DE69311005T2 - Elastische Schaumfolie und Aufspannvorrichtung zum Polieren von Waffeln, die diese Folie verwendet - Google Patents

Elastische Schaumfolie und Aufspannvorrichtung zum Polieren von Waffeln, die diese Folie verwendet

Info

Publication number
DE69311005T2
DE69311005T2 DE69311005T DE69311005T DE69311005T2 DE 69311005 T2 DE69311005 T2 DE 69311005T2 DE 69311005 T DE69311005 T DE 69311005T DE 69311005 T DE69311005 T DE 69311005T DE 69311005 T2 DE69311005 T2 DE 69311005T2
Authority
DE
Germany
Prior art keywords
sheet
jig
elastic foam
polishing wafers
foam sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69311005T
Other languages
English (en)
Other versions
DE69311005D1 (de
Inventor
Shigeyoshi Netsu
Kihachiro Watanabe
Makoto Tsukada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69311005D1 publication Critical patent/DE69311005D1/de
Application granted granted Critical
Publication of DE69311005T2 publication Critical patent/DE69311005T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249961—With gradual property change within a component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249975—Void shape specified [e.g., crushed, flat, round, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249978—Voids specified as micro
    • Y10T428/249979—Specified thickness of void-containing component [absolute or relative] or numerical cell dimension
DE69311005T 1992-07-07 1993-03-22 Elastische Schaumfolie und Aufspannvorrichtung zum Polieren von Waffeln, die diese Folie verwendet Expired - Fee Related DE69311005T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20303992A JP3024373B2 (ja) 1992-07-07 1992-07-07 シート状弾性発泡体及びウェーハ研磨加工用治具

Publications (2)

Publication Number Publication Date
DE69311005D1 DE69311005D1 (de) 1997-07-03
DE69311005T2 true DE69311005T2 (de) 1997-10-30

Family

ID=16467337

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69311005T Expired - Fee Related DE69311005T2 (de) 1992-07-07 1993-03-22 Elastische Schaumfolie und Aufspannvorrichtung zum Polieren von Waffeln, die diese Folie verwendet

Country Status (4)

Country Link
US (2) US5409770A (de)
EP (1) EP0578351B1 (de)
JP (1) JP3024373B2 (de)
DE (1) DE69311005T2 (de)

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Publication number Priority date Publication date Assignee Title
JP2586319B2 (ja) * 1993-12-15 1997-02-26 日本電気株式会社 半導体基板の研磨方法
WO1995022836A1 (de) * 1994-02-17 1995-08-24 Siemens Aktiengesellschaft Verfahren zur herstellung eines stapels aus substraten
US5622875A (en) * 1994-05-06 1997-04-22 Kobe Precision, Inc. Method for reclaiming substrate from semiconductor wafers
DE4420024C2 (de) * 1994-06-09 1996-05-30 Heraeus Quarzglas Halbzeug in Form eines Verbundkörpers für ein elektronisches oder opto-elektronisches Halbleiterbauelement
JPH08309657A (ja) * 1995-05-17 1996-11-26 Ebatetsuku:Kk 被研磨物の研磨方法及び研磨装置
TW344695B (en) * 1995-08-24 1998-11-11 Matsushita Electric Ind Co Ltd Method for polishing semiconductor substrate
JP3453977B2 (ja) * 1995-12-28 2003-10-06 信越半導体株式会社 ウェーハの研磨装置
JPH09201765A (ja) * 1996-01-25 1997-08-05 Shin Etsu Handotai Co Ltd バッキングパッドおよび半導体ウエーハの研磨方法
JPH09270401A (ja) * 1996-01-31 1997-10-14 Shin Etsu Handotai Co Ltd 半導体ウェーハの研磨方法
JPH09234667A (ja) * 1996-02-29 1997-09-09 Komatsu Electron Metals Co Ltd 半導体ウェハの研磨方法
JPH10217112A (ja) * 1997-02-06 1998-08-18 Speedfam Co Ltd Ｃｍｐ装置
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
DE69813374T2 (de) * 1997-05-28 2003-10-23 Tokyo Seimitsu Co Ltd Halbleiterscheibe Poliervorrichtung mit Halterring
US6080050A (en) * 1997-12-31 2000-06-27 Applied Materials, Inc. Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
US6020262A (en) * 1998-03-06 2000-02-01 Siemens Aktiengesellschaft Methods and apparatus for chemical mechanical planarization (CMP) of a semiconductor wafer
WO1999048645A1 (en) * 1998-03-23 1999-09-30 Speedfam-Ipec Corporation Backing pad for workpiece carrier
US6142853A (en) * 1998-12-23 2000-11-07 Lucent Technologies, Inc. Method and apparatus for holding laser wafers during a fabrication process to minimize breakage
US6402594B1 (en) * 1999-01-18 2002-06-11 Shin-Etsu Handotai Co., Ltd. Polishing method for wafer and holding plate
JP3925602B2 (ja) * 1999-06-14 2007-06-06 セイコーエプソン株式会社 接着材料の貼着方法及び半導体装置の製造方法
US6383056B1 (en) 1999-12-02 2002-05-07 Yin Ming Wang Plane constructed shaft system used in precision polishing and polishing apparatuses
JP2002066911A (ja) * 2000-08-29 2002-03-05 Disco Abrasive Syst Ltd 弾性吸着パッドに吸着保持された板状物の剥離方法
JP2002100593A (ja) * 2000-09-21 2002-04-05 Nikon Corp 研磨装置、これを用いた半導体デバイスの製造方法及びこの製造方法により製造された半導体デバイス
EP1193031A1 (de) * 2000-09-29 2002-04-03 Infineon Technologies SC300 GmbH & Co. KG Vorrichtung zum Polieren von Scheibenartigen Gegenständen
US6462305B1 (en) * 2001-02-16 2002-10-08 Agere Systems Inc. Method of manufacturing a polishing pad using a beam
JP2002355755A (ja) * 2001-05-31 2002-12-10 Nitto Shinko Kk 被研磨物保持用のバッキング材
JP4909506B2 (ja) * 2004-10-29 2012-04-04 株式会社岡本工作機械製作所 ウエハ保持用バッキング材を備える研磨ヘッド構造
US7220167B2 (en) * 2005-01-11 2007-05-22 Hitachi Global Storage Technologies Netherlands B.V. Gentle chemical mechanical polishing (CMP) liftoff process
JP4598551B2 (ja) * 2005-02-04 2010-12-15 ニッタ・ハース株式会社 被加工物保持材および被加工物保持材の製造方法
CN101704309B (zh) 2005-07-15 2014-12-03 东洋橡胶工业株式会社 层叠片及其制造方法
JP2007030144A (ja) * 2005-07-29 2007-02-08 Nitta Haas Inc 被研磨物保持材
JP4884726B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
TWI400142B (zh) * 2006-07-28 2013-07-01 Toray Industries 相互侵入高分子網目構造體及研磨墊與其製法
KR101177781B1 (ko) * 2006-09-08 2012-08-30 도요 고무 고교 가부시키가이샤 연마 패드의 제조 방법
CN101511537B (zh) 2006-09-08 2011-05-04 东洋橡胶工业株式会社 抛光垫
JP5122107B2 (ja) * 2006-10-08 2013-01-16 ムサシ化成工業株式会社 研磨装置用超強粘着シート
SG177964A1 (en) 2007-01-15 2012-02-28 Toyo Tire & Rubber Co Polishing pad and method for producing the same
US8087975B2 (en) * 2007-04-30 2012-01-03 San Fang Chemical Industry Co., Ltd. Composite sheet for mounting a workpiece and the method for making the same
US20080268223A1 (en) * 2007-04-30 2008-10-30 Chung-Chih Feng Composite sheet for mounting a workpiece and the method for making the same
JP4593643B2 (ja) 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
US20100174384A1 (en) * 2008-09-04 2010-07-08 Iwalk, Inc. Hybrid terrain-adaptive lower-extremity systems
JP5355165B2 (ja) * 2009-03-19 2013-11-27 富士紡ホールディングス株式会社 保持シート
JP5992258B2 (ja) * 2012-08-28 2016-09-14 ニッタ・ハース株式会社 被研磨物保持材
JP5503049B2 (ja) * 2013-04-19 2014-05-28 富士紡ホールディングス株式会社 保持パッド
US20210323116A1 (en) * 2020-04-18 2021-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Offset pore poromeric polishing pad

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL296361A (de) * 1962-08-13 1900-01-01
JPS6114854A (ja) * 1984-06-28 1986-01-23 Toshiba Corp 研磨治具
US4841680A (en) * 1987-08-25 1989-06-27 Rodel, Inc. Inverted cell pad material for grinding, lapping, shaping and polishing
JPH0288229A (ja) * 1988-09-26 1990-03-28 Rodeele Nitta Kk 積層体、並びに該積層体を用いた被研磨部材の保持材及び研磨布
JP2632738B2 (ja) * 1990-04-27 1997-07-23 信越半導体 株式会社 パッキングパッド、および半導体ウェーハの研磨方法

Also Published As

Publication number Publication date
US5409770A (en) 1995-04-25
EP0578351B1 (de) 1997-05-28
JPH0623664A (ja) 1994-02-01
EP0578351A1 (de) 1994-01-12
US5538465A (en) 1996-07-23
DE69311005D1 (de) 1997-07-03
JP3024373B2 (ja) 2000-03-21

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