DE69210704T2 - Thermisches Glühen von Palladium Legierungen - Google Patents

Thermisches Glühen von Palladium Legierungen

Info

Publication number
DE69210704T2
DE69210704T2 DE69210704T DE69210704T DE69210704T2 DE 69210704 T2 DE69210704 T2 DE 69210704T2 DE 69210704 T DE69210704 T DE 69210704T DE 69210704 T DE69210704 T DE 69210704T DE 69210704 T2 DE69210704 T2 DE 69210704T2
Authority
DE
Germany
Prior art keywords
thermal annealing
palladium alloys
palladium
alloys
annealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69210704T
Other languages
English (en)
Other versions
DE69210704D1 (de
Inventor
Joseph Anthony Abys
Igor Veljko Kadija
Joseph John Maisano
Shohei Nakahara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Application granted granted Critical
Publication of DE69210704D1 publication Critical patent/DE69210704D1/de
Publication of DE69210704T2 publication Critical patent/DE69210704T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
DE69210704T 1991-07-22 1992-07-14 Thermisches Glühen von Palladium Legierungen Expired - Fee Related DE69210704T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/733,492 US5180482A (en) 1991-07-22 1991-07-22 Thermal annealing of palladium alloys

Publications (2)

Publication Number Publication Date
DE69210704D1 DE69210704D1 (de) 1996-06-20
DE69210704T2 true DE69210704T2 (de) 1996-10-10

Family

ID=24947830

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69210704T Expired - Fee Related DE69210704T2 (de) 1991-07-22 1992-07-14 Thermisches Glühen von Palladium Legierungen

Country Status (9)

Country Link
US (1) US5180482A (de)
EP (1) EP0524760B1 (de)
JP (1) JP2607002B2 (de)
KR (1) KR950004992B1 (de)
CA (1) CA2069363C (de)
DE (1) DE69210704T2 (de)
HK (1) HK179096A (de)
SG (1) SG43778A1 (de)
TW (1) TW208046B (de)

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US6540154B1 (en) * 1991-04-24 2003-04-01 Aerogen, Inc. Systems and methods for controlling fluid feed to an aerosol generator
CA2110327A1 (en) * 1992-11-30 1994-05-31 Brian E. Aufderheide Touch switch with coating for inhibiting increased contact resistance
US7200930B2 (en) * 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
US5665639A (en) * 1994-02-23 1997-09-09 Cypress Semiconductor Corp. Process for manufacturing a semiconductor device bump electrode using a rapid thermal anneal
US5758637A (en) 1995-08-31 1998-06-02 Aerogen, Inc. Liquid dispensing apparatus and methods
US6205999B1 (en) 1995-04-05 2001-03-27 Aerogen, Inc. Methods and apparatus for storing chemical compounds in a portable inhaler
KR960039315A (ko) * 1995-04-06 1996-11-25 이대원 리드프레임 제조방법
FR2766396B1 (fr) * 1997-07-25 1999-10-01 Radiall Sa Procede pour revetir une piece metallique destinee a etre brasee, revetement utilise a cet effet et piece ainsi revetue
US6807734B2 (en) * 1998-02-13 2004-10-26 Formfactor, Inc. Microelectronic contact structures, and methods of making same
US6255126B1 (en) * 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
US6235177B1 (en) * 1999-09-09 2001-05-22 Aerogen, Inc. Method for the construction of an aperture plate for dispensing liquid droplets
US6335107B1 (en) 1999-09-23 2002-01-01 Lucent Technologies Inc. Metal article coated with multilayer surface finish for porosity reduction
US7971588B2 (en) * 2000-05-05 2011-07-05 Novartis Ag Methods and systems for operating an aerosol generator
MXPA02010884A (es) * 2000-05-05 2003-03-27 Aerogen Ireland Ltd Aparato y metodo para el suministro de medicamentos al sistema respiratorio.
US6948491B2 (en) * 2001-03-20 2005-09-27 Aerogen, Inc. Convertible fluid feed system with comformable reservoir and methods
US7600511B2 (en) * 2001-11-01 2009-10-13 Novartis Pharma Ag Apparatus and methods for delivery of medicament to a respiratory system
US8336545B2 (en) * 2000-05-05 2012-12-25 Novartis Pharma Ag Methods and systems for operating an aerosol generator
US7100600B2 (en) * 2001-03-20 2006-09-05 Aerogen, Inc. Fluid filled ampoules and methods for their use in aerosolizers
US6546927B2 (en) 2001-03-13 2003-04-15 Aerogen, Inc. Methods and apparatus for controlling piezoelectric vibration
US6732944B2 (en) * 2001-05-02 2004-05-11 Aerogen, Inc. Base isolated nebulizing device and methods
US7677467B2 (en) * 2002-01-07 2010-03-16 Novartis Pharma Ag Methods and devices for aerosolizing medicament
MXPA04006629A (es) 2002-01-07 2004-11-10 Aerogen Inc Aparatos y metodos para nebulizar fluidos para inhalacion.
US20050205089A1 (en) * 2002-01-07 2005-09-22 Aerogen, Inc. Methods and devices for aerosolizing medicament
ES2603067T3 (es) * 2002-01-15 2017-02-23 Novartis Ag Métodos y sistemas para hacer funcionar un generador de aerosol
US7109111B2 (en) * 2002-02-11 2006-09-19 Applied Materials, Inc. Method of annealing metal layers
US20070044792A1 (en) * 2005-08-30 2007-03-01 Aerogen, Inc. Aerosol generators with enhanced corrosion resistance
ES2572770T3 (es) * 2002-05-20 2016-06-02 Novartis Ag Aparato para proporcionar pulverización para tratamiento médico y métodos
US8616195B2 (en) * 2003-07-18 2013-12-31 Novartis Ag Nebuliser for the production of aerosolized medication
US7267121B2 (en) * 2004-04-20 2007-09-11 Aerogen, Inc. Aerosol delivery apparatus and method for pressure-assisted breathing systems
US7946291B2 (en) 2004-04-20 2011-05-24 Novartis Ag Ventilation systems and methods employing aerosol generators
KR101226995B1 (ko) * 2004-04-20 2013-01-28 노바르티스 아게 압력 보조식 호흡 장치용 에어로졸 전달 장치
US7290541B2 (en) * 2004-04-20 2007-11-06 Aerogen, Inc. Aerosol delivery apparatus and method for pressure-assisted breathing systems
BRPI0611198B1 (pt) * 2005-05-25 2018-02-06 Aerogen, Inc. Vibration systems and methods
JP4828884B2 (ja) * 2005-07-26 2011-11-30 株式会社東芝 プリント回路配線基板、及び電子機器
CN100388572C (zh) * 2006-03-15 2008-05-14 上海坤链电子产品有限公司 电连接器的盒式结构插孔接触件的局部电镀金方法
JP5318375B2 (ja) * 2007-06-25 2013-10-16 株式会社サンユー パラジウム−コバルト合金めっき液、パラジウム−コバルト合金被膜の形成方法及びパラジウム−コバルト合金硬質被膜の製造方法
JP4846740B2 (ja) * 2008-01-23 2011-12-28 旭鍍金株式会社 めっき物の製造方法及び電気めっき方法
US7842170B1 (en) * 2009-03-09 2010-11-30 Von Detten Volker Device for selective plating of electrical contacts for connectors
RU2593254C2 (ru) 2010-12-28 2016-08-10 Стэмфорд Девайсиз Лтд. Полученная фотолитографическим способом дырчатая пластина и способ ее изготовления
WO2013186031A2 (en) 2012-06-11 2013-12-19 Stamford Devices Limited A method of producing an aperture plate for a nebulizer
US10279357B2 (en) 2014-05-23 2019-05-07 Stamford Devices Limited Method for producing an aperture plate

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3925170A (en) * 1974-01-23 1975-12-09 American Chem & Refining Co Method and composition for producing bright palladium electrodepositions
GB1495910A (en) * 1975-10-30 1977-12-21 Ibm Method and bath for electroplating palladium on an articl
US4066517A (en) * 1976-03-11 1978-01-03 Oxy Metal Industries Corporation Electrodeposition of palladium
JPS569387A (en) * 1979-07-04 1981-01-30 Seiko Instr & Electronics Ltd Plating method of decorative article
JPS6019630B2 (ja) * 1979-07-18 1985-05-17 日本鉱業株式会社 接触子
US4319967A (en) * 1979-11-01 1982-03-16 Bell Telephone Laboratories, Incorporated Fabrication of palladium anode for X-ray lithography
JPS5772284A (en) * 1980-10-21 1982-05-06 Fujitsu Ltd Method of producing electric contactor
US4486274A (en) * 1981-02-27 1984-12-04 At&T Bell Laboratories Palladium plating prodedure
US4468296A (en) * 1982-12-10 1984-08-28 At&T Bell Laboratories Process for electroplating palladium
JPH0244106B2 (ja) * 1985-06-17 1990-10-02 Yazaki Corp Denkyosetsuten
JPS6353872A (ja) * 1986-08-22 1988-03-08 三菱電機株式会社 接触子用材料
US4911798A (en) * 1988-12-20 1990-03-27 At&T Bell Laboratories Palladium alloy plating process
US4911799A (en) * 1989-08-29 1990-03-27 At&T Bell Laboratories Electrodeposition of palladium films

Also Published As

Publication number Publication date
HK179096A (en) 1996-10-04
JP2607002B2 (ja) 1997-05-07
SG43778A1 (en) 1997-11-14
DE69210704D1 (de) 1996-06-20
US5180482A (en) 1993-01-19
KR950004992B1 (ko) 1995-05-16
JPH05190250A (ja) 1993-07-30
KR930003459A (ko) 1993-02-24
EP0524760B1 (de) 1996-05-15
CA2069363A1 (en) 1993-01-23
EP0524760A2 (de) 1993-01-27
EP0524760A3 (en) 1994-07-13
CA2069363C (en) 1999-05-18
TW208046B (de) 1993-06-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee