DE68919291T2 - Elektrolumineszierende Anordnung von Verbindungshalbleitern. - Google Patents

Elektrolumineszierende Anordnung von Verbindungshalbleitern.

Info

Publication number
DE68919291T2
DE68919291T2 DE68919291T DE68919291T DE68919291T2 DE 68919291 T2 DE68919291 T2 DE 68919291T2 DE 68919291 T DE68919291 T DE 68919291T DE 68919291 T DE68919291 T DE 68919291T DE 68919291 T2 DE68919291 T2 DE 68919291T2
Authority
DE
Germany
Prior art keywords
compound semiconductors
electroluminescent arrangement
electroluminescent
arrangement
semiconductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68919291T
Other languages
English (en)
Other versions
DE68919291D1 (de
Inventor
Yoshitaka Tomomura
Masahiko Kitagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26501383&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE68919291(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of DE68919291D1 publication Critical patent/DE68919291D1/de
Application granted granted Critical
Publication of DE68919291T2 publication Critical patent/DE68919291T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/14Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
    • H01L33/145Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure with a current-blocking structure
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00Illuminated signs; Luminous advertising
    • G09F13/20Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00Illuminated signs; Luminous advertising
    • G09F13/20Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G09F2013/222Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent with LEDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/49105Connecting at different heights
    • H01L2224/49107Connecting at different heights on the semiconductor or solid-state body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4918Disposition being disposed on at least two different sides of the body, e.g. dual array
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/0004Devices characterised by their operation
    • H01L33/0037Devices characterised by their operation having a MIS barrier layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • H01L33/28Materials of the light emitting region containing only elements of group II and group VI of the periodic system
    • H01L33/285Materials of the light emitting region containing only elements of group II and group VI of the periodic system characterised by the doping materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/917Electroluminescent
DE68919291T 1988-07-21 1989-07-21 Elektrolumineszierende Anordnung von Verbindungshalbleitern. Expired - Fee Related DE68919291T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18266488A JP2708183B2 (ja) 1988-07-21 1988-07-21 化合物半導体発光素子
JP63240556A JPH0287685A (ja) 1988-07-21 1988-09-26 化合物半導体発光素子

Publications (2)

Publication Number Publication Date
DE68919291D1 DE68919291D1 (de) 1994-12-15
DE68919291T2 true DE68919291T2 (de) 1995-03-23

Family

ID=26501383

Family Applications (3)

Application Number Title Priority Date Filing Date
DE68919291T Expired - Fee Related DE68919291T2 (de) 1988-07-21 1989-07-21 Elektrolumineszierende Anordnung von Verbindungshalbleitern.
DE68918361T Expired - Fee Related DE68918361T2 (de) 1988-07-21 1989-07-21 Elektrolumineszierende Anordnung von Verbindungshalbleitern.
DE68918362T Expired - Fee Related DE68918362T2 (de) 1988-07-21 1989-07-21 Elektrolumineszierende Anordnung von Verbindungshalbleitern.

Family Applications After (2)

Application Number Title Priority Date Filing Date
DE68918361T Expired - Fee Related DE68918361T2 (de) 1988-07-21 1989-07-21 Elektrolumineszierende Anordnung von Verbindungshalbleitern.
DE68918362T Expired - Fee Related DE68918362T2 (de) 1988-07-21 1989-07-21 Elektrolumineszierende Anordnung von Verbindungshalbleitern.

Country Status (4)

Country Link
US (3) US5055363A (de)
EP (3) EP0351867B1 (de)
JP (5) JP2708183B2 (de)
DE (3) DE68919291T2 (de)

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US5198690A (en) * 1990-11-26 1993-03-30 Sharp Kabushiki Kaisha Electroluminescent device of II-IV compound semiconductor
JP2593960B2 (ja) * 1990-11-29 1997-03-26 シャープ株式会社 化合物半導体発光素子とその製造方法
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US7009213B2 (en) 2003-07-31 2006-03-07 Lumileds Lighting U.S., Llc Light emitting devices with improved light extraction efficiency
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JP2005123526A (ja) * 2003-10-20 2005-05-12 Oki Data Corp 半導体装置、ledヘッド、及び画像形成装置
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Also Published As

Publication number Publication date
DE68919291D1 (de) 1994-12-15
JP3066344B2 (ja) 2000-07-17
US5037709A (en) 1991-08-06
EP0351868B1 (de) 1994-09-21
EP0351868A3 (de) 1991-10-16
US5055363A (en) 1991-10-08
EP0351867B1 (de) 1994-09-21
JPH0287685A (ja) 1990-03-28
EP0351869B1 (de) 1994-11-09
JP2708183B2 (ja) 1998-02-04
DE68918361D1 (de) 1994-10-27
DE68918362T2 (de) 1995-01-19
EP0351869A3 (de) 1991-10-16
DE68918362D1 (de) 1994-10-27
JPH1056204A (ja) 1998-02-24
EP0351869A2 (de) 1990-01-24
JPH11220175A (ja) 1999-08-10
JPH0232570A (ja) 1990-02-02
EP0351867A2 (de) 1990-01-24
JP3069533B2 (ja) 2000-07-24
US4988579A (en) 1991-01-29
EP0351867A3 (de) 1991-10-16
DE68918361T2 (de) 1995-03-30
EP0351868A2 (de) 1990-01-24
JPH1056205A (ja) 1998-02-24

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Legal Events

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8339 Ceased/non-payment of the annual fee