DE60212906D1 - Feder mit leitfähiger Beschichtung - Google Patents

Feder mit leitfähiger Beschichtung

Info

Publication number
DE60212906D1
DE60212906D1 DE60212906T DE60212906T DE60212906D1 DE 60212906 D1 DE60212906 D1 DE 60212906D1 DE 60212906 T DE60212906 T DE 60212906T DE 60212906 T DE60212906 T DE 60212906T DE 60212906 D1 DE60212906 D1 DE 60212906D1
Authority
DE
Germany
Prior art keywords
spring
conductive coating
conductive
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60212906T
Other languages
English (en)
Other versions
DE60212906T2 (de
Inventor
David K Fork
Christopher L Chua
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of DE60212906D1 publication Critical patent/DE60212906D1/de
Application granted granted Critical
Publication of DE60212906T2 publication Critical patent/DE60212906T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
    • B81C1/0065—Mechanical properties
    • B81C1/00666—Treatments for controlling internal stress or strain in MEMS structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/00468—Releasing structures
    • B81C1/00476—Releasing structures removing a sacrificial layer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H01R12/718—Contact members provided on the PCB without an insulating housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0118—Cantilevers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0307—Anchors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035—Plated dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
DE60212906T 2001-07-11 2002-07-03 Feder mit leitfähiger Beschichtung Expired - Lifetime DE60212906T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/904,370 US6560861B2 (en) 2001-07-11 2001-07-11 Microspring with conductive coating deposited on tip after release
US904370 2001-07-11

Publications (2)

Publication Number Publication Date
DE60212906D1 true DE60212906D1 (de) 2006-08-17
DE60212906T2 DE60212906T2 (de) 2007-01-18

Family

ID=25419030

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60212906T Expired - Lifetime DE60212906T2 (de) 2001-07-11 2002-07-03 Feder mit leitfähiger Beschichtung

Country Status (4)

Country Link
US (2) US6560861B2 (de)
EP (1) EP1277696B1 (de)
JP (1) JP2003097617A (de)
DE (1) DE60212906T2 (de)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7247035B2 (en) * 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US7382142B2 (en) * 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US20070245553A1 (en) * 1999-05-27 2007-10-25 Chong Fu C Fine pitch microfabricated spring contact structure & method
US6799976B1 (en) * 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US7579848B2 (en) * 2000-05-23 2009-08-25 Nanonexus, Inc. High density interconnect system for IC packages and interconnect assemblies
US7952373B2 (en) * 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US6595787B2 (en) * 2001-02-09 2003-07-22 Xerox Corporation Low cost integrated out-of-plane micro-device structures and method of making
JP3794586B2 (ja) * 2001-08-24 2006-07-05 ナノネクサス インク スパッタされた膜において、均一な等方性の応力を生じさせるための方法および装置
US6794737B2 (en) * 2001-10-12 2004-09-21 Xerox Corporation Spring structure with stress-balancing layer
US8914590B2 (en) * 2002-08-07 2014-12-16 Pact Xpp Technologies Ag Data processing method and device
US6866255B2 (en) * 2002-04-12 2005-03-15 Xerox Corporation Sputtered spring films with low stress anisotropy
US7265565B2 (en) 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
US20060053625A1 (en) * 2002-05-07 2006-03-16 Microfabrica Inc. Microprobe tips and methods for making
US20060051948A1 (en) * 2003-02-04 2006-03-09 Microfabrica Inc. Microprobe tips and methods for making
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US20080211524A1 (en) * 2003-02-04 2008-09-04 Microfabrica Inc. Electrochemically Fabricated Microprobes
US20080157793A1 (en) * 2003-02-04 2008-07-03 Microfabrica Inc. Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes
US7015584B2 (en) * 2003-07-08 2006-03-21 Xerox Corporation High force metal plated spring structure
US6881074B1 (en) * 2003-09-29 2005-04-19 Cookson Electronics, Inc. Electrical circuit assembly with micro-socket
US6890185B1 (en) * 2003-11-03 2005-05-10 Kulicke & Soffa Interconnect, Inc. Multipath interconnect with meandering contact cantilevers
US7410590B2 (en) 2003-12-19 2008-08-12 Palo Alto Research Center Incorporated Transferable micro spring structure
US20080108221A1 (en) * 2003-12-31 2008-05-08 Microfabrica Inc. Microprobe Tips and Methods for Making
JP4747562B2 (ja) * 2004-06-25 2011-08-17 株式会社日立製作所 希土類磁石及びその製造方法、並びに磁石モータ
JP4382593B2 (ja) 2004-06-29 2009-12-16 山一電機株式会社 プローブユニット及びその製造方法
US7082684B2 (en) * 2004-08-04 2006-08-01 Palo Alto Research Center Incorporated Intermetallic spring structure
US20060030179A1 (en) * 2004-08-05 2006-02-09 Palo Alto Research Center, Incorporated Transmission-line spring structure
US8330485B2 (en) * 2004-10-21 2012-12-11 Palo Alto Research Center Incorporated Curved spring structure with downturned tip
US7230440B2 (en) 2004-10-21 2007-06-12 Palo Alto Research Center Incorporated Curved spring structure with elongated section located under cantilevered section
US20060180927A1 (en) * 2005-02-14 2006-08-17 Daisuke Takai Contact structure and method for manufacturing the same
US7550855B2 (en) * 2005-12-02 2009-06-23 Palo Alto Research Center Incorporated Vertically spaced plural microsprings
JP4654897B2 (ja) 2005-12-09 2011-03-23 イビデン株式会社 部品実装用ピンを有するプリント配線板の製造方法
JP4848752B2 (ja) * 2005-12-09 2011-12-28 イビデン株式会社 部品実装用ピンを有するプリント配線板及びこれを使用した電子機器
JP2007165383A (ja) 2005-12-09 2007-06-28 Ibiden Co Ltd 部品実装用ピンを形成したプリント基板
CN100439234C (zh) * 2005-12-29 2008-12-03 中国科学院上海微系统与信息技术研究所 二氟化氙气体腐蚀过程中锚的制作方法
US7982290B2 (en) * 2006-01-12 2011-07-19 Palo Alto Research Center, Inc. Contact spring application to semiconductor devices
TWI332086B (en) * 2006-10-24 2010-10-21 Ind Tech Res Inst Multi-layer electric probe and fabricating method
US20090140433A1 (en) * 2007-11-30 2009-06-04 Alces Technology, Inc. MEMS chip-to-chip interconnects
US7927905B2 (en) * 2007-12-21 2011-04-19 Palo Alto Research Center Incorporated Method of producing microsprings having nanowire tip structures
DE202008001997U1 (de) * 2008-02-14 2008-04-03 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Kontaktfeder
US8278748B2 (en) 2010-02-17 2012-10-02 Maxim Integrated Products, Inc. Wafer-level packaged device having self-assembled resilient leads
US8686560B2 (en) 2010-04-07 2014-04-01 Maxim Integrated Products, Inc. Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress
US8519534B2 (en) 2010-09-22 2013-08-27 Palo Alto Research Center Incorporated Microsprings partially embedded in a laminate structure and methods for producing same
US8441808B2 (en) 2010-09-22 2013-05-14 Palo Alto Research Center Incorporated Interposer with microspring contacts
US8643140B2 (en) * 2011-07-11 2014-02-04 United Microelectronics Corp. Suspended beam for use in MEMS device
US8525353B2 (en) 2011-12-19 2013-09-03 Palo Alto Research Center Incorporated Microspring structures adapted for target device cooling
JP6379416B2 (ja) * 2014-10-31 2018-08-29 北川工業株式会社 接触部材
DE102015211472A1 (de) * 2015-06-22 2016-07-07 Carl Zeiss Smt Gmbh Mikro-elektromechanisches system und verfahren zum herstellen eines mikro-elektromechanischen systems
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US11867721B1 (en) 2019-12-31 2024-01-09 Microfabrica Inc. Probes with multiple springs, methods for making, and methods for using
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
US11201275B1 (en) * 2020-06-10 2021-12-14 Palo Alto Research Center Incorporated Superconducting stress-engineered micro-fabricated springs
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape
US11908782B2 (en) * 2021-03-22 2024-02-20 Xerox Corporation Spacers formed on a substrate with etched micro-springs

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US3842189A (en) 1973-01-08 1974-10-15 Rca Corp Contact array and method of making the same
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US6117694A (en) * 1994-07-07 2000-09-12 Tessera, Inc. Flexible lead structures and methods of making same
US5613861A (en) 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
WO1997043654A1 (en) * 1996-05-17 1997-11-20 Formfactor, Inc. Microelectronic spring contact elements
JPH11504725A (ja) * 1996-05-17 1999-04-27 フォームファクター，インコーポレイテッド マイクロエレクトロニクスばね接触部品
DE19736674C1 (de) * 1997-08-22 1998-11-26 Siemens Ag Mikromechanisches elektrostatisches Relais und Verfahren zu dessen Herstellung
TW589453B (en) * 1998-12-02 2004-06-01 Formfactor Inc Lithographic contact elements
US6366414B1 (en) * 1999-09-03 2002-04-02 Agere Systems Guardian Corp. Micro-electro-mechanical optical device
US6794725B2 (en) * 1999-12-21 2004-09-21 Xerox Corporation Amorphous silicon sensor with micro-spring interconnects for achieving high uniformity in integrated light-emitting sources
US6827584B2 (en) * 1999-12-28 2004-12-07 Formfactor, Inc. Interconnect for microelectronic structures with enhanced spring characteristics

Also Published As

Publication number Publication date
US20030010615A1 (en) 2003-01-16
JP2003097617A (ja) 2003-04-03
US6560861B2 (en) 2003-05-13
EP1277696B1 (de) 2006-07-05
EP1277696A2 (de) 2003-01-22
EP1277696A3 (de) 2004-04-07
DE60212906T2 (de) 2007-01-18
US20030096519A1 (en) 2003-05-22

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