DE69128187T2 - Fotoempfindliche Harzzusammensetzung zum Herstellen eines Polyimidfilmmusters und Verfahren zum Herstellen eines Polyimidfilmmusters - Google Patents

Fotoempfindliche Harzzusammensetzung zum Herstellen eines Polyimidfilmmusters und Verfahren zum Herstellen eines Polyimidfilmmusters

Info

Publication number
DE69128187T2
DE69128187T2 DE69128187T DE69128187T DE69128187T2 DE 69128187 T2 DE69128187 T2 DE 69128187T2 DE 69128187 T DE69128187 T DE 69128187T DE 69128187 T DE69128187 T DE 69128187T DE 69128187 T2 DE69128187 T2 DE 69128187T2
Authority
DE
Germany
Prior art keywords
producing
polyimide film
film pattern
resin composition
photosensitive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69128187T
Other languages
English (en)
Other versions
DE69128187D1 (de
Inventor
Masayuki Oba
Rumiko Hayase
Naoko Kihara
Shuzi Hayase
Yukihiro Mikogami
Yoshihiko Nakano
Naohiko Oyasato
Shigeru Matake
Kei Takano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3-90001A external-priority patent/JP3029316B2/ja
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE69128187D1 publication Critical patent/DE69128187D1/de
Publication of DE69128187T2 publication Critical patent/DE69128187T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
DE69128187T 1990-09-28 1991-09-26 Fotoempfindliche Harzzusammensetzung zum Herstellen eines Polyimidfilmmusters und Verfahren zum Herstellen eines Polyimidfilmmusters Expired - Lifetime DE69128187T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP25903290 1990-09-28
JP396291 1991-01-17
JP3985491 1991-03-06
JP3-90001A JP3029316B2 (ja) 1990-09-28 1991-03-28 ポリイミド膜パターンを形成するための感光性樹脂組成物およびこれを用いた半導体装置

Publications (2)

Publication Number Publication Date
DE69128187D1 DE69128187D1 (de) 1997-12-18
DE69128187T2 true DE69128187T2 (de) 1998-03-26

Family

ID=27453987

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69128187T Expired - Lifetime DE69128187T2 (de) 1990-09-28 1991-09-26 Fotoempfindliche Harzzusammensetzung zum Herstellen eines Polyimidfilmmusters und Verfahren zum Herstellen eines Polyimidfilmmusters

Country Status (3)

Country Link
US (2) US5348835A (de)
EP (1) EP0478321B1 (de)
DE (1) DE69128187T2 (de)

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JP3509612B2 (ja) 1998-05-29 2004-03-22 日立化成デュポンマイクロシステムズ株式会社 感光性重合体組成物、レリーフパターンの製造法及び電子部品
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JP3805918B2 (ja) * 1999-02-09 2006-08-09 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、レリーフパターンの製造法及び電子部品
JP3677191B2 (ja) 1999-03-15 2005-07-27 株式会社東芝 感光性ポリイミド用現像液、ポリイミド膜パターン形成方法、及び電子部品
CN1208683C (zh) * 1999-11-30 2005-06-29 日产化学工业株式会社 正型感光性聚酰亚胺树脂组合物
JP4665333B2 (ja) * 2000-11-27 2011-04-06 東レ株式会社 ポジ型感光性樹脂前駆体組成物
JP3773845B2 (ja) * 2000-12-29 2006-05-10 三星電子株式会社 ポジティブ型感光性ポリイミド前駆体およびこれを含む組成物
JP2002212288A (ja) * 2001-01-23 2002-07-31 Hitachi Cable Ltd ポリイミドの製造方法
FR2825480B1 (fr) * 2001-05-31 2003-12-19 Nemoptic Polyimides pour ancrage de cristaux liquides, dispositifs d'affichage les incluant et procede de preparation de ces dispositifs
US7285363B2 (en) * 2002-11-08 2007-10-23 The University Of Connecticut Photoactivators, methods of use, and the articles derived therefrom
TW200512543A (en) * 2003-08-06 2005-04-01 Sumitomo Bakelite Co Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
CN101010640A (zh) * 2004-09-01 2007-08-01 东京应化工业株式会社 光蚀刻用显影液组合物与抗蚀图案的形成方法
US20060122560A1 (en) * 2004-12-07 2006-06-08 Robert Burgmeier Medical devices and processes for preparing same
KR100921149B1 (ko) * 2005-03-30 2009-10-12 신닛테츠가가쿠 가부시키가이샤 감광성 수지 조성물 및 이것을 이용한 회로기판
KR100662542B1 (ko) * 2005-06-17 2006-12-28 제일모직주식회사 반사방지 하드마스크 조성물 및 이를 이용하여 기판 상에패턴화된 재료 형상을 형성시키는 방법
WO2007125921A1 (ja) 2006-04-28 2007-11-08 Asahi Kasei Kabushiki Kaisha 感光性樹脂組成物及び感光性フィルム
US20080058496A1 (en) * 2006-08-29 2008-03-06 Daily Polymer Co., Ltd. Polyamic acid-based composition, and liquid crystal orienting agent and orienting film containing the same
US20090075080A1 (en) * 2007-09-19 2009-03-19 General Electric Company Coated fiber and method for making the coated fiber
WO2010050357A1 (ja) * 2008-10-27 2010-05-06 Jsr株式会社 感光性絶縁樹脂組成物及びその硬化物
JP5585065B2 (ja) * 2009-01-30 2014-09-10 Ｊｓｒ株式会社 感光性絶縁樹脂組成物及びその硬化物並びに絶縁膜の製造方法
KR101781517B1 (ko) * 2010-09-30 2017-09-26 삼성디스플레이 주식회사 블록 공중합체 및 이를 이용한 패턴 형성 방법
KR20120066924A (ko) * 2010-12-15 2012-06-25 제일모직주식회사 오르토-니트로벤질 에스테르 화합물 및 이를 포함하는 포지티브형 감광성 수지 조성물
CA2849381C (en) * 2011-10-04 2019-04-30 The University Of Western Ontario Fabrication of free standing membranes and use thereof for synthesis of nanoparticle patterns
JP2013131424A (ja) * 2011-12-22 2013-07-04 Hitachi Cable Ltd 絶縁電線及びそれを用いたコイル
JP5761151B2 (ja) 2012-10-16 2015-08-12 日立金属株式会社 絶縁電線及びコイル
CN106256846B (zh) * 2015-06-17 2019-04-16 长兴材料工业股份有限公司 聚酰亚胺前驱物组合物、其用途及由其制备的聚酰亚胺
US10090194B2 (en) * 2016-03-18 2018-10-02 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method
JP6663380B2 (ja) * 2017-03-22 2020-03-11 信越化学工業株式会社 ポリイミド前駆体の重合体、ポジ型感光性樹脂組成物、ネガ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品
CN112899746B (zh) * 2021-02-05 2022-04-08 南京理工大学 降低叠氮化亚铜薄膜静电感度的方法

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Also Published As

Publication number Publication date
EP0478321A1 (de) 1992-04-01
EP0478321B1 (de) 1997-11-12
US5518864A (en) 1996-05-21
DE69128187D1 (de) 1997-12-18
US5348835A (en) 1994-09-20

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