 容器および容器の製造方法 |
| US8205766B2 (en) * | 2009-05-20 | 2012-06-26 | The Bergquist Company | Method for packaging thermal interface materials |
| US8430264B2 (en) * | 2009-05-20 | 2013-04-30 | The Bergquist Company | Method for packaging thermal interface materials |
| WO2020081811A1 (en) * | 2018-10-18 | 2020-04-23 | Csp Technologies, Inc. | Apparatus and methods for packaging electronic components using a tape having desiccant entrained polymer on a reel |
| CN109612990B (zh) * | 2018-12-14 | 2021-04-27 | 杭州家爽包装材料有限公司 | 一种任意设定干燥剂包指定失效点的方法及产品 |
| US11655966B2 (en) | 2019-01-14 | 2023-05-23 | Musco Corporation | Apparatus, method, and system for reducing moisture in LED lighting fixtures |
| US11192063B2 (en) * | 2019-01-14 | 2021-12-07 | Musco Corporation | Apparatus, method, and system for reducing moisture in LED lighting fixtures |
Family Cites Families (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2446361A (en) | 1945-07-09 | 1948-08-03 | Herbert B Clibbon | Moisture vapor indicator for packaged goods |
| NL81798C (de) | 1951-10-23 | |||
| US3245946A (en) | 1959-04-29 | 1966-04-12 | Union Carbide Corp | Rubber and plastic formulations and process |
| US4013799A (en) | 1972-05-30 | 1977-03-22 | Gerber Products Company | Preparation of a stabilized precooked baby food formulation thickened with modified tapioca starch |
| US3833406A (en) | 1972-08-07 | 1974-09-03 | Owens Illinois Inc | Closed container with desiccant coating on inside surface thereof |
| US4013566A (en) | 1975-04-07 | 1977-03-22 | Adsorbex, Incorporated | Flexible desiccant body |
| US4427992A (en) | 1975-12-17 | 1984-01-24 | Motorola, Inc. | Method for incorporating a desiccant in a semiconductor package |
| US4061807A (en) | 1976-02-09 | 1977-12-06 | Shaler Amos J | Adsorbent body and method for making same |
| JPS5913244B2 (ja) | 1976-05-12 | 1984-03-28 | 本州製紙株式会社 | 吸着性不織布およびその製造方法 |
| FR2381804A1 (fr) | 1977-02-28 | 1978-09-22 | Solvay | Compositions moulables a base de polymeres thermoplastiques et de matieres fibreuses vegetales et utilisation de ces compositions pour le calandrage et le thermoformage |
| US4407897A (en) | 1979-12-10 | 1983-10-04 | American Can Company | Drying agent in multi-layer polymeric structure |
| JPS60170270A (ja) | 1984-02-15 | 1985-09-03 | Matsushita Electric Ind Co Ltd | 太陽電池素子のパツケ−ジ構成法 |
| US4568416A (en) | 1984-06-06 | 1986-02-04 | Tokujiro Okui | Taping package method for small-size electronic parts |
| US4665050A (en) | 1984-08-13 | 1987-05-12 | Pall Corporation | Self-supporting structures containing immobilized inorganic sorbent particles and method for forming same |
| US4792484A (en) | 1986-05-15 | 1988-12-20 | Kuraray Co., Ltd. | Composition, process for producing the same and multi-layer structure |
| KR960015106B1 (ko) | 1986-11-25 | 1996-10-28 | 가부시기가이샤 히다찌세이사꾸쇼 | 면실장형 반도체패키지 포장체 |
| US5295297B1 (en) | 1986-11-25 | 1996-11-26 | Hitachi Ltd | Method of producing semiconductor memory |
| JPH0219271A (ja) | 1988-07-06 | 1990-01-23 | Toshiba Corp | 半導体装置用テーピング部品 |
| US4894417A (en) | 1988-10-12 | 1990-01-16 | Shell Oil Company | Polymeric composition |
| DE69018312T2 (de) | 1989-05-23 | 1995-12-14 | Sasaki Chemicals Co Ltd | Feuchtigkeitssorbentmittelzusammenstellungen. |
| DE69017085T2 (de) | 1989-05-30 | 1995-06-14 | Kuraray Co | Kunststoff-Zusammensetzung. |
| EP0432438B1 (de) | 1989-11-02 | 1994-02-02 | Kuraray Chemical Co., Ltd. | Geformtes Sorbentmittel |
| DE4013799A1 (de) | 1990-04-28 | 1991-10-31 | Gaplast Gmbh | Behaelter und behaelterverschluss aus kunststoff, insbesondere fuer arznei- und genussmittel |
| US5304419A (en) | 1990-07-06 | 1994-04-19 | Alpha Fry Ltd | Moisture and particle getter for enclosures |
| CA2049271C (en) | 1990-08-28 | 1998-05-05 | Roger L. Juhl | Transferable modifier containing film |
| US5318181A (en) | 1992-03-31 | 1994-06-07 | Motorola, Inc. | Compartmentalized humidity sensing indicator |
| US5293996A (en) | 1992-05-14 | 1994-03-15 | Motorola, Inc. | Container having an observation window |
| US5238648A (en) | 1992-06-03 | 1993-08-24 | Irwin Kremen | Hermetic enclosure assembly for preservational storage and/or display of otherwise degradable objects |
| US5390472A (en) * | 1992-06-19 | 1995-02-21 | Minnesota Mining And Manufacturing Company | Carrier tape with cover strip |
| FR2698289B1 (fr) | 1992-11-20 | 1995-01-27 | Airsec Ind Sa | Matières déshydratantes à base de polymères. |
| US5401706A (en) | 1993-01-06 | 1995-03-28 | Semco Incorporated | Desiccant-coated substrate and method of manufacture |
| DE69411860T2 (de) | 1993-11-19 | 1999-02-18 | Mitsubishi Gas Chemical Co | Sauerstoffabsorber-Einsatz für Behälterdeckel |
| GB9505425D0 (en) | 1995-03-17 | 1995-05-03 | Unilever Plc | Assay devices |
| US6486231B1 (en) | 1995-04-19 | 2002-11-26 | Csp Technologies, Inc. | Co-continuous interconnecting channel morphology composition |
| US6080350A (en) | 1995-04-19 | 2000-06-27 | Capitol Specialty Plastics, Inc. | Dessicant entrained polymer |
| US5911937A (en) | 1995-04-19 | 1999-06-15 | Capitol Specialty Plastics, Inc. | Desiccant entrained polymer |
| US6221446B1 (en) | 1995-04-19 | 2001-04-24 | Capitol Specialty Plastics, Inc | Modified polymers having controlled transmission rates |
| US6214255B1 (en) | 1995-04-19 | 2001-04-10 | Capitol Specialty Plastics, Inc. | Desiccant entrained polymer |
| US6130263A (en) | 1995-04-19 | 2000-10-10 | Capitol Specialty Plastics, Inc. | Desiccant entrained polymer |
| US6194079B1 (en) | 1995-04-19 | 2001-02-27 | Capitol Specialty Plastics, Inc. | Monolithic polymer composition having an absorbing material |
| US6613405B1 (en) | 1995-04-19 | 2003-09-02 | Csp Technologies, Inc. | Monolithic composition having the capability of maintaining constant relative humidity in a package |
| US6124006A (en) | 1995-04-19 | 2000-09-26 | Capitol Specialty Plastics, Inc. | Modified polymers having controlled transmission rates |
| WO1996033108A1 (en) | 1995-04-19 | 1996-10-24 | Capitol Vial, Inc. | Desiccant material included in a closed container |
| US6174952B1 (en) | 1995-04-19 | 2001-01-16 | Capitol Specialty Plastics, Inc. | Monolithic polymer composition having a water absorption material |
| US6177183B1 (en) | 1995-04-19 | 2001-01-23 | Capitol Specialty Plastics, Inc. | Monolithic composition having an activation material |
| US6279736B1 (en) | 1995-04-19 | 2001-08-28 | Capitol Specialty Plastics, Inc. | Barrier pack having an absorbing agent applied to the interior of the pack |
| US5789044A (en) * | 1996-01-24 | 1998-08-04 | Eastman Kodak Company | Zeolite molecular sieves for packaging structures |
| US5702508A (en) | 1996-01-25 | 1997-12-30 | Moratalla; Jose | Ceramic desiccant device |
| US6059860A (en) | 1996-06-21 | 2000-05-09 | 3M Innovative Properties Company | Sorptive articles |
| US5875892A (en) | 1997-01-10 | 1999-03-02 | Humidial Corporation | Packaging container with humidity indicator |
| US6465532B1 (en) | 1997-03-05 | 2002-10-15 | Csp Tecnologies, Inc. | Co-continuous interconnecting channel morphology polymer having controlled gas transmission rate through the polymer |
| US5875897A (en) | 1997-03-31 | 1999-03-02 | Motorola, Inc. | Packaging apparatus and method |
| US5857573A (en) | 1998-01-15 | 1999-01-12 | Advanced Micro Devices, Inc. | Tray for shipping PCMCIA cards |
| US6206198B1 (en) | 1998-08-11 | 2001-03-27 | Texas Instruments Incorporated | Lightweight, high temperature packing reel for integrated circuits |
| US6212756B1 (en) | 1998-08-14 | 2001-04-10 | Truseal Technologies, Inc. | Dispensable non-adhesive desiccated matrix system for insulating glass units |
| JP2000208252A (ja) | 1999-01-14 | 2000-07-28 | Tdk Corp | 有機ｅｌ素子 |
| US6116423A (en) | 1999-07-23 | 2000-09-12 | Texas Instruments Incorporated | Multi-functional shipping system for integrated circuit devices |
| US6357207B1 (en) | 1999-08-03 | 2002-03-19 | Southpac Trust International, Inc. | Modified atmosphere packaging for a floral grouping |
| US6696002B1 (en) | 2000-03-29 | 2004-02-24 | Capitol Security Plastics, Inc. | Co-continuous interconnecting channel morphology polymer having modified surface properties |
| US20020185409A1 (en) * | 2000-04-05 | 2002-12-12 | Morrow Anthony B. | Desiccant containing product carrier |
| SE516853C2 (sv) | 2000-04-28 | 2002-03-12 | Foerpackningsinnovation Norden | Transportband för lagring och transport av komponenter samt förfarande för framställning av detta |
| US6469372B2 (en) | 2000-05-16 | 2002-10-22 | Texas Instruments Incorporated | Matched thermal expansion carrier tape assemblage for semiconductor devices |
| US6827218B1 (en) | 2000-08-28 | 2004-12-07 | Sud-Chemie Inc. | Packaging container for electronic components |
| JP2002096974A (ja) * | 2000-09-22 | 2002-04-02 | Oki Electric Ind Co Ltd | 搬送用リールとそれを用いた搬送方法、及び電子装置の製造方法 |
-
2004
- 2004-12-06 US US11/005,289 patent/US7389877B2/en not_active Expired - Fee Related
-
2005
- 2005-11-01 DE DE602005008096T patent/DE602005008096D1/de active Active
- 2005-11-01 EP EP05824921A patent/EP1815729B1/de not_active Not-in-force
- 2005-11-01 AT AT05824921T patent/ATE400990T1/de not_active IP Right Cessation
- 2005-11-01 WO PCT/US2005/039427 patent/WO2006057776A2/en active Application Filing
- 2005-11-23 TW TW094141136A patent/TW200626445A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US20050098475A1 (en) | 2005-05-12 |
| US7389877B2 (en) | 2008-06-24 |
| ATE400990T1 (de) | 2008-07-15 |
| WO2006057776A3 (en) | 2007-01-11 |
| TW200626445A (en) | 2006-08-01 |
| EP1815729B1 (de) | 2008-07-09 |
| EP1815729A2 (de) | 2007-08-08 |
| WO2006057776A2 (en) | 2006-06-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8328 | Change in the person/name/address of the agent |
Representative=s name: WESTENDORP SOMMER, 80336 MUENCHEN |