DE69030260T2 - Kondensatorlaminat für halbleiterkarte - Google Patents

Kondensatorlaminat für halbleiterkarte

Info

Publication number
DE69030260T2
DE69030260T2 DE1990630260 DE69030260T DE69030260T2 DE 69030260 T2 DE69030260 T2 DE 69030260T2 DE 1990630260 DE1990630260 DE 1990630260 DE 69030260 T DE69030260 T DE 69030260T DE 69030260 T2 DE69030260 T2 DE 69030260T2
Authority
DE
Germany
Prior art keywords
capacitor laminate
capacitor
laminate
capacitive
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE1990630260
Other languages
English (en)
Other versions
DE69030260D1 (de
Inventor
James Howard
Gregory Lucas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hadco Santa Clara Inc
Original Assignee
Zycon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27015899&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69030260(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US07/397,518 external-priority patent/US5079069A/en
Application filed by Zycon Corp filed Critical Zycon Corp
Application granted granted Critical
Publication of DE69030260D1 publication Critical patent/DE69030260D1/de
Publication of DE69030260T2 publication Critical patent/DE69030260T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/642Capacitive arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/09309Core having two or more power planes; Capacitive laminate of two power planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/3154Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544Addition polymer is perhalogenated
DE1990630260 1989-08-23 1990-08-22 Kondensatorlaminat für halbleiterkarte Expired - Lifetime DE69030260T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/397,518 US5079069A (en) 1989-08-23 1989-08-23 Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
US07/521,588 US5155655A (en) 1989-08-23 1990-05-10 Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
PCT/US1990/004777 WO1991002647A1 (en) 1989-08-23 1990-08-22 Capacitor laminate for printed circuit board

Publications (2)

Publication Number Publication Date
DE69030260D1 DE69030260D1 (de) 1997-04-24
DE69030260T2 true DE69030260T2 (de) 1997-10-30

Family

ID=27015899

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1990630260 Expired - Lifetime DE69030260T2 (de) 1989-08-23 1990-08-22 Kondensatorlaminat für halbleiterkarte

Country Status (10)

Country Link
US (1) US5155655A (de)
EP (1) EP0487640B1 (de)
JP (1) JP2738590B2 (de)
KR (1) KR100227528B1 (de)
AT (1) ATE150611T1 (de)
AU (1) AU6348590A (de)
CA (1) CA2064784C (de)
DE (1) DE69030260T2 (de)
ES (1) ES2103275T3 (de)
WO (1) WO1991002647A1 (de)

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Publication number Publication date
JPH05500136A (ja) 1993-01-14
EP0487640A4 (en) 1993-08-11
ES2103275T3 (es) 1997-09-16
ATE150611T1 (de) 1997-04-15
CA2064784C (en) 1998-11-24
WO1991002647A1 (en) 1991-03-07
JP2738590B2 (ja) 1998-04-08
EP0487640A1 (de) 1992-06-03
DE69030260D1 (de) 1997-04-24
EP0487640B1 (de) 1997-03-19
KR100227528B1 (ko) 1999-11-01
US5155655A (en) 1992-10-13
AU6348590A (en) 1991-04-03
CA2064784A1 (en) 1991-02-24

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