DE69322775D1 - Verfahren zur Inspektion vom Verbindungskugel-Satz eines intergrierten Schaltungsmoduls - Google Patents

Verfahren zur Inspektion vom Verbindungskugel-Satz eines intergrierten Schaltungsmoduls

Info

Publication number
DE69322775D1
DE69322775D1 DE69322775T DE69322775T DE69322775D1 DE 69322775 D1 DE69322775 D1 DE 69322775D1 DE 69322775 T DE69322775 T DE 69322775T DE 69322775 T DE69322775 T DE 69322775T DE 69322775 D1 DE69322775 D1 DE 69322775D1
Authority
DE
Germany
Prior art keywords
integrated circuit
circuit module
connecting ball
inspection procedure
ball set
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69322775T
Other languages
English (en)
Other versions
DE69322775T2 (de
Inventor
Olivier Collet-Beillon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69322775D1 publication Critical patent/DE69322775D1/de
Publication of DE69322775T2 publication Critical patent/DE69322775T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
DE69322775T 1993-08-12 1993-08-12 Verfahren zur Inspektion vom Verbindungskugel-Satz eines intergrierten Schaltungsmoduls Expired - Fee Related DE69322775T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP93480113A EP0638801B1 (de) 1993-08-12 1993-08-12 Verfahren zur Inspektion vom Verbindungskugel-Satz eines intergrierten Schaltungsmoduls

Publications (2)

Publication Number Publication Date
DE69322775D1 true DE69322775D1 (de) 1999-02-04
DE69322775T2 DE69322775T2 (de) 1999-07-22

Family

ID=8214843

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69322775T Expired - Fee Related DE69322775T2 (de) 1993-08-12 1993-08-12 Verfahren zur Inspektion vom Verbindungskugel-Satz eines intergrierten Schaltungsmoduls

Country Status (3)

Country Link
US (1) US5574801A (de)
EP (1) EP0638801B1 (de)
DE (1) DE69322775T2 (de)

Families Citing this family (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6067379A (en) 1988-12-09 2000-05-23 Cognex Corporation Method and apparatus for locating patterns in an optical image
JP3271461B2 (ja) * 1995-02-07 2002-04-02 松下電器産業株式会社 半田ボールの搭載装置および搭載方法
JP3158966B2 (ja) * 1995-06-19 2001-04-23 松下電器産業株式会社 バンプ付電子部品の製造装置および製造方法
US6026176A (en) 1995-07-25 2000-02-15 Cognex Corporation Machine vision methods and articles of manufacture for ball grid array inspection
US5872870A (en) 1996-02-16 1999-02-16 Cognex Corporation Machine vision methods for identifying extrema of objects in rotated reference frames
US6115491A (en) * 1996-02-27 2000-09-05 Cyberoptics Corporation Apparatus and method for estimating background tilt and offset
US5909504A (en) 1996-03-15 1999-06-01 Cognex Corporation Method of testing a machine vision inspection system
US6259827B1 (en) 1996-03-21 2001-07-10 Cognex Corporation Machine vision methods for enhancing the contrast between an object and its background using multiple on-axis images
US6298149B1 (en) 1996-03-21 2001-10-02 Cognex Corporation Semiconductor device image inspection with contrast enhancement
US5978502A (en) 1996-04-01 1999-11-02 Cognex Corporation Machine vision methods for determining characteristics of three-dimensional objects
US6137893A (en) 1996-10-07 2000-10-24 Cognex Corporation Machine vision calibration targets and methods of determining their location and orientation in an image
US5960125A (en) 1996-11-21 1999-09-28 Cognex Corporation Nonfeedback-based machine vision method for determining a calibration relationship between a camera and a moveable object
JP3551667B2 (ja) * 1996-12-04 2004-08-11 株式会社日立製作所 はんだバンプの高さ測定方法
US5953130A (en) 1997-01-06 1999-09-14 Cognex Corporation Machine vision methods and apparatus for machine vision illumination of an object
US6412685B2 (en) 1997-01-28 2002-07-02 Galahad, Co. Method and apparatus for release and optional inspection for conductive preforms placement apparatus
US6230963B1 (en) 1997-01-28 2001-05-15 Eric L. Hertz Method and apparatus using colored foils for placing conductive preforms
US6202918B1 (en) 1997-01-28 2001-03-20 Eric Hertz Method and apparatus for placing conductive preforms
US6427903B1 (en) 1997-02-06 2002-08-06 Speedline Technologies, Inc. Solder ball placement apparatus
US6641030B1 (en) 1997-02-06 2003-11-04 Speedline Technologies, Inc. Method and apparatus for placing solder balls on a substrate
US6056190A (en) * 1997-02-06 2000-05-02 Speedline Technologies, Inc. Solder ball placement apparatus
US6236747B1 (en) 1997-02-26 2001-05-22 Acuity Imaging, Llc System and method for image subtraction for ball and bumped grid array inspection
US6201892B1 (en) 1997-02-26 2001-03-13 Acuity Imaging, Llc System and method for arithmetic operations for electronic package inspection
US5943125A (en) * 1997-02-26 1999-08-24 Acuity Imaging, Llc Ring illumination apparatus for illuminating reflective elements on a generally planar surface
US6118524A (en) * 1997-02-26 2000-09-12 Acuity Imaging, Llc Arc illumination apparatus and method
US5926557A (en) * 1997-02-26 1999-07-20 Acuity Imaging, Llc Inspection method
US5828449A (en) * 1997-02-26 1998-10-27 Acuity Imaging, Llc Ring illumination reflective elements on a generally planar surface
KR100333222B1 (ko) * 1997-03-05 2002-04-25 칼 하인쯔 호르닝어 연결 볼들의 존재를 검사하기 위한 방법
US6075881A (en) 1997-03-18 2000-06-13 Cognex Corporation Machine vision methods for identifying collinear sets of points from an image
US5974169A (en) 1997-03-20 1999-10-26 Cognex Corporation Machine vision methods for determining characteristics of an object using boundary points and bounding regions
US6055054A (en) * 1997-05-05 2000-04-25 Beaty; Elwin M. Three dimensional inspection system
US6141033A (en) 1997-05-15 2000-10-31 Cognex Corporation Bandwidth reduction of multichannel images for machine vision
US6608647B1 (en) 1997-06-24 2003-08-19 Cognex Corporation Methods and apparatus for charge coupled device image acquisition with independent integration and readout
US5956134A (en) * 1997-07-11 1999-09-21 Semiconductor Technologies & Instruments, Inc. Inspection system and method for leads of semiconductor devices
US6130959A (en) * 1997-07-16 2000-10-10 Cognex Corporation Analyzing an image of an arrangement of discrete objects
US6118893A (en) 1997-07-16 2000-09-12 Cognex Corporation Analysis of an image of a pattern of discrete objects
US5978080A (en) 1997-09-25 1999-11-02 Cognex Corporation Machine vision methods using feedback to determine an orientation, pixel width and pixel height of a field of view
US6151406A (en) 1997-10-09 2000-11-21 Cognex Corporation Method and apparatus for locating ball grid array packages from two-dimensional image data
US6025854A (en) 1997-12-31 2000-02-15 Cognex Corporation Method and apparatus for high speed image acquisition
US6055328A (en) * 1998-01-16 2000-04-25 Cognex Corporation Analyzing an acquired arrangement of object locations
US6915006B2 (en) * 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
US6067376A (en) * 1998-01-16 2000-05-23 Cognex Corporation Classifying pixels of an image
US6915007B2 (en) 1998-01-16 2005-07-05 Elwin M. Beaty Method and apparatus for three dimensional inspection of electronic components
US6072898A (en) * 1998-01-16 2000-06-06 Beaty; Elwin M. Method and apparatus for three dimensional inspection of electronic components
US6282328B1 (en) 1998-01-28 2001-08-28 Cognex Corporation Machine vision systems and methods for morphological transformation of an image with non-uniform offsets
US6236769B1 (en) 1998-01-28 2001-05-22 Cognex Corporation Machine vision systems and methods for morphological transformation of an image with zero or other uniform offsets
US6381375B1 (en) 1998-02-20 2002-04-30 Cognex Corporation Methods and apparatus for generating a projection of an image
US6215915B1 (en) 1998-02-20 2001-04-10 Cognex Corporation Image processing methods and apparatus for separable, general affine transformation of an image
JP3405175B2 (ja) * 1998-03-10 2003-05-12 松下電器産業株式会社 導電ボールの実装装置および実装方法
US7740371B1 (en) 1998-03-19 2010-06-22 Charles A. Lemaire Method and apparatus for pulsed L.E.D. illumination for a camera
US6095661A (en) 1998-03-19 2000-08-01 Ppt Vision, Inc. Method and apparatus for an L.E.D. flashlight
US7353954B1 (en) 1998-07-08 2008-04-08 Charles A. Lemaire Tray flipper and method for parts inspection
WO2000003198A1 (en) 1998-07-08 2000-01-20 Ppt Vision, Inc. Machine vision and semiconductor handling
US6956963B2 (en) 1998-07-08 2005-10-18 Ismeca Europe Semiconductor Sa Imaging for a machine-vision system
US6518997B1 (en) * 1998-08-05 2003-02-11 National Semiconductor Corporation Grid array inspection system and method
US6595408B1 (en) * 1998-10-07 2003-07-22 Micron Technology, Inc. Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement
US6268275B1 (en) 1998-10-08 2001-07-31 Micron Technology, Inc. Method of locating conductive spheres utilizing screen and hopper of solder balls
JP2000121338A (ja) * 1998-10-13 2000-04-28 Yamagata Casio Co Ltd 電子部品検査装置
US6177682B1 (en) * 1998-10-21 2001-01-23 Novacam Tyechnologies Inc. Inspection of ball grid arrays (BGA) by using shadow images of the solder balls
JP3932500B2 (ja) * 1998-11-25 2007-06-20 澁谷工業株式会社 マウント検査装置
GB2344550A (en) 1998-12-09 2000-06-14 Ibm Pad design for electronic package
US6381366B1 (en) 1998-12-18 2002-04-30 Cognex Corporation Machine vision methods and system for boundary point-based comparison of patterns and images
US6687402B1 (en) 1998-12-18 2004-02-03 Cognex Corporation Machine vision methods and systems for boundary feature comparison of patterns and images
US6671397B1 (en) 1998-12-23 2003-12-30 M.V. Research Limited Measurement system having a camera with a lens and a separate sensor
IE991080A1 (en) * 1998-12-23 2000-07-26 M V Res Ltd A measurement system
US6360935B1 (en) * 1999-01-26 2002-03-26 Board Of Regents Of The University Of Texas System Apparatus and method for assessing solderability
ATE282815T1 (de) * 1999-04-13 2004-12-15 Icos Vision Systems Nv Messung der lagen oder koplanarität von kontaktelementen eines elektronischen bauteils mit flacher beleuchtung und zwei kameras
US6788411B1 (en) 1999-07-08 2004-09-07 Ppt Vision, Inc. Method and apparatus for adjusting illumination angle
US6707545B1 (en) 1999-09-07 2004-03-16 Applied Materials, Inc. Optical signal routing method and apparatus providing multiple inspection collection points on semiconductor manufacturing systems
US6693708B1 (en) 1999-09-07 2004-02-17 Applied Materials, Inc. Method and apparatus for substrate surface inspection using spectral profiling techniques
US6707544B1 (en) 1999-09-07 2004-03-16 Applied Materials, Inc. Particle detection and embedded vision system to enhance substrate yield and throughput
US7012684B1 (en) 1999-09-07 2006-03-14 Applied Materials, Inc. Method and apparatus to provide for automated process verification and hierarchical substrate examination
US6630995B1 (en) 1999-09-07 2003-10-07 Applied Materials, Inc. Method and apparatus for embedded substrate and system status monitoring
US6813032B1 (en) 1999-09-07 2004-11-02 Applied Materials, Inc. Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques
US6721045B1 (en) 1999-09-07 2004-04-13 Applied Materials, Inc. Method and apparatus to provide embedded substrate process monitoring through consolidation of multiple process inspection techniques
US6684402B1 (en) 1999-12-01 2004-01-27 Cognex Technology And Investment Corporation Control methods and apparatus for coupling multiple image acquisition devices to a digital data processor
US6525331B1 (en) 1999-12-01 2003-02-25 Nanyang Technological University Ball grid array (BGA) package on-line non-contact inspection method and system
US6748104B1 (en) 2000-03-24 2004-06-08 Cognex Corporation Methods and apparatus for machine vision inspection using single and multiple templates or patterns
US6853751B1 (en) * 2000-03-31 2005-02-08 Cognex Technology And Investment Corporation Location of generally rectangular shaped objects in an image
US6501554B1 (en) 2000-06-20 2002-12-31 Ppt Vision, Inc. 3D scanner and method for measuring heights and angles of manufactured parts
US6486963B1 (en) 2000-06-20 2002-11-26 Ppt Vision, Inc. Precision 3D scanner base and method for measuring manufactured parts
US6509559B1 (en) 2000-06-20 2003-01-21 Ppt Vision, Inc. Binary optical grating and method for generating a moire pattern for 3D imaging
SE518642C2 (sv) * 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för att förse ett substrat med visköst medium, anordning för korrigering av applikationsfel samt användningen av utskjutnings- organ för korrigering av appliceringsfel
SE518640C2 (sv) * 2000-07-11 2002-11-05 Mydata Automation Ab Förfarande, anordning för applicering av ett visköst medium på ett substrat, anordning för applicering av ytterligare visköst medium samt användningen av screentryckning
EP1220596A1 (de) 2000-12-29 2002-07-03 Icos Vision Systems N.V. Verfahren und Einrichtung zur Lageerfassung der Anschlusskontakte elektronischer Bauelemente
US6547409B2 (en) * 2001-01-12 2003-04-15 Electroglas, Inc. Method and apparatus for illuminating projecting features on the surface of a semiconductor wafer
US20020196336A1 (en) 2001-06-19 2002-12-26 Applied Materials, Inc. Method and apparatus for substrate imaging
KR101059825B1 (ko) * 2002-07-25 2011-08-29 파나소닉 주식회사 기판에 인쇄되는 크림 솔더 검사용 장치 및 방법
JP2004170329A (ja) * 2002-11-22 2004-06-17 Nippon Steel Corp バンプ電極およびバンプ電極用ボール検査方法
WO2004055531A1 (ja) * 2002-11-28 2004-07-01 Advantest Corporation 位置検出装置、位置検出方法、及び電子部品搬送装置
US7742071B2 (en) * 2003-01-23 2010-06-22 Oracle America, Inc. Methods and apparatus for inspecting centerplane connectors
WO2004088399A1 (en) * 2003-03-31 2004-10-14 Hits Co., Ltd. Lcd cell edge inspection apparatus and method thereof
AU2003264916A1 (en) * 2003-09-05 2005-03-29 Semiconductor Technologies And Instruments Pte Ltd. Ball grid array inspection system and method
JP3828532B2 (ja) * 2003-10-29 2006-10-04 Ｔｄｋ株式会社 検査装置および検査方法
US8111904B2 (en) 2005-10-07 2012-02-07 Cognex Technology And Investment Corp. Methods and apparatus for practical 3D vision system
US7848848B2 (en) * 2006-04-28 2010-12-07 Freeslate, Inc. Robotic station for capturing both image and weight of a sample
CN101443649A (zh) * 2006-05-15 2009-05-27 株式会社尼康 表面检查装置
SG138491A1 (en) * 2006-06-21 2008-01-28 Generic Power Pte Ltd Method and apparatus for 3-dimensional vision and inspection of ball and like protrusions of electronic components
US8162584B2 (en) 2006-08-23 2012-04-24 Cognex Corporation Method and apparatus for semiconductor wafer alignment
WO2009123808A2 (en) * 2008-04-04 2009-10-08 Research Triangle Institute A solder bump bondig method, stencil. and system
TWI500317B (zh) * 2011-07-15 2015-09-11 Primax Electronics Ltd 決定攝像模組之植球數量之方法
US20130278750A1 (en) * 2012-04-23 2013-10-24 Metrospec Technology, L.L.C. Self-learning machine vision system
US9704232B2 (en) 2014-03-18 2017-07-11 Arizona Board of Regents of behalf of Arizona State University Stereo vision measurement system and method
CN112834528A (zh) * 2021-01-06 2021-05-25 深圳格兰达智能装备股份有限公司 3d缺陷检测系统及方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3721825A (en) * 1970-12-03 1973-03-20 J Rasmussen Method and apparatus for analysis of liquid residues using nuclear reactions
US4296474A (en) * 1977-09-06 1981-10-20 Deere & Company Inspection system and apparatus therefor
JPS61293657A (ja) * 1985-06-21 1986-12-24 Matsushita Electric Works Ltd 半田付け外観検査方法
US4688939A (en) * 1985-12-27 1987-08-25 At&T Technologies, Inc. Method and apparatus for inspecting articles
US5058178A (en) * 1989-12-21 1991-10-15 At&T Bell Laboratories Method and apparatus for inspection of specular, three-dimensional features
JP2691789B2 (ja) * 1990-03-08 1997-12-17 三菱電機株式会社 はんだ印刷検査装置
US5137362A (en) * 1990-03-26 1992-08-11 Motorola, Inc. Automatic package inspection method
JPH0786466B2 (ja) * 1990-07-18 1995-09-20 大日本スクリーン製造株式会社 プリント基板のパターン検査装置
EP0471196A3 (en) * 1990-08-13 1994-09-07 Siemens Ag Image analysis method
JPH04105341A (ja) * 1990-08-24 1992-04-07 Hitachi Ltd 半導体装置のリード曲がり、浮き検出方法及び検出装置
US5108024A (en) * 1991-06-03 1992-04-28 Motorola, Inc. Method of inspecting solder joints
JP2981941B2 (ja) * 1991-12-02 1999-11-22 株式会社新川 ボンデイングワイヤ検査装置
US5376790A (en) * 1992-03-13 1994-12-27 Park Scientific Instruments Scanning probe microscope
US5368217A (en) * 1993-08-25 1994-11-29 Microelectronics And Computer Technology Corporation High force compression flip chip bonding method and system

Also Published As

Publication number Publication date
EP0638801B1 (de) 1998-12-23
US5574801A (en) 1996-11-12
DE69322775T2 (de) 1999-07-22
EP0638801A1 (de) 1995-02-15

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