DE69421699D1 - Kohlenstoffzusammensetzungen und verfahren zur vorbereitung nichtleitender substrate zum elektrochemischen beschichten - Google Patents

Kohlenstoffzusammensetzungen und verfahren zur vorbereitung nichtleitender substrate zum elektrochemischen beschichten

Info

Publication number
DE69421699D1
DE69421699D1 DE69421699T DE69421699T DE69421699D1 DE 69421699 D1 DE69421699 D1 DE 69421699D1 DE 69421699 T DE69421699 T DE 69421699T DE 69421699 T DE69421699 T DE 69421699T DE 69421699 D1 DE69421699 D1 DE 69421699D1
Authority
DE
Germany
Prior art keywords
conductive substrates
preparing non
electrochemical coating
carbon compositions
compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69421699T
Other languages
English (en)
Other versions
DE69421699T2 (de
Inventor
Charles Edwin Thorn
Frank Polakovic
Charles A Mosolf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
Electrochemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/062,943 external-priority patent/US5389270A/en
Application filed by Electrochemicals Inc filed Critical Electrochemicals Inc
Application granted granted Critical
Publication of DE69421699D1 publication Critical patent/DE69421699D1/de
Publication of DE69421699T2 publication Critical patent/DE69421699T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/423Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/032Materials
    • H05K2201/0323Carbon
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12Using specific substances
    • H05K2203/122Organic non-polymeric compounds, e.g. oil, wax, thiol
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/425Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
DE69421699T 1993-05-17 1994-05-12 Kohlenstoffzusammensetzungen und verfahren zur vorbereitung nichtleitender substrate zum elektrochemischen beschichten Expired - Lifetime DE69421699T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/062,943 US5389270A (en) 1993-05-17 1993-05-17 Composition and process for preparing a non-conductive substrate for electroplating
US08/232,574 US5476580A (en) 1993-05-17 1994-05-03 Processes for preparing a non-conductive substrate for electroplating
PCT/US1994/005267 WO1994026958A1 (en) 1993-05-17 1994-05-12 Carbon compositions and processes for preparing a non-conductive substrate for electroplating

Publications (2)

Publication Number Publication Date
DE69421699D1 true DE69421699D1 (de) 1999-12-23
DE69421699T2 DE69421699T2 (de) 2000-07-06

Family

ID=26742894

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69421699T Expired - Lifetime DE69421699T2 (de) 1993-05-17 1994-05-12 Kohlenstoffzusammensetzungen und verfahren zur vorbereitung nichtleitender substrate zum elektrochemischen beschichten

Country Status (11)

Country Link
US (1) US5476580A (de)
EP (1) EP0698132B1 (de)
JP (1) JP3335176B2 (de)
AU (1) AU6831794A (de)
CA (1) CA2162905A1 (de)
DE (1) DE69421699T2 (de)
FI (1) FI955542A (de)
HK (1) HK1005414A1 (de)
NO (1) NO954637L (de)
PL (1) PL311705A1 (de)
WO (1) WO1994026958A1 (de)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7168084B1 (en) 1992-12-09 2007-01-23 Sedna Patent Services, Llc Method and apparatus for targeting virtual objects
TW222313B (en) * 1993-01-29 1994-04-11 Mekku Kk Electroplating method
US6171468B1 (en) * 1993-05-17 2001-01-09 Electrochemicals Inc. Direct metallization process
US6303181B1 (en) 1993-05-17 2001-10-16 Electrochemicals Inc. Direct metallization process employing a cationic conditioner and a binder
US6710259B2 (en) 1993-05-17 2004-03-23 Electrochemicals, Inc. Printed wiring boards and methods for making them
US5690805A (en) 1993-05-17 1997-11-25 Electrochemicals Inc. Direct metallization process
JPH07268682A (ja) * 1994-03-28 1995-10-17 Mec Kk 非導電体表面に電気メッキする方法
US5536386A (en) * 1995-02-10 1996-07-16 Macdermid, Incorporated Process for preparing a non-conductive substrate for electroplating
US5611905A (en) * 1995-06-09 1997-03-18 Shipley Company, L.L.C. Electroplating process
US5618400A (en) * 1995-09-19 1997-04-08 Shipley Company, L.L.C. Electroplating process
US6231619B1 (en) * 1995-12-11 2001-05-15 Shipley Company, L.L.C. Electroplating process
WO1997027142A1 (en) * 1996-01-29 1997-07-31 Electrochemicals Inc. Ultrasonic mixing of through hole treating compositions
US5800739A (en) * 1996-04-11 1998-09-01 Shipley Company, L.L.C. Stabilized dispersions of graphite particles
DE19731186C2 (de) * 1997-07-10 2000-08-03 Atotech Deutschland Gmbh Feststofffreie Vorbehandlungslösung für elektrisch nichtleitende Oberflächen sowie Verfahren zur Herstellung der Lösung und deren Verwendung
US6440331B1 (en) 1999-06-03 2002-08-27 Electrochemicals Inc. Aqueous carbon composition and method for coating a non conductive substrate
US6524758B2 (en) 1999-12-20 2003-02-25 Electrox Corporation Method of manufacture of printed wiring boards and flexible circuitry
US6375731B1 (en) * 2000-01-06 2002-04-23 Electrochemicals Inc. Conditioning of through holes and glass
US6623787B2 (en) 2001-07-26 2003-09-23 Electrochemicals Inc. Method to improve the stability of dispersions of carbon
AU2002364240A1 (en) * 2002-06-28 2004-01-19 Foamex L.P. Gas diffusion layer for fuel cells
KR100487860B1 (ko) * 2002-08-09 2005-05-03 (주)호설암물산 도금 방법
US7029529B2 (en) 2002-09-19 2006-04-18 Applied Materials, Inc. Method and apparatus for metallization of large area substrates
US20040191605A1 (en) * 2002-12-27 2004-09-30 Foamex L.P. Gas diffusion layer containing inherently conductive polymer for fuel cells
DE10315186A1 (de) * 2003-04-03 2004-10-21 Degussa Ag Verfahren zur anodischen Alkoxylierung von organischen Verbindungen
US20050130023A1 (en) * 2003-05-09 2005-06-16 Lebowitz Jeffrey I. Gas diffusion layer having carbon particle mixture
JP4253280B2 (ja) * 2003-12-05 2009-04-08 三井金属鉱業株式会社 プリント配線基板の製造方法
US7211204B2 (en) * 2003-12-12 2007-05-01 Electrochemicals, Inc. Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (MEA)
FR2866329B1 (fr) * 2004-02-12 2006-06-02 Saint Gobain Vetrotex Fils de verre conducteurs de l'electricite et structures comprenant de tels fils.
US7128820B2 (en) * 2004-03-11 2006-10-31 Hyunjung Lee Process for preparing a non-conductive substrate for electroplating
EP1577372A1 (de) * 2004-03-19 2005-09-21 Sika Technology AG Stabile wässrige Dispersion von Partikeln sowie Verwendung und Herstellungsverfahren solcher Dispersionen
DE102005043542A1 (de) * 2005-09-13 2007-03-15 Graphit Kropfmühl AG Stabile wässrige Graphitdispersion mit hohem Feststoffgehalt
CN101394712B (zh) * 2007-09-21 2010-08-25 清华大学 黑孔化溶液及其制备方法
JP5575669B2 (ja) * 2008-03-13 2014-08-20 ビーエーエスエフ ソシエタス・ヨーロピア 基板上に金属層を形成するための方法及び分散液、並びに金属化可能な熱可塑性成形用化合物
EP3865454A3 (de) * 2009-05-26 2021-11-24 Belenos Clean Power Holding AG Stabile dispersionen von ein- und mehrfachen graphenschichten in lösung
US8974869B2 (en) * 2010-01-26 2015-03-10 Robert Hamilton Method for improving plating on non-conductive substrates
US20140339092A1 (en) 2011-12-02 2014-11-20 Byk-Chemie Gmbh Method for producing electrically conductive structures on non-conductive substrates and structures made in this matter
US10920321B2 (en) 2014-05-30 2021-02-16 Uab Rekin International Chrome-free adhesion pre-treatment for plastics
SE545567C2 (en) * 2018-04-19 2023-10-24 Provexa Ab Method for surface treatment
US10986738B2 (en) * 2018-05-08 2021-04-20 Macdermid Enthone Inc. Carbon-based direct plating process
CN111382487A (zh) * 2018-12-28 2020-07-07 健鼎(湖北)电子有限公司 一种提高电路板镀层厚度精确度的方法
CN111647901B (zh) * 2020-05-15 2023-08-25 湖北省哈福生物化学有限公司 一种黑孔液及其制备方法和使用方法
CN112105173B (zh) * 2020-09-21 2022-01-18 广东硕成科技有限公司 一种用于软板孔金属化的碳纳米组合物及其制备方法

Family Cites Families (109)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US409096A (en) * 1889-08-13 Water-proof and fire-proof material for roofing
US1037469A (en) * 1911-08-02 1912-09-03 Hyman Eli Goldberg Process of metallizing electrotype-molds.
GB493485A (en) * 1937-01-13 1938-10-10 Langbein Pfanhauser Werke Ag Process for the electrolytic production of metal coatings on objects with a non-conducting surface
US2176879A (en) * 1937-11-20 1939-10-24 Acheson Colloids Corp Method of disintegrating, dispersing and stabilizing graphite and product
US2692857A (en) * 1951-01-19 1954-10-26 Josef M Michel Noncorrosive graphite emulsions
US2833736A (en) * 1953-07-20 1958-05-06 Western Union Telegraph Co Aqueous graphite-polyvinyl alcohol ink composition
US2897409A (en) * 1954-10-06 1959-07-28 Sprague Electric Co Plating process
US3163588A (en) * 1955-02-14 1964-12-29 Technograph Printed Electronic Method of interconnecting pathway patterns of printed circuit products
US2983220A (en) * 1955-03-16 1961-05-09 Timefax Corp Electro-sensitive planographic printing plate
US2978428A (en) * 1957-08-01 1961-04-04 Surface Chemical Dev Corp Aqueous suspensions of colloidal graphite and their preparation
US3099608A (en) * 1959-12-30 1963-07-30 Ibm Method of electroplating on a dielectric base
US3152996A (en) * 1960-07-13 1964-10-13 Ashland Oil Inc Preparation of carbon black slurries
US3249559A (en) * 1963-08-26 1966-05-03 Gallas William Conductive coating
NL145095B (nl) * 1965-06-15 1975-02-17 Acheson Ind Inc Werkwijze voor het bereiden van een preparaat voor het vormen van een elektrisch geleidende bekledingslaag, alsmede werkwijze voor het vormen van deze elektrisch geleidende bekledingslaag op drageroppervlakken en voorwerp met aan het oppervlak een dergelijke bekledingslaag.
US3509088A (en) * 1965-10-22 1970-04-28 Harold R Dalton Carbon black dispersions,their preparation and film products therewith
US3506482A (en) * 1967-04-25 1970-04-14 Matsushita Electric Ind Co Ltd Method of making printed circuits
US3495962A (en) * 1967-06-14 1970-02-17 Exxon Research Engineering Co Method of utilizing graphite-containing oil-in-water lubricants for glass molding
DE1704766C3 (de) * 1967-09-04 1975-02-06 Hoechst Ag, 6000 Frankfurt Polyesterfolie hoher Festigkeit mit geringem elektrischen Oberflächenwiderstand
US3578577A (en) * 1967-10-11 1971-05-11 Scm Corp Surfacer treating process for blemished electrocoat substrates
US3515201A (en) * 1967-11-14 1970-06-02 Amsted Ind Inc Method of casting
BE734845A (de) * 1968-06-22 1969-12-01
FR95881E (fr) 1968-07-10 1971-11-12 Acheson Ind Inc Procédé de production de revetements électriquement conducteurs, nouvelles compositions et nouveaux produits ainsi obtenus.
US3565658A (en) * 1968-07-19 1971-02-23 Phillips Petroleum Co Carbon black dispersing agent
US3639121A (en) * 1969-03-03 1972-02-01 Eastman Kodak Co Novel conducting lacquers for electrophotographic elements
GB1296855A (de) * 1969-04-18 1972-11-22
US4035265A (en) * 1969-04-18 1977-07-12 The Research Association Of British, Paint, Colour & Varnish Manufacturers Paint compositions
US3655530A (en) * 1970-06-15 1972-04-11 Mead Corp Fabrication of orifices
US3764280A (en) * 1970-11-02 1973-10-09 Gen Electric Electroconductive coatings on non conductive substrates
US3725214A (en) * 1971-02-19 1973-04-03 Du Pont Chromium plating medium for a portable plating device
US3852131A (en) * 1972-05-17 1974-12-03 Gen Electric Method of manufacturing x-ray image intensifier input phosphor screen
US3843529A (en) * 1972-08-10 1974-10-22 Dow Corning Metal working lubricant compositions
US3818412A (en) * 1973-01-10 1974-06-18 Owens Corning Fiberglass Corp Electric conductor and method
US3870987A (en) * 1973-05-29 1975-03-11 Acheson Ind Inc Ignition cable
US3865699A (en) * 1973-10-23 1975-02-11 Int Nickel Co Electrodeposition on non-conductive surfaces
US3874862A (en) * 1973-12-13 1975-04-01 Ball Brothers Res Corp Mold release composition for molten glass and method of application
US3991397A (en) * 1974-02-06 1976-11-09 Owens-Corning Fiberglas Corporation Ignition cable
GB1506464A (en) 1974-05-29 1978-04-05 Degussa Aqueous carbon black preparation
US3966581A (en) * 1974-10-16 1976-06-29 Auric Corporation Selective plating apparatus
CS182408B1 (en) 1974-12-09 1978-04-28 Bedrich Cihak Conductive sealing agents and paints
US4104178A (en) * 1975-10-24 1978-08-01 Wyman-Gordon Company Water-based forging lubricant
US3983042A (en) * 1975-10-24 1976-09-28 Wyman-Gordon Company Water-based forging lubricant
SU571435A2 (ru) 1976-04-23 1977-09-05 Предприятие П/Я Р-6579 Способ получени коллоидного графита
SU674981A1 (ru) 1977-02-09 1979-07-25 Предприятие П/Я А-1837 Способ получени коллоиднографитового препарата дл покрытий
US4090984A (en) * 1977-02-28 1978-05-23 Owens-Corning Fiberglas Corporation Semi-conductive coating for glass fibers
US4213870A (en) * 1977-07-29 1980-07-22 Loran T J Cleaning and lubricating compositions and method of using the same
JPS5469768A (en) * 1977-11-14 1979-06-05 Nitto Electric Ind Co Printing circuit substrate with resistance
SU745964A1 (ru) 1977-12-07 1980-07-07 Ленинградский Ордена Трудового Красного Знамени Технологический Институт Им. Ленсовета Суспензи дл электрофоретического осаждени графитосодержащих покрытий
US4321295A (en) * 1977-12-23 1982-03-23 Ramu International Modified graphite and process for using same
SU768793A1 (ru) 1978-02-14 1980-10-07 Всесоюзный Научно-Исследовательский Институт Технического Углерода Способ получени водной дисперсии сажи
US4239794A (en) * 1978-08-04 1980-12-16 Ludlow Corporation Process of dispersing electro-conductive carbon black and web product made thereby
US4239818A (en) * 1978-11-01 1980-12-16 Labate Michael D Process and material for treating steel walls and fans in electrical precipitation installations with micron colloidal graphite particles
US4187334A (en) * 1978-11-01 1980-02-05 Labate Michael D Process and material for treating steel walls and fans in electrical precipitation installations with micron colloidal graphite particles
US4254180A (en) * 1979-01-02 1981-03-03 Medical Evaluation Devices & Instruments Corp. Thrombo-resistant non-thrombogenic objects formed from resin-graphite mixtures
SU943333A1 (ru) 1979-03-19 1982-07-15 1-Й Ленинградский Ордена Трудового Красного Знамени Медицинский Институт Им.Академика И.П.Павлова Способ получени полимерного покрыти
US4205974A (en) * 1979-05-09 1980-06-03 Ppg Industries, Inc. Glass welding using aqueous colloidal graphite with improved wetting properties
US4316831A (en) * 1979-06-18 1982-02-23 Labate M D Material for treating coke oven doors and jambs to prevent the build up of tar thereon
US4278511A (en) * 1980-02-28 1981-07-14 General Dynamics, Pomona Division Plug plating
JPS58500408A (ja) * 1981-03-03 1983-03-17 アロス・ハイドラウリフ・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツンク ペ−スト状ダンピング媒体それを製造および使用する方法
US4424930A (en) * 1981-06-29 1984-01-10 Cooper Industries, Inc. Carbon-based soldering and de-soldering tip and method of manufacturing same
JPS5932915B2 (ja) * 1981-07-25 1984-08-11 「弐」夫 甲斐 スル−ホ−ルを有する配線基板製造方法
US4401579A (en) * 1981-09-03 1983-08-30 Acheson Industries, Inc. Water-based metal forming lubricant composition and process
JPS58132058A (ja) 1982-01-30 1983-08-06 Daikin Ind Ltd 導電性塗料組成物の調製方法
US4430166A (en) * 1982-09-27 1984-02-07 Inland Steel Company Method and apparatus for electro-treating a metal strip
FR2535344A1 (fr) * 1982-10-29 1984-05-04 Thomson Csf Procede de depot selectif d'une couche de metal refractaire sur une piece en graphite
US4465565A (en) * 1983-03-28 1984-08-14 Ford Aerospace & Communications Corporation CdTe passivation of HgCdTe by electrochemical deposition
US4683036A (en) * 1983-06-10 1987-07-28 Kollmorgen Technologies Corporation Method for electroplating non-metallic surfaces
US4617579A (en) * 1984-04-05 1986-10-14 International Business Machines Corporation Hydrophilic protective coatings for electroerosion printing
US4581301A (en) * 1984-04-10 1986-04-08 Michaelson Henry W Additive adhesive based process for the manufacture of printed circuit boards
DE3507927A1 (de) * 1985-03-06 1986-09-11 Dr.Ing.H.C. F. Porsche Ag, 7000 Stuttgart Verfahren und handgeraet zum halbmechanischen verzinken von blechoberflaechen
US4619741A (en) * 1985-04-11 1986-10-28 Olin Hunt Specialty Products Inc. Process for preparing a non-conductive substrate for electroplating
US4964948A (en) * 1985-04-16 1990-10-23 Protocad, Inc. Printed circuit board through hole technique
US4911796A (en) * 1985-04-16 1990-03-27 Protocad, Inc. Plated through-holes in a printed circuit board
US4631117A (en) * 1985-05-06 1986-12-23 Olin Hunt Specialty Products Inc. Electroless plating process
US4629537A (en) * 1985-05-17 1986-12-16 Hsu Michael S Compact, light-weight, solid-oxide electrochemical converter
US4895673A (en) 1985-07-12 1990-01-23 Westinghouse Electric Corp. Emulsions for electrodepositing polymeric alloys and copolymers
US4818438A (en) * 1985-07-19 1989-04-04 Acheson Industries, Inc. Conductive coating for elongated conductors
US4818437A (en) * 1985-07-19 1989-04-04 Acheson Industries, Inc. Conductive coatings and foams for anti-static protection, energy absorption, and electromagnetic compatability
US4889750A (en) * 1985-07-19 1989-12-26 Acheson Industries, Inc. Conductive coatings and foams for anti-static protection, energy absorption, and electromagnetic compatibility
CH665847A5 (de) * 1985-10-02 1988-06-15 Lonza Ag Verfahren zum suspendieren von festschmierstoffen.
US4724005A (en) * 1985-11-29 1988-02-09 Olin Hunt Specialty Products Inc. Liquid carbon black dispersion
US4684560A (en) * 1985-11-29 1987-08-04 Olin Hunt Specialty Products, Inc. Printed wiring board having carbon black-coated through holes
US4691091A (en) * 1985-12-31 1987-09-01 At&T Technologies Direct writing of conductive patterns
US4735676A (en) * 1986-01-14 1988-04-05 Asahi Chemical Research Laboratory Co., Ltd. Method for forming electric circuits on a base board
JPS62276894A (ja) * 1986-02-21 1987-12-01 株式会社メイコー スル−ホ−ル付導体回路板の製造方法
CH669129A5 (de) * 1986-04-04 1989-02-28 Lonza Ag Schmierstoffsystem fuer blech- und profilwalzwerke.
US4622108A (en) * 1986-05-05 1986-11-11 Olin Hunt Specialty Products, Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US4622107A (en) * 1986-05-05 1986-11-11 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US4718993A (en) * 1987-05-29 1988-01-12 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US4758358A (en) * 1987-06-08 1988-07-19 Van Straaten Corporation Environmentally acceptable forging lubricants
US4921777A (en) * 1987-08-03 1990-05-01 Allied-Signal Inc. Method for manufacture of multilayer printed circuit boards
US4935109A (en) * 1988-05-23 1990-06-19 General Dynamics Corp., Pomona Div. Double-cell electroplating apparatus and method
JPH064482B2 (ja) 1988-06-08 1994-01-19 三井鉱山株式会社 葉片状黒鉛粉末及びその製造方法
US5032235A (en) * 1988-07-27 1991-07-16 The Boeing Company Method and apparatus for plating through holes in graphite composites
CA1329802C (en) * 1988-08-30 1994-05-24 Nippon Kokan Kabushiki Kaisha Lubricant for the production of seamless steel pipes
US5041242A (en) * 1989-01-12 1991-08-20 Cappar Limited Conductive coating composition
US5024735A (en) * 1989-02-15 1991-06-18 Kadija Igor V Method and apparatus for manufacturing interconnects with fine lines and spacing
US5108553A (en) * 1989-04-04 1992-04-28 Olin Corporation G-tab manufacturing process and the product produced thereby
US4874477A (en) * 1989-04-21 1989-10-17 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US4897164A (en) * 1989-04-24 1990-01-30 Olin Hunt Specialty Products Inc. Process for preparing the through hole walls of a printed wiring board for electroplating
US4969979A (en) * 1989-05-08 1990-11-13 International Business Machines Corporation Direct electroplating of through holes
US4980202A (en) * 1989-07-03 1990-12-25 United Technologies Corporation CVD SiC matrix composites containing carbon coated fibers
US5110355A (en) * 1990-03-26 1992-05-05 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates
US5015339A (en) * 1990-03-26 1991-05-14 Olin Hunt Sub Iii Corp. Process for preparing nonconductive substrates
US5106537A (en) * 1990-04-12 1992-04-21 Olin Hunt Sub Iii Corp. Liquid dispersion for enhancing the electroplating of a non-conductive surface
US4964959A (en) * 1990-04-12 1990-10-23 Olin Hunt Specialty Products Inc. Process for preparing a nonconductive substrate for electroplating
US4994153A (en) * 1990-06-28 1991-02-19 Olin Corporation Process for preparing nonconductive substrates
CA2102240A1 (en) * 1991-04-22 1992-10-23 Heinrich Meyer Method for selectively coating non-conductors with carbon particles and use of copper containing solutions therein
US5139642A (en) * 1991-05-01 1992-08-18 Olin Corporation Process for preparing a nonconductive substrate for electroplating
JPH05218618A (ja) * 1992-01-30 1993-08-27 Cmk Corp プリント配線板の製造方法

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US5476580A (en) 1995-12-19
JPH09500419A (ja) 1997-01-14
CA2162905A1 (en) 1994-11-24
EP0698132A4 (de) 1996-01-15
AU6831794A (en) 1994-12-12
PL311705A1 (en) 1996-03-04
HK1005414A1 (en) 1999-01-08
FI955542A0 (fi) 1995-11-16
EP0698132B1 (de) 1999-11-17
JP3335176B2 (ja) 2002-10-15
NO954637D0 (no) 1995-11-16
DE69421699T2 (de) 2000-07-06
WO1994026958A1 (en) 1994-11-24
FI955542A (fi) 1996-01-16
NO954637L (no) 1996-01-16
EP0698132A1 (de) 1996-02-28

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Owner name: OMG ELECTRONIC CHEMICALS, INC., SOUTH PLAINFIE, US

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Owner name: OMG ELECTRONIC CHEMICALS, LLC (N. D. GES.D. ST, US