DE69427665D1 - Harzzusammensetzungen und Verfahren für Ihre Herstellung - Google Patents

Harzzusammensetzungen und Verfahren für Ihre Herstellung

Info

Publication number
DE69427665D1
DE69427665D1 DE69427665T DE69427665T DE69427665D1 DE 69427665 D1 DE69427665 D1 DE 69427665D1 DE 69427665 T DE69427665 T DE 69427665T DE 69427665 T DE69427665 T DE 69427665T DE 69427665 D1 DE69427665 D1 DE 69427665D1
Authority
DE
Germany
Prior art keywords
manufacture
processes
resin compositions
compositions
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69427665T
Other languages
English (en)
Other versions
DE69427665T2 (de
Inventor
Dong Dong Wang
Motoo Asai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of DE69427665D1 publication Critical patent/DE69427665D1/de
Application granted granted Critical
Publication of DE69427665T2 publication Critical patent/DE69427665T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06—Polysulfones; Polyethersulfones
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
DE69427665T 1993-02-24 1994-02-23 Harzzusammensetzungen und Verfahren für Ihre Herstellung Expired - Lifetime DE69427665T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5807893 1993-02-24
JP13916893 1993-05-19

Publications (2)

Publication Number Publication Date
DE69427665D1 true DE69427665D1 (de) 2001-08-16
DE69427665T2 DE69427665T2 (de) 2001-10-31

Family

ID=26399157

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69427665T Expired - Lifetime DE69427665T2 (de) 1993-02-24 1994-02-23 Harzzusammensetzungen und Verfahren für Ihre Herstellung

Country Status (3)

Country Link
US (6) US5994480A (de)
EP (1) EP0612812B1 (de)
DE (1) DE69427665T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6384344B1 (en) * 1995-06-19 2002-05-07 Ibiden Co., Ltd Circuit board for mounting electronic parts
DE69532651T2 (de) * 1995-12-26 2004-07-29 Ibiden Co. Ltd., Ogaki Metallfilm verbundkörper, verbindungsschicht und bindemittel
EP1397031A3 (de) * 1996-09-12 2005-01-19 Ibiden Co., Ltd. Leiterplatte zur Montage von elektronischen Bauelementen
US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
DE19734659A1 (de) * 1997-08-11 1999-02-18 Bayer Ag Flammwidrige Polycarbonat-ABS-Formmassen
KR20000028796A (ko) 1998-10-07 2000-05-25 고사이 아끼오 빌드업 방법용 열경화성 수지 조성물
US6617048B1 (en) * 1999-03-30 2003-09-09 Nkk Corporation Prepainted steel sheet and method for producing the same
MY121156A (en) 1999-07-02 2005-12-30 Sumitomo Chemical Co Thermosetting resin composition for build-up method
KR20090024308A (ko) 1999-08-27 2009-03-06 제넨테크, 인크. 항-ＥｒｂＢ2 항체 투여 치료 방법
DE60143164D1 (de) 2000-07-26 2010-11-11 Ballard Power Systems N und darauf bezogene verfahren
US6599632B1 (en) * 2001-04-18 2003-07-29 Edge Structural Composites, Llc Composite system and method for reinforcement of existing structures
JP2004051938A (ja) * 2002-05-30 2004-02-19 Sumitomo Chem Co Ltd エポキシ樹脂組成物およびその用途
JP3949676B2 (ja) 2003-07-22 2007-07-25 三井金属鉱業株式会社 極薄接着剤層付銅箔及びその極薄接着剤層付銅箔の製造方法
KR100529371B1 (ko) * 2003-07-29 2005-11-21 주식회사 엘지화학 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법
JP2007141956A (ja) * 2005-11-15 2007-06-07 Three M Innovative Properties Co プリント回路基板の接続方法
WO2008020768A1 (en) * 2006-08-15 2008-02-21 Orica New Zealand Limited Composite material manufactured from a binder system including waste powder coating powder
US8425785B2 (en) 2008-03-31 2013-04-23 Intel Corporation Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers
US20110210517A1 (en) 2008-11-14 2011-09-01 Nitta Gelatin Inc. Sealing material and method of foaming application thereof
JP5815555B2 (ja) 2009-12-17 2015-11-17 サイテク・テクノロジー・コーポレーシヨン エンジニアリング熱可塑性樹脂中の多官能性添加剤
CN113149650B (zh) * 2021-04-25 2022-09-23 陕西理工大学 一种基于sla的碳材料零件用光敏树脂及零件的制备方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3878019A (en) * 1970-05-19 1975-04-15 Ici Ltd Process of producing spot bonded non-woven webs using ultra-violet radiation
JPS4842454B1 (de) * 1970-12-28 1973-12-12
US4291087A (en) * 1979-06-12 1981-09-22 Rohm And Haas Company Non-woven fabrics bonded by radiation-curable, hazard-free binders
JPS6019610B2 (ja) * 1979-12-14 1985-05-17 株式会社日立製作所 透明導電膜形成法
JPS58223149A (ja) * 1982-06-22 1983-12-24 Toray Ind Inc 感光性ポリイミド用現像液
JPS59226074A (ja) * 1983-06-07 1984-12-19 Mitsubishi Rayon Co Ltd 耐熱性の良好な感光性組成物
GB8320270D0 (en) * 1983-07-27 1983-09-01 Raychem Ltd Polymer composition
DE3579102D1 (de) * 1984-04-18 1990-09-13 Nippon Kayaku Kk Basismaterial mit gefaerbtem oberflaechenfilm und faerbeverfahren.
US4752499A (en) * 1985-05-16 1988-06-21 Ibiden Co. Ltd. Adhesive for electroless plating and method of preparation of circuit board using this adhesive
JPH0193027A (ja) * 1987-10-01 1989-04-12 Sony Corp カラー陰極線管の製造方法
ATE142676T1 (de) * 1987-10-05 1996-09-15 Ici Plc Polymermasse
US5434224A (en) * 1987-10-05 1995-07-18 Imperial Chemical Industries Plc Thermoset and polyarylsulfone resin system that forms an interpenetrating network
US5231150A (en) * 1987-10-05 1993-07-27 Imperial Chemical Industries Plc Polymer composition
US5002821A (en) * 1987-12-15 1991-03-26 The Dexter Corporation Toughened prepregs and formulations
EP0326112B1 (de) * 1988-01-29 1994-09-14 Toppan Printing Co., Ltd. Elektrodenstruktur für Anzeigevorrichtungen und ihr Herstellungsverfahren
DE3913966B4 (de) * 1988-04-28 2005-06-02 Ibiden Co., Ltd., Ogaki Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung
US4883744A (en) * 1988-05-17 1989-11-28 International Business Machines Corporation Forming a polymide pattern on a substrate
JPH0291157A (ja) * 1988-09-28 1990-03-30 Nippon Petrochem Co Ltd 熱可塑性樹脂組成物およびその製造方法
DE3833219A1 (de) * 1988-09-30 1990-04-05 Bayer Ag Verfahren zur herstellung feindisperser polymermischungen
US4972031A (en) * 1988-10-05 1990-11-20 Imperial Chemical Industries Plc Plastic moulding composition comprising an uncured or partly cured thermoset resin precursor and a polyarylsulphone
US5364914A (en) * 1988-10-05 1994-11-15 Imperial Chemical Industries Plc Moulding composition comprising a thermoset component and thermoplast component
US4954195A (en) * 1989-02-13 1990-09-04 Lockheed Corporation Production of thermoset composites containing thermoplastic fillers
US5248711A (en) * 1989-02-16 1993-09-28 Hexcel Corporation Toughened resin systems for composite applications
US5106918A (en) * 1989-11-29 1992-04-21 The B. F. Goodrich Company Method for dispersing miscible polymeric components
EP0441047B1 (de) * 1990-01-19 1996-06-05 Minnesota Mining And Manufacturing Company Wärmehärtbare Zusammensetzung
JPH04154860A (ja) * 1990-10-19 1992-05-27 Asahi Denka Kogyo Kk 硬化性エポキシ樹脂組成物
US5344893A (en) * 1991-07-23 1994-09-06 Ibiden Co., Ltd. Epoxy/amino powder resin adhesive for printed circuit board
US5519177A (en) * 1993-05-19 1996-05-21 Ibiden Co., Ltd. Adhesives, adhesive layers for electroless plating and printed circuit boards
US5827907A (en) * 1993-08-30 1998-10-27 Ibm Corporation Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin

Also Published As

Publication number Publication date
EP0612812B1 (de) 2001-07-11
US6294621B1 (en) 2001-09-25
DE69427665T2 (de) 2001-10-31
US6451932B1 (en) 2002-09-17
US6306980B1 (en) 2001-10-23
US6124408A (en) 2000-09-26
US5994480A (en) 1999-11-30
EP0612812A3 (en) 1995-11-15
US6265498B1 (en) 2001-07-24
EP0612812A2 (de) 1994-08-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition