DE69123074D1 - Elektrisch programmierbares Antischmelzsicherungselement und Verfahren zu seiner Herstellung - Google Patents

Elektrisch programmierbares Antischmelzsicherungselement und Verfahren zu seiner Herstellung

Info

Publication number
DE69123074D1
DE69123074D1 DE69123074T DE69123074T DE69123074D1 DE 69123074 D1 DE69123074 D1 DE 69123074D1 DE 69123074 T DE69123074 T DE 69123074T DE 69123074 T DE69123074 T DE 69123074T DE 69123074 D1 DE69123074 D1 DE 69123074D1
Authority
DE
Germany
Prior art keywords
amorphous silicon
layer
tungsten
electrically programmable
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69123074T
Other languages
English (en)
Other versions
DE69123074T2 (de
Inventor
John L Mccollum
Shih-Ou Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microsemi SoC Corp
Original Assignee
Actel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Actel Corp filed Critical Actel Corp
Application granted granted Critical
Publication of DE69123074D1 publication Critical patent/DE69123074D1/de
Publication of DE69123074T2 publication Critical patent/DE69123074T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5252—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising anti-fuses, i.e. connections having their state changed from non-conductive to conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53214—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being aluminium
    • H01L23/53223—Additional layers associated with aluminium layers, e.g. adhesion, barrier, cladding layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
DE69123074T 1990-04-12 1991-04-09 Elektrisch programmierbares Antischmelzsicherungselement und Verfahren zu seiner Herstellung Expired - Fee Related DE69123074T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/508,306 US5070384A (en) 1990-04-12 1990-04-12 Electrically programmable antifuse element incorporating a dielectric and amorphous silicon interlayer

Publications (2)

Publication Number Publication Date
DE69123074D1 true DE69123074D1 (de) 1996-12-19
DE69123074T2 DE69123074T2 (de) 1997-03-06

Family

ID=24022211

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69123074T Expired - Fee Related DE69123074T2 (de) 1990-04-12 1991-04-09 Elektrisch programmierbares Antischmelzsicherungselement und Verfahren zu seiner Herstellung

Country Status (5)

Country Link
US (1) US5070384A (de)
EP (1) EP0452091B1 (de)
JP (1) JP3095811B2 (de)
AT (1) ATE145301T1 (de)
DE (1) DE69123074T2 (de)

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Also Published As

Publication number Publication date
ATE145301T1 (de) 1996-11-15
EP0452091A2 (de) 1991-10-16
US5070384A (en) 1991-12-03
EP0452091B1 (de) 1996-11-13
JP3095811B2 (ja) 2000-10-10
JPH04226068A (ja) 1992-08-14
DE69123074T2 (de) 1997-03-06
EP0452091A3 (en) 1991-12-11

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