DE69311353D1 - Sockel für integrierte schaltungen mit mehreren anschlussdrähten - Google Patents

Sockel für integrierte schaltungen mit mehreren anschlussdrähten

Info

Publication number
DE69311353D1
DE69311353D1 DE69311353T DE69311353T DE69311353D1 DE 69311353 D1 DE69311353 D1 DE 69311353D1 DE 69311353 T DE69311353 T DE 69311353T DE 69311353 T DE69311353 T DE 69311353T DE 69311353 D1 DE69311353 D1 DE 69311353D1
Authority
DE
Germany
Prior art keywords
socket
integrated circuits
connecting wires
multiple connecting
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69311353T
Other languages
English (en)
Other versions
DE69311353T2 (de
Inventor
Richard Middlehurst
Michael Knight
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
McKenzie Socket Technology Inc
Original Assignee
McKenzie Socket Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by McKenzie Socket Technology Inc filed Critical McKenzie Socket Technology Inc
Application granted granted Critical
Publication of DE69311353D1 publication Critical patent/DE69311353D1/de
Publication of DE69311353T2 publication Critical patent/DE69311353T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/045—Sockets or component fixtures for RF or HF testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/931—Conductive coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
DE69311353T 1992-09-28 1993-09-21 Sockel für integrierte schaltungen mit mehreren anschlussdrähten Expired - Fee Related DE69311353T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/951,906 US5399104A (en) 1992-09-28 1992-09-28 Socket for multi-lead integrated circuit packages
PCT/US1993/008939 WO1994008364A1 (en) 1992-09-28 1993-09-21 Socket for multi-lead integrated circuit packages

Publications (2)

Publication Number Publication Date
DE69311353D1 true DE69311353D1 (de) 1997-07-10
DE69311353T2 DE69311353T2 (de) 1997-12-18

Family

ID=25492308

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69311353T Expired - Fee Related DE69311353T2 (de) 1992-09-28 1993-09-21 Sockel für integrierte schaltungen mit mehreren anschlussdrähten

Country Status (8)

Country Link
US (2) US5399104A (de)
EP (1) EP0662258B1 (de)
JP (2) JPH08504997A (de)
KR (1) KR100314923B1 (de)
DE (1) DE69311353T2 (de)
HK (1) HK1006609A1 (de)
SG (1) SG69950A1 (de)
WO (1) WO1994008364A1 (de)

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DE4412950C1 (de) * 1994-04-14 1995-03-23 Siemens Ag Steckverbinder für Rückwandverdrahtungen
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US5869961A (en) * 1995-07-31 1999-02-09 Spinner; Howard D. Smart IC-test receptacle having holes adapted for mounting capacitors arranged adjacent to pin positions
US6202853B1 (en) * 1996-01-11 2001-03-20 Autosplice Systems, Inc. Secondary processing for electrical or mechanical components molded to continuous carrier supports
US5899755A (en) * 1996-03-14 1999-05-04 Johnstech International Corporation Integrated circuit test socket with enhanced noise imminity
US5718606A (en) * 1996-10-30 1998-02-17 Component Equipment Company, Inc. Electrical connector between a pair of printed circuit boards
CA2270564C (en) 1997-07-29 2006-03-14 Hybricon Corporation Connectors having improved crosstalk and signal transmission characteristics
US6028497A (en) * 1998-01-28 2000-02-22 Trw Inc. RF pin grid array
US6184460B1 (en) * 1998-02-27 2001-02-06 Berg Technology, Inc. Modular box shield for forming a coaxial header
US6027345A (en) * 1998-03-06 2000-02-22 Hon Hai Precision Ind. Co., Ltd. Matrix-type electrical connector
US6181219B1 (en) * 1998-12-02 2001-01-30 Teradyne, Inc. Printed circuit board and method for fabricating such board
US6498506B1 (en) * 2000-07-26 2002-12-24 Gore Enterprise Holdings, Inc. Spring probe assemblies
US6482038B2 (en) 2001-02-23 2002-11-19 Fci Americas Technology, Inc. Header assembly for mounting to a circuit substrate
US6586826B1 (en) 2001-06-13 2003-07-01 Amkor Technology, Inc. Integrated circuit package having posts for connection to other packages and substrates
US6869292B2 (en) * 2001-07-31 2005-03-22 Fci Americas Technology, Inc. Modular mezzanine connector
US6534854B1 (en) * 2001-11-08 2003-03-18 Conexant Systems, Inc. Pin grid array package with controlled impedance pins
US6780057B2 (en) * 2001-12-21 2004-08-24 Intel Corporation Coaxial dual pin sockets for high speed I/O applications
JP4197234B2 (ja) * 2001-12-28 2008-12-17 三菱電機株式会社 光通信器
US6811410B2 (en) 2002-05-28 2004-11-02 Intel Corporation Integrated circuit socket with capacitors and shunts
US6641411B1 (en) * 2002-07-24 2003-11-04 Maxxan Systems, Inc. Low cost high speed connector
US20040018773A1 (en) * 2002-07-29 2004-01-29 Fci Americas Technology, Inc. Printed circuit board assembly having a BGA connection
JP4242199B2 (ja) * 2003-04-25 2009-03-18 株式会社ヨコオ Ｉｃソケット
JP4689196B2 (ja) * 2003-11-05 2011-05-25 日本発條株式会社 導電性接触子ホルダ、導電性接触子ユニット
US7200509B2 (en) * 2004-05-18 2007-04-03 Circuit Check Vacuum chamber with two-stage longitudinal translation for circuit board testing
US7592796B2 (en) * 2004-05-18 2009-09-22 Circuit Check Plate with an indicator for discerning among pre-identified probe holes in the plate
US7090501B1 (en) 2005-03-22 2006-08-15 3M Innovative Properties Company Connector apparatus
US7226298B1 (en) * 2006-03-29 2007-06-05 Fci Americas Technology, Inc. Electrical connector with segmented housing
JP5379474B2 (ja) * 2006-04-28 2013-12-25 日本発條株式会社 導電性接触子ホルダ
JP2008140560A (ja) * 2006-11-30 2008-06-19 Nidec-Read Corp 多極コネクタ
US7553170B2 (en) * 2006-12-19 2009-06-30 Fci Americas Technology, Inc. Surface mount connectors
US7999192B2 (en) 2007-03-14 2011-08-16 Amphenol Corporation Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards
US7811100B2 (en) * 2007-07-13 2010-10-12 Fci Americas Technology, Inc. Electrical connector system having a continuous ground at the mating interface thereof
US7635278B2 (en) * 2007-08-30 2009-12-22 Fci Americas Technology, Inc. Mezzanine-type electrical connectors
US8147254B2 (en) * 2007-11-15 2012-04-03 Fci Americas Technology Llc Electrical connector mating guide
US8764464B2 (en) * 2008-02-29 2014-07-01 Fci Americas Technology Llc Cross talk reduction for high speed electrical connectors
US8277241B2 (en) * 2008-09-25 2012-10-02 Fci Americas Technology Llc Hermaphroditic electrical connector
US7896698B2 (en) * 2008-10-13 2011-03-01 Tyco Electronics Corporation Connector assembly having multiple contact arrangements
US7867032B2 (en) * 2008-10-13 2011-01-11 Tyco Electronics Corporation Connector assembly having signal and coaxial contacts
US9277649B2 (en) 2009-02-26 2016-03-01 Fci Americas Technology Llc Cross talk reduction for high-speed electrical connectors
US8267721B2 (en) * 2009-10-28 2012-09-18 Fci Americas Technology Llc Electrical connector having ground plates and ground coupling bar
US8616919B2 (en) * 2009-11-13 2013-12-31 Fci Americas Technology Llc Attachment system for electrical connector
US8727808B2 (en) * 2011-07-13 2014-05-20 Tyco Electronics Corporation Electrical connector assembly for interconnecting an electronic module and an electrical component
US8597047B2 (en) * 2011-11-14 2013-12-03 Airborn, Inc. Insulator with air dielectric cavities for electrical connector
CH705740B1 (de) * 2011-11-14 2015-08-14 Huber+Suhner Ag Kabelinterface für Koaxialkabel.
JP2013214376A (ja) * 2012-03-31 2013-10-17 Nidec-Read Corp コネクタ
KR101403048B1 (ko) * 2012-06-26 2014-06-09 주식회사 오킨스전자 고주파 특성을 갖는 반도체 디바이스 테스트소켓
KR102214509B1 (ko) 2014-09-01 2021-02-09 삼성전자 주식회사 반도체 장치용 테스트 소켓 및 그를 포함하는 테스트 장치
CN109411937B (zh) * 2017-08-14 2021-09-21 富顶精密组件（深圳）有限公司 电连接器及其制造方法
TWI650561B (zh) * 2018-04-13 2019-02-11 中國探針股份有限公司 應用於探針基座之絕緣件及其探針基座
CN110726918B (zh) * 2019-09-25 2022-04-05 苏州韬盛电子科技有限公司 阻抗匹配结构的半导体芯片测试同轴插座及其制备方法
JPWO2022145134A1 (de) 2020-12-28 2022-07-07

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US5037332A (en) * 1990-08-07 1991-08-06 Itt Corporation Intermodule electrical coupling
US5076800A (en) * 1991-04-29 1991-12-31 W. L. Gore & Associates, Inc. Shielded impedance-controlled idc connector
US5194020A (en) * 1991-06-17 1993-03-16 W. L. Gore & Associates, Inc. High-density coaxial interconnect system
US5211567A (en) * 1991-07-02 1993-05-18 Cray Research, Inc. Metallized connector block
US5190472A (en) * 1992-03-24 1993-03-02 W. L. Gore & Associates, Inc. Miniaturized high-density coaxial connector system with staggered grouper modules

Also Published As

Publication number Publication date
WO1994008364A1 (en) 1994-04-14
US5527189A (en) 1996-06-18
EP0662258A4 (en) 1995-08-09
EP0662258A1 (de) 1995-07-12
US5399104A (en) 1995-03-21
JP2002000021U (ja) 2002-08-02
EP0662258B1 (de) 1997-06-04
JPH08504997A (ja) 1996-05-28
HK1006609A1 (en) 1999-03-05
DE69311353T2 (de) 1997-12-18
KR100314923B1 (ko) 2002-02-28
KR950704835A (ko) 1995-11-20
SG69950A1 (en) 2000-01-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee