DE69218468D1 - Verfahren zur Herstellung behandelter Kupfer-Folien, daraus hergestellte Produkte sowie Elektrolyt zur Verwendung in einem solchen Verfahren - Google Patents

Verfahren zur Herstellung behandelter Kupfer-Folien, daraus hergestellte Produkte sowie Elektrolyt zur Verwendung in einem solchen Verfahren

Info

Publication number
DE69218468D1
DE69218468D1 DE69218468T DE69218468T DE69218468D1 DE 69218468 D1 DE69218468 D1 DE 69218468D1 DE 69218468 T DE69218468 T DE 69218468T DE 69218468 T DE69218468 T DE 69218468T DE 69218468 D1 DE69218468 D1 DE 69218468D1
Authority
DE
Germany
Prior art keywords
electrolyte
production
products made
made therefrom
copper foils
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69218468T
Other languages
English (en)
Other versions
DE69218468T2 (de
Inventor
Adam M Wolski
Laurette M Maquet
Michel Streel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Circuit Foil USA Inc
Original Assignee
Circuit Foil USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circuit Foil USA Inc filed Critical Circuit Foil USA Inc
Publication of DE69218468D1 publication Critical patent/DE69218468D1/de
Application granted granted Critical
Publication of DE69218468T2 publication Critical patent/DE69218468T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
DE69218468T 1991-01-16 1992-01-14 Verfahren zur Herstellung behandelter Kupfer-Folien, daraus hergestellte Produkte sowie Elektrolyt zur Verwendung in einem solchen Verfahren Expired - Fee Related DE69218468T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/641,922 US5207889A (en) 1991-01-16 1991-01-16 Method of producing treated copper foil, products thereof and electrolyte useful in such method

Publications (2)

Publication Number Publication Date
DE69218468D1 true DE69218468D1 (de) 1997-04-30
DE69218468T2 DE69218468T2 (de) 1997-07-03

Family

ID=24574426

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69218468T Expired - Fee Related DE69218468T2 (de) 1991-01-16 1992-01-14 Verfahren zur Herstellung behandelter Kupfer-Folien, daraus hergestellte Produkte sowie Elektrolyt zur Verwendung in einem solchen Verfahren

Country Status (3)

Country Link
US (1) US5207889A (de)
EP (1) EP0495468B1 (de)
DE (1) DE69218468T2 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6042711A (en) * 1991-06-28 2000-03-28 Gould Electronics, Inc. Metal foil with improved peel strength and method for making said foil
US5513537A (en) * 1992-02-25 1996-05-07 The Boeing Company Method and apparatus to determine composite prepreg tack
US5779870A (en) * 1993-03-05 1998-07-14 Polyclad Laminates, Inc. Method of manufacturing laminates and printed circuit boards
US5447619A (en) * 1993-11-24 1995-09-05 Circuit Foil Usa, Inc. Copper foil for the manufacture of printed circuit boards and method of producing the same
TW420729B (en) * 1996-02-12 2001-02-01 Gould Electronics Inc A non-cyanide brass plating bath and a method of making metallic foil having a brass layer using the non-cyanide brass plating bath
US5989727A (en) * 1998-03-04 1999-11-23 Circuit Foil U.S.A., Inc. Electrolytic copper foil having a modified shiny side
US6527939B1 (en) 1999-06-28 2003-03-04 Eltech Systems Corporation Method of producing copper foil with an anode having multiple coating layers
US6224991B1 (en) 1999-09-13 2001-05-01 Yates Foil Usa, Inc. Process for electrodeposition of barrier layer over copper foil bonding treatment, products thereof and electrolyte useful in such process
US6372113B2 (en) * 1999-09-13 2002-04-16 Yates Foil Usa, Inc. Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing same
US7612283B2 (en) * 2002-07-09 2009-11-03 Canon Kabushiki Kaisha Solar power generation apparatus and its manufacturing method
FR2869622B1 (fr) * 2004-04-28 2008-04-18 Rhodia Chimie Sa Comprimes de micro-organismes pour ensemencement direct
TWI433964B (zh) 2010-10-08 2014-04-11 Water Star Inc 複數層之混合金屬氧化物電極及其製法
US11668017B2 (en) 2018-07-30 2023-06-06 Water Star, Inc. Current reversal tolerant multilayer material, method of making the same, use as an electrode, and use in electrochemical processes

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3857681A (en) * 1971-08-03 1974-12-31 Yates Industries Copper foil treatment and products produced therefrom
US4356067A (en) * 1979-06-13 1982-10-26 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4572768A (en) * 1985-06-28 1986-02-25 Square D Company Treatment for copper foil

Also Published As

Publication number Publication date
EP0495468B1 (de) 1997-03-26
EP0495468A2 (de) 1992-07-22
DE69218468T2 (de) 1997-07-03
US5207889A (en) 1993-05-04
EP0495468A3 (en) 1994-05-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee