DE69231272T2 - Verbesserte Struktur einer Schotty-Diode und Herstellungsprozeß dafür - Google Patents

Verbesserte Struktur einer Schotty-Diode und Herstellungsprozeß dafür

Info

Publication number
DE69231272T2
DE69231272T2 DE69231272T DE69231272T DE69231272T2 DE 69231272 T2 DE69231272 T2 DE 69231272T2 DE 69231272 T DE69231272 T DE 69231272T DE 69231272 T DE69231272 T DE 69231272T DE 69231272 T2 DE69231272 T2 DE 69231272T2
Authority
DE
Germany
Prior art keywords
improved
manufacturing process
diode structure
process therefor
schotty diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69231272T
Other languages
English (en)
Other versions
DE69231272D1 (de
Inventor
Murray J Robinson
Christopher C Joyce
Tim Wah Luk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Application granted granted Critical
Publication of DE69231272D1 publication Critical patent/DE69231272D1/de
Publication of DE69231272T2 publication Critical patent/DE69231272T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861—Diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
    • H01L27/0623—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with bipolar transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0641—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type
    • H01L27/0647—Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. vertical bipolar transistor and bipolar lateral transistor and resistor
    • H01L27/0652—Vertical bipolar transistor in combination with diodes, or capacitors, or resistors
    • H01L27/0664—Vertical bipolar transistor in combination with diodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/917—Plural dopants of same conductivity type in same region
DE69231272T 1991-12-06 1992-08-11 Verbesserte Struktur einer Schotty-Diode und Herstellungsprozeß dafür Expired - Lifetime DE69231272T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/803,214 US5150177A (en) 1991-12-06 1991-12-06 Schottky diode structure with localized diode well

Publications (2)

Publication Number Publication Date
DE69231272D1 DE69231272D1 (de) 2000-08-24
DE69231272T2 true DE69231272T2 (de) 2001-03-15

Family

ID=25185915

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69231272T Expired - Lifetime DE69231272T2 (de) 1991-12-06 1992-08-11 Verbesserte Struktur einer Schotty-Diode und Herstellungsprozeß dafür

Country Status (5)

Country Link
US (1) US5150177A (de)
EP (1) EP0545521B1 (de)
JP (1) JPH05259438A (de)
KR (1) KR930015107A (de)
DE (1) DE69231272T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5326710A (en) * 1992-09-10 1994-07-05 National Semiconductor Corporation Process for fabricating lateral PNP transistor structure and BICMOS IC
US5614755A (en) * 1993-04-30 1997-03-25 Texas Instruments Incorporated High voltage Shottky diode
US5889315A (en) * 1994-08-18 1999-03-30 National Semiconductor Corporation Semiconductor structure having two levels of buried regions
US6445014B1 (en) 1999-06-16 2002-09-03 Micron Technology Inc. Retrograde well structure for a CMOS imager
US6310366B1 (en) 1999-06-16 2001-10-30 Micron Technology, Inc. Retrograde well structure for a CMOS imager
US6261932B1 (en) 1999-07-29 2001-07-17 Fairchild Semiconductor Corp. Method of fabricating Schottky diode and related structure
US20060076639A1 (en) * 2004-10-13 2006-04-13 Lypen William J Schottky diodes and methods of making the same
US10050157B2 (en) * 2005-07-01 2018-08-14 Texas Instruments Incorporated Spike implanted Schottky diode
US8759194B2 (en) 2012-04-25 2014-06-24 International Business Machines Corporation Device structures compatible with fin-type field-effect transistor technologies

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4032372A (en) * 1971-04-28 1977-06-28 International Business Machines Corporation Epitaxial outdiffusion technique for integrated bipolar and field effect transistors
US3849789A (en) * 1972-11-01 1974-11-19 Gen Electric Schottky barrier diodes
JPS55141763A (en) * 1979-04-23 1980-11-05 Hitachi Ltd Schottky barrier diode and fabricating method of the same
JPS5712564A (en) * 1980-06-27 1982-01-22 Hitachi Ltd Semiconductor device
JPS58123754A (ja) * 1982-01-20 1983-07-23 Hitachi Ltd 半導体装置の製造法
JPS59177960A (ja) * 1983-03-28 1984-10-08 Hitachi Ltd 半導体装置およびその製造方法
US4536945A (en) * 1983-11-02 1985-08-27 National Semiconductor Corporation Process for producing CMOS structures with Schottky bipolar transistors
JPS60154681A (ja) * 1984-01-25 1985-08-14 Hitachi Ltd 半導体装置およびその製造方法
US4604790A (en) * 1985-04-01 1986-08-12 Advanced Micro Devices, Inc. Method of fabricating integrated circuit structure having CMOS and bipolar devices
EP0213425B1 (de) * 1985-08-26 1992-05-06 Siemens Aktiengesellschaft Integrierte Schaltung in komplementärer Schaltungstechnik mit einem Substratvorspannungs-Generator und einer Schottky-Diode
JPS6281120A (ja) * 1985-10-03 1987-04-14 Fujitsu Ltd 半導体装置
US4752813A (en) * 1986-08-08 1988-06-21 International Business Machines Corporation Schottky diode and ohmic contact metallurgy
JPH0194659A (ja) * 1987-10-05 1989-04-13 Nec Corp バイポーラ型半導体集積回路装置

Also Published As

Publication number Publication date
KR930015107A (ko) 1993-07-23
EP0545521A3 (en) 1994-08-24
EP0545521B1 (de) 2000-07-19
US5150177A (en) 1992-09-22
DE69231272D1 (de) 2000-08-24
JPH05259438A (ja) 1993-10-08
EP0545521A2 (de) 1993-06-09

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