DE69427665T2 - Harzzusammensetzungen und Verfahren für Ihre Herstellung - Google Patents
Harzzusammensetzungen und Verfahren für Ihre HerstellungInfo
- Publication number
- DE69427665T2 DE69427665T2 DE69427665T DE69427665T DE69427665T2 DE 69427665 T2 DE69427665 T2 DE 69427665T2 DE 69427665 T DE69427665 T DE 69427665T DE 69427665 T DE69427665 T DE 69427665T DE 69427665 T2 DE69427665 T2 DE 69427665T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- processes
- resin compositions
- compositions
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/06—Polysulfones; Polyethersulfones
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5807893 | 1993-02-24 | ||
JP13916893 | 1993-05-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69427665D1 DE69427665D1 (de) | 2001-08-16 |
DE69427665T2 true DE69427665T2 (de) | 2001-10-31 |
Family
ID=26399157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69427665T Expired - Lifetime DE69427665T2 (de) | 1993-02-24 | 1994-02-23 | Harzzusammensetzungen und Verfahren für Ihre Herstellung |
Country Status (3)
Country | Link |
---|---|
US (6) | US5994480A (de) |
EP (1) | EP0612812B1 (de) |
DE (1) | DE69427665T2 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6384344B1 (en) * | 1995-06-19 | 2002-05-07 | Ibiden Co., Ltd | Circuit board for mounting electronic parts |
WO1998011605A1 (fr) * | 1995-06-19 | 1998-03-19 | Ibiden Co., Ltd. | Carte de circuit permettant le montage de pieces electroniques |
WO1997024229A1 (fr) | 1995-12-26 | 1997-07-10 | Ibiden Co., Ltd. | Corps sur lequel est lie un film metallique, couche d'agent de liaison et agent de liaison |
US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
DE19734659A1 (de) * | 1997-08-11 | 1999-02-18 | Bayer Ag | Flammwidrige Polycarbonat-ABS-Formmassen |
KR20000028796A (ko) * | 1998-10-07 | 2000-05-25 | 고사이 아끼오 | 빌드업 방법용 열경화성 수지 조성물 |
US6617048B1 (en) * | 1999-03-30 | 2003-09-09 | Nkk Corporation | Prepainted steel sheet and method for producing the same |
MY121156A (en) | 1999-07-02 | 2005-12-30 | Sumitomo Chemical Co | Thermosetting resin composition for build-up method |
DK1210115T3 (da) | 1999-08-27 | 2009-11-30 | Genentech Inc | Doseringer til behandling med anti-ErB2-antistoffer |
US6638883B2 (en) | 2000-07-26 | 2003-10-28 | Ballard Material Products Inc. | Carbon-matrix composites, compositions and methods related thereto |
US6599632B1 (en) * | 2001-04-18 | 2003-07-29 | Edge Structural Composites, Llc | Composite system and method for reinforcement of existing structures |
JP2004051938A (ja) * | 2002-05-30 | 2004-02-19 | Sumitomo Chem Co Ltd | エポキシ樹脂組成物およびその用途 |
JP3949676B2 (ja) | 2003-07-22 | 2007-07-25 | 三井金属鉱業株式会社 | 極薄接着剤層付銅箔及びその極薄接着剤層付銅箔の製造方法 |
KR100529371B1 (ko) * | 2003-07-29 | 2005-11-21 | 주식회사 엘지화학 | 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법 |
JP2007141956A (ja) * | 2005-11-15 | 2007-06-07 | Three M Innovative Properties Co | プリント回路基板の接続方法 |
WO2008020768A1 (en) * | 2006-08-15 | 2008-02-21 | Orica New Zealand Limited | Composite material manufactured from a binder system including waste powder coating powder |
US8425785B2 (en) | 2008-03-31 | 2013-04-23 | Intel Corporation | Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers |
US20110210517A1 (en) | 2008-11-14 | 2011-09-01 | Nitta Gelatin Inc. | Sealing material and method of foaming application thereof |
KR101767699B1 (ko) | 2009-12-17 | 2017-08-11 | 사이텍 테크놀러지 코포레이션 | 엔지니어링 열가소성 물질 중의 다작용기성 첨가제 |
CN113149650B (zh) * | 2021-04-25 | 2022-09-23 | 陕西理工大学 | 一种基于sla的碳材料零件用光敏树脂及零件的制备方法 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3878019A (en) * | 1970-05-19 | 1975-04-15 | Ici Ltd | Process of producing spot bonded non-woven webs using ultra-violet radiation |
JPS4842454B1 (de) * | 1970-12-28 | 1973-12-12 | ||
US4291087A (en) * | 1979-06-12 | 1981-09-22 | Rohm And Haas Company | Non-woven fabrics bonded by radiation-curable, hazard-free binders |
JPS6019610B2 (ja) * | 1979-12-14 | 1985-05-17 | 株式会社日立製作所 | 透明導電膜形成法 |
JPS58223149A (ja) * | 1982-06-22 | 1983-12-24 | Toray Ind Inc | 感光性ポリイミド用現像液 |
JPS59226074A (ja) * | 1983-06-07 | 1984-12-19 | Mitsubishi Rayon Co Ltd | 耐熱性の良好な感光性組成物 |
GB8320270D0 (en) * | 1983-07-27 | 1983-09-01 | Raychem Ltd | Polymer composition |
WO1985004912A1 (en) * | 1984-04-18 | 1985-11-07 | Nippon Kayaku Kabushiki Kaisha | Base material having a dyed surface film and dyeing method |
US4752499A (en) * | 1985-05-16 | 1988-06-21 | Ibiden Co. Ltd. | Adhesive for electroless plating and method of preparation of circuit board using this adhesive |
JPH0193027A (ja) * | 1987-10-01 | 1989-04-12 | Sony Corp | カラー陰極線管の製造方法 |
ATE142676T1 (de) * | 1987-10-05 | 1996-09-15 | Ici Plc | Polymermasse |
US5231150A (en) * | 1987-10-05 | 1993-07-27 | Imperial Chemical Industries Plc | Polymer composition |
US5434224A (en) * | 1987-10-05 | 1995-07-18 | Imperial Chemical Industries Plc | Thermoset and polyarylsulfone resin system that forms an interpenetrating network |
US5002821A (en) * | 1987-12-15 | 1991-03-26 | The Dexter Corporation | Toughened prepregs and formulations |
EP0326112B1 (de) * | 1988-01-29 | 1994-09-14 | Toppan Printing Co., Ltd. | Elektrodenstruktur für Anzeigevorrichtungen und ihr Herstellungsverfahren |
DE3913966B4 (de) * | 1988-04-28 | 2005-06-02 | Ibiden Co., Ltd., Ogaki | Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung |
US4883744A (en) * | 1988-05-17 | 1989-11-28 | International Business Machines Corporation | Forming a polymide pattern on a substrate |
JPH0291157A (ja) * | 1988-09-28 | 1990-03-30 | Nippon Petrochem Co Ltd | 熱可塑性樹脂組成物およびその製造方法 |
DE3833219A1 (de) * | 1988-09-30 | 1990-04-05 | Bayer Ag | Verfahren zur herstellung feindisperser polymermischungen |
US5364914A (en) * | 1988-10-05 | 1994-11-15 | Imperial Chemical Industries Plc | Moulding composition comprising a thermoset component and thermoplast component |
US4972031A (en) * | 1988-10-05 | 1990-11-20 | Imperial Chemical Industries Plc | Plastic moulding composition comprising an uncured or partly cured thermoset resin precursor and a polyarylsulphone |
US4954195A (en) * | 1989-02-13 | 1990-09-04 | Lockheed Corporation | Production of thermoset composites containing thermoplastic fillers |
US5248711A (en) * | 1989-02-16 | 1993-09-28 | Hexcel Corporation | Toughened resin systems for composite applications |
US5106918A (en) * | 1989-11-29 | 1992-04-21 | The B. F. Goodrich Company | Method for dispersing miscible polymeric components |
EP0441047B1 (de) * | 1990-01-19 | 1996-06-05 | Minnesota Mining And Manufacturing Company | Wärmehärtbare Zusammensetzung |
JPH04154860A (ja) * | 1990-10-19 | 1992-05-27 | Asahi Denka Kogyo Kk | 硬化性エポキシ樹脂組成物 |
US5344893A (en) * | 1991-07-23 | 1994-09-06 | Ibiden Co., Ltd. | Epoxy/amino powder resin adhesive for printed circuit board |
US5519177A (en) * | 1993-05-19 | 1996-05-21 | Ibiden Co., Ltd. | Adhesives, adhesive layers for electroless plating and printed circuit boards |
US5827907A (en) * | 1993-08-30 | 1998-10-27 | Ibm Corporation | Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin |
-
1994
- 1994-02-23 DE DE69427665T patent/DE69427665T2/de not_active Expired - Lifetime
- 1994-02-23 EP EP94102736A patent/EP0612812B1/de not_active Expired - Lifetime
-
1997
- 1997-09-30 US US08/941,397 patent/US5994480A/en not_active Expired - Lifetime
-
1999
- 1999-02-26 US US09/258,199 patent/US6124408A/en not_active Expired - Lifetime
-
2000
- 2000-04-19 US US09/552,642 patent/US6306980B1/en not_active Expired - Fee Related
- 2000-04-19 US US09/552,644 patent/US6294621B1/en not_active Expired - Fee Related
- 2000-04-19 US US09/552,643 patent/US6265498B1/en not_active Expired - Lifetime
- 2000-04-19 US US09/552,641 patent/US6451932B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5994480A (en) | 1999-11-30 |
US6265498B1 (en) | 2001-07-24 |
US6294621B1 (en) | 2001-09-25 |
US6306980B1 (en) | 2001-10-23 |
DE69427665D1 (de) | 2001-08-16 |
US6124408A (en) | 2000-09-26 |
EP0612812A2 (de) | 1994-08-31 |
EP0612812B1 (de) | 2001-07-11 |
US6451932B1 (en) | 2002-09-17 |
EP0612812A3 (en) | 1995-11-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |