DE69320327T2 - Maskenmuster für die Herstellung von konische Tintenstrahldüsen - Google Patents

Maskenmuster für die Herstellung von konische Tintenstrahldüsen

Info

Publication number
DE69320327T2
DE69320327T2 DE69320327T DE69320327T DE69320327T2 DE 69320327 T2 DE69320327 T2 DE 69320327T2 DE 69320327 T DE69320327 T DE 69320327T DE 69320327 T DE69320327 T DE 69320327T DE 69320327 T2 DE69320327 T2 DE 69320327T2
Authority
DE
Germany
Prior art keywords
manufacture
ink jet
mask pattern
jet nozzles
conical ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69320327T
Other languages
English (en)
Other versions
DE69320327D1 (de
Inventor
Stuart D Asakawa
Paul H Mcclelland
Ellen R Tappon
Richard R Vandepoll
Kenneth E Trueba
Chien-Hua Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE69320327D1 publication Critical patent/DE69320327D1/de
Publication of DE69320327T2 publication Critical patent/DE69320327T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/162—Manufacturing of the nozzle plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
DE69320327T 1993-05-10 1993-12-23 Maskenmuster für die Herstellung von konische Tintenstrahldüsen Expired - Lifetime DE69320327T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/059,686 US5378137A (en) 1993-05-10 1993-05-10 Mask design for forming tapered inkjet nozzles

Publications (2)

Publication Number Publication Date
DE69320327D1 DE69320327D1 (de) 1998-09-17
DE69320327T2 true DE69320327T2 (de) 1999-03-25

Family

ID=22024584

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69320327T Expired - Lifetime DE69320327T2 (de) 1993-05-10 1993-12-23 Maskenmuster für die Herstellung von konische Tintenstrahldüsen

Country Status (4)

Country Link
US (2) US5378137A (de)
EP (1) EP0624471B1 (de)
JP (1) JPH06328699A (de)
DE (1) DE69320327T2 (de)

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US6555449B1 (en) * 1996-05-28 2003-04-29 Trustees Of Columbia University In The City Of New York Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidfication
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US6313435B1 (en) * 1998-11-20 2001-11-06 3M Innovative Properties Company Mask orbiting for laser ablated feature formation
US6120976A (en) * 1998-11-20 2000-09-19 3M Innovative Properties Company Laser ablated feature formation method
US6172329B1 (en) 1998-11-23 2001-01-09 Minnesota Mining And Manufacturing Company Ablated laser feature shape reproduction control
US6592943B2 (en) 1998-12-01 2003-07-15 Fujitsu Limited Stencil and method for depositing solder
JP3675272B2 (ja) * 1999-01-29 2005-07-27 キヤノン株式会社 液体吐出ヘッドおよびその製造方法
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US6080959A (en) * 1999-03-12 2000-06-27 Lexmark International, Inc. System and method for feature compensation of an ablated inkjet nozzle plate
IT1310099B1 (it) * 1999-07-12 2002-02-11 Olivetti Lexikon Spa Testina di stampa monolitica e relativo processo di fabbricazione.
US6130688A (en) * 1999-09-09 2000-10-10 Hewlett-Packard Company High efficiency orifice plate structure and printhead using the same
US6290331B1 (en) 1999-09-09 2001-09-18 Hewlett-Packard Company High efficiency orifice plate structure and printhead using the same
AU781452B2 (en) 1999-09-15 2005-05-26 Aradigm Corporation Pore structures for reduced pressure aerosolization
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US6467878B1 (en) 2000-05-10 2002-10-22 Hewlett-Packard Company System and method for locally controlling the thickness of a flexible nozzle member
IT1320599B1 (it) * 2000-08-23 2003-12-10 Olivetti Lexikon Spa Testina di stampa monolitica con scanalatura autoallineata e relativoprocesso di fabbricazione.
US6588887B2 (en) * 2000-09-01 2003-07-08 Canon Kabushiki Kaisha Liquid discharge head and method for liquid discharge head
EP1259985A2 (de) 2000-10-10 2002-11-27 The Trustees Of Columbia University In The City Of New York Methode und apparat für die bearbeitung von dünnen metallschichten
NL1016735C2 (nl) * 2000-11-29 2002-05-31 Ocu Technologies B V Werkwijze voor het vormen van een nozzle in een orgaan voor een inkjet printkop, een nozzle-orgaan, een inkjet printkop voorzien van dit nozzle-orgaan en een inkjet printer voorzien van een dergelijke printkop.
US6491376B2 (en) 2001-02-22 2002-12-10 Eastman Kodak Company Continuous ink jet printhead with thin membrane nozzle plate
US6951627B2 (en) * 2002-04-26 2005-10-04 Matsushita Electric Industrial Co., Ltd. Method of drilling holes with precision laser micromachining
US6938986B2 (en) 2002-04-30 2005-09-06 Hewlett-Packard Development Company, L.P. Surface characteristic apparatus and method
US6898358B2 (en) 2002-05-31 2005-05-24 Matsushita Electric Industrial Co., Ltd. Adjustable photonic crystal and method of adjusting the index of refraction of photonic crystals to reversibly tune transmissions within the bandgap
US20040021741A1 (en) * 2002-07-30 2004-02-05 Ottenheimer Thomas H. Slotted substrate and method of making
US6666546B1 (en) 2002-07-31 2003-12-23 Hewlett-Packard Development Company, L.P. Slotted substrate and method of making
CN100459041C (zh) 2002-08-19 2009-02-04 纽约市哥伦比亚大学托管会 激光结晶处理薄膜样品以最小化边缘区域的方法和系统
US7718517B2 (en) * 2002-08-19 2010-05-18 Im James S Single-shot semiconductor processing system and method having various irradiation patterns
US20040076376A1 (en) * 2002-10-17 2004-04-22 Pate Michael A. Optical fiber coupler and method of fabrication
US7880117B2 (en) * 2002-12-24 2011-02-01 Panasonic Corporation Method and apparatus of drilling high density submicron cavities using parallel laser beams
WO2004075263A2 (en) * 2003-02-19 2004-09-02 The Trustees Of Columbia University In The City Of New York System and process for processing a plurality of semiconductor thin films which are crystallized using sequential lateral solidification techniques
WO2005029546A2 (en) * 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Method and system for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts, and a mask for facilitating such artifact reduction/elimination
TWI359441B (en) * 2003-09-16 2012-03-01 Univ Columbia Processes and systems for laser crystallization pr
WO2005029547A2 (en) * 2003-09-16 2005-03-31 The Trustees Of Columbia University In The City Of New York Enhancing the width of polycrystalline grains with mask
TWI351713B (en) 2003-09-16 2011-11-01 Univ Columbia Method and system for providing a single-scan, con
KR100561864B1 (ko) * 2004-02-27 2006-03-17 삼성전자주식회사 잉크젯 프린트헤드의 노즐 플레이트 표면에 소수성코팅막을 형성하는 방법
US20050276933A1 (en) * 2004-06-14 2005-12-15 Ravi Prasad Method to form a conductive structure
US20050276911A1 (en) * 2004-06-15 2005-12-15 Qiong Chen Printing of organometallic compounds to form conductive traces
US7709050B2 (en) * 2004-08-02 2010-05-04 Hewlett-Packard Development Company, L.P. Surface treatment for OLED material
US7655275B2 (en) * 2004-08-02 2010-02-02 Hewlett-Packard Delopment Company, L.P. Methods of controlling flow
DE102004053191A1 (de) * 2004-11-04 2006-05-11 Bayer Cropscience Ag 2,6-Diethyl-4-methyl-phenyl substituierte Tetramsäure-Derivate
US7158159B2 (en) * 2004-12-02 2007-01-02 Agilent Technologies, Inc. Micro-machined nozzles
TWI254132B (en) * 2004-12-13 2006-05-01 Benq Corp Device and method of detecting openings
EP1769919B1 (de) * 2005-09-30 2010-11-03 Brother Kogyo Kabushiki Kaisha Verfahren zur Herstellung einer Düsenplatte und Verfahren zur Herstellung eines Flüssigkeitstropfenstrahlgeräts
US7607227B2 (en) * 2006-02-08 2009-10-27 Eastman Kodak Company Method of forming a printhead
US20070182777A1 (en) * 2006-02-08 2007-08-09 Eastman Kodak Company Printhead and method of forming same
US10870175B2 (en) 2013-09-18 2020-12-22 Cytonome/St, Llc Microfluidic flow-through elements and methods of manufacture of same
JP6533644B2 (ja) * 2014-05-02 2019-06-19 株式会社ブイ・テクノロジー ビーム整形マスク、レーザ加工装置及びレーザ加工方法
JP5994952B2 (ja) * 2015-02-03 2016-09-21 大日本印刷株式会社 蒸着マスクの製造方法、蒸着マスク製造装置、レーザー用マスクおよび有機半導体素子の製造方法
KR101582175B1 (ko) * 2015-03-17 2016-01-05 에이피시스템 주식회사 레이저 패터닝을 이용한 섀도우 마스크의 제조 장치 및 레이저 패터닝을 이용한 섀도우 마스크의 제조 방법

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Also Published As

Publication number Publication date
US5417897A (en) 1995-05-23
EP0624471A3 (de) 1995-10-18
US5378137A (en) 1995-01-03
JPH06328699A (ja) 1994-11-29
EP0624471A2 (de) 1994-11-17
EP0624471B1 (de) 1998-08-12
DE69320327D1 (de) 1998-09-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD CO. (N.D.GES.D.STAATES DELAWARE),

8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE